Substrate bonding apparatus

Abstract

The utility model provides a substrate combination device, relates to the packaging technology field, the substrate combination device comprises a base tool and a covering tool, the base tool is provided with an accommodating groove, the middle part of the accommodating groove is provided with a bearing platform used for bearing a substrate support plate in a matching manner, the covering tool covers the base tool, and the substrate support plate is provided with a plurality of grooves. And a plurality of grinding rollers are arranged on the covering jig, are arranged along a circumference, correspond to the outer edge of the bearing table and are used for removing a glue layer on the edge of the substrate carrier plate. Compared with the prior art, the residual adhesive layer on the edge of the wafer can be effectively removed, the pulling problem caused by the residual adhesive is avoided, and meanwhile, the residual adhesive is prevented from polluting the process environment.

Description

Technical Field

[0001] The utility model relates to the technical field of packaging, in particular to a substrate combining device. Background Art

[0002] The inventors have discovered that in the field of advanced packaging manufacturing, the wafer temporary adhesion bonding process plays an important role. With its low bonding temperature and substrate diversity, it is widely used in the field of three-dimensional advanced packaging as a substrate interposer structure.

[0003] The conventional carrier substrate temporary adhesion bonding process generally requires spin coating temporary bonding glue or coating on the surface of the carrier substrate, and after mounting the wafer or glass substrate material on the carrier surface, it is heated and pressurized in a closed vacuum chamber for bonding. Finally, the wafer surface is cleaned with a chemical solvent to remove the bonding glue. Since the wafer bonding layer is affected by the vacuum negative pressure, there is a problem of residual glue on the edge. During debonding, the residual glue on the edge is easily pulled, causing hidden cracks in the wafer, and the residual glue layer of the substrate bonding structure is easy to contaminate the process environment in subsequent etching or wiring processes, affecting the process quality. Utility Model Content

[0004] The utility model aims to provide a substrate bonding device, which can effectively remove the residual adhesive layer at the edge of the wafer, avoid the pulling problem caused by the residual adhesive, and also avoid the residual adhesive from polluting the process environment.

[0005] The embodiment of the utility model is achieved as follows:

[0006] In the first aspect, the utility model provides a substrate combining device, including a base jig and a covering jig, wherein the base jig is provided with a receiving groove, a carrying platform for adapting to carrying a substrate carrier is provided in the middle of the receiving groove, the covering jig is covered on the base jig, and a plurality of grinding rollers are provided on the covering jig, the plurality of grinding rollers are arranged along a circle and correspond to the outer edge of the carrying platform, and are used to remove the glue layer at the edge of the substrate carrier.

[0007] In an optional embodiment, the height of the supporting platform is lower than the depth of the accommodating groove, and the peripheral wall of the supporting platform is spaced apart from the inner wall of the accommodating groove to form a roller groove, and the grinding roller at least partially extends into the roller groove.

[0008] In an optional embodiment, the receiving groove and the supporting platform are both circular, and the center of the supporting platform overlaps with the center of the receiving groove, the diameter of the supporting platform is smaller than the diameter of the receiving groove, and the width of the roller groove is adapted to the width of the grinding roller.

[0009] In an optional embodiment, a pressing platform protruding toward the supporting platform is provided on one side surface of the covering jig, the shape of the pressing platform is adapted to the shape of the supporting platform, and the plurality of grinding rollers are arranged outside the edge of the pressing platform.

[0010] In an optional embodiment, each of the grinding rollers is arranged to protrude toward the supporting platform relative to the pressing platform so that the height of the pressing platform relative to the surface of the covering jig is smaller than the height of the grinding roller relative to the surface of the covering jig.

[0011] In an optional embodiment, the end of each grinding roller away from the covering jig is hemispherical.

[0012] In an optional embodiment, the covering jig is further provided with an exhaust hole, which passes through to the outside and is connected to the roller groove.

[0013] In an optional embodiment, the number of the exhaust holes is multiple, and the multiple exhaust holes are arranged along the same circumference and outside the edge of the pressing platform.

[0014] In an optional embodiment, the plurality of exhaust holes and the plurality of grinding rollers are arranged along the same circumference, and the plurality of exhaust holes and the plurality of grinding rollers are evenly and staggered.

[0015] In an optional embodiment, a connecting hole is provided on the outer side wall of the covering fixture, and the connecting hole is connected to the exhaust hole.

[0016] The beneficial effects of the embodiments of the utility model include:

[0017] The substrate bonding device provided by the embodiment of the utility model has a receiving groove on the base jig, and a supporting platform for adapting to the substrate carrier is provided in the middle of the receiving groove, and the covering jig is covered on the base jig, and a plurality of grinding rollers are also provided on the covering jig, and the plurality of grinding rollers are arranged along the circumference and correspond to the outer edge of the supporting platform, and are used to rotate and remove the glue layer on the edge of the carrier. In actual use, the substrate carrier is first placed on the supporting platform, and then a layer of adhesive film is coated or attached, and then the wafer to be bonded is attached to the film layer, and finally the covering jig is covered on the base jig for pressing, so as to discharge the bubbles in the bonding area of ​​the film layer. When covering, the covering jig can be rotated, and the grinding roller can be used to remove the residual glue layer in the substrate carrier and wafer edge area. Compared with the prior art, the utility model can effectively remove the residual glue layer on the edge of the wafer, avoid the pulling problem caused by the residual glue, and also avoid the residual glue from polluting the process environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 A schematic structural diagram of a substrate bonding device provided by an embodiment of the utility model at a first viewing angle;

[0020] Figure 2 A schematic structural diagram of a substrate bonding device provided by an embodiment of the utility model at a second viewing angle;

[0021] Figure 3 A schematic diagram of the assembly structure of a substrate bonding device provided in an embodiment of the utility model.

[0022] icon:

[0023] 100-substrate combining device; 110-base fixture; 111-accommodating groove; 113-roller groove; 130-covering fixture; 131-exhaust hole; 133-connecting hole; 150-carrying platform; 170-grinding roller; 190-pressing platform; 200-substrate carrier; 210-wafer. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.

[0025] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0026] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0027] In the description of the present utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the utility model product is usually placed when in use, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0028] In addition, the terms "horizontal", "vertical" and the like do not mean that the components are required to be absolutely horizontal or suspended, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0029] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0030] Please refer to Figures 1 to 3 This embodiment provides a substrate bonding device 100, which can effectively remove the residual adhesive layer at the edge of the wafer 210, avoid the pulling problem caused by the residual adhesive, and also avoid the residual adhesive from polluting the process environment. At the same time, the bonding process is carried out in the inner diameter of the cavity, and the cavity is used to form a vacuum negative pressure to ensure the bonding and fixing effect, so as to achieve the bonding of the wafer 210 with the glass substrate.

[0031] The substrate combining device 100 provided in this embodiment includes a base jig 110 and a covering jig 130. The base jig 110 is provided with a receiving groove 111. A carrying platform 150 for adapting to carrying a substrate carrier 200 is provided in the middle of the receiving groove 111. The covering jig 130 covers the base jig 110, and a plurality of grinding rollers 170 are provided on the covering jig 130. The plurality of grinding rollers 170 are arranged along a circle and correspond to the outer edge of the carrying platform 150, so as to remove the glue layer at the edge of the substrate carrier 200.

[0032] It should be noted that in this embodiment, the covering jig 130 and the base jig 110 can rotate relative to each other, so that the residual adhesive layer in the edge area of ​​the substrate carrier 200 can be ground and removed by using multiple grinding rollers 170. When actually combining the wafer 210 and the substrate carrier 200, the substrate carrier 200 is first placed on the carrier 150, and then a layer of adhesive film is coated or attached, and then the wafer 210 to be bonded is attached to the film layer, and finally the covering jig 130 is covered on the base jig 110 for pressing, so as to discharge the bubbles in the bonding area of ​​the film layer. When covering, the covering jig 130 can be rotated, and the residual adhesive layer in the edge area of ​​the substrate carrier 200 and the wafer 210 can be removed by using the grinding rollers 170.

[0033] In this embodiment, the height of the carrier 150 is lower than the depth of the receiving groove 111, and the peripheral wall of the carrier 150 is spaced apart from the inner side wall of the receiving groove 111 to form a roller groove 113, and the grinding roller 170 at least partially extends into the roller groove 113. Specifically, the height of the carrier 150 can be set according to the thickness of the substrate carrier 200 and the wafer 210. Preferably, the wafer 210 can be flush with the edge of the receiving groove 111 after the substrate carrier 200, the film layer and the wafer 210 are bonded, so as to facilitate the pressing of the covering jig 130.

[0034] In this embodiment, the receiving groove 111 and the carrier 150 are both circular, and the center of the carrier 150 overlaps with the center of the receiving groove 111, the diameter of the carrier 150 is smaller than the diameter of the receiving groove 111, and the width of the roller groove 113 matches the width of the grinding roller 170. Specifically, the size of the receiving groove 111 is larger than the size of the carrier 150, the carrier 150 can be integrally arranged on the bottom wall of the receiving groove 111, and the carrier 150 and the receiving groove 111 are concentrically arranged, which can ensure that the roller groove 113 formed around the carrier 150 is a groove of equal width, and ensure that the grinding roller 170 will not interfere with the edge of the roller groove 113 during the rolling process.

[0035] In this embodiment, a pressing platform 190 protruding toward the carrier 150 is provided on one side surface of the covering jig 130, and the shape of the pressing platform 190 is adapted to the shape of the carrier 150, and a plurality of grinding rollers 170 are provided on the outer side of the edge of the pressing platform 190. Specifically, the pressing platform 190 is also circular and protrudes from the surface of the covering jig 130, and is used to press on the surface of the wafer 210, to ensure the uniformity of the wafer 210 and the substrate carrier 200 through the adhesive film layer, and further press and discharge the air in the adhesive film layer. A plurality of grinding rollers 170 are arranged around the periphery of the pressing platform 190, to ensure that the plurality of grinding rollers 170 can just extend into the roller groove 113 during the pressing process.

[0036] In this embodiment, each grinding roller 170 is arranged to protrude relative to the pressing platform 190 toward the carrier 150, so that the height of the pressing platform 190 relative to the surface of the covering jig 130 is less than the height of the grinding roller 170 relative to the surface of the covering jig 130. Specifically, the protruding height of the grinding roller 170 is higher, so after covering, the grinding roller 170 can partially extend into the roller groove 113, thereby grinding away the excess residual glue layer on the edge of the substrate carrier 200 and the wafer 210.

[0037] Furthermore, one end of each grinding roller 170 away from the covering jig 130 is hemispherical. Specifically, the end face of the grinding roller 170 is hemispherical, so that the rubber layer can be gradually ground during the movement along the roller groove 113, avoiding direct interference with the rubber layer at a large angle and causing rotation obstruction. In addition, the hemispherical grinding roller 170 has better controllability and is also conducive to the rotation of the covering jig 130. Of course, in other preferred embodiments of the utility model, the grinding roller 170 can also be in other shapes such as a semi-roller or a cylindrical shape, which is not specifically limited here.

[0038] In this embodiment, the covering jig 130 is further provided with an exhaust hole 131, which is connected to the outside and to the roller groove 113. Specifically, the exhaust hole 131 can exhaust the air in the roller groove 113, thereby exhausting the air in the film layer after lamination, so as to avoid excessive air pressure inside the cavity and affect the lamination effect.

[0039] Furthermore, there are multiple exhaust holes 131, which are arranged along the same circumference and outside the edge of the pressing platform 190. Specifically, the exhaust holes 131 are evenly distributed along the circumference to achieve uniform exhaust and avoid excessive local air pressure inside the cavity affecting the uniformity of pressing.

[0040] In this embodiment, the plurality of exhaust holes 131 and the plurality of grinding rollers 170 are arranged along the same circumference, and the plurality of exhaust holes 131 and the plurality of grinding rollers 170 are evenly arranged in a staggered manner. Specifically, the plurality of exhaust holes 131 and the plurality of grinding rollers 170 are arranged along the same circumference, which can ensure that the exhaust holes 131 are accurately aligned with the roller grooves 113, and the gas in the roller grooves 113 is discharged in a timely and accurate manner.

[0041] In this embodiment, a connecting hole 133 is provided on the outer wall of the covering jig 130, and the connecting hole 133 is connected to the exhaust hole 131. Specifically, by opening a hole on the side wall of the covering jig 130 to form the connecting hole 133, the exhaust air can be discharged from the side wall of the covering jig 130, and avoid being discharged from the top side of the covering jig 130, ensuring that the component applying external force will not block the connecting hole 133 and cause poor exhaust. In addition, the connecting hole 133 can also be connected to an external vacuum device to achieve vacuuming of the internal cavity, further ensuring the vacuum environment during the wafer 210 box lifting process.

[0042] In summary, the substrate bonding device 100 provided in this embodiment has a receiving groove 111 on the base jig 110, and a support platform 150 for adapting to support the substrate carrier 200 is arranged in the middle of the receiving groove 111, and the covering jig 130 is covered on the base jig 110, and a plurality of grinding rollers 170 are also arranged on the covering jig 130, and the plurality of grinding rollers 170 are arranged along the circumference and correspond to the outer edge of the support platform 150, and are used to rotate and remove the adhesive layer on the edge of the carrier. In actual use, the substrate carrier 200 is first placed on the support platform 150, and then a layer of adhesive film is coated or attached, and then the wafer 210 to be bonded is attached to the film layer, and finally the covering jig 130 is covered on the base jig 110 for pressing, so as to discharge the bubbles in the bonding area of ​​the film layer. During the covering process, the covering jig 130 can be rotated to remove the residual adhesive layer at the edge of the substrate carrier 200 and the wafer 210 using the grinding roller 170. Compared with the prior art, the present invention can effectively remove the residual adhesive layer at the edge of the wafer 210, avoid the pulling problem caused by the residual adhesive, and also avoid the residual adhesive from polluting the process environment.

[0043] The above description is only the preferred embodiment of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A substrate bonding device, characterized in that: It includes a base jig and a covering jig, wherein the base jig is provided with a receiving groove, a carrying platform for adapting to carrying a substrate carrier is provided in the middle of the receiving groove, the covering jig is covered on the base jig, and a plurality of grinding rollers are provided on the covering jig, the plurality of grinding rollers are arranged along a circle and correspond to the outer edge of the carrying platform, and are used to remove the glue layer on the edge of the substrate carrier.

2. The substrate bonding device according to claim 1, characterized in that: The height of the support platform is lower than the depth of the receiving groove, and the peripheral wall of the support platform is spaced apart from the inner side wall of the receiving groove to form a roller groove, and the grinding roller at least partially extends into the roller groove.

3. The substrate bonding device according to claim 2, characterized in that: The receiving groove and the supporting platform are both circular, and the center of the supporting platform overlaps with the center of the receiving groove. The diameter of the supporting platform is smaller than the diameter of the receiving groove, and the width of the roller groove is adapted to the width of the grinding roller.

4. The substrate bonding device according to claim 2, characterized in that: A pressing platform protruding toward the supporting platform is disposed on one side surface of the covering fixture, the shape of the pressing platform is adapted to the shape of the supporting platform, and the plurality of grinding rollers are disposed outside the edge of the pressing platform.

5. The substrate bonding device according to claim 4, characterized in that: Each of the grinding rollers is arranged to protrude relative to the pressing platform toward the supporting platform, so that the height of the pressing platform relative to the surface of the covering jig is smaller than the height of the grinding roller relative to the surface of the covering jig.

6. The substrate bonding device according to claim 5, characterized in that: One end of each grinding roller away from the covering fixture is hemispherical.

7. The substrate bonding device according to claim 4, characterized in that: The covering fixture is also provided with an exhaust hole, which passes through to the outside and is connected to the roller groove.

8. The substrate bonding device according to claim 7, characterized in that: There are multiple exhaust holes, which are arranged along the same circumference and outside the edge of the pressing platform.

9. The substrate bonding device according to claim 8, characterized in that: The plurality of exhaust holes and the plurality of grinding rollers are arranged along the same circumference, and the plurality of exhaust holes and the plurality of grinding rollers are evenly and staggeredly arranged.

10. The substrate bonding device according to claim 7, characterized in that: A connecting hole is provided on the outer side wall of the covering fixture, and the connecting hole is connected with the exhaust hole.

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