Wafer cleaning device

Abstract

The utility model discloses a wafer cleaning device, which is characterized by comprising a base frame, a transmission structure and a cleaning structure, a feeding and discharging area is arranged on the base frame. The transmission structure comprises a first transmission piece, the first transmission piece is arranged on the base frame, and the first transmission piece is used for transferring a wafer carrier loaded with wafers; the cleaning structure is arranged on the base frame around the first conveying part, the cleaning structure comprises a process tank body and a cleaning tank body, and the process tank body and the cleaning tank body are detachably installed on the base frame; a containing space with an opening is formed in the side edge of the base frame in the extending direction of the base frame, and the process tank body is installed in the containing space. The structure is smaller in occupied area and more compact in layout, and diversity of process formulas and free replacement of the process tank bodies can be realized.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer cleaning, in particular to a wafer cleaning device. Background Art

[0002] For the semiconductor industry, with the continuous reduction of the key dimensions of semiconductor devices and the introduction of new materials, the cleanliness requirements for semiconductor substrates such as wafer surfaces are becoming increasingly stringent during the manufacturing process of semiconductor devices. Nowadays, the requirements for the ability to remove contaminants on the substrate and the degree of scratches and structural damage on the substrate surface are becoming increasingly higher. Contaminants such as particles, organic matter and metals on the substrate usually need to be removed by chemical reactions or physical forces to overcome the attraction of chemical bonds or physical adhesion.

[0003] Currently, the existing cleaning devices for this type of demand all use mass production models / semi-automatic equipment, and the tank-type cleaning equipment can only correspond to different processes. If there is a demand for other processes, the entire equipment needs to be replaced, which is very costly. Utility Model Content

[0004] Therefore, the technical problem to be solved by the utility model is to overcome the problem that the existing cleaning devices for such needs are all mass production models / semi-automatic equipment, and the tank cleaning equipment can only be fixed to correspond to different processes. If there are requirements for other processes, then the entire equipment needs to be replaced, which is costly.

[0005] To this end, the utility model provides a wafer cleaning device, comprising:

[0006] A base frame, wherein a loading and unloading area is provided on the base frame;

[0007] A transmission structure, the transmission structure comprising a first transmission member, the first transmission member is disposed on the base frame, and the first transmission member is used to transfer a wafer carrier loaded with wafers;

[0008] A cleaning structure, the cleaning structure is arranged on the base frame around the first transmission member, the cleaning structure comprises a process tank body and a cleaning tank body, the process tank body and the cleaning tank body are detachably mounted on the base frame;

[0009] Wherein, a side edge of the base frame is provided with an accommodation space with an opening along its extension direction, and the process tank body is installed in the accommodation space.

[0010] Optionally, the above-mentioned base frame is further provided with mounting grooves, which are relatively arranged on two sides of the first transmission member; the cleaning tank body is arranged in the mounting grooves, or the cleaning tank body is arranged in the accommodating space and the mounting grooves.

[0011] Optionally, the above-mentioned loading and unloading area includes a loading platform and a unloading platform, the loading platform is adjacent to the unloading platform, the loading platform is used to place a carrier with wafers to be cleaned, and the unloading platform is used to place a carrier with wafers that have been cleaned.

[0012] Optionally, the above-mentioned wafer cleaning device also includes a drying structure; the drying structure includes: a first drying component and a second drying component, the first drying component and the second drying component are both connected to the base frame, the first drying component is used to clean and dry the first transmission component; the second drying component is used to dry the wafer.

[0013] Optionally, the first drying component and the second drying component are arranged on the same side of the base frame;

[0014] The loading and unloading areas are arranged opposite to the drying structure.

[0015] Optionally, the first drying component and the second drying component are relatively arranged on two sides of the first transmission member;

[0016] The loading and unloading area is arranged between the first drying component and the second drying component.

[0017] Optionally, the above-mentioned cleaning structure also includes a single-wafer cleaning piece, and the transmission structure also includes a second transmission piece, the second transmission piece is spaced apart from the single-wafer cleaning piece, the second transmission piece is used to transfer the single-wafer, and the single-wafer cleaning piece is used to clean the single-wafer.

[0018] Optionally, the wafer cleaning device further comprises a prompting member, and the prompting member is electrically connected to the unloading platform.

[0019] Optionally, the above-mentioned base frame has an openable and closable accommodation space built in, and the cleaning structure and the transmission structure are both arranged in the accommodation space;

[0020] The cleaning structure further comprises an exhaust member, and the exhaust member is used to extract the gas in the accommodating space to the outside.

[0021] Optionally, the above-mentioned wafer cleaning device further includes:

[0022] A first filter element is disposed on the base frame to filter gas flowing from the outside into the accommodation space.

[0023] The technical solution provided by the utility model has the following advantages:

[0024] 1. This embodiment provides a wafer cleaning device, including a base frame, a transmission structure and a cleaning structure. The base frame is placed horizontally, and the top view of the base frame is the reference plane. At the upper side position, a plurality of accommodating spaces are opened along the extension direction of the side. The accommodating spaces are opened upward and forward respectively, which is convenient for the installation and replacement of the process tank body. The transmission structure includes a first transmission member, which is a six-axis manipulator. The first transmission member is arranged on the base frame. The cleaning structure includes a process tank body and a cleaning tank body. The process tank body can be detachably arranged on the base frame. There are multiple process tank bodies and cleaning tank bodies. One process tank body corresponds to one process. The process needs to be implemented according to the requirements. Specifically, for example, the cleaning agents in different multi-wafer cleaning components are different; the cleaning structure and the loading and unloading areas are arranged around the first transmission member to reduce the rotation radius of the manipulator, thereby reducing the size of the entire wafer cleaning device. Among them, the process tank body is arranged in the accommodating space, that is, the process tank body is arranged at the edge of the base frame, which can make it easier to replace the process tank body to adapt to different process requirements.

[0025] The utility model adopts a surround tank installation mode, which can meet the current research and development needs of cleaning equipment. Compared with the equipment on the market, it occupies a smaller area, has a more compact layout, and can realize the diversity of process formulas and the free replacement of process tanks. It integrates user needs into one device, and there is no need to develop different equipment for different research and development needs, which reduces a lot of costs, reduces the land cost of the entire device, and reduces the operating costs of customers, thereby achieving better economic benefits. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0027] Figure 1 This is a schematic diagram of the overall structure of the wafer cleaning device provided in the utility model;

[0028] Figure 2 A top view of a wafer cleaning device provided in the utility model having three process tanks and three cleaning tanks;

[0029] Figure 3 A top view of a wafer cleaning device provided in the utility model having four process tanks and two cleaning tanks;

[0030] Figure 4 A top view of a wafer cleaning device for transferring an electric control area provided in the utility model;

[0031] Figure 5 A top view of a wafer cleaning device provided by the utility model having a single-wafer cleaning member and a second transmission member;

[0032] Description of reference numerals:

[0033] 1 – base frame;

[0034] 21 - loading platform; 22 - unloading platform; 23 - single piece loading and unloading platform;

[0035] 3-transmission structure; 31-first transmission member; 32-second transmission member;

[0036] 4-cleaning structure; 41-process tank; 42-cleaning tank; 43-single-piece cleaning element;

[0037] 5-drying structure; 51-first drying component; 52-second drying component;

[0038] 6 - first filter element;

[0039] 7-Electrical control area. DETAILED DESCRIPTION

[0040] The technical solution of the utility model will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0041] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0042] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0043] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0044] Example 1

[0045] This embodiment provides a wafer cleaning device, such as Figures 1 to 5 As shown, it includes a base frame 1, a transmission structure 3 and a cleaning structure 4. The base frame 1 is placed horizontally. Figure 2 As shown, the top view of the base frame 1 is the reference plane. At the upper side position, a plurality of accommodating spaces are opened along the extension direction of the side. The accommodating spaces are opened upward and forward respectively for removing and placing the process tank body 41, which is convenient for the installation and replacement of the process tank body 41. From the top view of the wafer cleaning device, the loading and unloading area is set at the lower left corner of the base frame 1 or the middle part of the lower side. The transmission structure 3 includes a first transmission member 31, which is a six-axis manipulator. The first transmission member 31 is set on the base frame 1. The cleaning structure 4 includes a process tank body 41 and a cleaning tank body 42. The process tank body 41 can be detachably set on the base frame 1.

[0046] There are multiple process tanks 41 and cleaning tanks 42, and one process tank 41 corresponds to one process. The process needs to be implemented according to the needs. Specifically, for example, the cleaning agents in different multi-wafer cleaning components are different; the cleaning structure 4 and the loading and unloading area are arranged around the first transmission member 31 to reduce the rotation radius of the manipulator, thereby reducing the size of the entire wafer cleaning device. Among them, the process tank 41 is arranged in the accommodating space, that is, the process tank 41 is arranged at the edge of the base frame 1, and the process tank 41 can be more easily replaced to adapt to different process requirements. When it is necessary to clean the wafer, the cleaning process required for the wafer is pre-input or the upper computer system determines, and the flower basket with several wafers is manually placed on the loading and unloading area. The first transmission member 31 places the entire flower basket in the process tank 41 of the corresponding process for cleaning. After the cleaning is completed, the first transmission member 31 transports the flower basket in the corresponding process tank 41 to the cleaning tank 42 for rinsing, and removes it after the rinsing is completed.

[0047] Under normal conditions, the process tank body 41 is placed in the accommodating space. When one or more process tank bodies 41 need to be replaced, the process tank body 41 is pulled out from the corresponding accommodating space and directly pushed into the accommodating space after replacement, which can save the time of replacing multiple cleaning tank bodies 42 and improve the efficiency of replacement.

[0048] The utility model adopts a surround tank installation mode, which can meet the current research and development needs of cleaning equipment. Compared with the equipment on the market, it occupies a smaller area, has a more compact layout, and can realize the diversity of process formulas and the free replacement of process tanks 41. And by setting a detachable process tank 41, only the equipment is needed to meet the current research and development needs of cleaning equipment, and when adding different process tests, there is no need to replace the equipment, only one or more process tanks 41 need to be replaced to meet the needs, integrating user needs into one device, and there is no need to develop different equipment for different research and development needs, which reduces a lot of costs, reduces the land cost of the entire device, and reduces the operating costs of customers, thereby achieving better economic benefits.

[0049] like Figures 2 to 5 As shown, mounting grooves are also provided on both sides of the first transmission member 31, and the mounting grooves are used to install the cleaning tank body 42. Figure 2 As shown, according to user requirements, the accommodating space is provided at four locations along the extension direction of the side, and two mounting grooves are provided. The two mounting grooves are respectively located on both sides of the first transmission member 31. Specifically, for different process requirements, such as Figure 2 As shown, three process tanks 41 can be installed in the accommodating space, and three cleaning tanks 42 can be installed in the installation tank and the remaining accommodating space to achieve three acids and three waters, and one process tank 41 uses one cleaning tank 42 to rinse the wafer; or as shown in FIG. Figure 3 As shown, four process tanks 41 are arranged in the accommodation space, and two cleaning tanks 42 are installed in the installation tank, so as to realize four acids and two waters, and two process tanks 41 share one cleaning tank 42, which is a flexible combination.

[0050] Specifically, Figure 2 and Figure 3 As shown, the loading and unloading area at the lower left position of the base frame 1 includes a loading platform 21 and a unloading platform 22, the loading platform 21 and the unloading platform 22 are adjacent, and the unloading platform 22 is electrically connected to a prompt member, which can be a prompt light; a drying structure 5 is arranged on the right side of the base frame 1, and the drying structure 5 includes a first drying component 51 and a second drying component 52, and the first drying component 51 and the second drying component 52 are both arranged on the right side of the base frame 1, and the first drying component 51 and the second drying component 52 are arranged at intervals;

[0051] Under normal conditions, Figures 2 to 4As shown, only one loading platform 21 and one unloading platform 22 are provided. When the wafer needs to be cleaned, the wafer basket with the device wafer is manually placed on the loading platform 21, and the first transmission component 31 is used for transportation. After the chemical cleaning in the process tank 41 and the rinsing in the cleaning tank 42 are completed, the first transmission component 31 moves the basket to the second drying component 52 for drying, and finally moves the dried wafer to the unloading platform 22, triggering a three-color reminder light to remind the staff to take it, thus completing the tank cleaning process. In the above process, after the first transmission member 31 contacts the chemical liquid in the process tank 41, the first transmission member 31 needs to be cleaned and dried. For example, after the first transmission member 31 puts the wafer basket in the previous process into one process tank 41, it also needs to put the next wafer basket into another process tank 41. Between the two processes, the first transmission member 31 needs to be moved to the first drying component 51, and the first drying component 51 cleans and dries the first transmission member 31 to prevent the chemical liquids in the process tanks 41 of two different processes from contaminating each other. Specifically, it can be water spray cleaning and then nitrogen drying.

[0052] Specifically, there is a closed storage space above the base frame 1, and only an openable and closable inlet and outlet are provided at the loading and unloading area. The cleaning structure 4 and the transmission structure 3 are arranged in the storage space. In the process of cleaning the wafer, acid gas will be generated. By fixing a vacuum component on the storage space, the acid gas in the storage space can be extracted to the outside to prevent the acid gas from corroding the internal parts. The wafer cleaning device also includes: a first filter element 6. During the vacuum process of the vacuum component, fresh air needs to enter the storage space. At this time, a first filter element 6 is arranged on the base frame 1. While realizing air circulation, it can filter the gas flowing from the outside to the storage space to prevent impurities from entering and causing impurities to adhere to the surface of the wafer after cleaning.

[0053] In other possible implementations, such as Figure 4 As shown, the loading and unloading areas are arranged on the lower side of the base frame 1, the loading platform 21 and the unloading platform 22 are distributed in the left and right directions, and the first drying component 51 and the second drying component 52 are arranged on both sides of the loading and unloading areas. At the same time, the electric control area 7 on the base frame 1 is moved to other positions, thereby further reducing the size of the entire wafer cleaning device.

[0054] In other possible implementations, such as Figure 5As shown, the wafer cleaning device is also provided with a single-wafer cleaning component 43 and a second transmission component 32. The second transmission component 32 is a vacuum manipulator with a suction cup. The single-wafer cleaning component 43 and the second transmission component 32 are arranged at the lower left position of the base frame 1, and the two are arranged at an interval. The second transmission component 32 is used to transmit a single wafer. The loading and unloading area is arranged in the middle position below the base frame 1. In addition to the loading platform 21 and the unloading platform 22, the loading and unloading area is also provided with an additional single-wafer loading and unloading platform 23. The single-wafer loading and unloading platform 23 is also electrically connected to the prompt component. When single-wafer cleaning is required, the wafer basket is manually placed on the single-wafer loading and unloading platform 23, and the second transmission component 32 takes out the single wafer from the wafer basket and transfers it to the single-wafer cleaning component 43 for cleaning. After the wafer cleaning is completed, the second transmission component 32 takes the single wafer out of the single-wafer cleaning component 43 and places it back in the basket of the single-wafer loading and unloading platform 23, and triggers the prompt light to remind, completing the single-wafer cleaning process.

[0055] In this wafer cleaning device, excluding other components of the base frame 1, the loading and unloading areas, the cleaning structure 4 and the drying structure 5 are all arranged around the first transmission member 31. Compared with the existing equipment, it occupies a smaller area and has a more compact layout.

[0056] Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the invention of the utility model.

Claims

1. A wafer cleaning device, characterized in that: include: A base frame (1), wherein a loading and unloading area is provided on the base frame (1); A transmission structure (3), the transmission structure (3) comprising a first transmission member (31), the first transmission member (31) being arranged on the base frame (1), the first transmission member (31) being used for transferring a wafer carrier loaded with wafers; a cleaning structure (4), the cleaning structure (4) being arranged on the base frame (1) around the first transmission member (31), the cleaning structure (4) comprising a process tank body (41) and a cleaning tank body (42), the process tank body (41) and the cleaning tank body (42) being detachably mounted on the base frame (1); Wherein, a side edge of the base frame (1) is provided with an accommodation space having an opening along its extension direction, and the process tank body (41) is installed in the accommodation space.

2. The wafer cleaning device according to claim 1, characterized in that: The base frame (1) is also provided with a mounting groove, which is relatively arranged on two sides of the first transmission member (31); the cleaning tank body is arranged in the mounting groove, or the cleaning tank body is arranged in the accommodating space and the mounting groove.

3. The wafer cleaning device according to claim 2, characterized in that: The loading and unloading area comprises a loading platform (21) and a unloading platform (22), wherein the loading platform (21) is adjacent to the unloading platform (22), the loading platform (21) is used to place a carrier carrying wafers to be cleaned, and the unloading platform (22) is used to place a carrier carrying wafers that have been cleaned.

4. The wafer cleaning device according to claim 3, characterized in that: The wafer cleaning device further comprises a drying structure (5); the drying structure (5) comprises: a first drying component (51) and a second drying component (52); the first drying component (51) and the second drying component (52) are both connected to the base frame (1); the first drying component (51) is used for cleaning and drying the first transmission component (31); and the second drying component (52) is used for drying the wafer.

5. The wafer cleaning device according to claim 4, characterized in that: The first drying component (51) and the second drying component (52) are arranged on the same side of the base frame (1); The loading and unloading areas are arranged opposite to the drying structure (5).

6. The wafer cleaning device according to claim 4, characterized in that: The first drying component (51) and the second drying component (52) are arranged oppositely on two sides of the first transmission member (31); The loading and unloading area is arranged between the first drying component (51) and the second drying component (52).

7. The wafer cleaning device according to claim 4, characterized in that: The cleaning structure (4) further comprises a single-wafer cleaning member (43), and the transmission structure (3) further comprises a second transmission member (32), wherein the second transmission member (32) and the single-wafer cleaning member (43) are arranged at a distance from each other, the second transmission member (32) is used to transfer a single wafer, and the single-wafer cleaning member (43) is used to clean a single wafer.

8. The wafer cleaning device according to claim 7, characterized in that: The wafer cleaning device also includes a prompting member, which is electrically connected to the unloading platform (22).

9. The wafer cleaning device according to any one of claims 1 to 8, characterized in that: The base frame (1) has a built-in accommodating space that can be opened and closed, and the cleaning structure (4) and the transmission structure (3) are both arranged in the accommodating space; The cleaning structure (4) further comprises an exhaust component, which is used to extract the gas in the accommodating space to the outside.

10. The wafer cleaning device according to claim 9, characterized in that: The wafer cleaning device also includes: A first filter element (6), wherein the first filter element (6) is arranged on the base frame (1) to filter gas flowing from the outside into the containing space.

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