Submicron chip laminating equipment

Abstract

The utility model relates to the technical field of chip mounting equipment, and discloses submicron chip laminating equipment, which comprises a rack, the first moving mechanism comprises a supporting plate, a movable frame and an extension spring, the supporting plate is arranged on the rack, one side of the supporting plate is provided with a vertical first sliding rail, the first sliding rail is sleeved with a first sliding block, the movable frame is fixedly connected with the first sliding block, and the extension spring is parallel to the first sliding rail; the upper end and the lower end of the extension spring are connected with the supporting plate and the movable frame correspondingly. The chip mounting mechanism is arranged on one side, deviating from the supporting plate, of the movable frame and is used for sucking and laminating the submicron chip; precise sliding of the first sliding rail and the first sliding block is adopted, it can be guaranteed that the movable frame and the chip mounting mechanism on the movable frame are kept stable in the moving process, the upper end and the lower end of the extension spring parallel to the first sliding rail are connected with the supporting plate and the movable frame respectively, impact force generated in the moving process is effectively relieved, vibration is further reduced, and the service life of the chip mounting device is prolonged. And the working precision and the stability of equipment are obviously improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip bonding equipment, in particular to a submicron chip bonding equipment. Background Art

[0002] With the rapid development of electronic technology, submicron chips have been widely used in microelectronics, integrated circuits and other fields due to their ultra-small size and high-efficiency performance. In the field of semiconductor and microelectronics manufacturing, there is a demand for extremely high precision and stability in chip manufacturing and bonding technology. Submicron chip bonding equipment is also called submicron chip mounter. Its main function is to achieve submicron-level precision bonding between chips and substrates, ensure the stability and performance of chips, and form chip components with higher integration and stronger functions.

[0003] Existing sub-micron chip bonding equipment generally uses a mechanical transmission mechanism to transfer the substrate into place according to the transmission feed rate, and then uses a cylinder or electric cylinder to perform straight up and down bonding welding, so that the working head reaches the set position directly. The lack of buffering makes it easy to vibrate and deflect during the bonding process, affecting the accuracy and stability of chip bonding.

[0004] Therefore, it is necessary to provide a submicron chip bonding equipment to solve the above problems. Utility Model Content

[0005] The utility model aims to provide a sub-micron chip bonding device to solve the technical problem in the prior art that vibration is easily generated during chip bonding and affects the bonding accuracy.

[0006] The utility model adopts the following technical solutions:

[0007] A submicron chip bonding device, comprising:

[0008] frame;

[0009] A first moving mechanism, the first moving mechanism comprising a support plate, a movable frame and a tension spring, the support plate being arranged on the frame, a vertical first slide rail being arranged on one side of the support plate, the first slide rail being sleeved with a first slider, the movable frame being fixedly connected to the first slider, the tension spring being arranged in parallel with the first slide rail, and the upper end and the lower end of the tension spring being respectively connected to the support plate and the movable frame;

[0010] The chip bonding mechanism is arranged on an end surface of the movable frame away from the support plate and is used for sucking and bonding the submicron chip.

[0011] Furthermore, the first moving mechanism also includes a first driving motor, which is arranged at the top of the support plate, and the output end of the first driving motor is connected to a belt, which is arranged on the side of the support plate facing the movable frame, and the belt is fixedly connected to the movable frame to drive the movable frame to slide and rise and fall on the first slide rail through the first slider.

[0012] Furthermore, the patch mechanism includes an adjustment motor and a suction head, the adjustment motor is fixedly connected to the movable frame, the suction head is arranged at the output end of the adjustment motor, and a heating block is sleeved on the circumference of the suction head.

[0013] Furthermore, it also includes a second moving mechanism, which includes a gantry, a second slide rail and a second drive motor, the gantry is arranged on the frame, the second slide rail is fixedly connected to the gantry, the second slide rail is provided with a second slider, the second slider is fixedly connected to the support plate, and the second drive motor is arranged on one side of the gantry to drive the support plate to move horizontally on the second slide rail through the second slider.

[0014] Furthermore, it also includes a third moving mechanism, which includes a third slide rail and a third drive motor. The third slide rail is fixedly set on the frame, and the third slide rail is sleeved with a third slider. The gantry is fixedly set on the top of the third slider, and the third drive motor is set on the frame for driving the gantry to move horizontally on the third slide rail through the third slider.

[0015] Furthermore, it also includes a conveyor belt, which is arranged below the suction head. A carrying tray is equidistantly arranged on one side of the conveyor belt facing the suction head, and the carrying tray is used to fix and install the chip substrate.

[0016] Furthermore, a chip rack is provided on one side of the conveyor belt, and a plurality of chip slots are provided on the upper end surface of the chip rack, and the chip slots are used to store a single sub-micron chip.

[0017] Furthermore, a heating platform is provided below the carrying tray, and a heating surface of the heating platform abuts against a bottom end of the carrying tray to perform preheating treatment on the chip substrate.

[0018] Furthermore, a dispensing needle is provided on one side of the suction head, the dispensing needle is fixedly connected to the movable frame, and the bottom end of the dispensing needle and the bottom end of the suction head are in the same horizontal plane.

[0019] Furthermore, it also includes a visual aligner, which is arranged on the side of the dispensing needle away from the support plate, and the detection end of the visual aligner faces the bottom end of the suction head.

[0020] Beneficial effects:

[0021] The utility model provides a submicron chip bonding equipment, which adopts the precise sliding of a first slide rail and a first slider, can ensure that a movable frame and a chip bonding mechanism thereon remain stable during movement, and reduces vibration caused by mechanical movement; a tension spring parallel to the first slide rail is respectively connected to a support plate and the movable frame through an upper end and a lower end, can effectively mitigate the impact force generated during movement, further reduce vibration, make the entire movable mechanism more stable when performing lifting operations, and significantly improve the working accuracy and stability of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a schematic diagram of the overall structure of an embodiment of a submicron chip bonding device of the utility model;

[0023] Figure 2 It is a side structural schematic diagram of a first moving mechanism of a sub-micron chip bonding device of the utility model;

[0024] Figure 3 It is a schematic diagram of another angle of the first moving mechanism of a sub-micron chip bonding device of the utility model;

[0025] Among them: 1. frame; 2. first moving mechanism; 21. support plate; 22. movable frame; 23. tension spring; 24. first slide rail; 25. first slider; 26. first drive motor; 27. belt; 3. patch mechanism; 31. adjustment motor; 32. suction head; 33. heating block; 4. gantry; 5. second slide rail; 6. second drive motor; 7. second slider; 8. third slide rail; 9. third drive motor; 10. third slider; 11. conveyor belt; 12. carrying tray; 13. chip rack; 14. dispensing needle; 15. visual aligner.

[0026] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0027] It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0028] In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "several" is two or more, unless otherwise clearly and specifically defined.

[0029] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0030] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0031] Reference Figures 1 to 3The utility model proposes a submicron chip bonding device, comprising: a frame; a first moving mechanism 2, the first moving mechanism 2 comprising a support plate 21, a movable frame 22 and a tension spring 23, the support plate 21 is arranged on the frame, a vertical first slide rail 24 is arranged on one side of the support plate 21, the first slide rail 24 is sleeved with a first slider 25, the movable frame 22 is fixedly connected to the first slider 25, the tension spring 23 is arranged parallel to the first slide rail 24, and the upper end and the lower end of the tension spring 23 are respectively connected to the support plate 21 and the movable frame 22; a chip bonding mechanism 3, arranged on the side of the movable frame 22 away from the support plate 21, for sucking and bonding submicron chips.

[0032] In the above embodiment, the first moving mechanism 2 is used to realize the precise lifting of the movable frame 22, thereby driving the lifting operation of the patch mechanism 3. Among them, the support plate 21 is arranged on the frame, providing a stable support foundation. The first slide rail 24 is arranged vertically, so that the movable frame 22 can slide and lift in the vertical direction. The first slider 25 is closely matched with the first slide rail 24 to ensure the stability of the movable frame 22 during the lifting process. The upper end and the lower end of the tension spring 23 are respectively connected to the upper end of the support plate 21 and the lower end of the movable frame 22, which effectively reduces the impact force that may be generated by the movable frame 22 during the lifting process, and further improves the stability and working accuracy of the equipment.

[0033] The chip attaching mechanism 3 is arranged on the side of the movable frame 22 away from the support plate 21, and is used to absorb and attach the submicron chip. The chip attaching mechanism 3 can select different absorbing methods as needed, such as vacuum absorption, electrostatic adsorption, etc., to adapt to different types of submicron chips.

[0034] In summary, the utility model provides a submicron chip bonding device, which realizes the precise bonding of submicron chips through the cooperation of the first moving mechanism 2 and the bonding mechanism 3. The device has the characteristics of high precision, high stability and high reliability, and can meet the needs of the submicron chip manufacturing field.

[0035] In one embodiment, the first moving mechanism 2 further includes a first driving motor 26, which is disposed at the top of the support plate 21, and a belt 27 is connected to the output end of the first driving motor 26, which is disposed on a side of the support plate 21 facing the movable frame 22, and the belt 27 is fixedly connected to the movable frame 22 to drive the movable frame 22 to slide and rise and fall on the first slide rail 24 through the first slider 25;

[0036] In the above embodiment, the first drive motor 26 serves as a power source, and the belt 27 connected to its output end is fixedly connected to the movable frame 22. The connection here can be through another fixing part. The movable frame 22 is driven to slide and rise on the first slide rail 24 by the belt 27.

[0037] Furthermore, the first moving mechanism 2 may also use an electric cylinder or a pneumatic cylinder as a driving source, so that the movable frame 22 can slide and rise and fall smoothly on the first slide rail 24 to achieve the precise fitting requirements of sub-micron chips.

[0038] In one embodiment, the patch mechanism 3 includes an adjustment motor 31 and a suction head 32 . The adjustment motor 31 is fixedly connected to the movable frame 22 . The suction head 32 is arranged at the output end of the adjustment motor 31 . A heating block 33 is sleeved around the suction head 32 .

[0039] In the above embodiment, the suction head 32 is arranged at the output end of the adjustment motor 31, and the position and angle of the suction head 32 can be adjusted as needed to meet the sub-micron chip bonding requirements at different positions and angles. A heating block 33 is sleeved on the circumference of the suction head 32. By heating the suction head 32 with the heating block 33, tiny foreign matter and bubbles on the surface of the chip can be effectively removed to improve the bonding quality. At the same time, the heating block 33 can also soften the adhesive between the chip and the substrate, so that the suction head 32 can be used as a welding head between the chip and the substrate. The temperature of the heating block 33 can be adjusted as needed to adapt to different types of sub-micron chips and adhesives. The heating block 33 preferably adopts high-frequency heating to achieve precise heating of the suction head 32. By adjusting the coordinated use of the motor 31 and the heating block 33, the work efficiency can be improved while ensuring product quality.

[0040] In one embodiment, it also includes a second moving mechanism, which includes a gantry 4, a second slide rail 5 and a second drive motor 6. The gantry 4 is arranged on the frame, the second slide rail 5 is fixedly connected to the gantry 4, the second slide rail 5 is sleeved with a second slider 7, the second slider 7 is fixedly connected to the support plate 21, and the second drive motor 6 is arranged on one side of the gantry 4 to drive the support plate 21 to move horizontally on the second slide rail 5 through the second slider 7.

[0041] In the above embodiment, the second moving mechanism brings higher flexibility and operating space to the submicron chip bonding equipment. The gantry 4, as a stable supporting structure, ensures the stability and reliability of the second slide rail 5. The second slide rail 5 is fixedly connected to the gantry 4, providing a track for horizontal movement of the support plate 21. The second slider 7 and the second slide rail 5 are closely matched to ensure the stability and accuracy of the support plate 21 during the horizontal movement. The second drive motor 6, as a power source, is arranged on one side of the gantry 4. Through the screw and the stator, the second slider 7 is driven to move on the second slide rail 5, thereby realizing the horizontal movement of the support plate 21 and the first moving mechanism 2 and the patch mechanism 3 installed thereon.

[0042] In one embodiment, a third moving mechanism is further included, and the third moving mechanism includes a third slide rail 8 and a third drive motor 9. The third slide rail 8 is fixedly arranged on the frame, and the third slide rail 8 is sleeved with a third slider 10. The gantry 4 is fixedly arranged on the top of the third slider 10. The third drive motor 9 is arranged on the frame and is used to drive the gantry 4 to move horizontally on the third slide rail 8 through the third slider 10.

[0043] In the above embodiment, the third slide rail 8 is fixed on the frame as a stable support structure, providing a stable track for the movement of the gantry 4. The third slider 10 is closely matched with the third slide rail 8 to ensure the stability and accuracy of the gantry 4 during the horizontal movement. The third drive motor 9 is used as a power source. Through the connection of its output end with the third slider 10 or the gantry 4, the gantry 4 and the second moving mechanism and support plate 21 installed thereon are moved in the horizontal direction, further ensuring the accuracy and quality of sub-micron chip bonding.

[0044] In one embodiment, a conveyor belt 11 is further included, which is arranged below the suction head 32. A carrying tray 12 is equidistantly arranged on one side of the conveyor belt 11 facing the suction head 32. The carrying tray 12 is used for fixing and mounting the chip substrate.

[0045] In the above embodiment, the conveyor belt 11 serves as a transmission mechanism for the chip substrate, and an equidistantly arranged carrying tray 12 is provided above the conveyor belt 11. The carrying tray 12 is provided with slots for accommodating the substrate, which can effectively fix and support the chip substrate and ensure the stability of the substrate during the bonding process. The conveyor belt 11 allows the chip substrate to continuously enter the working area of ​​the patch mechanism 3, thereby realizing the automation and efficiency of sub-micron chip bonding. After the patch mechanism 3 accurately bonds the sub-micron chip to the chip substrate by adjusting the coordination of the motor 31 and the heating block 33, the conveyor belt 11 will continue to move the carrying tray 12 and the chip substrate thereon to the next working area for subsequent processing.

[0046] In one embodiment, a chip rack 13 is disposed on one side of the conveyor belt 11 , and a plurality of chip slots are disposed on the upper end surface of the chip rack 13 , and the chip slots are used to store a single sub-micron chip.

[0047] In the above embodiment, the upper end surface of the chip rack 13 is equidistantly provided with a plurality of chip slots, and the size and shape of each chip slot can be adapted to the submicron chips of the current batch. The integrity and traceability of the chips are ensured through orderly storage, and it is convenient for operators to quickly and accurately access the chips. In addition, the chip rack 13 is arranged adjacent to the conveyor belt 11, which can ensure that the chips are quickly transferred to the working area of ​​the chip mounting mechanism 3 when needed, greatly improving the efficiency and accuracy of submicron chip bonding.

[0048] In one embodiment, a heating platform is disposed below the carrying tray 12 , and a heating surface of the heating platform abuts against the bottom end of the carrying tray 12 to preheat the chip substrate.

[0049] In the above embodiment, the heating platform is arranged below the carrier tray 12, and its heating surface is in close contact with the bottom end of the carrier tray 12. The chip substrate is preheated by the heating platform, and the heating platform preferably adopts a pulse heating method. The preheating treatment can effectively remove tiny foreign matter and moisture on the surface of the chip substrate, improve the adhesion between the chip substrate and the submicron chip, and thus ensure the quality of bonding. In addition, the preheating treatment can also soften the adhesive on the surface of the substrate, reduce the stress during chip bonding, and avoid chip damage or poor bonding due to stress concentration. The temperature of the heating platform can be adjusted according to the material of the chip substrate and the characteristics of the adhesive to achieve the best preheating effect.

[0050] In one embodiment, a dispensing needle 14 is disposed on one side of the suction head 32 , the dispensing needle 14 is fixedly connected to the movable frame 22 , and the bottom end of the dispensing needle 14 is in the same horizontal plane as the bottom end of the suction head 32 .

[0051] In the above embodiment, the glue dispensing needle 14 and the suction head 32 are arranged side by side on the movable frame 22, and the bottom ends of the two are kept at the same horizontal plane, ensuring that after the sub-micron chip bonding is completed, the glue dispensing needle 14 can accurately apply an appropriate amount of adhesive at a predetermined position on the chip substrate. At the same time, the bottom end of the glue dispensing needle 14 is horizontally aligned with the bottom end of the suction head 32, so that when the suction head 32 absorbs and bonds the chip, the glue dispensing needle 14 can synchronously complete the application of the adhesive, thereby improving work efficiency.

[0052] In one embodiment, a visual aligner 15 is further included, which is disposed on a side of the dispensing needle 14 away from the support plate 21 , and a detection end of the visual aligner 15 faces the bottom end of the suction head 32 .

[0053] In the above embodiment, the visual alignment device 15 is an important component of the submicron chip bonding equipment, which is installed on the side of the dispensing needle 14 away from the support plate 21, and the detection end accurately points to the bottom of the suction head 32. Through high-resolution image capture technology, the visual alignment device 15 can capture the spatial position and angle of the chip substrate and the submicron chip under the suction head 32 in real time, and accurately calculate the relative position of the two through image processing software to ensure the accuracy and precision of chip bonding.

[0054] During the sub-micron chip bonding process, the visual alignment device 15 can quickly identify the marking points or feature points on the chip substrate and the sub-micron chip, providing a reliable basis for subsequent position calibration. Through real-time image feedback and precise calculation, the visual alignment device 15 can guide the chip bonding mechanism 3 to make fine adjustments to ensure the accuracy of the chip bonding position. The visual alignment device 15 can also monitor the bonding process in real time. Once an abnormality or deviation is found, it can promptly alarm and automatically stop the machine to prevent the production of defective products.

[0055] In one embodiment, the visual aligner 15 is provided with an ultraviolet illuminator, and the ultraviolet illuminator is directed toward the output end of the dispensing needle 14 to cure the sub-micron chip after dispensing.

[0056] In the above embodiment, the visual aligner 15 is additionally provided with a UV illuminator, which is oriented toward the bottom output end of the dispensing needle 14. After the dispensing needle 14 dispenses the adhesive onto the chip substrate, the UV illuminator emits ultraviolet rays of a specific wavelength, which are directly irradiated onto the dispensing area. Ultraviolet rays can effectively activate the photosensitive components in the adhesive, causing it to solidify in a short time, thereby rapidly enhancing the bonding force between the submicron chip and the substrate. The power and irradiation time of the UV illuminator can be precisely adjusted according to the type of adhesive and the curing requirements to ensure that the adhesive is fully cured while avoiding thermal damage to the chip and substrate.

[0057] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A submicron chip bonding device, characterized in that: include: frame; A first moving mechanism, the first moving mechanism comprising a support plate, a movable frame and a tension spring, the support plate being arranged on the frame, a vertical first slide rail being arranged on one side of the support plate, the first slide rail being sleeved with a first slider, the movable frame being fixedly connected to the first slider, the tension spring being arranged in parallel with the first slide rail, and the upper end and the lower end of the tension spring being respectively connected to the support plate and the movable frame; The chip bonding mechanism is arranged on an end surface of the movable frame away from the support plate and is used for sucking and bonding the submicron chip.

2. The submicron chip bonding equipment according to claim 1, characterized in that: The first moving mechanism also includes a first driving motor, which is arranged at the top of the support plate. The output end of the first driving motor is connected to a belt, which is arranged on a side of the support plate facing the movable frame, and the belt is fixedly connected to the movable frame to drive the movable frame to slide and rise and fall on the first slide rail through the first slider.

3. The submicron chip bonding equipment according to claim 1, characterized in that: The patch mechanism comprises an adjustment motor and a suction head, wherein the adjustment motor is fixedly connected to the movable frame, the suction head is arranged at the output end of the adjustment motor, and a heating block is sleeved on the peripheral side of the suction head.

4. The submicron chip bonding equipment according to claim 1, characterized in that: It also includes a second moving mechanism, which includes a gantry, a second slide rail and a second drive motor. The gantry is arranged on the frame, the second slide rail is fixedly connected to the gantry, the second slide rail is sleeved with a second slider, the second slider is fixedly connected to the support plate, and the second drive motor is arranged on one side of the gantry to drive the support plate to move horizontally on the second slide rail through the second slider.

5. The submicron chip bonding equipment according to claim 4, characterized in that: The third moving mechanism also includes a third slide rail and a third drive motor. The third slide rail is fixedly arranged on the frame. The third slide rail is sleeved with a third slider. The gantry is fixedly arranged on the top of the third slider. The third drive motor is arranged on the frame and is used for driving the gantry to move horizontally on the third slide rail through the third slider.

6. The submicron chip bonding equipment according to claim 3, characterized in that: It also includes a conveyor belt, which is arranged below the suction head. A carrying tray is equidistantly arranged on one side of the conveyor belt facing the suction head. The carrying tray is used for fixing and mounting the chip substrate.

7. The submicron chip bonding equipment according to claim 6, characterized in that: A chip rack is arranged on one side of the conveyor belt, and a plurality of chip slots are arranged on the upper end surface of the chip rack. The chip slots are used to store a single sub-micron chip.

8. The submicron chip bonding equipment according to claim 6, characterized in that: A heating platform is arranged below the carrying tray, and a heating surface of the heating platform abuts against the bottom end of the carrying tray to perform preheating treatment on the chip substrate.

9. The submicron chip bonding equipment according to claim 3, characterized in that: A glue dispensing needle is arranged on one side of the suction head, the glue dispensing needle is fixedly connected to the movable frame, and the bottom end of the glue dispensing needle and the bottom end of the suction head are in the same horizontal plane.

10. The submicron chip bonding equipment according to claim 9, characterized in that: It also includes a visual aligner, which is arranged on the side of the dispensing needle away from the support plate, and the detection end of the visual aligner faces the bottom end of the suction head.

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