Wafer flattening equipment

Abstract

The utility model relates to the technical field of die bonding equipment, and particularly discloses wafer flattening equipment, which comprises a wafer platform provided with a plurality of vacuum adsorption holes; a crystal pressing plate, wherein the crystal pressing plate is located above the wafer platform; a universal joint assembly; and the lifting mechanism is connected with the crystal pressing plate through the universal joint assembly and drives the crystal pressing plate to move up and down relative to the wafer platform. The wafer flattening equipment provided by the utility model can effectively solve the problem that the wafer is easy to break due to uneven stress in the flattening process.

Description

Technical Field

[0001] The utility model relates to the technical field of crystal bonding equipment, in particular to a wafer flattening equipment. Background Art

[0002] When the wafer is incoming, there is a certain amount of warping. Before entering the subsequent die bonding process, the wafer needs to be flattened. The existing wafer pressing equipment includes a wafer platform for placing the wafer, a wafer pressing plate located above the wafer platform, and a wafer pressing cylinder that drives the wafer pressing plate to move up and down.

[0003] After placing the wafer on the wafer platform, the wafer pressing cylinder drives the wafer pressing plate downward toward the wafer platform to flatten the wafer. Generally, the bottom surface of the wafer pressing plate is completely horizontal. If the right end of the wafer is tilted upward, the right end of the wafer will first contact the wafer pressing plate during the downward movement of the wafer pressing plate, and will be squeezed downward by the wafer pressing plate. The uneven force on the left and right ends of the wafer will easily cause it to break.

[0004] Therefore, it is necessary to improve the existing wafer pressing equipment to solve the problem that the wafer is easily broken due to uneven force during the flattening process.

[0005] The above information disclosed in this Background section is included only for enhancement of understanding of the background of the present disclosure and therefore it may contain information that does not form the prior art that is currently known to a person of ordinary skill in the art. Utility Model Content

[0006] One purpose of the utility model is to provide a wafer flattening device, which can effectively solve the problem that the wafer is easily broken due to uneven force during the flattening process.

[0007] In order to achieve the above purpose, the utility model provides a wafer flattening device, comprising:

[0008] A wafer platform, wherein the wafer platform is provided with a plurality of vacuum adsorption holes;

[0009] A crystal pressing plate, the crystal pressing plate is located above the wafer platform;

[0010] Universal joint assembly;

[0011] A lifting mechanism is connected to the crystal pressing plate through the universal joint assembly to drive the crystal pressing plate to move up and down relative to the wafer platform.

[0012] Optionally, a silicone pad is provided on the bottom surface of the crystal pressing plate.

[0013] Optionally, the lifting mechanism includes a secondary lifting component connected to the crystal pressing plate, and a primary lifting component driving the secondary lifting component to move up and down;

[0014] Among them, the driving stroke of the first-stage lifting component is greater than that of the second-stage lifting component, and the displacement control accuracy of the second-stage lifting component is higher than that of the first-stage lifting component.

[0015] Optionally, the first-stage lifting assembly includes a fixed bracket, a first-stage linear driving mechanism installed on the fixed bracket, and a first-stage sliding plate that is driven by the first-stage linear driving mechanism to slide up and down relative to the fixed bracket.

[0016] Optionally, the secondary lifting assembly includes a secondary linear drive mechanism installed on the primary slide, and a secondary slide that is driven by the secondary linear drive mechanism to slide up and down relative to the fixed bracket.

[0017] Optionally, the universal joint assembly includes:

[0018] A ball head base, the top surface of which is fixedly mounted on the bottom of the secondary slide, and the bottom surface of which is provided with a ball head structure;

[0019] A ball groove connecting block, the top surface of which is provided with a spherical groove for inserting the ball head structure, and the crystal pressing plate is installed at the bottom of the ball groove connecting block.

[0020] Optionally, the ball groove connecting block and the crystal pressing plate are detachably connected.

[0021] Optionally, the ball groove connecting block is magnetically connected to the crystal pressing plate.

[0022] The beneficial effects of the utility model are: providing a wafer flattening device, the wafer platform first vacuum absorbs and fixes the bottom surface of the wafer to prevent the wafer from shifting during the subsequent flattening process, when the lifting mechanism drives the crystal pressing plate to move downward, after the crystal pressing plate is subjected to the reaction force of the wafer, the whole will adaptively tilt with the warping of the wafer until it is fully adapted to the warping angle of the wafer, and the lifting mechanism drives the crystal pressing plate to continue to move downward, and the crystal pressing plate can evenly apply pressure to the wafer from both ends, thereby flattening the wafer.

[0023] Therefore, the wafer flattening device provided in this embodiment can effectively solve the problem that the wafer is easily broken due to uneven force during the flattening process. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0025] Figure 1 A schematic diagram of the structure of a wafer flattening device provided in an embodiment;

[0026] Figure 2 A schematic structural diagram of a lifting mechanism provided in an embodiment.

[0027] In the figure:

[0028] 1. Wafer platform;

[0029] 2. Crystal pressing plate;

[0030] 3. Universal joint assembly; 301. Ball head base; 302. Ball slot connection block;

[0031] 4. Lifting mechanism; 401. Fixed bracket; 402. Primary linear drive mechanism; 403. Primary slide plate; 404. Secondary linear drive mechanism; 405. Secondary slide plate;

[0032] 5. Silicone pad. DETAILED DESCRIPTION

[0033] The reference to "embodiment" in the present invention means that the specific features, structures or characteristics described in conjunction with the embodiment may be included in at least one embodiment of the present invention. The word "embodiment" appearing in various places in the specification does not necessarily refer to the same embodiment, nor does it particularly limit its independence or association with other embodiments. In principle, in the present invention, as long as there is no technical contradiction or conflict, the various technical features mentioned in each embodiment can be combined in any way to form a corresponding implementable technical solution.

[0034] Unless otherwise defined, the technical terms used in this document have the same meanings as those generally understood by those skilled in the art to which the present invention belongs; the use of relevant terms in this document is only for describing specific embodiments and is not intended to limit the present invention.

[0035] In the description of the present invention, the term "and / or" is an expression used to describe the logical relationship between objects, indicating that three relationships may exist, for example, A and / or B, which means: A exists, B exists, and A and B exist at the same time. In addition, the character " / " in this article generally indicates that the objects before and after are in a logical relationship of "or".

[0036] In the present invention, terms such as “first” and “second” are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship of quantity, priority or sequence between these entities or operations.

[0037] Without further restrictions, in the present invention, the words "include", "comprises", "has" or other similar expressions used in sentences are intended to cover non-exclusive inclusion. These expressions do not exclude the presence of additional elements in the process, method or product including the elements, so that the process, method or product including a series of elements may include not only those limited elements, but also other elements not explicitly listed, or also include elements inherent to such process, method or product.

[0038] Similar to the understanding in the Examination Guidelines, in the present invention, expressions such as "greater than", "less than", "exceed" and the like are understood to exclude the number itself; expressions such as "above", "below", "within" and the like are understood to include the number itself. In addition, in the description of the embodiments of the present invention, "multiple" means more than two (including two), and similar expressions related to "multiple" are also understood in this way, such as "multiple groups", "multiple times", etc., unless otherwise clearly and specifically limited.

[0039] In the description of the embodiments of the present invention, the space-related expressions used, such as "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "vertical", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicate the orientation or position relationship based on the orientation or position relationship shown in the specific embodiments or drawings, and are only for the convenience of describing the specific embodiments of the present invention or facilitating the reader's understanding, and do not indicate or imply that the referred device or component must have a specific position, a specific orientation, or be constructed or operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present invention.

[0040] Unless otherwise expressly specified or limited, in the description of the embodiments of the present utility model, the terms "install", "connect", "connect", "fix", "set" and the like used should be understood in a broad sense. For example, the "connection" can be a fixed connection, a detachable connection, or an integrated setting; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection, or an indirect connection through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements. For those skilled in the technical field of the present utility model, the specific meanings of the above terms in the embodiments of the present utility model can be understood according to the specific circumstances.

[0041] The utility model provides a wafer flattening device, which is suitable for application scenarios of flattening wafers and can effectively solve the problem that the wafer is easily broken due to uneven force during the flattening process.

[0042] See also Figure 1In this embodiment, the wafer flattening device includes a wafer platform 1, a wafer pressing plate 2, a universal joint assembly 3, and a lifting mechanism 4.

[0043] The wafer platform 1 is provided with a plurality of vacuum adsorption holes; the crystal pressing plate 2 is located above the wafer platform 1; the lifting mechanism 4 is connected to the crystal pressing plate 2 through the universal joint assembly 3, driving the crystal pressing plate 2 to move up and down relative to the wafer platform 1.

[0044] The wafer flattening device provided in the present embodiment places the wafer on the wafer platform 1, and the wafer platform 1 first fixes the bottom surface of the wafer by vacuum adsorption to prevent the wafer from shifting during the subsequent flattening process. Then, the lifting mechanism 4 drives the crystal pressing plate 2 to move downward. If the right end of the wafer is tilted upward, the right end of the wafer will first contact the crystal pressing plate 2 during the downward movement of the crystal pressing plate 2. After the crystal pressing plate 2 is subjected to the reaction force of the right end of the wafer, under the connection action of the universal joint assembly 3, the right end of the crystal pressing plate 2 no longer moves downward, and the left end of the crystal pressing plate 2 continues to move downward. At this time, the crystal pressing plate 2 as a whole presents an inclined state with the left side lower and the right side higher, until it is fully adapted to the tilting angle of the wafer; at this time, the lifting mechanism 4 drives the crystal pressing plate 2 to continue to move downward, and the crystal pressing plate 2 can evenly apply pressure to the wafer from both ends, thereby flattening the wafer.

[0045] Therefore, the wafer flattening device provided in this embodiment can effectively solve the problem that the wafer is easily broken due to uneven force during the flattening process.

[0046] Optionally, a silicone pad 5 is provided on the bottom surface of the wafer pressing plate 2. The silicone pad 5 is soft in texture and can protect the wafer from being damaged by a hard impact force.

[0047] In this embodiment, see Figure 2 , the lifting mechanism 4 includes a secondary lifting assembly connected to the crystal pressing plate 2, and a primary lifting assembly that drives the secondary lifting assembly to move up and down; wherein the driving stroke of the primary lifting assembly is greater than that of the secondary lifting assembly, and the displacement control accuracy of the secondary lifting assembly is higher than that of the primary lifting assembly. For example, the primary linear drive mechanism 402 is a cylinder, and the secondary linear drive mechanism 404 is a motor screw assembly. Optionally, a proportional valve is configured in the air supply pipeline corresponding to the cylinder of the primary linear drive mechanism 402, and the pressure of the primary linear drive mechanism 404 is controlled by the proportional valve. When the pressure of the secondary linear drive mechanism 404 driving the crystal pressing plate 2 downward to squeeze the wafer is too large, the air pressure of the air supply pipeline of the primary linear drive mechanism 402 is adaptively adjusted under the action of the proportional valve, thereby ensuring that the pressure applied to the wafer is not too large.

[0048] When the wafer needs to be flattened, the first-stage lifting component first causes the second-stage lifting component and the wafer pressing plate 2 to move downward quickly, so that the wafer pressing plate 2 is close to the wafer. Then, the second-stage lifting component drives the wafer pressing plate 2 downward to slowly flatten the wafer to avoid wafer damage caused by excessive flattening speed. The two-stage lifting design is conducive to balancing production efficiency and pressure control.

[0049] Furthermore, the primary lifting assembly includes a fixed bracket 401 , a primary linear drive mechanism 402 installed on the fixed bracket 401 , and a primary slide plate 403 that is driven by the primary linear drive mechanism 402 to slide up and down relative to the fixed bracket 401 .

[0050] The secondary lifting assembly includes a secondary linear drive mechanism 404 installed on the primary slide 403 , and a secondary slide 405 driven by the secondary linear drive mechanism 404 to slide up and down relative to the fixed bracket 401 .

[0051] The universal joint assembly 3 includes a ball head base 301 and a ball groove connection block 302. The top surface of the ball head base 301 is fixedly mounted on the bottom of the secondary slide 405, and the bottom surface of the ball head base 301 is provided with a ball head structure; the top surface of the ball groove connection block 302 is provided with a spherical groove for inserting the ball head structure, and the crystal pressing plate 2 is installed at the bottom of the ball groove connection block 302. The ball head structure and the spherical groove can rotate relative to each other at any angle, so it can be well adapted to wafers with various tilt angles.

[0052] In this embodiment, the ball groove connection block 302 is detachably connected to the crystal pressing plate 2, so that the crystal pressing plate 2 of different sizes can be replaced according to the size of the wafer. For example, the ball groove connection block 302 is magnetically connected to the crystal pressing plate 2. Optionally, a magnet is provided in the ball groove connection block 302, and an iron block is provided at the crystal pressing plate 2, thereby realizing magnetic attraction, and the magnetic fixing method is quite convenient for assembly and disassembly.

[0053] In summary, the wafer flattening device provided in this embodiment has the following advantages: the wafer platform 1 first fixes the bottom surface of the wafer by vacuum adsorption to prevent the wafer from shifting during the subsequent flattening process. When the lifting mechanism 4 drives the crystal pressing plate 2 to move downward, the crystal pressing plate 2 is subjected to the reaction force of the wafer, and the whole will be adaptively tilted with the tilting of the wafer until it is completely adapted to the tilting angle of the wafer. The lifting mechanism 4 drives the crystal pressing plate 2 to continue to move downward, and the crystal pressing plate 2 can evenly apply pressure to the wafer from both ends, thereby flattening the wafer. Therefore, the wafer flattening device provided in this embodiment can effectively solve the problem that the wafer is easily broken due to uneven force during the flattening process.

[0054] It should be noted that the linear drive mechanism mentioned in the present invention can be a cylinder, a hydraulic cylinder, an electric cylinder or a motor screw linear module, etc., and the rotary drive mechanism mentioned can be a brushed motor, a brushless motor, or a rotary cylinder, etc. The present invention does not limit the specific structural forms of the linear drive mechanism and the rotary drive mechanism.

[0055] Finally, it should be noted that although the above embodiments have been described in the specification and drawings of this application, this does not limit the scope of patent protection of this application. All technical solutions generated by replacing or modifying equivalent structures or equivalent processes based on the essential concept of this application using the contents recorded in the specification and drawings of this application, as well as directly or indirectly implementing the technical solutions of the above embodiments in other related technical fields, are included in the scope of patent protection of this application.

Claims

1. A wafer flattening device, characterized in that: include: A wafer platform (1), wherein the wafer platform (1) is provided with a plurality of vacuum adsorption holes; A crystal pressing plate (2), the crystal pressing plate (2) being located above the wafer platform (1); Universal joint assembly (3); A lifting mechanism (4), wherein the lifting mechanism (4) is connected to the crystal pressing plate (2) via the universal joint assembly (3), and drives the crystal pressing plate (2) to move up and down relative to the wafer platform (1).

2. The wafer flattening device according to claim 1, characterized in that: A silica gel pad (5) is provided on the bottom surface of the crystal pressing plate (2).

3. The wafer flattening device according to claim 1, characterized in that: The lifting mechanism (4) comprises a secondary lifting component connected to the crystal pressing plate (2), and a primary lifting component driving the secondary lifting component to move up and down; Among them, the driving stroke of the first-stage lifting component is greater than that of the second-stage lifting component, and the displacement control accuracy of the second-stage lifting component is higher than that of the first-stage lifting component.

4. The wafer flattening device according to claim 3, characterized in that: The primary lifting assembly comprises a fixed bracket (401), a primary linear drive mechanism (402) mounted on the fixed bracket (401), and a primary slide plate (403) driven by the primary linear drive mechanism (402) to slide up and down relative to the fixed bracket (401).

5. The wafer flattening device according to claim 4, characterized in that: The secondary lifting assembly comprises a secondary linear drive mechanism (404) mounted on the primary slide plate (403), and a secondary slide plate (405) driven by the secondary linear drive mechanism (404) to slide up and down relative to the fixed support (401).

6. The wafer flattening device according to claim 5, characterized in that: The universal joint assembly (3) comprises: A ball head base (301), wherein the top surface of the ball head base (301) is fixedly mounted on the bottom of the secondary slide plate (405), and the bottom surface of the ball head base (301) is provided with a ball head structure; A ball groove connecting block (302), wherein a spherical groove for inserting the ball head structure is provided on the top surface of the ball groove connecting block (302), and the crystal pressing plate (2) is mounted on the bottom of the ball groove connecting block (302).

7. The wafer flattening device according to claim 6, characterized in that: The ball groove connection block (302) and the crystal pressing plate (2) are detachably connected.

8. The wafer flattening device according to claim 7, characterized in that: The ball groove connection block (302) is magnetically connected to the crystal pressing plate (2).

Images