Semiconductor structure heating and cooling device

Abstract

The utility model belongs to the technical field of semiconductors, and discloses a semiconductor structure heating and cooling device. The semiconductor structure heating and cooling device comprises a shell, a heating disc and a cooling disc. The shell is provided with a containing cavity, the shell comprises a cover plate, a constant-temperature disc and a heat conducting plate, the constant-temperature disc is embedded in the cover plate, the constant-temperature disc has a preset temperature and can maintain the temperature of the cover plate at the preset temperature, and the heat conducting plate is configured to heat or cool the semiconductor structure; the heating disc is fixedly arranged in the accommodating cavity, and the heating disc is configured to be a heating heat-conducting plate; the cooling disc is fixedly arranged in the containing cavity and is configured to cool the heat conduction plate. The heating disc and the cooling disc can be alternately started according to actual requirements, heating and cooling are integrally designed, and the structure is compact; meanwhile, the temperature of the cover plate can be maintained at the preset temperature through the constant-temperature disc, except for the heat conducting plate, the temperature field of the other positions of the shell cannot generate large floating along with alternate operation of the heating disc and the cooling disc, and the overall durability of the device is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a semiconductor structure heating and cooling device. Background Art

[0002] In the semiconductor processing industry, some processes require heating and cooling of wafers. However, since the heating and cooling stations are independent of each other, there are a large number of wafer placement processes in the process, which greatly reduces the overall process efficiency of the wafer and increases the risk of damage to the wafer or semiconductor processing structure due to improper operation.

[0003] The semiconductor structure heaters in the prior art all adopt an integrated design of cooling plate and heating plate to streamline the operation process and improve efficiency. However, since the heater needs to frequently switch between heating and cooling states, temperature stress that is difficult to dissipate is generated inside the shell, which is prone to deformation or cracking after long-term use, thus affecting the overall durability of the device. Utility Model Content

[0004] The utility model aims to provide a semiconductor structure heating and cooling device with a shell having strong durability.

[0005] To achieve this purpose, the utility model adopts the following technical solutions:

[0006] A semiconductor structure heating and cooling device, comprising:

[0007] A housing is provided with a containing cavity, the housing comprising a cover plate, a constant temperature plate and a heat conducting plate, the constant temperature plate is embedded in the cover plate, the constant temperature plate is set with a preset temperature and can maintain the temperature of the cover plate at the preset temperature, and the heat conducting plate is configured to heat or cool the semiconductor structure;

[0008] A heating plate, fixedly disposed in the accommodating cavity, wherein the heating plate is configured to heat the heat conducting plate;

[0009] A cooling plate is fixedly disposed in the accommodating cavity, and the cooling plate is configured to cool the heat conducting plate.

[0010] Preferably, the housing further comprises:

[0011] A side wall plate, wherein the side wall plate, the cover plate and the heat conducting plate surround the accommodating cavity, and the cover plate is connected to the side wall plate;

[0012] The sealing ring is pressed between the cover plate and the side wall plate.

[0013] Preferably, the cover plate and the side wall plate are welded to each other by vacuum electron beam.

[0014] Preferably, it further comprises a detection probe, wherein the detection probe is embedded in the heat conducting plate, and the detection probe is configured to monitor the temperature of the heat conducting plate.

[0015] Preferably, the thermostatic disk is provided with a thermostatic tube, which is arranged around the circumference of the thermostatic disk, and a thermostatic liquid is arranged in the thermostatic tube, and the input end and the output end of the thermostatic tube both pass through the cover plate.

[0016] Preferably, the heating disk is provided with a heating wire, and the heating wire is arranged around the circumference of the heating disk, and the input end and the output end of the heating wire both pass through the cover plate.

[0017] Preferably, the cooling disk is provided with a cooling pipe, the cooling pipe is arranged around the circumference of the cooling disk, a coolant is arranged in the cooling pipe, and the input end and the output end of the cooling pipe both pass through the cover plate.

[0018] Preferably, a heat conducting plate is further included, and the heat conducting plate is abutted between the heating plate and the cooling plate.

[0019] Preferably, the material of the heat conductive sheet is nickel.

[0020] Preferably, the heating plate is made of copper.

[0021] Beneficial effects of the utility model:

[0022] During operation, the heating plate and the cooling plate can be started alternately according to actual needs. The heating and cooling are integrated into a compact structure. At the same time, the constant temperature plate can maintain the temperature of the cover plate at a preset temperature. Except for the heat conduction plate, the temperature field at other positions of the shell will not fluctuate greatly with the alternating operation of the heating plate and the cooling plate, thereby improving the overall durability of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a cross-sectional view of the semiconductor structure heating and cooling device of the utility model.

[0024] In the figure:

[0025] 1. Shell; 11. Cover plate; 12. Constant temperature plate; 121. Constant temperature tube; 13. Heat conducting plate; 14. Side wall plate; 15. Sealing ring;

[0026] 2. Heating plate; 21. Heating wire;

[0027] 3. Cooling plate; 31. Cooling pipe;

[0028] 4. Detection probe;

[0029] 5. Protective sleeve;

[0030] 6. Locking parts. DETAILED DESCRIPTION

[0031] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar components or components having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0032] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection, it can be a mechanical connection or an electrical connection, it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0033] In the description of the present utility model, unless otherwise clearly stipulated and limited, a first feature being "above" or "below" a second feature may include the first feature and the second feature being in direct contact, or may include the first feature and the second feature being in contact not directly but through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes the first feature being directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0034] The technical solution of the utility model is further explained below with reference to the accompanying drawings and through specific implementation methods.

[0035] like Figure 1 As shown, the utility model provides a semiconductor structure heating and cooling device for heating or cooling a semiconductor structure. The semiconductor structure heating and cooling device comprises a shell 1, a heating plate 2 and a cooling plate 3. The shell 1 is provided with a receiving cavity, the shell 1 comprises a cover plate 11, a constant temperature plate 12 and a heat conducting plate 13, the constant temperature plate 12 is embedded in the cover plate 11, the constant temperature plate 12 is provided with a preset temperature, and can maintain the temperature of the cover plate 11 at the preset temperature, the heat conducting plate 13 is configured to heat or cool the semiconductor structure; the heating plate 2 is fixed in the receiving cavity, the heating plate 2 is configured to heat the heat conducting plate 13; the cooling plate 3 is fixed in the receiving cavity and is stacked on the heating plate 2, the cooling plate 3 is configured to cool the heat conducting plate 13.

[0036] During operation, the heating plate 2 and the cooling plate 3 can be started alternately according to actual needs, and the heating and cooling are integrated into a compact structure. At the same time, the constant temperature plate 12 can maintain the temperature of the cover plate 11 at a preset temperature. Except for the heat conduction plate 13, the temperature field at other positions of the shell 1 will not fluctuate greatly with the alternating operation of the heating plate 2 and the cooling plate 3, thereby improving the overall durability of the device.

[0037] Specifically, it is understandable that the shapes of the heat conducting plate 13, the heating plate 2 and the cooling plate 3 can be set to be circular or rectangular according to the requirements of actual applications, so as to increase the contact area between the heat conducting plate 13 and the semiconductor structure.

[0038] Specifically, the housing 1 further includes a side wall plate 14 and a sealing ring 15. The side wall plate 14, the cover plate 11 and the heat conducting plate 13 are arranged to form a receiving cavity, the cover plate 11 is connected to the side wall plate 14; the sealing ring 15 is pressed between the cover plate 11 and the side wall plate 14. The arrangement of the sealing ring 15 can enhance the sealing of the receiving cavity and improve the efficiency of heating and cooling. At the same time, due to the presence of the constant temperature plate 12, the sealing ring 15 is not easy to age, and the service life of the sealing ring 15 is extended.

[0039] In this embodiment, the material of the sealing ring 15 is rubber.

[0040] In this embodiment, the material of the heating plate 2 is copper, and the surface of the heating plate 2 is nickel-plated.

[0041] In this embodiment, the material of the housing 1 is stainless steel.

[0042] More specifically, the cover plate 11 and the side wall plate 14 are welded to each other by vacuum electron beam. In this embodiment, the vacuum electron beam welding between the cover plate 11 and the side wall plate 14 is full welding.

[0043] Specifically, the semiconductor structure heating and cooling device further includes a detection probe 4, which is embedded in the heat conducting plate 13 and configured to monitor the temperature of the heat conducting plate 13. The above-mentioned setting of the detection probe 4 enables the staff to change the output power of the heating plate 2 or the cooling plate 3 according to the detection result of the detection probe 4, thereby improving the operation accuracy. In this embodiment, the detection probe 4 is a temperature sensor commonly used in the art, which will not be described in detail here.

[0044] Specifically, the thermostatic disk 12 is provided with a thermostatic tube 121, which is arranged around the circumference of the thermostatic disk 12, and a thermostatic liquid is arranged in the thermostatic tube 121, and the input end and the output end of the thermostatic tube 121 are both passed through the cover plate 11. The above arrangement makes the thermostatic disk 12 have a more uniform thermostatic effect on the cover plate 11, and the staff can accurately control the preset temperature of the thermostatic disk 12 by changing the temperature of the thermostatic liquid, with a large adjustment range and a good thermostatic effect.

[0045] Specifically, the heating plate 2 is provided with a heating wire 21, which is arranged around the circumference of the heating plate 2, and the input end and the output end of the heating wire 21 are both passed through the cover plate 11. The above arrangement makes the heating effect of the heating plate 13 by the heating plate 2 more uniform, and the staff can accurately control the heating effect of the heating plate 2 by changing the temperature of the heating wire 21, with a large adjustment range and good heating effect.

[0046] Specifically, the cooling plate 3 is provided with a cooling pipe 31, which is arranged around the circumference of the cooling plate 3, and a coolant is arranged in the cooling pipe 31, and the input end and the output end of the cooling pipe 31 are both passed through the cover plate 11. The above arrangement makes the cooling effect of the cooling pipe 31 on the heat conducting plate 13 more uniform, and the staff can adjust the cooling effect of the cooling pipe 31 by changing the temperature of the coolant, and the cooling effect is good with a large adjustment range.

[0047] Specifically, a heat conducting sheet is also included, and the heat conducting sheet is attached between the heating plate 2 and the cooling plate 3. The arrangement of the heat conducting sheet can improve the heat transfer efficiency between the heating plate 2 and the cooling plate 3.

[0048] In this embodiment, the material of the heat conducting sheet is nickel. In other embodiments, the heat conducting sheet may also be other heat conducting materials commonly used in the art, which is not limited here.

[0049] In this embodiment, the constant temperature liquid and the cooling liquid are commonly used heat transfer liquids in the art, which are prior art and will not be described in detail here.

[0050] Specifically, the semiconductor structure heating and cooling device further includes a locking member 6, a locking hole is provided on the heat conducting plate 13, the locking member 6 can pass through the cooling plate 3 and the heating plate 2 in sequence, and extend into the heat conducting plate 13, and the locking member 6 is configured to lock the cooling plate 3 and the heating plate 2 to the heat conducting plate 13. The provision of the locking member 6 can increase the firmness of the connection between the cooling plate 3, the heating plate 2 and the heat conducting plate 13, prevent the three from being separated during operation, and has a simple structure and is not easily damaged.

[0051] More specifically, a plurality of locking members 6 are arranged at intervals, and the locking holes correspond to the locking members 6 one by one.

[0052] In this embodiment, the locking member 6 is a bolt structure commonly used in the art, and the locking member 6 is screwed to the heat conducting plate 13. In other embodiments, the locking member 6 may also be a rivet or a pin, which is not limited here.

[0053] Specifically, the semiconductor structure heating and cooling device further includes a protective sleeve 5, which is fixedly connected to the housing 1. The housing 1 is provided with a through hole that passes through in the vertical direction. The input and output ends of the thermostatic tube 121, the input and output ends of the heating wire 21, and the input and output ends of the cooling tube 31 all pass through the housing 1 through the through hole and extend into the protective sleeve 5. The above-mentioned setting of the protective sleeve 5 can protect the pipeline and the wiring harness.

[0054] More specifically, the protection sleeve 5 is welded to the housing 1. In this embodiment, the protection sleeve 5 and the housing 1 are fully welded by argon arc welding.

[0055] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all implementation methods here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included in the protection scope of the claims of the present invention.

Claims

1. A semiconductor structure heating and cooling device, characterized in that: include: A housing (1) is provided with a containing cavity, the housing (1) comprising a cover plate (11), a constant temperature plate (12) and a heat conducting plate (13), the constant temperature plate (12) being embedded in the cover plate (11), the constant temperature plate (12) being provided with a preset temperature and being capable of maintaining the temperature of the cover plate (11) at the preset temperature, the heat conducting plate (13) being configured to heat or cool a semiconductor structure; A heating plate (2) is fixedly arranged in the accommodating cavity, and the heating plate (2) is configured to heat the heat conducting plate (13); A cooling plate (3) is fixedly arranged in the accommodating cavity, and the cooling plate (3) is configured to cool the heat conducting plate (13).

2. The semiconductor structure heating and cooling device according to claim 1, characterized in that: The housing (1) further comprises: A side wall plate (14), wherein the side wall plate (14), the cover plate (11) and the heat conducting plate (13) enclose the accommodating cavity, and the cover plate (11) is connected to the side wall plate (14); The sealing ring (15) is pressed between the cover plate (11) and the side wall plate (14).

3. The semiconductor structure heating and cooling device according to claim 2, characterized in that: The cover plate (11) and the side wall plate (14) are welded to each other by vacuum electron beam.

4. The semiconductor structure heating and cooling device according to claim 1, characterized in that: It also comprises a detection probe (4), wherein the detection probe (4) is embedded in the heat conducting plate (13), and the detection probe (4) is configured to monitor the temperature of the heat conducting plate (13).

5. The semiconductor structure heating and cooling device according to claim 1, characterized in that: The thermostatic disk (12) is provided with a thermostatic tube (121), the thermostatic tube (121) is arranged around the circumference of the thermostatic disk (12), a thermostatic liquid is arranged in the thermostatic tube (121), and the input end and the output end of the thermostatic tube (121) both pass through the cover plate (11).

6. The semiconductor structure heating and cooling device according to claim 1, characterized in that: The heating disk (2) is provided with a heating wire (21), and the heating wire (21) is arranged around the circumference of the heating disk (2), and the input end and the output end of the heating wire (21) both pass through the cover plate (11).

7. The semiconductor structure heating and cooling device according to claim 1, characterized in that: The cooling disk (3) is provided with a cooling pipe (31), the cooling pipe (31) is arranged around the circumference of the cooling disk (3), a cooling liquid is arranged in the cooling pipe (31), and the input end and the output end of the cooling pipe (31) both pass through the cover plate (11).

8. The semiconductor structure heating and cooling device according to claim 1, characterized in that: It also comprises a heat conducting plate, which is abutted between the heating plate (2) and the cooling plate (3).

9. The semiconductor structure heating and cooling device according to claim 8, characterized in that: The material of the heat conducting sheet is nickel.

10. The semiconductor structure heating and cooling device according to any one of claims 1 to 9, characterized in that: The material of the heating plate (2) is copper.

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