Welding-free circuit board and electronic device

Abstract

The utility model relates to the technical field of circuit boards, in particular to a welding-free circuit board, which is characterized in that two protruding metal points are arranged on a substrate, so that the metal points are in stable contact with a power supply end of an electronic device or a part needing signal connection, and the purpose of supplying power to the electronic device or providing other signals can be achieved. According to the utility model, a light source power supply mode without welding and elastic sheets can be realized, the assembly structure is simple, the production efficiency can be effectively improved, the use of the elastic sheets is reduced, and the production cost can be reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a solder-free circuit board. Background Art

[0002] There are two main ways to power the light source in a lamp: welding and using spring contacts.

[0003] Welding method problems:

[0004] Soldering is the process of electrically connecting the light source to the wire. Although this method can provide a stable electrical connection in some cases, it has the following major problems:

[0005] Low production efficiency: The welding process requires precise operation, high technical requirements for operators, and each connection point needs to be handled separately, which greatly reduces production efficiency.

[0006] Difficult quality control: Quality problems such as cold soldering and over-soldering are prone to occur during the welding process, which not only affects the performance of the lamp, but also may cause safety hazards.

[0007] Inconvenient maintenance: Once there is a problem with the light source or connecting wire, replacement or repair becomes very complicated due to the permanent connection of welding.

[0008] The problem of shrapnel contact mode:

[0009] In order to overcome the disadvantages of welding, another welding-free connection method is to set a spring in the lamp structure, and connect the light source signal through the deformation of the spring to realize the power supply of the light source. However, this method is not perfect:

[0010] High assembly complexity: multiple springs need to be designed and installed, which increases the assembly steps and time of the lamp, and the springs need to be manually assembled, making it difficult to achieve fully automatic production, reducing the efficiency of production and assembly.

[0011] Increased costs: The additional spring components not only increase the material cost, but also the labor cost due to the complicated assembly process.

[0012] Reliability issues: Long-term use of the shrapnel may cause poor contact due to fatigue, wear and other reasons, affecting the stability and life of the lamp.

[0013] In summary, the existing power supply methods for light sources, whether welding or using spring contacts, have their own limitations and problems and cannot meet the modern production requirements of high efficiency, reliability and low cost. Therefore, a new circuit board connection structure is needed to solve the above problems and improve the production efficiency and product quality of electronic products. Summary of the invention

[0014] The utility model provides a solder-free circuit board to solve the problems of the prior art. By improving the structure of the circuit board, a solder-free connection mode between the circuit board and the electronic device is achieved. The structure is simple and the assembly is convenient, and the production and assembly efficiency of electronic products can be effectively improved.

[0015] In order to solve the above technical problems, the utility model adopts the following technical solution: a solder-free circuit board, comprising a substrate and a soldering pad arranged on the substrate, the soldering pad is fixed with a metal point, the metal point is used to contact with an external structure to achieve electrical connection, and the surface of the metal point is an arc surface.

[0016] Preferably, the metal dots are tin dots.

[0017] Preferably, the metal dots are hemispherical in shape.

[0018] Preferably, at least two metal points are provided, and the two metal points are located on the same side of the substrate, and the other side of the substrate is supported by the external structure so that the two metal points can stably contact the external structure.

[0019] Preferably, the substrate is provided with a wiring terminal, the wiring terminal is connected to a metal point signal, and the wiring terminal is used to connect to an external power supply.

[0020] Preferably, the surface of the metal dots is provided with an anti-oxidation coating.

[0021] An electronic device comprises the above-mentioned solder-free circuit board.

[0022] Preferably, it comprises a fixing component and a structure to be powered, wherein the structure to be powered is provided with a positive terminal and a negative terminal, and the fixing component is used to abut against the other side of the substrate so that two metal points are in contact with the positive terminal and the negative terminal respectively.

[0023] Beneficial effects of the utility model:

[0024] The utility model provides a solder-free circuit board, which can realize the purpose of powering the electronic device or providing other signals by arranging two protruding metal points on the substrate so that the metal points are in stable contact with the power supply end of the electronic device or the signal connection required. The utility model can realize a solder-free and shrapnel-free light source power supply method, has a simple assembly structure, can effectively improve production efficiency, and reduce the use of shrapnel, which can reduce production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a schematic structural diagram of the first embodiment of the present utility model;

[0026] Figure 2 A schematic diagram of the structure of a welding pad according to an embodiment of the present invention;

[0027] Figure 3 This is a schematic diagram of the structure of the second embodiment of the present utility model. Figure 1 ;

[0028] Figure 4 This is a schematic diagram of the structure of the second embodiment of the present utility model. Figure 2 ;

[0029] Figure 5 It is a schematic diagram of the structure of a COB light source in the prior art.

[0030] exist Figures 1 to 5 Reference numerals in the drawings include:

[0031] 1-structure to be powered, 2-substrate, 8-metal point, 14-terminal, 23-soldering pad, 24-fixed component. DETAILED DESCRIPTION

[0032] In order to facilitate the understanding of those skilled in the art, the present invention is further described below in conjunction with the embodiments and drawings, and the contents mentioned in the implementation modes are not intended to limit the present invention. The present invention is described in detail below in conjunction with the drawings.

[0033] Embodiment 1:

[0034] This embodiment provides a solder-free circuit board, such as Figure 1 , including a substrate 2 and a pad 23 arranged on the substrate 2, the pad 23 is fixed with a metal point 8, the metal point 8 is used to contact with an external structure to achieve electrical connection, and the surface of the metal point 8 is an arc surface.

[0035] like Figure 2 As shown, a corresponding soldering pad 23 is provided on the substrate 2. During production, a corresponding amount of tin is first placed on the soldering pad 23, and then the substrate 2 with tin is subjected to reflow soldering. The tin melts during the reflow soldering process, and the melting process forms an arc-shaped outer surface on the soldering pad 23 based on the characteristics of the liquid. Therefore, after the reflow soldering is completed, a convex point is formed on the soldering pad 23. The reflow soldering process can ensure the contact between the metal point 8 and the soldering pad 23, avoid the occurrence of cold soldering, false soldering, etc. The production automation degree is high, and the production efficiency can be improved.

[0036] Furthermore, the shape of the axial cross section of the metal point 8 is similar to a hemisphere, and the surface of the metal point 8 is provided with a coating, namely an anti-oxidation coating (not shown in the drawings), which can prevent poor contact caused by oxidation of the surface of the metal point 8.

[0037] like Figures 1 to 4As shown, the two metal points 8 are mainly used for power supply, so they are set as positive and negative poles. Preferably, the two metal points 8 are located on the same side of the substrate 2. After the present embodiment is installed in the electronic device, the fixing component 24 provided on the electronic device can be in contact with the other side of the substrate 2, so that the metal points 8 can stably contact the positive and negative poles of the structure to be powered 1 of the electronic device, thereby achieving the purpose of power supply. Of course, the metal points 8 can contact with the external electronic device to transmit other electronic signals, which is not limited in the present embodiment. Among them, the substrate 2 can be connected to the external power supply through the wiring terminal 14 by installing the wiring terminal 14. The wiring terminal 14 is a prior art and is not specifically limited in the present embodiment.

[0038] For example, the wiring element for LED electrical connection disclosed in patent CN200810184925.0 adopts a power supply method of spring connection, and deformation occurs during the contact process of the spring, thereby ensuring the contact between the spring and the light source to achieve power supply. In this embodiment, power supply is achieved by contact between the metal point 8 and the positive and negative electrodes of the light source, that is, the contact method adopted in this embodiment is hard contact, and the metal point 8 will not be deformed. Therefore, in actual assembly, there is no need to control the degree of deformation, and there is no need to worry about the problem of poor contact caused by deformation changes over time. The metal point 8 can maintain contact with the positive and negative electrodes of the light source with the assistance of the fixing component. In addition, the metal point 8 is a point, and the positive and negative electrode pads of the light source are surfaces. The contact between the point and the surface has a certain contact area, that is, even if the metal point 8 is displaced to a certain extent, it will not affect the contact between the metal point 8 and the pad, thereby ensuring the stability of the contact.

[0039] Embodiment 2:

[0040] This embodiment provides an electronic device, including the solder-free circuit board of the first embodiment. The electronic device includes a housing, and a fixing component 24 and a structure to be powered 1 are arranged in the housing.

[0041] The fixing assembly 24 may be mounted on the housing, such as a card block structure integrally molded on the housing. Figure 3 and Figure 4 As shown, it can also be an elastic part installed in the housing, such as a rubber pad, a spring, etc., as long as it can be abutted against the solder-free circuit board.

[0042] The structure to be powered 1, such as a light source in a lamp, is provided with a positive terminal and a negative terminal for connecting to a power supply. It may also be a structure in other electronic products that require power supply, which is not limited in this embodiment.

[0043] The solder-free circuit board is assembled in the housing, and the fixing component 24 abuts against one side of the substrate 2, such as Figure 3 and Figure 4As shown, the fixing component 24, the solder-free circuit board and the structure to be powered 1 are arranged in sequence, and the fixing component 24 applies a rightward force to the substrate 2. The metal point 8 on the other side of the substrate 2 conflicts with the structure to be powered 1, and the position of the structure to be powered 1 is fixed. Therefore, the force applied to the substrate 2 by the fixing component 24 can make the contact between the substrate 2 and the structure to be powered 1 more stable, thereby ensuring the stable contact between the metal point 8 and the structure to be powered 1 and the stable transmission of the electrical signal.

[0044] For example, in lamps using COB light sources, the structure of COB is as follows: Figure 5 As shown, the prior art for the installation and power supply of COB light sources refers to the COB bracket disclosed in patent CN201620634420.X, in which the COB light source is installed on the bracket, and then the positive and negative electrodes of the COB light source are contacted by metal shrapnel, and then the metal shrapnel is connected to the external power supply to achieve the purpose of powering the COB light source. This structure requires the installation of metal shrapnel, and a slot dedicated to the installation of metal shrapnel needs to be set on the bracket. The shrapnel needs to be installed and fixed to ensure stable power supply. The shrapnel structure is relatively small, and the production and installation process will lead to inefficiency. The shrapnel is easy to lose, and the shrapnel is prone to oxidation after a long period of use. Furthermore, the production and assembly of the shrapnel requires manual participation, that is, it is difficult to achieve fully automatic production if the shrapnel structure is adopted. In this embodiment, a circuit board is added, and there is no need to use springs. The circuit board is larger than the springs and is easier to install. In actual production, the components on the circuit board can be automatically assembled by a placement machine, and the circuit board assembly method is simpler and can be assembled into electronic products through automated equipment. In other words, this embodiment can achieve fully automatic production, which helps to improve production efficiency and production quality, and power supply can be achieved as long as the metal point 8 of the circuit board is in contact with the positive and negative poles of the light source. The circuit board is then contacted and fixed by a fixing component set on the outer casing to ensure the stability of power supply. The application of circuit boards in COB light source lamps can effectively improve production efficiency and can be used for a long time with more stable power supply.

[0045] The above is only a preferred embodiment of the utility model, and does not limit the utility model in any form. Although the utility model is disclosed as a preferred embodiment as above, it is not used to limit the utility model. Any technician familiar with this profession can make some changes or modifications to equivalent embodiments of equivalent changes by using the technical content disclosed above without departing from the scope of the technical solution of the utility model. However, any simple modification, equivalent change and modification made to the above embodiments according to the technology of the utility model, which does not depart from the content of the technical solution of the utility model, belongs to the scope of the technical solution of the utility model.

Claims

1. A solder-free circuit board, characterized in that: The invention comprises a substrate and a pad arranged on the substrate, wherein the pad is fixed with a metal point, the metal point is used to contact with an external structure to realize electrical connection, and the surface of the metal point is a curved surface.

2. A solder-free circuit board according to claim 1, characterized in that: The metal dots are in a hemispherical shape.

3. The solder-free circuit board according to claim 1, characterized in that: The metal dots are tin dots.

4. The solder-free circuit board according to claim 1, characterized in that: At least two metal points are provided, and the two metal points are located on the same side of the substrate. The other side of the substrate is supported by the external structure so that the two metal points can stably contact the external structure.

5. The solder-free circuit board according to claim 1, characterized in that: The substrate is provided with connection terminals, the connection terminals are connected to metal point signals, and the connection terminals are used to connect to external power supply.

6. The solder-free circuit board according to claim 1, characterized in that: The surface of the metal point is provided with an anti-oxidation coating.

7. An electronic device, characterized in that: A solder-free circuit board comprising any one of claims 1 to 6.

8. An electronic device according to claim 7, characterized in that: It comprises a fixing component and a structure to be powered, wherein the structure to be powered is provided with a positive terminal and a negative terminal, and the fixing component is used to abut against the other side of the substrate so that two metal points are respectively in contact with the positive terminal and the negative terminal.

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