Spraying structure for wafer glass slide wet process mass thinning

Abstract

The utility model provides a spraying structure for wafer glass slide wet process mass thinning, and relates to the field of spraying structures, the spraying structure comprises a spraying assembly and a water return assembly, the spraying assembly is arranged on the upper side of a wafer grinding table, the spraying assembly comprises a shaft sleeve fixed on the upper end of the wafer grinding table, the upper end of the shaft sleeve is rotatably connected with a rotating pipe, and the water return assembly is connected with the rotating pipe. The outer wall of the rotating pipe is connected with a water distribution disc, the outer wall of the water distribution disc is connected with a horizontal pipe, the outer end of the horizontal pipe is connected with a spraying pipe, the water return assembly is arranged on the lower side of the wafer grinding table and comprises a water receiving disc located on the lower side of the wafer grinding table, and a filtering hopper is arranged in the water receiving disc. The lower side of the water pan is connected with a water tank, the upper end of the water tank is connected with a water pump, and the water outlet end of the water pump is connected to the rotating pipe through a pipeline. The wafer grinding device solves the problems that a spraying mechanism related to an existing wafer grinding device has use functionality deviation, and cooling liquid cannot be recycled.

Description

Technical Field

[0001] The utility model relates to the technical field of spray structures, in particular to a spray structure for wet mass thinning of wafer glass carriers. Background Art

[0002] Silicon wafers, also known as wafers, are processed and manufactured on the wafers with various circuit element structures and interconnected according to certain circuits, and then packaged in a tube shell to become semiconductor chips with specific electrical functions. Before the wafer is divided into semiconductors, it needs to be thinned, that is, the side of the wafer that does not contain circuit elements is ground and thinned to the target thickness to meet the packaging requirements. After searching, the prior art (publication number: CN220372848U) records "a wafer thickness measuring device and a grinder. The wafer thickness measuring device includes a base, a measuring mechanism and a spraying mechanism. The base can be connected to a fixed structure; the measuring mechanism includes a first measuring head and a second measuring head. The first measuring head can be raised and lowered to contact the turntable of the grinder to measure the height of the upper surface of the turntable. The second measuring head can be raised and lowered to contact the wafer placed on the turntable to measure the height of the upper surface of the wafer; the spraying mechanism includes a first spraying assembly. The first spraying assembly can be selectively connected to a liquid storage source. The liquid in the liquid storage source can be sprayed on the first measuring head and the second measuring head through the first spraying assembly. The wafer thickness measuring device and the grinder can measure the thickness of the wafer in real time, and can cool and clean the first measuring head and the second measuring head of the measuring mechanism at the same time, so as to ensure the measurement accuracy of the measuring mechanism and extend the service life of the measuring mechanism."

[0003] Although the spray mechanism involved in the wafer thickness measuring device and the grinder in the prior art has achieved cleaning and cooling, there are still some shortcomings: when in use, the spray mechanism involved in the existing wafer thickness measuring device and the grinder can only spray and cool down a wafer in a grinding process and cannot be used for spraying and cooling multiple wafers. At the same time, it is impossible to continue spraying for continuous cooling after grinding, resulting in slow natural cooling efficiency. Secondly, the coolant after spraying cannot be recycled, resulting in waste. Utility Model Content

[0004] In order to overcome the defects of the prior art, a spray structure for wet mass thinning of wafer glass carrier is provided to solve the problem that the spray mechanism involved in the existing wafer grinding device has functional deviation in use and cannot realize the reuse of cooling liquid.

[0005] To achieve the above-mentioned purpose, a spray structure for wet mass thinning of wafer glass carrier is provided, including: a spray component and a return water component, the spray component is arranged on the upper side of the wafer grinding table, and the spray component includes a sleeve fixed on the upper end of the wafer grinding table, and the upper end of the sleeve is rotatably connected to a rotating tube, the outer wall of the rotating tube is connected to a water distribution tray, and the outer wall of the water distribution tray is connected to a horizontal tube, and the outer end of the horizontal tube is connected to a spray pipe, the return water component is arranged on the lower side of the wafer grinding table, and the return water component includes a water receiving tray located on the lower side of the wafer grinding table, and a filter bucket is provided inside the water receiving tray, and at the same time, a water tank is connected to the lower side of the water receiving tray, and a water pump is connected to the upper end of the water tank, and the water outlet end of the water pump is connected to the rotating tube through a pipeline.

[0006] Furthermore, the upper end of the rotating tube is connected to a connecting vertical pipe through a rotating joint, and the connecting vertical pipe is connected to a water pump through a pipeline.

[0007] Furthermore, a first through hole is formed on the outer wall of the rotating tube, and a water distribution tray is connected to the outer side of the first through hole, and a buffer cavity is formed inside the water distribution tray, and a second through hole is formed on the outer wall of the water distribution tray.

[0008] Furthermore, the horizontal tubes are provided in four groups which are arranged equidistantly along the circumferential direction of the water distribution tray, and the inner ends of the horizontal tubes are connected to the second through holes.

[0009] Furthermore, the shaft sleeve is fixed at the center of the wafer grinding table, and a locking bolt is screwed on the outer wall of the shaft sleeve.

[0010] Furthermore, the filter bucket includes an edge, and the lower end of the edge is connected to a conical bucket body, and the inner bottom of the conical bucket body is provided with a filter bottom.

[0011] Furthermore, a water filter hole is opened inside the water receiving tray, and the filter bucket is inserted into the water filter hole. At the same time, a water pipe is connected to the lower side of the water filter hole, and the lower end of the water pipe is connected to a collecting pipe, and the outer end of the collecting pipe is connected to the water tank.

[0012] The beneficial effects of the utility model are:

[0013] 1. When in use, the water pump is started to facilitate the delivery of coolant to the spray assembly, and then the coolant can be sprayed out through multiple horizontal pipes and nozzles through the rotating pipe and the water distribution tray, so that it is suitable for multiple grinding wheels to thin wafers at the same time. Then, in normal use, part of the nozzles can be used for continued cooling after grinding, that is, through the rotation of the grinding table, the ground wafer is rotated to the lower side of the spare part of the nozzle, so as to achieve continued spray cooling, thereby improving the cooling speed of the ground wafer;

[0014] 2. During the spraying process, the coolant flowing down the grinding table enters the water receiving tray from the edge of the grinding table, and then is filtered through the filter bucket to intercept the ground impurities. The filtered coolant flows into the water tank through the downpipe and the collecting pipe, and then is continuously extracted and used by the water pump, thus realizing the recycling effect of the coolant and reducing the waste of the coolant. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the utility model.

[0016] Figure 2 It is a schematic diagram of the three-dimensional structure of the spray assembly of an embodiment of the utility model.

[0017] Figure 3 This is a schematic diagram of the cross-sectional structure of a water distribution tray according to an embodiment of the utility model.

[0018] Figure 4 This is a schematic diagram of the filter bucket structure of an embodiment of the utility model.

[0019] In the figure: 1. spray assembly; 11. connecting vertical pipe; 12. rotating joint; 13. rotating pipe; 131. first through hole; 14. water distribution tray; 141. buffer chamber; 142. second through hole; 15. horizontal pipe; 16. spray pipe; 17. bushing; 18. locking bolt; 2. return water assembly; 21. water tank; 22. water pump; 23. collecting pipe; 24. downpipe; 25. water receiving tray; 26. filter bucket; 261. edge; 262. bucket body; 263. filter bottom. DETAILED DESCRIPTION

[0020] Reference Figures 1 to 4 As shown, the utility model provides a spray structure for wet mass thinning of wafer glass carriers, including: a spray component 1 and a return water component 2, the spray component 1 is arranged on the upper side of the wafer grinding table, and the spray component 1 includes a shaft sleeve 17 fixed on the upper end of the wafer grinding table, and the upper end of the shaft sleeve 17 is rotatably connected to a rotating tube 13, the outer wall of the rotating tube 13 is connected to a water distribution tray 14, and the outer wall of the water distribution tray 14 is connected to a horizontal tube 15, and the outer end of the horizontal tube 15 is connected to a spray pipe 16, the return water component 2 is arranged on the lower side of the wafer grinding table, and the return water component 2 includes a water receiving tray 25 located on the lower side of the wafer grinding table, and a filter bucket 26 is provided inside the water receiving tray 25, and at the same time, a water tank 21 is connected to the lower side of the water receiving tray 25, and a water pump 22 is connected to the upper end of the water tank 21, and the water outlet end of the water pump 22 is connected to the rotating tube 13 through a pipeline.

[0021] In this embodiment, the spray component 1 and the return water component 2 constitute the main structure of the spray structure for wet mass thinning of the wafer glass carrier involved in this application, which is used for cooling during the wafer thinning and grinding process and for flushing impurities ground on the wafer surface.

[0022] Specifically, a rotating shaft is provided at the bottom of the grinding table, and a suction cup is provided on the upper end surface of the grinding table to facilitate the fixation of the wafer. Then at least two sets of grinding wheels are provided on the upper side of the grinding table, and the positions of the grinding wheels correspond to the upper and lower suction cups.

[0023] Specifically, a plurality of heat dissipation holes are provided at the upper end of the water tank 21 to dissipate the heat of the returning coolant.

[0024] like Figure 2 and Figure 3 As shown, the upper end of the rotating tube 13 is connected to the connecting vertical pipe 11 through the rotating joint 12, and the connecting vertical pipe 11 is connected to the water pump 22 through a pipeline, the outer wall of the rotating tube 13 is provided with a first through hole 131, and the water distribution tray 14 is connected to the outside of the first through hole 131, and the inside of the water distribution tray 14 is provided with a buffer cavity 141, and the outer wall of the water distribution tray 14 is provided with a second through hole 142, and the horizontal tube 15 is provided with four groups of equidistantly arranged along the circumferential direction of the water distribution tray 14, and the inner end of the horizontal tube 15 is connected to the second through hole 142, the sleeve 17 is fixed at the center of the wafer grinding table, and the outer wall of the sleeve 17 is screwed with a locking bolt 18.

[0025] Specifically, the water distribution tray 14 is configured as a hollow disc structure to achieve water flow to multiple groups of horizontal pipes 15 .

[0026] As a preferred embodiment, by providing the shaft sleeve 17 and the locking bolt 18 , the angle of the rotating tube 13 can be adjusted, thereby adjusting the angle of the nozzle 16 , and then fixed by the locking bolt 18 .

[0027] like Figure 1 and Figure 4 As shown, the filter bucket 26 includes an edge 261, and the lower end of the edge 261 is connected to a conical bucket body 262, and the inner bottom of the conical bucket body 262 is provided with a filter bottom 263, a water filter hole is opened inside the water receiving tray 25, and the filter bucket 26 is inserted into the water filter hole, and a water pipe 24 is connected to the lower side of the water filter hole, and the lower end of the water pipe 24 is connected to a collecting pipe 23, and the outer end of the collecting pipe 23 is connected to the water tank 21.

[0028] As a preferred embodiment, a filter bucket 26 is provided to collect the coolant after the process, and then the filter bucket 26 is directly placed in the water filter hole through the edge 261. At this time, the bucket body 262 is placed inside the sewer pipe 24, so that it is convenient to directly take out the filter bucket 26 and clean the impurities inside.

[0029] When in use, the coolant is conveniently transported to the spray assembly by starting the water pump, and then the coolant can be sprayed out through multiple horizontal pipes and nozzles through the rotating pipe and the water distribution tray, so that it is suitable for multiple grinding wheels to thin the wafers at the same time. Then, in normal use, some nozzles can also be used for continued cooling after grinding, that is, through the rotation of the grinding table, the ground wafers are rotated to the lower side of some spare nozzles, so as to achieve continued spray cooling. During the spraying process, the coolant flowing down the grinding table enters the water receiving tray from the edge of the grinding table, and then is filtered through the filter bucket to intercept the impurities of grinding. The filtered coolant flows to the water tank through the downpipe and the collecting pipe, and then is continuously extracted and used by the water pump.

[0030] The spray structure for wet mass thinning of glass wafer carriers of the utility model can effectively solve the problems that the spray mechanism involved in the existing wafer grinding device has deviation in usage functionality and cannot realize the reuse of cooling liquid. It increases the functionality of the spray mechanism on the basis of the existing technology of the spray structure for wet mass thinning of glass wafer carriers and realizes the reuse effect of cooling liquid.

Claims

1. A spray structure for wet mass thinning of a wafer glass carrier, comprising: The spray assembly (1) and the return water assembly (2) are characterized in that: the spray assembly (1) is arranged on the upper side of the wafer grinding table, and the spray assembly (1) includes a shaft sleeve (17) fixed on the upper end of the wafer grinding table, and the upper end of the shaft sleeve (17) is rotatably connected to a rotating tube (13), the outer wall of the rotating tube (13) is connected to a water distribution tray (14), and the outer wall of the water distribution tray (14) is connected to a horizontal tube (15), and the horizontal tube (15) is The outer end is connected to a nozzle (16), the return water assembly (2) is arranged at the lower side of the wafer grinding table, and the return water assembly (2) includes a water receiving tray (25) located at the lower side of the wafer grinding table, and a filter bucket (26) is arranged inside the water receiving tray (25), and the lower side of the water receiving tray (25) is connected to a water tank (21), and the upper end of the water tank (21) is connected to a water pump (22), and the water outlet end of the water pump (22) is connected to the rotating tube (13) through a pipeline.

2. A spray structure for wet mass thinning of a wafer glass carrier according to claim 1, characterized in that: The upper end of the rotating tube (13) is connected to a connecting vertical tube (11) via a rotating joint (12), and the connecting vertical tube (11) is connected to a water pump (22) via a pipeline.

3. The spray structure for wet mass thinning of a wafer glass carrier according to claim 1, characterized in that: The outer wall of the rotating tube (13) is provided with a first through hole (131), and the water distribution tray (14) is connected to the outside of the first through hole (131), and a buffer cavity (141) is provided inside the water distribution tray (14), and a second through hole (142) is provided on the outer wall of the water distribution tray (14).

4. The spray structure for wet mass thinning of a wafer glass carrier according to claim 1, characterized in that: The horizontal tubes (15) are provided in four groups arranged at equal intervals along the circumferential direction of the water distribution tray (14), and the inner ends of the horizontal tubes (15) are connected to the second through holes (142).

5. The spray structure for wet mass thinning of a wafer glass carrier according to claim 1, characterized in that: The shaft sleeve (17) is fixed at the center of the wafer grinding table, and a locking bolt (18) is screwed onto the outer wall of the shaft sleeve (17).

6. The spray structure for wet mass thinning of a wafer glass carrier according to claim 1, characterized in that: The filter bucket (26) comprises an edge (261), and the lower end of the edge (261) is connected to a conical bucket body (262), and the inner bottom of the conical bucket body (262) is provided with a filter screen bottom (263).

7. The spray structure for wet mass thinning of a wafer glass carrier according to claim 1, characterized in that: The water receiving tray (25) is provided with a water filter hole inside, and the filter bucket (26) is inserted into the water filter hole. A water down pipe (24) is connected to the lower side of the water filter hole, and the lower end of the water down pipe (24) is connected to a collecting pipe (23), and the outer end of the collecting pipe (23) is connected to the water tank (21).

Images