Spliced large-area target material

Abstract

The utility model discloses a spliced large-area target material, and relates to the technical field of vacuum coating, and the spliced large-area target material comprises a back plate and target material units; the target material unit is fixedly adhered to one surface of the back plate through an adhesive and is formed by splicing a plurality of target material splicing blocks; and a splicing surface for splicing and matching on each target material splicing block is an inclined surface. The back plate is used as a carrier, the target material splicing blocks are spliced to form the target material unit, and then the target material unit is fixedly adhered to the back plate through an adhesive. A small-area single-crystal target material is cut into target material splicing blocks in a certain form, then the target material splicing blocks are spliced to manufacture a large-area high-purity target material unit, and the design can meet the machining requirement of any size and the high-purity requirement. And moreover, the splicing surface for splicing and matching on each target material splicing block is designed to be an inclined surface, so that the splicing requirement can be met, the problem that a bottom binder is sputtered out can be avoided, and further coating pollution is avoided.

Description

Technical Field

[0001] The present application relates to the field of vacuum coating technology, and in particular to a spliced ​​large-area target material. Background Art

[0002] In the production process of mercury cadmium telluride infrared detector chips, sputtering coating of cadmium telluride thin film is a conventional process, in which cadmium telluride target is an important raw material.

[0003] There are usually two types of materials for cadmium telluride targets. One is to use cadmium telluride powder to make cadmium telluride targets by powder pressing. It has the advantages of wide processing area, convenient processing and low cost, but also has the disadvantage of low purity. The other is to use single crystal cadmium telluride material to make cadmium telluride targets by cutting. It has the characteristics of high purity, but the target area is limited by the processing method of cadmium telluride single crystal material. Usually, only 4-6 inches of cadmium telluride target surface can be made, which cannot meet the current magnetron sputtering process for large-area target material requirements. For this reason, it is urgent to provide a new design solution that meets both the large-area target material requirements and the high purity requirements. Utility Model Content

[0004] In view of this, the purpose of this application is to provide a spliced ​​large-area target material that meets both the demand for large-area targets and the demand for high purity.

[0005] In order to achieve the above technical purpose, the present application provides a spliced ​​large-area target material, including a back plate and a target material unit;

[0006] The target material unit is bonded to one surface of the back plate by an adhesive and is composed of a plurality of target material splicing blocks;

[0007] The splicing surfaces on each of the target material splicing blocks used for splicing and matching are inclined surfaces.

[0008] Furthermore, the adhesive is provided on one side of the back plate and has a thickness of 1 mm to 3 mm;

[0009] The target unit is fixedly connected to the back plate via the adhesive.

[0010] Furthermore, the binder is made of indium material.

[0011] Furthermore, each of the target material splicing blocks has a cross-section that is polygonal, quasi-polygonal or fan-shaped.

[0012] Furthermore, the inclination angle of the joint surface is 45° to 80°.

[0013] Furthermore, a positioning groove is provided on one side of the back plate;

[0014] The target unit is fixed in the positioning groove.

[0015] Furthermore, a screw hole is provided on one side of the back plate at a position outside the target unit.

[0016] Furthermore, there are multiple screw holes, which are distributed around the circumference of the target unit.

[0017] Furthermore, the back plate is made of copper material;

[0018] The back plate has a thickness of 3 mm to 8 mm.

[0019] Furthermore, the target material splicing block has a thickness of 3 mm to 20 mm.

[0020] It can be seen from the above technical scheme that the splicing type large-area target material designed in this application uses a back plate as a carrier, assembles multiple target material splicing blocks to form a target material unit, and then adheres it to the back plate with an adhesive. By cutting a small-area single crystal target material into a certain shape to form a target material splicing block and then assembling it to make a large-area high-purity target material unit, this design can meet the processing requirements of any size and high purity requirements. Moreover, the splicing surface on each target material splicing block used for splicing is designed as an inclined surface, which can not only meet the splicing requirements, but also avoid the problem of sputtering of the bottom adhesive, thereby avoiding coating contamination. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0022] Figure 1 This is a front view of a spliced ​​large-area target provided in this application;

[0023] Figure 2 A top view of a spliced ​​large-area target provided in this application;

[0024] Figure 3 A top view of a back plate of a spliced ​​large-area target provided in the present application;

[0025] In the figure: 1. back plate; 11. positioning groove; 12. screw hole; 2. adhesive; 3. target unit; 31. target splicing block. DETAILED DESCRIPTION

[0026] The technical solutions of the embodiments of the present application will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present application, not all of them. All other embodiments obtained by ordinary technicians in this field without creative work based on the embodiments in the embodiments of the present application are within the scope of protection of the embodiments of the present application.

[0027] In the description of the embodiments of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0028] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a replaceable connection, or an integral connection, it can be a mechanical connection, it can be an electrical connection, it can be a direct connection, it can be indirectly connected through an intermediate medium, and it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0029] The embodiment of the present application discloses a spliced ​​large-area target material.

[0030] See also Figure 1 , an embodiment of a spliced ​​large-area target material provided in the embodiments of the present application includes:

[0031] The back plate 1 and the target unit 3 are bonded to one surface of the back plate 1 by the adhesive 2, and are assembled from a plurality of target splicing blocks 31. The target splicing block 31 is the main part of the target unit 3, and the adhesive 2 is the bonding material that bonds the target splicing block 31 to the back plate 1. The back plate 1 is used as a carrier of the target unit 3, and is a connector that connects and fixes the prepared spliced ​​large-area target to the machine equipment.

[0032] Using the back plate 1 as a carrier, multiple target material splicing blocks 31 are assembled to form a target material unit 3, and then fixed to the back plate 1 by an adhesive 2. By cutting a small-area single-crystal cadmium telluride target material into a target material splicing block 31 through a certain shape and then assembling it to make a large-area high-purity target material unit 3, this design can meet the processing requirements of any size and high purity requirements. Single-crystal cadmium telluride target materials are usually grown by pulling single crystals, and their size depends on the growth process, usually a 2-6 inch cylindrical single crystal. In this application, a 6-inch single-crystal cadmium telluride single crystal block can be made into a 10-inch large-area single-crystal cadmium telluride target by cutting and splicing. Of course, it is not limited to the target material and the splicing size. Those skilled in the art can change the design according to actual needs.

[0033] When each target material splicing block 31 is vertically spliced, a processing gap will be generated, and this gap is easy to sputter out the adhesive 2 or the back plate 1 material during sputtering coating, resulting in film contamination of the sputtering coating. To solve this problem, the present application designs the splicing surface used for splicing and matching on each target material splicing block 31 as an inclined surface. This design of splicing together in a slanted overlap manner can not only meet the splicing requirements, but also avoid the problem of sputtering the bottom adhesive 2, thereby avoiding coating contamination. In the present application, the splicing surface is inclined relative to one side of the back plate 1, that is, it is not perpendicular to one side of the back plate 1.

[0034] The above is an embodiment of a spliced ​​large-area target provided in the embodiment of the present application. The following is an embodiment of a spliced ​​large-area target provided in the embodiment of the present application. For details, please refer to Figures 1 to 3 .

[0035] Based on the solution of the above embodiment 1:

[0036] Furthermore, the adhesive 2 is disposed on one side of the back plate 1 and has a thickness of 1 mm to 3 mm. The target unit 3 is fixedly connected to the back plate 1 via the adhesive 2 .

[0037] Furthermore, the adhesive 2 is preferably made of indium material, that is, indium adhesive material, which has the following characteristics: low melting point, high thermal conductivity, non-volatility, and is easy to bond materials together after heating and cooling, without specific limitation.

[0038] Furthermore, each target material splicing block 31 has a polygonal, quasi-polygonal or fan-shaped cross section, and the specific shape can be comprehensively designed according to the size of the original target material, the size of the required large-area target material, material utilization, processing technology capabilities, etc., without limitation.

[0039] like Figure 1 as well as Figure 2As shown, taking the circular design of the target unit 3 as an example, the multiple target splicing blocks 31 can be divided into three shape designs, one is a hexagonal design located in the middle, one is a quasi-hexagonal design surrounding the hexagonal design in the middle, and a quasi-sector-shaped design located between two adjacent quasi-hexagonal designs. The above shape combination design can effectively improve material utilization and reduce material waste.

[0040] Furthermore, the inclination angle of the splicing surface is 45° to 80°, and there is no specific limitation.

[0041] Furthermore, in order to better perform positioning and installation, a positioning groove 11 is provided on one side of the back plate 1 , and the target unit 3 is fixed in the positioning groove 11 .

[0042] Furthermore, a screw hole 12 is provided on one side of the back plate 1 outside the target unit 3, and the diameter of the screw hole 12 may be 5.3 mm, and there is no specific limitation. The screw hole 12 is provided to facilitate the connection and fixation of the back plate 1 with the machine equipment.

[0043] Furthermore, there are multiple screw holes 12 distributed around the circumference of the target unit 3, which further improves the reliability of the fixed connection.

[0044] Furthermore, in the present application, the back plate 1 can be made of copper material, and the thickness of the back plate 1 is 3 mm to 8 mm, without any specific limitation.

[0045] Furthermore, the target material splicing block 31 in the present application may have a thickness of 3 mm to 20 mm, without any specific limitation.

[0046] The spliced ​​large-area target designed in the present application effectively increases the uniformity of the equipment coating due to the increased target area.

[0047] The above is a detailed introduction to a spliced ​​large-area target material provided in the present application. For a person skilled in the art, according to the idea of ​​the embodiments of the present application, there may be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A spliced ​​large-area target, characterized in that: It comprises a back plate (1) and a target unit (3); The target material unit (3) is bonded to one surface of the back plate (1) by means of an adhesive (2), and is composed of a plurality of target material splicing blocks (31); The splicing surfaces on each of the target material splicing blocks (31) used for splicing and matching are inclined surfaces.

2. A spliced ​​large-area target according to claim 1, characterized in that: The adhesive (2) is disposed on one side of the back plate (1) and has a thickness of 1 mm to 3 mm; The target unit (3) is fixedly connected to the back plate (1) via the adhesive (2).

3. A spliced ​​large-area target according to claim 2, characterized in that: The binder (2) is made of indium material.

4. A spliced ​​large-area target according to claim 1, characterized in that: Each target material splicing block (31) has a polygonal or fan-shaped cross section.

5. The spliced ​​large-area target according to claim 1, characterized in that: The inclination angle of the splicing surface is 45° to 80°.

6. The spliced ​​large-area target according to claim 1, characterized in that: A positioning groove (11) is provided on one side of the back plate (1); The target unit (3) is fixed in the positioning groove (11).

7. The spliced ​​large-area target according to claim 1, characterized in that: A screw hole (12) is provided on one side of the back plate (1) at a position outside the target unit (3).

8. The spliced ​​large-area target according to claim 7, characterized in that: There are a plurality of screw holes (12), which are distributed around the circumference of the target unit (3).

9. The spliced ​​large-area target according to claim 1, characterized in that: The back plate (1) is made of copper material; The back plate (1) has a thickness of 3 mm to 8 mm.

10. The spliced ​​large-area target according to claim 1, characterized in that: The target material splicing block (31) has a thickness of 3 mm to 20 mm.

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