Wafer bearing table assembly and probe table

Abstract

The utility model provides a wafer bearing table assembly and a probe table. The wafer bearing table assembly comprises a wafer bearing table, wherein the wafer bearing table is provided with a bearing surface; the first moving assembly comprises a first driving piece, a first guiding piece and a first calibrating piece, the first calibrating piece is used for calibrating the position of the first guiding piece, the first guiding piece is used for guiding the wafer bearing table, and the first driving piece is matched with the first guiding piece to drive the wafer bearing table to move in the first direction; the second moving assembly is arranged on the side, away from the wafer bearing table, of the first moving assembly, the second moving assembly comprises a second driving part, a second guiding part and a second calibration part, the second calibration part is used for calibrating the position of the second guiding part, and the second guiding part is used for guiding the wafer bearing table; and the second driving piece is matched with the second guiding piece to drive the wafer bearing table to move in the second direction, so that the high precision of movement of the wafer bearing table is ensured.

Description

Technical Field

[0001] The present application relates to the technical field of wafer detection, and in particular to a wafer carrier assembly and a probe station. Background Art

[0002] The probe station is an important device for testing the electrical performance of semiconductor devices. The probe station usually includes components such as a stage, a wafer carrier, and a probe card. The wafer carrier can carry and fix the wafer to be tested, and the probe card can test the wafer carried by the wafer carrier. The probe station is usually equipped with a moving component to drive the wafer carrier to move.

[0003] However, conventional moving components use a lead screw motor to drive the movement of the wafer carrier. Since the lead screw motor has low positioning accuracy and limited rotation speed, the movement accuracy and speed of the probe station are low. Utility Model Content

[0004] In view of this, the present application provides a wafer carrier assembly and a probe station to improve the movement accuracy and speed of the wafer carrier.

[0005] In a first aspect, the present application provides a wafer carrier assembly, the wafer carrier assembly comprising:

[0006] A wafer carrying platform, wherein the wafer carrying platform has a carrying surface, and the carrying surface is used to carry the wafer;

[0007] a first moving component, the first moving component is arranged on a side of the wafer carrying platform away from the carrying surface, the first moving component comprises a first driving member, a first guiding member and a first calibrating member, the first calibrating member is used to calibrate the position of the first guiding member, the first guiding member is used to guide the wafer carrying platform, and the first driving member cooperates with the first guiding member to drive the wafer carrying platform to move along a first direction; and

[0008] A second movable component, the second movable component is arranged on a side of the first movable component away from the wafer carrier, the second movable component includes a second driving member, a second guiding member and a second calibration member, the second calibration member is used to calibrate the position of the second guiding member, the second guiding member is used to guide the wafer carrier, and the second driving member cooperates with the second guiding member to drive the wafer carrier to move along a second direction, and the second direction is perpendicular to the first direction.

[0009] Wherein, the first calibration member includes a first rotating member and a first extruding member, the first rotating member is disposed adjacent to the first guiding member, and the first extruding member is sandwiched between the first guiding member and the first rotating member;

[0010] The first rotating member can rotate along a third direction and in an opposite direction to the third direction. When the first rotating member rotates along the third direction, the first rotating member squeezes the first guiding member through the first squeezing member and moves the position of the first guiding member.

[0011] Wherein, the second calibration member comprises a second rotating member and a second extruding member, the second rotating member is arranged adjacent to the second guiding member, and the second extruding member is sandwiched between the second guiding member and the second rotating member;

[0012] The second rotating member can rotate along the third direction and the opposite direction of the third direction. When the second rotating member rotates along the third direction, the second rotating member squeezes the second guide member through the second squeezing member and moves the position of the second guide member.

[0013] Wherein, the first movable component includes a plurality of first calibration parts, and the plurality of first calibration parts are arranged on two opposite sides of the first guide member, and the second movable component includes a plurality of second calibration parts, and the plurality of second calibration parts are arranged on two opposite sides of the second guide member.

[0014] The first driving member includes a first linear motor, the first linear motor includes a first stator and a first mover which are arranged opposite to each other, the first mover is fixed to a side of the wafer carrier adjacent to the first stator, and the first stator is used to drive the first mover and the wafer carrier to move along a first direction;

[0015] The second driving member includes a second linear motor, which includes a second stator and a second mover that are arranged opposite to each other. The second mover is fixed to a side of the first moving component adjacent to the second stator, and the second stator is used to drive the second mover to move along the second direction.

[0016] The first guide member includes a first slider and a first guide rail, the first guide rail extends along the first direction, one side of the first slider is fixedly connected to the wafer carrier, and the other end of the first slider is slidably connected to the first guide rail;

[0017] The second guide member includes a second slider and a second guide rail, the second guide rail extends along the second direction, one side of the second slider is fixedly connected to the first moving component, and the other side of the second slider is slidably connected to the second guide rail.

[0018] Among them, the wafer carrier assembly also includes a first carrier plate and a second carrier plate, the first carrier plate is arranged on the side of the first movable assembly away from the wafer carrier, and is used to carry the first movable assembly and the wafer carrier, the second carrier plate is arranged on the side of the first carrier plate away from the first movable assembly, and is used to carry the second movable assembly.

[0019] Wherein, the first moving component further includes a plurality of buffer components, the plurality of buffer components are carried on the first carrying plate, and the plurality of buffer components are arranged on two opposite sides of the wafer carrying platform along a first direction.

[0020] The wafer carrier assembly further includes a first sensor assembly, the first sensor assembly includes a first sensor sheet and a first sensor element, the first sensor sheet is fixed to the wafer carrier, the first sensor element is arranged on the first carrier plate, and the first sensor element is used to obtain position information of the first sensor sheet;

[0021] The wafer carrier assembly also includes a second sensor assembly, which includes a second sensor sheet and a second sensing element. The second sensor sheet is fixed to the first carrier plate, and the second sensing element is arranged on the second carrier plate. The second sensing element is used to obtain position information of the second sensor sheet.

[0022] In a second aspect, the present application also provides a probe station, which includes the wafer carrier assembly.

[0023] The wafer carrier assembly provided in this embodiment uses the first driving member and the first guiding member to cooperate to drive the wafer carrier to move along the first direction, and uses the second driving member and the second guiding member to cooperate to drive the wafer carrier to move along the second direction, so that the wafer carrier can move quickly and smoothly. In addition, the wafer carrier assembly is provided with the first calibration member to calibrate the position of the first guiding member, and the second calibration member to calibrate the position of the second guiding member, so as to ensure the straightness of the first guiding member and the second guiding member, and further enable the wafer carrier to maintain a precise trajectory when moving along the first direction and the second direction, thereby ensuring the high accuracy of the moving position of the wafer carrier and improving the reliability of the wafer carrier assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0025] Figure 1 is a structural schematic diagram of a wafer carrier assembly provided in an embodiment of the present application;

[0026] Figure 2 It is a schematic diagram of the three-dimensional exploded structure of the wafer carrier assembly of the first embodiment of the present application;

[0027] Figure 3 yes Figure 2 A schematic diagram of a partial enlarged structure of a wafer carrier assembly provided in FIG.

[0028] Figure 4 yes Figure 2 A schematic diagram of a partial enlarged structure of a wafer carrier assembly at position b provided in;

[0029] Figure 5 It is a schematic diagram of the three-dimensional exploded structure of the wafer carrier assembly of the second embodiment of the present application;

[0030] Figure 6 It is a schematic diagram of the three-dimensional exploded structure of the wafer carrier assembly of the third embodiment of the present application;

[0031] Figure 7 is a structural schematic diagram of a wafer carrier assembly provided by another embodiment of the present application;

[0032] Figure 8 It is a schematic diagram of the three-dimensional exploded structure of the wafer carrier assembly of the fourth embodiment of the present application;

[0033] Fig. 9 It is a schematic diagram of the three-dimensional exploded structure of the wafer carrier assembly of the fifth embodiment of the present application;

[0034] Fig.10 It is a schematic diagram of the structure of the probe station of an embodiment of the present application.

[0035] Description of reference numerals:

[0036] 1-probe station, 10-wafer carrier assembly, 11-wafer carrier, 12-first moving assembly, 13-second moving assembly, 14-first carrier plate, 15-second carrier plate, 16-first sensor assembly, 17-second sensor assembly, 111-carrying surface, 112-supporting member, 113-wafer carrier body, 121-first driving member, 122-first guide member, 123-first calibration member, 124-buffer member, 131-second driving member, 132-second guide member, 13 3-second calibration part, 161-first sensor plate, 162-first inductive part, 171-second sensor plate, 172-second inductive part, 1211-first stator, 1212-first mover, 1221-first slider, 1222-first guide rail, 1231-first rotating part, 1232-first extrusion part, 1311-second stator, 1312-second mover, 1321-second slider, 1322-second guide rail, 1331-second rotating part, 1332-second extrusion part. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0038] The terms "first", "second", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally includes steps or units that are not listed, or optionally includes other steps or units inherent to these processes, methods, products or devices.

[0039] Reference to "embodiment" or "implementation" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiment or implementation may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0040] Before introducing the technical solution of the present application, the technical problems in the related technology are introduced in detail.

[0041] The probe station is usually equipped with a moving component to drive the wafer carrier to move, and the conventional moving component is usually composed of a lead screw motor. However, during the driving process, due to the complexity of the mechanical structure and the existence of friction, the positioning accuracy of the lead screw motor is often difficult to meet the requirements of high-precision testing. In addition, the speed and acceleration of the lead screw motor are limited by its structure and driving method, resulting in a slow movement speed of the wafer carrier, which affects the test efficiency of the probe station.

[0042] In view of this, in order to solve the above problems, the present application provides a wafer carrier assembly 10. Figure 1 , Figure 2 , Figure 3 and Figure 4 . The wafer carrier assembly 10 of this embodiment includes a wafer carrier 11, a first moving assembly 12 and a second moving assembly 13. The wafer carrier 11 has a carrying surface 111, and the carrying surface 111 is used to carry a wafer. The first moving assembly 12 is arranged on the side of the wafer carrier 11 away from the carrying surface 111, and the first moving assembly 12 includes a first driving member 121, a first guide member 122 and a first calibration member 123, the first calibration member 123 is used to calibrate the position of the first guide member 122, the first guide member 122 is used to guide the wafer carrier 11, and the first driving member 121 cooperates with the first guide member 122 to drive the wafer carrier 11 to move along the first direction X. The second moving component 13 is arranged on the side of the first moving component 12 away from the wafer carrier 11, and the second moving component 13 includes a second driving member 131, a second guide member 132 and a second calibration member 133. The second calibration member 133 is used to calibrate the position of the second guide member 132. The second guide member 132 is used to guide the wafer carrier 11, and the second driving member 131 cooperates with the second guide member 132 to drive the wafer carrier 11 to move along the second direction Y, and the second direction Y is perpendicular to the first direction X.

[0043] Optionally, the wafer carrier assembly 10 is applied to the probe station 1 and is used to carry a wafer for testing. The wafer carrier assembly 10 includes a wafer carrier 11, a first moving assembly 12 and a second moving assembly 13. The wafer carrier 11 has a carrying surface 111 for carrying a wafer. The first moving assembly 12 is arranged on the side of the wafer carrier 11 away from the carrying surface 111, and is used to drive the wafer carrier 11 to move along the first direction X. The second moving assembly 13 is arranged on the side of the first moving assembly 12 away from the wafer carrier 11, and is used to drive the wafer carrier 11 to move along the second direction Y.

[0044] Preferably, the first driving member 121 is a linear motor, which can drive the wafer carrier 11 to reciprocate along the first direction X. Compared with the comparative implementation using a lead screw motor drive, the structure of the linear motor is simpler and has higher positioning accuracy and response speed, so that the wafer carrier 11 can achieve a high-precision and high-speed movement process.

[0045] Optionally, the first guide member 122 includes a first guide rail 1222 extending along the first direction X, and the first guide member 122 is used to assist the movement of the wafer carrier 11 along the first direction X. The first guide member 122 is used in conjunction with the linear motor to provide a stable and precise movement path for the wafer carrier 11, so that the wafer carrier 11 can maintain a stable state when moving along the first direction X.

[0046] Preferably, the first calibration member 123 is arranged adjacent to the first guide member 122. The operator can calibrate the position of the first guide member 122 by adjusting the first calibration member 123, that is, calibrate the straightness of the first guide member 122 along the first direction X, so that the first guide member 122 can keep extending along the first direction X, thereby ensuring the accuracy of the movement of the wafer carrier 11 along the first direction X.

[0047] Preferably, the second driving member 131 is a linear motor, and the linear motor can drive the wafer carrier 11 to reciprocate along the second direction Y. Specifically, the second driving member 131 is arranged on the side of the first moving component 12 away from the wafer carrier 11, and the second driving member 131 can drive the first moving component 12 and the wafer carrier 11 to move along the second direction Y at the same time.

[0048] Optionally, the second guide member 132 includes a second guide rail 1322 extending along the second direction Y, and the second guide member 132 is used to assist the movement of the wafer carrier 11 along the second direction Y. The second guide member 132 is used in conjunction with the linear motor to provide a stable and precise movement path for the wafer carrier 11, so that the wafer carrier 11 can maintain a stable state when moving along the second direction Y.

[0049] Preferably, the second calibration member 133 is arranged adjacent to the second guide member 132. The operator can calibrate the position of the second guide member 132 by adjusting the second calibration member 133, that is, calibrate the straightness of the second guide member 132 along the second direction Y, so that the second guide member 132 can keep extending along the second direction Y, thereby ensuring the accuracy of the movement of the wafer carrier 11 along the second direction Y.

[0050] In summary, the wafer carrier assembly 10 provided in this embodiment uses the first driving member 121 and the first guide member 122 to cooperate to drive the wafer carrier 11 to move along the first direction X, and uses the second driving member 131 and the second guide member 132 to cooperate to drive the wafer carrier 11 to move along the second direction Y, so that the wafer carrier 11 can move quickly and smoothly. In addition, the wafer carrier assembly 10 is provided with the first calibration member 123 to calibrate the position of the first guide member 122, and the second calibration member 133 to calibrate the position of the second guide member 132, so as to ensure the straightness of the first guide member 122 and the second guide member 132, so as to enable the wafer carrier 11 to maintain a precise trajectory when moving along the first direction X and the second direction Y, thereby ensuring the high accuracy of the moving position of the wafer carrier 11 and improving the reliability of the wafer carrier assembly 10.

[0051] Please refer again Figure 3 The first calibration member 123 includes a first rotating member 1231 and a first extruding member 1232. The first rotating member 1231 is disposed adjacent to the first guide member 122, and the first extruding member 1232 is sandwiched between the first guide member 122 and the first rotating member 1231. The first rotating member 1231 can rotate along the third direction R and the opposite direction of the third direction R. When the first rotating member 1231 rotates along the third direction R, the first rotating member 1231 squeezes the first guide member 122 through the first extruding member 1232 and moves the position of the first guide member 122.

[0052] Optionally, the first rotating member 1231 is a screw, and the first extruding member 1232 is a pin.

[0053] Preferably, the first extrusion member 1232 is sandwiched between the first rotating member 1231 and the first guide member 122, the first rotating member 1231 has an inclined surface on a side adjacent to the first rotating member 1231, and the inclined surface of the first rotating member 1231 abuts against the first extrusion member 1232. In other words, one side of the first extrusion member 1232 abuts against the first guide member 122, and the other side of the first extrusion member 1232 abuts against the first rotating member 1231.

[0054] Optionally, the third direction R is clockwise or counterclockwise. When the first rotating member 1231 moves along the third direction R, the first rotating member 1231 abuts against and presses the first extruding member 1232 through the inclined surface, so that the first extruding member 1232 moves along the direction from the first rotating member 1231 to the first guide member 122 .

[0055] In this embodiment, when the operator rotates the first rotating member 1231 along the third direction R, the first rotating member 1231 can squeeze the first extruding member 1232, and the first extruding member 1232 squeezes the first guide member 122, so that the first guide member 122 can move along the direction in which the first rotating member 1231 points to the first guide member 122. Compared with the comparative embodiment in which the operator manually straightens the position of the first guide member 122, the provision of the first calibration member 123 makes the operator's operation process more convenient and more accurate and reliable, and can significantly improve the efficiency of calibration. By adjusting the first calibration member 123, the operator can effectively compensate for the straightness deviation of the first guide member 122 caused by manufacturing errors, installation errors or long-term wear and tear, thereby ensuring that the first guide member 122 can extend along the first direction X and play a precise guiding effect on the movement of the wafer carrier 11 along the first direction X.

[0056] Please refer again Figure 4 The second calibration member 133 includes a second rotating member 1331 and a second extruding member 1332. The second rotating member 1331 is disposed adjacent to the second guide member 132, and the second extruding member 1332 is sandwiched between the second guide member 132 and the second rotating member 1331. The second rotating member 1331 can rotate along the third direction R and the opposite direction of the third direction R. When the second rotating member 1331 rotates along the third direction R, the second rotating member 1331 squeezes the second guide member 132 through the second extruding member 1332 and moves the position of the second guide member 132.

[0057] Optionally, the second rotating member 1331 is a screw, and the second extruding member 1332 is a pin.

[0058] Preferably, the second extruding member 1332 is sandwiched between the second rotating member 1331 and the second guiding member 132, the second rotating member 1331 has an inclined surface on a side adjacent to the second rotating member 1331, and the inclined surface of the second rotating member 1331 abuts against the second extruding member 1332. In other words, one side of the second extruding member 1332 abuts against the second guiding member 132, and the other side of the second extruding member 1332 abuts against the second rotating member 1331.

[0059] Optionally, the third direction R is clockwise or counterclockwise. When the second rotating member 1331 moves along the third direction R, the second rotating member 1331 abuts against and presses the second extruding member 1332 through the inclined surface, so that the second extruding member 1332 moves along the direction from the second rotating member 1331 to the second guide member 132 .

[0060] In this embodiment, when the operator rotates the second rotating member 1331 along the third direction R, the second rotating member 1331 can squeeze the second squeezing member 1332, and the second squeezing member 1332 squeezes the second guide member 132, so that the second guide member 132 can move along the direction in which the second rotating member 1331 points to the second guide member 132. Compared with the comparative embodiment in which the operator manually straightens the position of the second guide member 132, the provision of the second calibration member 133 makes the operator's operation process more convenient and more accurate and reliable, and can significantly improve the efficiency of calibration. By adjusting the second calibration member 133, the operator can effectively compensate for the straightness deviation of the second guide member 132 caused by manufacturing errors, installation errors or long-term wear and tear, thereby ensuring that the second guide member 132 can extend along the second direction Y and play a precise guiding effect on the movement of the wafer carrier 11 along the second direction Y.

[0061] Please refer again Figure 3 and Figure 4 The first moving assembly 12 includes a plurality of first calibration members 123 disposed on opposite sides of the first guide member 122 , and the second moving assembly 13 includes a plurality of second calibration members 133 disposed on opposite sides of the second guide member 132 .

[0062] Optionally, the number of the first calibration parts 123 may be but is not limited to two, three, four, five, or other greater numbers. It is understandable that the number of the first calibration parts 123 should not be a limitation of the wafer carrier assembly 10 provided in this embodiment.

[0063] In the terminology of the present application, "plurality" means greater than or equal to two, and can be two, three, four or five, etc.

[0064] Optionally, the first moving assembly 12 includes two first calibration piece groups, and each first calibration piece group includes a plurality of first calibration pieces 123 , and the two first calibration piece groups are arranged on opposite sides of the first guide member 122 along the second direction Y.

[0065] Preferably, in each first calibration piece group, a plurality of first calibration pieces 123 are evenly spaced apart from each other.

[0066] Optionally, the number of the second calibration parts 133 can be but is not limited to two, three, four, five, or other greater numbers. It can be understood that the number of the second calibration parts 133 should not be a limitation of the wafer carrier assembly 10 provided in this embodiment.

[0067] Optionally, the second moving assembly 13 includes two second calibration piece groups, and each second calibration piece group includes a plurality of second calibration pieces 133 , and the two second calibration piece groups are arranged on opposite sides of the second guide piece 132 along the first direction X.

[0068] Preferably, in each second calibration piece group, a plurality of second calibration pieces 133 are evenly spaced apart from each other.

[0069] In this embodiment, the first calibration members 123 are provided on both sides of the first guide member 122 to ensure that the first guide member 122 can accurately extend along the first direction X, and the second calibration members 133 are provided on both sides of the second guide member 132 to ensure that the second guide member 132 can accurately extend along the second direction Y, thereby ensuring the accuracy and reliability of the movement of the wafer carrier 11 along the first direction X and the second direction Y.

[0070] See also Figure 5 The first driving member 121 includes a first linear motor, which includes a first stator 1211 and a first mover 1212 that are arranged opposite to each other. The first mover 1212 is fixed to a side of the wafer carrier 11 adjacent to the first stator 1211. The first stator 1211 is used to drive the first mover 1212 and the wafer carrier 11 to move along the first direction X. The second driving member 131 includes a second linear motor, which includes a second stator 1311 and a second mover 1312 that are arranged opposite to each other. The second mover 1312 is fixed to a side of the first moving component 12 adjacent to the second stator 1311. The second stator 1311 is used to drive the second mover 1312 to move along the second direction Y.

[0071] Optionally, the first driving member 121 is composed of a first linear motor, which includes a first stator 1211 and a first mover 1212 that are arranged opposite to each other, that is, the first stator 1211 and the first mover 1212 are arranged at an interval.

[0072] Optionally, the first mover 1212 is disposed on a side of the wafer carrier 11 adjacent to the first stator 1211 , the first mover 1212 is indirectly fixed to the wafer carrier 11 , and the first stator 1211 is disposed on a side of the first mover 1212 away from the wafer carrier 11 .

[0073] Optionally, the first stator 1211 is used to generate a magnetic field and to drive the first mover 1212 to move. The first mover 1212 can receive the force from the first stator 1211 and can convert electrical energy into mechanical energy to drive the wafer carrier 11 to move along the first direction X.

[0074] Optionally, the second driving member 131 is composed of a second linear motor, and the second linear motor includes a second stator 1311 and a second mover 1312 that are arranged opposite to each other, that is, the second stator 1311 and the second mover 1312 are arranged at an interval.

[0075] Optionally, the second mover 1312 is disposed on a side of the first moving component 12 adjacent to the second stator 1311 , the second mover 1312 is indirectly fixed to the first moving component 12 , and the second stator 1311 is disposed on a side of the second mover 1312 away from the first moving component 12 .

[0076] Optionally, the second stator 1311 is used to generate a magnetic field and to drive the second mover 1312 to move. The second mover 1312 can receive the force from the second stator 1311 and can convert electrical energy into mechanical energy to drive the first moving component 12 and the wafer carrier 11 to move along the second direction Y.

[0077] In this embodiment, the first driving member 121 is composed of a first linear motor, and the second driving member 131 is composed of a second linear motor. Compared with the traditional motor, the first linear motor and the second linear motor do not need additional conversion mechanisms, such as gears, couplings or screws, to convert rotational motion into linear motion. Therefore, the structure of the first moving assembly 12 and the second moving assembly 13 is simplified, and the weight and volume are also reduced accordingly. And because there is a gap and no contact between the first stator 1211 and the first mover 1212, and there is a gap and no contact between the second stator 1311 and the second mover 1312, the contact friction resistance between the stator and the mover is eliminated, and the sensitivity of the first moving assembly 12 and the second moving assembly 13 is improved. The first driving member 121 and the second driving member 131 have high positioning accuracy, a wide range of feed speeds, and large acceleration, so that the wafer carrier 11 can move quickly, improving the test efficiency of the probe station 1.

[0078] See also Figure 6The first guide member 122 includes a first slider 1221 and a first guide rail 1222. The first guide rail 1222 extends along the first direction X. One side of the first slider 1221 is fixedly connected to the wafer carrier 11, and the other side of the first slider 1221 is slidably connected to the first guide rail 1222. The second guide member 132 includes a second slider 1321 and a second guide rail 1322. The second guide rail 1322 extends along the second direction Y. One side of the second slider 1321 is fixedly connected to the first moving assembly 12, and the other side of the second slider 1321 is slidably connected to the second guide rail 1322.

[0079] Optionally, the first guide rail 1222 extends along the first direction X, the first slider 1221 is slidably connected to the first guide rail 1222, and the side of the first slider 1221 away from the first guide rail 1222 is directly or indirectly fixed to the wafer carrier 11. When the wafer carrier 11 moves along the first direction X, the wafer carrier 11 can drive the slider to move along the extension direction of the first guide rail 1222. The arrangement of the first guide rail 1222 and the first slider 1221 can carry and guide the wafer carrier 11, so that the movement of the wafer carrier 11 along the first direction X is more stable and accurate.

[0080] Preferably, there are two first guide members 122, and the two first guide members 122 are arranged opposite to each other. The two first guide members 122 are arranged on both sides of the wafer carrier 11, and guide the wafer carrier 11 at the same time, so that the movement process of the wafer carrier 11 is more stable.

[0081] Optionally, the second guide rail 1322 extends along the second direction Y, the second slider 1321 is slidably connected to the second guide rail 1322, and the side of the second slider 1321 away from the second guide rail 1322 is directly or indirectly fixed to the wafer carrier 11. When the wafer carrier 11 moves along the second direction Y, the wafer carrier 11 can drive the slider to move along the extension direction of the second guide rail 1322. The arrangement of the second guide rail 1322 and the second slider 1321 can carry and guide the wafer carrier 11, so that the movement of the wafer carrier 11 along the second direction Y is more stable and accurate.

[0082] Preferably, there are three second guide members 132, and the three second guide members 132 are arranged at intervals from each other. The three second guide members 132 guide the wafer carrier 11 at the same time, so that the movement process of the wafer carrier 11 is more stable.

[0083] See also Figure 7 The wafer carrier assembly 10 further includes a first carrier plate 14 and a second carrier plate 15. The first carrier plate 14 is disposed on a side of the first moving assembly 12 away from the wafer carrier 11 and is used to carry the first moving assembly 12 and the wafer carrier 11. The second carrier plate 15 is disposed on a side of the first carrier plate 14 away from the first moving assembly 12 and is used to carry the second moving assembly 13.

[0084] Optionally, the wafer carrier 11 includes a support member 112 and a wafer carrier body 113 , the support member 112 is used to support the wafer carrier body 113 , and the first supporting plate 14 is disposed on a side of the support member 112 away from the wafer carrier body 113 .

[0085] Optionally, the first carrier plate 14 is used to carry the first moving component 12 and the wafer carrier 11. Specifically, the first stator 1211 of the first driving member 121 is carried and fixed on a side of the first carrier plate 14 adjacent to the wafer carrier 11, the first mover 1212 of the first driving member 121 is fixed to a side of the support member 112 away from the wafer carrier 11, and the first guide member 122 and the first calibration member 123 are both carried and fixed on a side of the first carrier plate 14 adjacent to the wafer carrier 11.

[0086] Optionally, the second carrier plate 15 is used to carry the first moving component 12, the second moving component 13 and the wafer carrier 11. Specifically, the second carrier plate 15 is arranged on the side of the first carrier plate 14 away from the wafer carrier 11. The second stator 1311 of the second driving member 131 is carried and fixed on the side of the second carrier plate 15 adjacent to the wafer carrier 11, the second mover 1312 of the second driving member 131 is arranged on the side of the first carrier plate 14 adjacent to the second carrier plate 15, and the second guide member 132 and the second calibration member 133 are both carried and fixed on the side of the second carrier plate 15 adjacent to the first carrier plate 14.

[0087] Optionally, the area of ​​the second carrier plate 15 is greater than the area of ​​the first carrier plate 14. In other words, the orthographic projection of the first carrier plate 14 on the second carrier plate 15 falls within the range of the second carrier plate 15. Further optionally, the orthographic projection of the wafer carrier 11 on the first carrier plate 14 falls within the range of the first carrier plate 14, so that the first carrier plate 14 and the second carrier plate 15 have sufficient structural strength and can stably carry the wafer carrier 11, so that the wafer carrier 11 has good stability during movement.

[0088] See also Figure 8 The first moving assembly 12 further includes a plurality of buffer members 124 , which are carried on the first carrying plate 14 and are disposed along the first direction X on two opposite sides of the wafer carrying platform 11 .

[0089] Optionally, the number of the buffer members 124 may be but is not limited to two, three, four, or other greater numbers. It is understandable that the number of the buffer members 124 should not be a limitation on the wafer carrier assembly 10 provided in this embodiment.

[0090] Preferably, the buffer member 124 is made of an elastic material, such as silicone, rubber, or other flexible materials.

[0091] In this embodiment, the buffer member 124 is carried on the first carrier plate 14, and the plurality of buffer members 124 are arranged on both sides of the wafer carrier 11 along the first direction X, and the plurality of buffer members 124 are arranged adjacent to the first guide member 122. When the wafer carrier 11 reciprocates along the first direction X, the buffer member 124 can limit the stroke of the wafer carrier 11 and the slider, and can also prevent the wafer carrier 11 from colliding with other environmental elements, thereby preventing the wafer carrier 11 from vibrating due to the collision, resulting in unstable wafer transportation, thereby improving the reliability of the wafer carrier assembly 10.

[0092] See also Fig. 9 The wafer carrier assembly 10 further includes a first sensor assembly 16, the first sensor assembly 16 includes a first sensor sheet 161 and a first sensor element 162, the first sensor sheet 161 is fixed to the wafer carrier 11, the first sensor element 162 is disposed on the first carrier plate 14, and the first sensor element 162 is used to obtain the position information of the first sensor sheet 161. The wafer carrier assembly 10 further includes a second sensor assembly 17, the second sensor assembly 17 includes a second sensor sheet 171 and a second sensor element 172, the second sensor sheet 171 is fixed to the first carrier plate 14, the second sensor element 172 is disposed on the second carrier plate 15, and the second sensor element 172 is used to obtain the position information of the second sensor sheet 171.

[0093] Optionally, the first sensor sheet 161 is indirectly fixed to the wafer carrying platform 11 , and the first induction element 162 is fixed to a side of the first carrying plate 14 adjacent to the wafer carrying platform 11 .

[0094] Optionally, the second sensing piece 171 is fixed to a position of the first supporting plate 14 adjacent to the second supporting plate 15 , and the second sensing element 172 is fixed to a side of the second supporting plate 15 adjacent to the first supporting plate 14 .

[0095] In this embodiment, when the wafer carrier 11 moves along the first direction X, the first sensor sheet 161 also moves synchronously along the first direction X. When the first sensor sheet 161 senses the first sensor sheet 161 via the first sensor element 162, the first sensor element 162 senses the first sensor sheet 161, and sends sensor information to the control system of the probe station 1, thereby protecting the wafer carrier 11 and preventing the wafer carrier 11 from moving beyond the preset stroke along the first direction X. When the wafer carrier 11 moves along the second direction Y, the second sensor sheet 171 also moves synchronously along the second direction Y. When the second sensor sheet 171 senses the second sensor sheet 171 via the second sensor element 172, the second sensor element 172 senses the second sensor sheet 171, and sends sensor information to the control system of the probe station 1, thereby protecting the wafer carrier 11 and preventing the wafer carrier 11 from moving beyond the preset stroke along the second direction Y.

[0096] See also Figure 1 and Fig.10 The present application also provides a probe station 1 , and the probe station 1 includes the wafer carrier assembly 10 .

[0097] The probe station 1 may be, but is not limited to, suitable for detecting wafers, micro-electro-mechanical systems (MEMS), biological structures, optoelectronic devices, light emitting diodes (LED), liquid crystal displays (LCD), or solar cells.

[0098] The probe station 1 may be, but is not limited to, a semi-automatic probe station 1 or a fully-automatic probe station 1 .

[0099] Optionally, the probe station 1 includes a wafer carrier assembly 10, a probe card, a manipulator and other components, wherein the wafer carrier assembly 10 is used to carry the wafer to be tested, the probe card can contact the wafer carried by the wafer carrier assembly 10 and detect the chip on the wafer, and the manipulator is used to transport the wafer.

[0100] In this embodiment, the wafer carrier assembly 10 of the probe station 1 utilizes the first driving member 121 and the first guide member 122 to cooperate to drive the wafer carrier 11 to move along the first direction X, and utilizes the second driving member 131 and the second guide member 132 to cooperate to drive the wafer carrier 11 to move along the second direction Y, so that the wafer carrier 11 can move quickly and smoothly. In addition, the wafer carrier assembly 10 is provided with the first calibration member 123 to calibrate the position of the first guide member 122, and the second calibration member 133 to calibrate the position of the second guide member 132, so as to ensure the straightness of the first guide member 122 and the second guide member 132, so as to enable the wafer carrier 11 to maintain a precise trajectory when moving along the first direction X and the second direction Y, thereby ensuring the high accuracy of the moving position of the wafer carrier 11 and improving the reliability of the wafer carrier assembly 10 and the probe station 1.

[0101] Mentioning "embodiment" and "implementation method" in this application means that the specific features, structures or characteristics described in conjunction with the embodiment may be included in at least one embodiment of the present application. The appearance of the phrases in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments. In addition, it should also be understood that the features, structures or characteristics described in the various embodiments of the present application can be arbitrarily combined to form another embodiment that does not deviate from the spirit and scope of the technical solution of the present application, provided that there is no contradiction between them.

[0102] Finally, it should be noted that the above implementation modes are only used to illustrate the technical solution of the present application and are not intended to limit it. Although the present application has been described in detail with reference to the above preferred implementation modes, a person of ordinary skill in the art should understand that the technical solution of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the present application.

Claims

1. A wafer carrier assembly, characterized in that: The wafer carrier assembly comprises: A wafer carrying platform, wherein the wafer carrying platform has a carrying surface, and the carrying surface is used to carry the wafer; a first moving component, the first moving component is arranged on a side of the wafer carrying platform away from the carrying surface, the first moving component comprises a first driving member, a first guiding member and a first calibrating member, the first calibrating member is used to calibrate the position of the first guiding member, the first guiding member is used to guide the wafer carrying platform, and the first driving member cooperates with the first guiding member to drive the wafer carrying platform to move along a first direction; and A second movable component, the second movable component is arranged on a side of the first movable component away from the wafer carrier, the second movable component includes a second driving member, a second guiding member and a second calibration member, the second calibration member is used to calibrate the position of the second guiding member, the second guiding member is used to guide the wafer carrier, and the second driving member cooperates with the second guiding member to drive the wafer carrier to move along a second direction, and the second direction is perpendicular to the first direction.

2. The wafer carrier assembly according to claim 1, wherein: The first calibration member includes a first rotating member and a first extruding member, the first rotating member is disposed adjacent to the first guiding member, and the first extruding member is sandwiched between the first guiding member and the first rotating member; The first rotating member can rotate along a third direction and in an opposite direction to the third direction. When the first rotating member rotates along the third direction, the first rotating member squeezes the first guiding member through the first squeezing member and moves the position of the first guiding member.

3. The wafer carrier assembly according to claim 2, wherein: The second calibration member includes a second rotating member and a second extruding member, the second rotating member is disposed adjacent to the second guide member, and the second extruding member is sandwiched between the second guide member and the second rotating member; The second rotating member can rotate along the third direction and the opposite direction of the third direction. When the second rotating member rotates along the third direction, the second rotating member squeezes the second guide member through the second squeezing member and moves the position of the second guide member.

4. The wafer carrier assembly according to claim 3, characterized in that: The first movable component includes a plurality of first calibration components, which are arranged on opposite sides of the first guide component, and the second movable component includes a plurality of second calibration components, which are arranged on opposite sides of the second guide component.

5. The wafer carrier assembly according to claim 1, wherein: The first driving member includes a first linear motor, the first linear motor includes a first stator and a first mover which are arranged opposite to each other, the first mover is fixed to a side of the wafer carrier adjacent to the first stator, and the first stator is used to drive the first mover and the wafer carrier to move along a first direction; The second driving member includes a second linear motor, which includes a second stator and a second mover that are arranged opposite to each other. The second mover is fixed to a side of the first moving component adjacent to the second stator, and the second stator is used to drive the second mover to move along the second direction.

6. The wafer carrier assembly according to claim 1, wherein: The first guide member includes a first slider and a first guide rail, the first guide rail extends along the first direction, one side of the first slider is fixedly connected to the wafer carrier, and the other end of the first slider is slidably connected to the first guide rail; The second guide member includes a second slider and a second guide rail, the second guide rail extends along the second direction, one side of the second slider is fixedly connected to the first moving component, and the other side of the second slider is slidably connected to the second guide rail.

7. The wafer carrier assembly according to claim 1, wherein: The wafer carrier assembly also includes a first carrier plate and a second carrier plate. The first carrier plate is arranged on the side of the first movable assembly away from the wafer carrier and is used to carry the first movable assembly and the wafer carrier. The second carrier plate is arranged on the side of the first carrier plate away from the first movable assembly and is used to carry the second movable assembly.

8. The wafer carrier assembly according to claim 7, wherein: The first moving assembly further includes a plurality of buffer components, the plurality of buffer components are carried on the first carrying plate, and the plurality of buffer components are arranged on two opposite sides of the wafer carrying platform along a first direction.

9. The wafer carrier assembly according to claim 7, wherein: The wafer carrier assembly further includes a first sensor assembly, the first sensor assembly includes a first sensor sheet and a first sensing element, the first sensor sheet is fixed to the wafer carrier, the first sensing element is arranged on the first carrier plate, and the first sensing element is used to obtain position information of the first sensor sheet; The wafer carrier assembly also includes a second sensor assembly, which includes a second sensor sheet and a second sensing element. The second sensor sheet is fixed to the first carrier plate, and the second sensing element is arranged on the second carrier plate. The second sensing element is used to obtain position information of the second sensor sheet.

10. A probe station, characterized in that: The probe station includes the wafer carrier assembly as described in any one of claims 1 to 9.

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