Turret type wafer sorting machine
By designing a turret wafer sorter, and using film expansion and turret structure to automatically sort and encapsulate grains, the problem of low grain sorting efficiency in the existing technology is solved, and efficient production processes and safe transport of grains are achieved.
Patent Information
- Application Number
- CN202421488375.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-27
- Publication Date
- 2025-05-09
- Estimated Expiration
- 2034-06-27
AI Technical Summary
In the prior art, the grain sorting efficiency is low, resulting in low production efficiency.
A turret wafer sorter is designed, including a membrane expansion mechanism, a first turret, a second turret and a testing mechanism. The grains are dispersed through the film expansion mechanism, and the grains are automatically transported and detected by the turret structure to achieve a packaging process without manual participation.
It greatly improves the production efficiency of grain sorting and packaging, avoids damage to grains during transport, and facilitates defect detection on the grain surface.
Smart Images
Figure CN222851390U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of wafer sorting, in particular to a turret type wafer sorting machine. Background Art
[0002] Wafer Level Chip Scale Packaging (WLCSP), also known as wafer-level chip packaging, is different from the traditional chip packaging method (cutting first and then packaging and testing, and the volume of the original chip is increased by at least 20% after packaging). This latest technology is to package and test the entire wafer first, and then cut it into individual grains. Therefore, the volume after packaging is equal to the original size of the grain.
[0003] When encapsulating the dies, it is necessary to pick out the individual dies one by one, inspect the dies, remove the defective ones, and then encapsulate the qualified dies. In the traditional technology, the above steps are all performed by independent equipment, and it takes a lot of time to transfer the dies in various mechanisms, which is not conducive to improving production efficiency. Utility Model Content
[0004] The utility model aims to provide a turret-type wafer sorting machine to solve the problem of low grain sorting efficiency in the prior art.
[0005] The technical solution of the utility model is: a turret-type wafer sorting machine, comprising:
[0006] A film expansion mechanism, on which a blue film is mounted, the blue film carrying closely arranged grains; and a film expansion ring, which expands the blue film and increases the distance between adjacent grains through film expansion action;
[0007] A first rotating tower is arranged corresponding to the film expansion mechanism, comprising a first rotating shaft with a horizontal axis and a first adsorber arranged radially thereon, wherein the first adsorber rotates around the axis of the first rotating shaft driven by the first rotating shaft;
[0008] The corresponding film expansion mechanism is also provided with an ejector mechanism, and the execution end of the ejector mechanism can lift any crystal grain through lifting motion;
[0009] The first adsorber includes a body and an adsorption head, and the adsorption head is connected to the body through an elastic member.
[0010] Preferably, the position where the first adsorber and the ejector mechanism are in contact with the grain at the same time is set as the transfer position;
[0011] The elastic member synchronizes the movement and extension of the execution end of the ejector mechanism at the transfer station, so that the resultant force exerted on the grain at the transfer station is equal to the elastic force of the elastic member.
[0012] Preferably, a guide rod is coaxially fixed to the adsorption head, and one end of the guide rod away from the adsorption head is slidably matched with the body to provide guidance for the adsorption head to move with the elastic member.
[0013] Preferably, a second turret is further provided, and the second turret is correspondingly provided at an end of the first turret away from the film expansion mechanism;
[0014] The second rotating tower comprises a second rotating shaft with a vertical axis. The second rotating shaft is radially provided with a second adsorber. The second adsorber rotates around the axis of the second rotating shaft driven by the second rotating shaft.
[0015] Preferably, the station where a pair of first adsorbers and second adsorbers whose axes coincide and are closest to each other are located is set as a handover station, and the grains are transferred from the first turret to the second turret at the handover station.
[0016] Preferably, the crystal grain has a first surface facing outward when adsorbed on the first adsorber, and the second adsorber adsorbs the first surface at the handover station and makes the crystal grain have a second surface facing outward;
[0017] A detection mechanism is provided in conjunction with the first turret and the second turret, and the detection mechanism performs defect detection on the first surface and the second surface in sequence.
[0018] Compared with the prior art, the advantages of the utility model are:
[0019] (1) The present application disperses the grains tightly attached to the blue film through a film expansion mechanism, and transports the grains to a packaging mechanism for packaging through a first turret and a second turret in turn. The entire process does not require human intervention, which greatly improves production efficiency.
[0020] (2) The first adsorber in the first turret is provided with a spring, which can adaptively shrink under the action of external force to prevent the two surfaces of the grain from being damaged by excessive pressure when the grain is adsorbed at the transfer station.
[0021] (3) By setting the first turret and the second turret, the upper and lower surfaces of the grain are successively located outside the adsorbed surface, which facilitates the detection mechanism to detect whether there are defects on the corresponding surface. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] The utility model is further described below in conjunction with the accompanying drawings and embodiments:
[0023] Figure 1 This is a structural diagram of a turret-type wafer sorting machine described in the utility model;
[0024] Figure 2 This is a structural diagram of a turret-type wafer sorting machine described in the utility model;
[0025] Figure 3 This is a structural diagram of the film expansion mechanism described in the utility model;
[0026] Figure 4 This is a structural diagram of the ejector mechanism of the utility model;
[0027] Figure 5 This is the structural diagram of the first turret of the utility model;
[0028] Figure 6 This is the structural diagram of the second turret of the utility model;
[0029] Wherein: 1. feeding mechanism, 2. film expanding mechanism, 21. base, 22. film expanding ring, 23. driving motor, 24. transmission part, 25. screw, 3. first turret, 31. first rotating shaft, 32. first adsorber, 321. main body, 322. adsorption head, 323. guide rod, 324. spring, 4. second turret, 41. second rotating shaft, 42. second adsorber, 5. packaging mechanism, 6. ejector mechanism. DETAILED DESCRIPTION
[0030] In order to facilitate the understanding of this application, the different forms of wafers and related accessories described in this application are first introduced: the wafers become crystal grains after being cut. In order to facilitate transportation and prevent crystal grains from flying during cutting, the wafers are attached to the blue film during cutting, and a hard wafer ring is fixed on the outside of the blue film to make the blue film straight and maintain its shape. The wafer is adhered to the blue film, so that the cut crystal grains are also closely arranged according to their original positions on the wafer.
[0031] The following is a further detailed description of the present invention in conjunction with specific embodiments:
[0032] A turret wafer sorting machine, such as Figure 1 and Figure 2 As shown, it includes a feeding mechanism 1, a film expansion mechanism 2, a pin mechanism 6, a first turret 3, a second turret 4 and a packaging mechanism 5. The blue film carrying the grains is transferred from the feeding mechanism 1 to the film expansion mechanism 2 for film expansion, and then transferred to the packaging mechanism 5 driven by the first turret 3 and the second turret 4 for packaging.
[0033] As mentioned above, the cut grains are closely arranged on the blue film. To avoid interference between adjacent grains during suction, the film expansion mechanism 2 is used to expand the blue film carrying the grains so that the grains on the blue film are evenly dispersed. Figure 3 As shown, the film expansion mechanism 2 includes a base 21, which is clamped with the wafer ring and is provided with a film expansion ring 22. Driven by the film expansion drive mechanism, the film expansion ring 22 performs a lifting movement, and continues to rise after contacting the bottom end of the blue film, so that the blue film expands and the crystal grains thereon are dispersed for easy absorption by the first turret 3.
[0034] Specifically, the film expansion drive mechanism includes a drive motor 23, a transmission part 24 and a screw 25. The screw 25 is provided in plurality, one end of which is provided on the base 21, and the other end is threadedly connected with the film expansion ring 22. The drive motor 23 drives the plurality of screws 25 to rotate through the transmission part 24, thereby driving the film expansion ring 22 to perform a lifting action.
[0035] like Figure 2 As shown, the ejector mechanism 6 is arranged below the film expansion mechanism 2, and any wafer on the blue film is lifted up through the lifting movement of its execution end, and the adsorption end on the first turret 3 synchronously adsorbs the lifted grains.
[0036] like Figure 5 As shown, the first turret 3 includes a first rotating shaft 31, and a plurality of first adsorbers 32 are evenly arranged along the radial direction of the first rotating shaft 31. The first adsorbers 32 rotate around the horizontal axis of the first rotating shaft 31 driven by the first rotating shaft 31. The first adsorber 32 includes a body 321, and an adsorption head 322 for adsorbing crystal grains is arranged at one end of the body 321 away from the first rotating shaft 31. In this embodiment, a guide rod 323 is coaxially fixed to the adsorption head 322, and a spring 324 is arranged on the outer sleeve of the guide rod 323, and the adsorption head 322 is connected to the body 321 through the spring 324. The end of the guide rod 323 away from the adsorption head 322 extends into a groove provided on the body 321, and slides with it to provide guidance for the movement of the adsorption head 322.
[0037] The position where the first absorber 32 and the ejector mechanism 6 are in contact with the crystal grain at the same time is set as the transfer position. The spring 324 is adapted to expand and contract with the movement of the execution end of the ejector mechanism 6 in synchronization with the transfer position, so that the resultant force on the crystal grain at the transfer position is equal to the elastic force of the elastic member, thereby preventing the upper and lower surfaces of the crystal grain from being directly affected by the first absorber 32 and the ejector mechanism 6, causing the crystal grain to be damaged.
[0038] like Figure 1 As shown, the second turret 4 is arranged at one end of the first turret 3 away from the film expansion mechanism 2, that is, the top of the first turret 3, and has a structure similar to that of the first turret 3. Figure 1 and Figure 6 As shown, it includes a second rotating shaft 41 with a vertical axis and a plurality of second adsorbers 42 arranged radially around the axis of the second rotating shaft 41. The position where a pair of first adsorbers 32 and second adsorbers 42 with overlapping axes and closest distances are located is set as a handover position, and the grains are transferred from the first turret 3 to the second turret 4 at the handover position.
[0039] The upper and lower surfaces of the grain at the transfer station are respectively set as the first surface and the second surface. Both the first surface and the second surface need to be inspected for defects by a detection mechanism (not shown). The detection mechanism includes a first detection unit and a second detection unit.
[0040] When the grain is adsorbed on the first turret 3, the second surface faces outward. The first detection unit disposed adjacent to the first turret 3 detects the second surface. When the grain is transferred to the second turret 4 at the handover station, the second turret 4 adsorbs the second surface of the grain, correspondingly making the first surface face outward, and is detected by the second detection unit disposed adjacent to the second turret 4.
[0041] The qualified grains are sent to the packaging mechanism 5 for packaging under the drive of the second turret 4 .
[0042] The above embodiments are only for illustrating the technical concept and features of the utility model, and their purpose is to enable people familiar with this technology to understand the content of the utility model and implement it accordingly, and they cannot be used to limit the protection scope of the utility model. For those skilled in the art, it is obvious that the utility model is not limited to the details of the above exemplary embodiments, and the utility model can be implemented in other specific forms without departing from the spirit or basic features of the utility model. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the utility model is limited by the attached claims rather than the above description, so it is intended to include all changes within the meaning and scope of the equivalent elements of the claims in the utility model.
Claims
1. A turret wafer sorting machine, characterized in that: include: A film expansion mechanism, on which a blue film is mounted, wherein the blue film carries closely arranged grains; A film expansion ring is provided, and the film expansion ring expands the blue film and enlarges the distance between adjacent grains through film expansion action; A first rotating tower is arranged corresponding to the film expansion mechanism, comprising a first rotating shaft with a horizontal axis and a first adsorber arranged radially thereon, wherein the first adsorber rotates around the axis of the first rotating shaft driven by the first rotating shaft; The corresponding film expansion mechanism is also provided with an ejector mechanism, and the execution end of the ejector mechanism can lift any crystal grain through lifting motion; The first adsorber includes a body and an adsorption head, and the adsorption head is connected to the body through an elastic member.
2. A turret wafer sorting machine according to claim 1, characterized in that: The position where the first adsorber and the ejector mechanism are in contact with the grain at the same time is set as the transfer position; The elastic member synchronizes the movement and extension of the execution end of the ejector mechanism at the transfer station, so that the resultant force exerted on the grain at the transfer station is equal to the elastic force of the elastic member.
3. A turret wafer sorting machine according to claim 2, characterized in that: A guide rod is coaxially fixed to the adsorption head, and one end of the guide rod away from the adsorption head is slidably matched with the body to provide guidance for the adsorption head to move along with the elastic member.
4. The turret wafer sorting machine according to claim 1, characterized in that: A second turret is also provided, and the second turret is correspondingly arranged at an end of the first turret away from the film expansion mechanism; The second rotating tower comprises a second rotating shaft with a vertical axis. The second rotating shaft is radially provided with a second adsorber. The second adsorber rotates around the axis of the second rotating shaft driven by the second rotating shaft.
5. The turret wafer sorting machine according to claim 4, characterized in that: The station where a pair of first adsorbers and second adsorbers with overlapping axes and closest distance are located is set as a handover station, and the crystal grains are transferred from the first turret to the second turret at the handover station.
6. The turret wafer sorting machine according to claim 5, characterized in that: The crystal grain has a first surface facing outward when adsorbed on the first adsorber, and the second adsorber adsorbs the first surface at the handover station and makes the crystal grain have a second surface facing outward; A detection mechanism is provided in conjunction with the first turret and the second turret, and the detection mechanism performs defect detection on the first surface and the second surface in sequence.