Cooling device, shunting device thereof, installation adjusting mechanism and semiconductor process equipment

Abstract

The utility model discloses a cooling device, a shunting device thereof, an installation adjusting mechanism and semiconductor process equipment, the shunting device of the cooling device comprises a first air inlet, a first air outlet, a second air outlet and a shunting cavity, air enters the shunting cavity through the first air inlet, and air exits through the first air outlet and the second air outlet; the air outlet directions of the first air outlet and the second air outlet are different, a flow dividing plate is arranged in the flow dividing cavity and comprises a first air plate and a second air plate, the first air plate is arranged to guide at least part of inlet air to the first air outlet, and the second air plate is arranged to guide at least part of inlet air to the second air outlet. The ends, close to the first air inlet, of the first air plate and the second air plate intersect and are connected. According to the cooling device, to-be-cooled air can be shunted, and the shunted to-be-cooled air is guided to different air outlets and then flows to heat exchangers corresponding to the air outlets, so that the overall cooling efficiency of the cooling device is improved, and the stability of the cooling effect of the cooling device is ensured.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor equipment, in particular to a cooling device and a flow distribution device thereof, a mounting adjustment mechanism and semiconductor process equipment. Background Art

[0002] In the production process of semiconductor devices, a large amount of micromachining is usually required. At present, chemical vapor deposition, physical vapor deposition and other processes are often used to micro-process semiconductor process parts or substrates, such as manufacturing flexible display screens, flat panel displays, light-emitting diodes, solar cells, etc. Micromachining manufacturing includes a variety of different processes and steps. Among them, the most widely used is the chemical vapor deposition process, which can deposit a variety of materials, including a wide range of insulating materials, most metal materials and metal alloy materials, such as depositing materials such as silicon, silicon carbide, zinc oxide, etc. on substrates or other surfaces. With the shrinking feature size of semiconductor devices and the increasing integration of devices, higher and higher requirements are placed on the surface processing quality of semiconductor device substrates. A semiconductor device requires dozens of process flows from silicon wafers to the final packaging, and multiple process flows have inevitably created complexity in the processing process. In the entire process flow, the processing environment of the substrate surface is very harsh. For example, in the process of depositing a thin film on the substrate surface, factors such as the equipment stability of each process component, the heating temperature field of the equipment, the direction of the reaction gas flow, and the test accuracy of the reaction temperature are all crucial. They directly or indirectly determine the quality of the substrate surface processing. However, in actual applications, due to the influence of various factors, the long-term stability of semiconductor process equipment is difficult to ensure, which will lead to the instability of the process environment. For example, the process is often accompanied by high temperature and high pressure process conditions, which may cause damage to some parts of the equipment and affect its service life or stability. Therefore, it is necessary to improve the existing equipment. It is understandable that the above statements only provide background technology related to the utility model and do not necessarily constitute prior art. Utility Model Content

[0003] Based on the above-mentioned technical problems, the purpose of the utility model is to provide a cooling device and its diversion device, an installation and adjustment mechanism and semiconductor process equipment. The diversion device of the cooling device combines the first wind plate and the second wind plate, so that the intersection and connection of the first wind plate and the second wind plate are arranged close to the first air inlet, which can realize the diversion of the cooling air and guide the diverted cooling air to different air outlets, and then flow to the heat exchanger corresponding to the air outlet, which helps to improve the overall cooling efficiency of the cooling device and ensure the stability of the cooling effect of the cooling device.

[0004] In order to achieve the above object, the utility model is implemented through the following technical solutions:

[0005] A diversion device,

[0006] The flow diversion device comprises a first air inlet, a first air outlet, a second air outlet and a flow diversion cavity.

[0007] The diversion cavity takes in air through the first air inlet and discharges air through the first air outlet and the second air outlet.

[0008] The first air outlet and the second air outlet have different air outlet directions.

[0009] A diverter plate is provided in the diverter cavity.

[0010] The splitter plate includes a first wind plate and a second wind plate,

[0011] The first air plate is configured to direct the incoming air at least partially to the first air outlet.

[0012] The second air plate is configured to direct the incoming air at least partially to the second air outlet.

[0013] The first wind plate and the second wind plate are intersected and connected at one end close to the first air inlet.

[0014] Optionally, the intersection is arranged away from a midpoint of a distance between the first air outlet and the second air outlet.

[0015] Optionally, the diverter plate can be arranged in the diverter cavity to be translated toward the first air outlet or the second air outlet.

[0016] Optionally, one end of the diverter plate away from the first air inlet is connected to a first connecting structure, and a supporting plate for supporting the diverter plate is connected to the first connecting structure via an adjustable connecting component.

[0017] Optionally, the adjustable connection component comprises:

[0018] The first connecting structure and the second connecting structure of the supporting plate, the first connecting structure is provided with a first through hole, the second connecting structure is correspondingly provided with a fastening hole, the first through hole and / or the fastening hole are waist-shaped holes, and the fixing bolt passes through the first through hole and is fixedly connected at the fastening hole.

[0019] Optionally, the first wind plate and / or the second wind plate comprises a wind guiding surface and a deflecting surface, and the wind guiding surface is closer to the first air inlet than the deflecting surface.

[0020] The wind guiding surface is used to divide the incoming wind into a first wind and a second wind, and the deflecting surface is used to deflect the first wind and the second wind toward the wind outlet directions of the first air outlet and the second air outlet, respectively.

[0021] Optionally, the angle between the wind guide surface and the air inlet direction ranges from 1° to 30°.

[0022] Optionally, the deflection surface is an arc transition surface to connect the wind guide surface to the wind outlet direction.

[0023] Optionally, the ratio of the arc radius of the arc transition surface to the wind guiding length of the wind guiding surface is 0.1 to 3.

[0024] Optionally, a mounting and adjusting mechanism for an air duct of a cooling device, the mounting and adjusting mechanism comprising:

[0025] A slidable bottom plate is configured to move the cooling device so that the second air inlet of the air inlet duct of the cooling device is aligned and connected with the air outlet of the target to be cooled.

[0026] Optionally, a position fine-adjustment mechanism for supporting the cooling device is provided on the bottom plate, and the position fine-adjustment mechanism can enable the cooling device to be movably fixed relative to the bottom plate in the horizontal and / or vertical direction.

[0027] Optionally, the base plate is supported by a plurality of wheels.

[0028] Optionally, the second air inlet of the air inlet duct is provided with a buckle for detachably fixing the air inlet of the duct to the air outlet of the target to be cooled.

[0029] Optionally, a cooling device comprises:

[0030] An air inlet duct, wherein the air inlet duct sucks in air to be cooled;

[0031] The air inlet duct is connected to a heat exchanger assembly,

[0032] The heat exchanger assembly is provided with a primary heat exchanger, a fan compartment and the aforementioned diverter device in sequence along the flow direction of the air to be cooled, and a secondary heat exchanger is provided outside the first air outlet and the second air outlet of the diverter device.

[0033] Optionally, also include:

[0034] The aforementioned installation adjustment mechanism is used to align and connect the second air inlet of the air inlet duct of the cooling device with the exhaust port of the target to be cooled.

[0035] Optionally, also include:

[0036] At least two air outlet buffer plates are arranged at the air outlet position of the secondary heat exchanger.

[0037] Optionally, a noise reduction structure is provided between the air outlet buffer plate and the heat exchanger.

[0038] Optionally, the primary heat exchanger and / or the secondary heat exchanger is a water-cooled heat exchanger.

[0039] Optionally, also include:

[0040] A heat exchanger water leakage detection device is arranged on the bottom plate.

[0041] Optionally, the air inlet and outlet of the heat exchanger assembly and the fan compartment are provided with temperature sensors.

[0042] Optionally, a wind pressure detector is provided in the second air inlet of the air inlet duct.

[0043] Optionally, the air inlet duct is provided with an air duct elbow and a diffuser section in sequence along the flow direction of the air to be cooled, and the diffuser section is connected to the primary heat exchanger.

[0044] Optionally, the water-cooled heat exchanger has a quick-connect connector extending outwardly.

[0045] Optionally, a semiconductor process equipment comprises:

[0046] A process chamber for performing a process, wherein the process chamber has an air inlet and an exhaust port;

[0047] An outer shell, the process chamber is located in the outer shell, a circulating air cavity is formed between the outer shell and the process chamber, and the air inlet is communicated with the circulating air cavity;

[0048] The aforementioned cooling device is movably located in the circulating air cavity so that the second air inlet of the air inlet duct of the cooling device is connected to the exhaust port of the process chamber.

[0049] Optionally, the distance between the first air outlet and the air inlet is smaller than the distance between the second air outlet and the air inlet, and the intersection and connection of the diverter plate is arranged closer to the first air outlet relative to the second air outlet.

[0050] Compared with the prior art, the utility model has the following advantages:

[0051] In a cooling device and its diversion device, an installation and adjustment mechanism and semiconductor process equipment of the utility model, the diversion device of the cooling device combines a first air plate and a second air plate, so that the intersection and connection of the first air plate and the second air plate are arranged close to the first air inlet and there is an angle between the two air plates, which can realize the diversion of the cooling air and guide the diverted cooling air to different air outlets, and then flow to the corresponding heat exchanger, which helps to improve the overall heat exchange efficiency of the cooling device and ensure the stability of the cooling effect of the cooling device.

[0052] Furthermore, the installation position of the diverter device can be adjusted, thereby adjusting the ventilation volume to different air outlets and corresponding heat exchangers. In actual applications, it can be adjusted according to needs to meet different application requirements.

[0053] Furthermore, the installation and adjustment mechanism of the cooling device enables the air inlet of the air inlet duct of the cooling device to be aligned and connected with the exhaust port of the target to be cooled, so that the cooling device as a whole can be removed and installed, thereby increasing the flexibility of maintenance and installation of the cooling device and other components. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] Figure 1 A schematic diagram of a semiconductor process equipment of the utility model;

[0055] Figure 2 This is a schematic diagram of the structure of one side of a cooling device of the utility model;

[0056] Figure 3 This is a schematic diagram of the structure of the other side of a cooling device of the utility model;

[0057] Figure 4 It is a partial schematic diagram of a cooling device of the utility model;

[0058] Figure 5 This is a schematic diagram of the structure of a diverter plate of the utility model;

[0059] Figure 6 A schematic diagram of flow diversion of a diverter plate of the utility model;

[0060] Figure 7 It is a schematic diagram of a diverter plate in the center of the diverter cavity of the utility model;

[0061] Figure 8 It is a schematic diagram of a diverter plate of the utility model at the left side of the diverter cavity;

[0062] Fig. 9 It is a schematic diagram of a diverter plate of the utility model at the right side of the diverter cavity. DETAILED DESCRIPTION

[0063] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model. At the same time, the drawings of the utility model are all in a very simplified form and use non-precise ratios, which are only used to conveniently and clearly assist in explaining the purpose of the embodiment of the utility model.

[0064] like Figure 1 As shown, it is a schematic diagram of a semiconductor process equipment (epitaxial growth equipment) of the utility model, and the semiconductor process equipment includes a process chamber 100 for performing a process, and the process chamber 100 can be used to process one or more substrates W, including depositing materials on the upper surface of the substrate W. In this embodiment, the process chamber 100 includes a vacuum reaction chamber 110, and the cavity body of the vacuum reaction chamber 110 includes an upper cavity wall 111 located at the top and a lower cavity wall 112 located at the bottom. Optionally, the upper cavity wall 111 and the lower cavity wall 112 are made of optically transparent or translucent materials that can transmit thermal radiation (such as quartz materials that are transparent to a specific infrared band). A susceptor 113 is disposed in the vacuum reaction chamber 110, and its upper surface is used to support the substrate W, so that the surface to be processed of the substrate W faces the upper chamber wall 111. The lower surface of the susceptor 113 is supported by a support frame 114, and the support frame 114 can drive the susceptor 113 and the substrate W supported by it to rotate, which helps to ensure the uniformity of the surface treatment of the substrate W.

[0065] In this embodiment, the process chamber 100 further comprises an upper heating chamber 120 and a lower heating chamber 130 respectively located above and below the vacuum reaction chamber 110, and a heating lamp group 140 is provided in each of the upper heating chamber 120 and the lower heating chamber 130. During the process, the heating lamp group 140 is started to provide heat energy for the interior of the vacuum reaction chamber 110 and the substrate W. Optionally, the heating lamp group 140 comprises a high-intensity tungsten filament lamp having a transparent quartz shell and containing a halogen gas such as iodine, and only a small part of the radiant heat energy generated by the high-intensity tungsten filament lamp is absorbed by the upper chamber wall 111 or the lower chamber wall 112, so as to ensure that the heat energy generated by each heating lamp group 140 reaches the interior of the vacuum reaction chamber 110 and the substrate W to the maximum extent. Optionally, the heating lamp group 140 comprises a plurality of high-intensity tungsten filament lamps arranged in a circumferential direction, so as to achieve uniform circumferential heating of the vacuum reaction chamber 110 and the substrate W therein. During the process, the heat radiation emitted from the heating lamp group 140 in the upper heating chamber 120 reaches the interior of the vacuum reaction chamber 110 and the substrate W through the upper chamber wall 111, so that the interior of the vacuum reaction chamber 110 and the substrate W reach the required process temperature (e.g., about 1000° C.), so that the reaction gas in the chamber is thermally decomposed, thereby generating a thin film material on the upper surface of the substrate W. At the same time, the heat radiation emitted from the heating lamp group 140 in the lower heating chamber 130 reaches the interior of the vacuum reaction chamber 110, the base 113 and the substrate W through the lower chamber wall 112, so as to assist the film formation reaction on the surface of the substrate W. Optionally, the grown thin film material is a semiconductor material such as silicon and germanium, and may also include other doping materials such as group III, group IV and / or group V materials.

[0066] As can be seen from the above, during the process, the temperature in the chamber is usually high. The heat energy provided by the heating lamp group 140 not only acts on the base 113 and the substrate W, but the upper chamber wall 111 and the lower chamber wall 112 will inevitably absorb part of the heat energy generated by the heating lamp group 140. If the upper chamber wall 111 and the lower chamber wall 112 are in a high-temperature radiation state for a long time, their temperature will usually be high, which may easily lead to accelerated aging or damage of the components, affecting their service life. At the same time, the inner walls of the high-temperature upper chamber wall 111 and the lower chamber wall 112 may also be deposited with some thin film materials, which may cause the particles of the thin film materials to peel off during the temperature change process, thereby polluting the environment in the chamber and affecting the cleanliness of the chamber. On the other hand, the continuously working heating lamp group 140 will also have a certain impact on its surrounding parts (such as the reflector, etc.), such as causing accelerated aging. Therefore, it is necessary to cool the upper heating chamber 120 or the lower heating chamber 130 of the process chamber 100 to avoid excessive temperature. Based on the above, the present invention provides a cooling device 200, wherein the second air inlet 211 of the cooling device 200 is connected to the upper heating chamber 120 or the lower heating chamber 130 of the process chamber 100, so as to realize cooling of the upper heating chamber 120 or the lower heating chamber 130, and cooling of the heating lamp group 140 in the chamber and its adjacent components. For ease of explanation, the following is an example of the cooling device 200 being connected to the exhaust port 132 of the lower heating chamber 130, but this does not mean that the cooling device 200 provided by the present invention can only be applied to the cooling and heat exchange of the lower heating chamber 130 and cannot be applied to the cooling and heat exchange of the upper heating chamber 120. It can be understood that in other embodiments, the upper heating chamber 120 is also provided with an exhaust port 132 connected to the cooling device 200 to reduce the temperature in the chamber.

[0067] like Figure 1 As shown, in order to avoid the temperature in the lower heating chamber 130 being too high, the lower heating chamber 130 has an air inlet 131 and an exhaust port 132, so that the gas can circulate between the inside and outside of the lower heating chamber 130, thereby taking away the heat in the lower heating chamber 130 and helping to dissipate heat in the chamber. Optionally, the exhaust port 132 of the lower heating chamber 130 is opened at a position close to the heating lamp group 140, so as to discharge the accumulated heat in time. On the other hand, optionally, a plurality of air inlets 131 evenly arranged along the circumferential direction are opened at the bottom of the lower heating chamber 130, so as to convey a uniform cooled airflow to the lower heating chamber 130, thereby ensuring the uniformity of the cooling effect inside the lower heating chamber 130, and thereby improving the accuracy of temperature control in the lower heating chamber 130.

[0068] like Figures 1 to 3As shown, in this embodiment, the cooling device 200 includes an air inlet duct 210, and the second air inlet 211 of the air inlet duct 210 is connected to the exhaust port 132 of the lower heating chamber 130 to inhale the air to be cooled. The air inlet duct 210 is connected to a heat exchanger assembly, and the heat exchanger assembly is sequentially provided with a primary heat exchanger 220, a fan compartment 230 and a diverter 240 along the flow direction of the air to be cooled. The first air outlet 242 and the second air outlet 243 of the diverter 240 are provided with a secondary heat exchanger 250 (see Figure 1 and Figure 2 ). The cooling device 200 combines a primary heat exchanger 220, a secondary heat exchanger 250, a fan chamber 230 and a diverter 240, etc., realizes primary heat exchange and cooling of the air to be cooled through the primary heat exchanger 220, and accelerates the flow of gas through the fan chamber 230 to further improve the heat exchange efficiency. At the same time, the primary heat exchanger 220 contacts the air to be cooled before the fan chamber 230, so that the temperature of the air to be cooled flowing to the fan chamber 230 is greatly lower than the temperature of the air to be cooled at the second air inlet 211, thereby avoiding damage to the components in the fan chamber 230 due to the excessively high temperature of the air to be cooled, and helping to improve the service life of the components in the fan chamber 230. Furthermore, the air to be cooled flowing out of the fan compartment 230 is diverted by the diverter device 240 and then flows to the secondary heat exchanger 250 for further heat exchange and cooling, so as to further reduce the temperature of the airflow, thereby fully ensuring the cooling effect of the cooling device 200; at the same time, the diverter device 240 divides the airflow flowing out of the fan compartment 230 into two sub-airflows, and then the two sub-airflows are respectively passed through the secondary heat exchanger 250 with different air outlets for heat exchange, which helps to improve the cooling and heat exchange effect of the cooling device 200 on the airflow, and at the same time can further improve the gas flow rate of the gas to be cooled that can be processed by the cooling device 200, so that the cooling device 200 can achieve sufficient heat exchange for the high-flow rate and high-volume gas to be cooled, thereby increasing the wide range of its application range. On the other hand, the cooling device 200 has multiple air outlets, which can output the cooled airflow from different directions, avoiding excessive cooling gradient caused by a single air outlet direction, helping to ensure the uniformity of the cooling effect and the uniformity of the wind speed at each air outlet, and helping to increase the life of each component in the lower heating chamber 130 and the lower chamber wall 112.

[0069] Further, such as Figure 1As shown, the semiconductor process equipment further includes an outer shell 300, the process chamber 100 is located in the outer shell 300, a circulating air cavity 310 is formed between the outer shell 300 and the process chamber 100, and the air inlet 131 of the process chamber 100 is in communication with the circulating air cavity 310. In this embodiment, the lower heating chamber 130 of the process chamber 100 is provided with an exhaust port 132 and a plurality of air inlets 131 uniformly arranged along the circumferential direction, the exhaust port 132 of the lower heating chamber 130 is connected to the second air inlet 211 of the air inlet duct 210 of the cooling device 200, and the air inlet 131 of the lower heating chamber 130 is in communication with the circulating air cavity 310. During the process, the air to be cooled in the lower heating chamber 130 flows from the exhaust port 132 to the air inlet duct 210 of the cooling device 200, and then is cooled and heat exchanged through the cooling device 200. The air flow cooled by the cooling device 200 flows in the circulating air chamber 310 and then enters the lower heating chamber 130 through the air inlet 131 of the lower heating chamber 130 to form a circulation, so as to reduce the temperature in the lower heating chamber 130.

[0070] It is understandable that, in other embodiments, the air outlet of the cooling device 200 can be connected to the air inlet 131 of the lower heating chamber 130 to realize the internal closed circulation of the airflow and avoid the airflow from affecting the external environment. However, the air to be cooled flowing from the lower heating chamber 130 to the cooling device 200 is usually non-toxic and harmless air, which will not pollute the environment. Therefore, in this embodiment, the airflow cooled by the cooling device 200 can flow in the circulating air cavity 310 and then flow into the lower heating chamber 130, and will not pollute the circulating air cavity 310 in this process. Usually, some required electrical components and equipment are placed in the circulating air cavity 310 between the outer shell 300 and the process chamber 100. These electrical components and equipment are usually sensitive to high temperatures. The airflow cooled by the cooling device 200 flows in the circulating air cavity 310, which can further reduce the impact of the lower heating chamber 130 on the electrical components and equipment in the circulating air cavity 310, which helps to ensure its normal operation.

[0071] like Figure 2 and Figure 3 As shown, in this embodiment, the second air inlet 211 of the air inlet duct 210 is provided with a buckle 212, and the buckle 212 is used to detachably fix the second air inlet 211 of the air inlet duct 210 and the exhaust port 132 of the object to be cooled. In this embodiment, the buckle 212 is made of metal material, and the buckle 212 is arranged at the second air inlet 211 of the air inlet duct 210, which can realize the rapid disassembly and fixation of the cooling device 200 and the process chamber 100, so as to quickly fix and separate the cooling device 200 as a whole from the process chamber 100.

[0072] Furthermore, the air inlet duct 210 is provided with an air duct elbow 213 and a pressure diffuser 214 in sequence along the flow direction of the air to be cooled, the pressure diffuser 214 is connected to the primary heat exchanger 220, the pressure diffuser 214 is communicated with the fan chamber 230, and the fan chamber 230 has a fan and other structures to accelerate the flow of air. In practical applications, the air to be cooled flowing in from the exhaust port 132 of the process chamber 100 is turned through the air duct elbow 213 of the air inlet duct 210, and then flows into the pressure diffuser 214, and then cooled and heat-exchanged through the primary heat exchanger 220 to reduce the temperature of the air to be cooled, and the air flow after the heat exchange treatment of the primary heat exchanger 220 passes through the fan chamber 230 and then flows into the diverter 240. Optionally, the air inlet and outlet of the heat exchanger assembly and the fan chamber 230 are all provided with a temperature sensor 260, so as to detect the temperature at the corresponding position in real time, so as to facilitate timely regulation. Furthermore, a wind pressure detector 215 is provided in the second air inlet 211 of the air inlet duct 210 (see Figure 3 ) in order to detect the wind pressure at the second air inlet 211 of the air inlet duct 210.

[0073] Further, such as Figure 2 As shown, the cooling device 200 further includes at least two air outlet buffer plates 270, each of which is disposed at the air outlet position of each of the secondary heat exchangers 250 to buffer the air outlet flow and reduce the wind impact on the components at the air outlet of the cooling device 200. Furthermore, a noise reduction structure 271 is disposed between the air outlet buffer plate 270 and the secondary heat exchanger 250 to reduce the impact of factors such as noise and vibration.

[0074] In this embodiment, the primary heat exchanger 220 and the secondary heat exchanger 250 are both water-cooled heat exchangers, and their frames can be made of metal materials. Of course, the primary heat exchanger 220 and the secondary heat exchanger 250 can also be other types of heat exchangers, and the types of the two can also be different, and the utility model does not limit this. Further, the cooling device 200 also includes a heat exchanger water leakage detection device 280, and the heat exchanger water leakage detection device 280 is arranged on the bottom plate 291 carrying the diversion device 240 to monitor whether the primary heat exchanger 220 and the secondary heat exchanger 250 have water leakage, so as to timely understand the relevant operating status of each heat exchanger. On the other hand, the water-cooled heat exchanger can also extend outward with a quick-plug connector, so that the water-cooled heat exchanger and the external cooling water pipeline can be quickly connected and disassembled, so that the cooling device 200 can be quickly connected and disconnected with the external cooling water supply source. Optionally, the quick-plug connector is a metal interface.

[0075] On the other hand, as can be seen from the foregoing, a secondary heat exchanger 250 is provided outside the first air outlet 242 and the second air outlet 243 of the diverter device 240. Research has found that since the air inlet 131 is not distributed at the same distance from the two secondary heat exchangers 250, and thus there is a pump air pressure difference, when multiple heat exchangers are used, it is easy for the wind speed and air volume flowing to each heat exchanger to be different due to the background pressure difference of each heat exchanger, resulting in a difference in the heat exchange effect of the air flow out of the air outlet corresponding to each heat exchanger, which can easily lead to uneven cooling effect of the cooling device 200, and thus there is a problem of reduced overall cooling efficiency. Ideally, the amount of air flowing through each secondary heat exchanger 250 is consistent, which is conducive to improving the cooling efficiency under a uniform refrigerant flow rate. Based on this, the utility model provides a diverter device 240 (see Figures 4 to 6 ), the diverter device 240 diverts the cooling air through the first air plate 2451 and the second air plate 2452, and then guides the diverted air flows to the air outlets with different air outlet directions (there may be multiple air outlets, taking the first air outlet 242 and the second air outlet 243 as an example), which helps to adjust the flow rate and flow rate of the air flow at each air outlet of the diverter device 240.

[0076] Specifically, Figure 4As shown, the diverter device 240 includes a first air inlet 241, a first air outlet 242, a second air outlet 243 and a diverter cavity 244. The diverter cavity 244 takes in air through the first air inlet 241 and discharges air through the first air outlet 242 and the second air outlet 243. The first air outlet 242 and the second air outlet 243 have different air outlet directions. A diverter plate 245 is provided in the diverter cavity 244. The diverter plate 245 includes a first air plate 2451 and a second air plate 2452. The first air plate 2451 is configured to guide the inlet air at least partially to the first air outlet 242. The second air plate 2452 is configured to guide the inlet air at least partially to the second air outlet 243. The first air plate 2451 and the second air plate 2452 are intersected and connected at one end close to the first air inlet 241, that is, there is an angle between the first air plate 2451 and the second air plate 2452. As can be seen from the above, the intersection of the first wind plate 2451 and the second wind plate 2452 of the diverter device 240 is arranged near the first air inlet 241, which can realize the diversion of the cooling air and play the role of airflow boundary. There is an angle between the first wind plate 2451 and the second wind plate 2452, which can realize the adjustment of the airflow direction (for example, adjusting the airflow flowing in the vertical direction to move in the horizontal direction), and realize different guidance of each airflow after diversion, so that the diverted gas flows to different secondary heat exchangers 250, and fully utilizes the cooling and heat exchange functions of the secondary heat exchangers 250 at both ends, which helps to improve the cooling efficiency of the cooling device 200, and thus ensure the cooling effect of the cooling device 200. On the other hand, in order to reduce the floor space of the equipment, the cooling device 200 needs to be arranged as compactly as possible, so its diverter device 240 also needs to reduce the occupied space as much as possible. The diverter device 240 of the utility model has the characteristics of simple structure, small occupied space, more flexible and compact design structure, etc., which helps to save space and improve the utilization rate of the installation space. Compared with a single partition plate, it has a flow-guiding and hollow design, which reduces pressure loss and weight. The overall triangular support has higher stability and avoids oscillation in large airflow.

[0077] like Figures 4 to 6As shown, in this embodiment, the diverter plate 245 and the diverter cavity 244 are both disposed on a supporting plate 246 , and the supporting plate 246 (made of metal) is used to support and fix the diverter plate 245 . In this embodiment, the first wind plate 2451 of the diverter plate 245 includes a first wind guide surface 24511 and a first deflection surface 24512, and the second wind plate 2452 includes a second wind guide surface 24521 and a second deflection surface 24522. The first wind guide surface 24511 is closer to the first air inlet 241 relative to the first deflection surface 24512, and the second wind guide surface 24521 is closer to the first air inlet 241 relative to the second deflection surface 24522. The first wind guide surface 24511 and the second wind guide surface 24521 are intersected and connected near the first air inlet 241. The two wind guide surfaces and their intersection and connection can cooperate to divide the incoming air into the first wind and the second wind, thereby realizing the diversion of the incoming air. The first deflection surface 24512 and the second deflection surface 24522 are used to deflect the first wind and the second wind to the outlet directions of the first air outlet 242 and the second air outlet 243 respectively. The splitter plate 245 combines the first air guide surface 24511, the first deflection surface 24512, the second air guide surface 24521 and the second deflection surface 24522, so that the splitter plate 245 has a special shape. While realizing the air flow diversion, it also has the function of guiding the air to adjust the flow direction of the incoming air flow (such as changing the flow direction of the incoming air from the up and down direction to the left and right direction), thereby changing the air flow and flow rate flowing to different secondary heat exchangers 250. On the other hand, the splitter plate 245 has a simple structure, is easy to install, occupies a small space, and helps to improve the space utilization efficiency. Compared with a single partition plate, it has a flow guide and hollow design, which reduces pressure loss and weight, and the overall triangular support has higher stability to avoid oscillation during large airflow.

[0078] Furthermore, in this embodiment, the first deflection surface 24512 and the second deflection surface 24522 are both arc transition surfaces, so as to respectively connect the first wind guide surface 24511 and the second wind guide surface 24521 to the wind outlet direction. The first deflection surface 24512 / the second deflection surface 24522 make the final adjustment to the wind outlet direction of the airflow, completely change the wind outlet direction, and guide the airflow to the corresponding air outlet; at the same time, the arc transition surface can also play a certain role in mitigating the impact of the deflection of the flow direction of the airflow, which helps to reduce the impact of the airflow on the bearing plate 246. It can be understood that, when the deflection angles of the first air guide surface 24511 and the second air guide surface 24521 are constant, the size of the arc radius of the arc transition surface affects the size of its effect on the deflection of the airflow direction. If the arc radius of the arc transition surface is small, the range of its contact with the airflow is small, and the airflow mainly relies on the first air guide surface 24511 and the second air guide surface 24521 and the contact with the bearing plate 246 to achieve deflection, and the controllability of the airflow flow state is slightly lower; if the arc radius of the arc transition surface is large, the range of its contact with the airflow is large, and the airflow direction can be guided to deflect earlier, and then the airflow is guided to flow to the corresponding air outlet more gently. Optionally, the ratio of the arc radius of the arc transition surface to the air guide length of the first air guide surface 24511 / the second air guide surface 24521 is 0.1 to 3. The arc transition can further make the airflow smoothly deflected and reduce the pressure loss. Of course, the ratio of the arc radius of the arc transition surface to the air guiding length of the first air guiding surface 24511 / the second air guiding surface 24521 may also be in other data ranges, and the present invention does not impose any limitation on this.

[0079] In this embodiment, the first wind guide surface 24511 and the first deflection surface 24512 of the first wind plate 2451 are an integrated structure, and the second wind guide surface 24521 and the second deflection surface 24522 of the second wind plate 2452 are also an integrated structure, and both can be made of metal materials. Further, the first wind plate 2451 and the second wind plate 2452 are also integrated to facilitate the processing and preparation of the components. On the other hand, the bearing plate 246 that supports the first wind plate 2451 and the second wind plate 2452 can also be made of metal materials to facilitate the fixation of the first wind plate 2451 and the second wind plate 2452 on the bearing plate 246.

[0080] As can be seen from the foregoing, when multiple heat exchangers are used simultaneously in the cooling device 200, due to factors such as the unbalanced background pressure on both sides of the diverter plate 245 (such as the pressure resistance on one end is too small and the other end is too large), the air volume and speed flowing to each secondary heat exchanger 250 corresponding to the diverter plate 245 may be different. The secondary heat exchanger 250 with a large gas flow rate may not be cooled sufficiently, resulting in excessive gas temperature, and the secondary heat exchanger 250 with a small gas flow rate is cooled relatively sufficiently, resulting in uneven cooling effects of each secondary heat exchanger 250, thereby making the cooling efficiency of the entire cooling device 200 low, and there is a temperature difference between the air flows flowing out of each air outlet of the cooling device 200, resulting in uncontrollable air flow temperature regulation. On the other hand, in actual applications, even if the air flow temperature and air flow rate of each air outlet of the cooling device 200 are relatively balanced, the air flow rate of each air inlet 131 of the lower heating chamber 130 may be uneven due to the influence of factors such as the distance, direction, and shielding of each air outlet from the air inlet 131, that is, the air flow distribution entering the lower heating chamber 130 is uneven, which will lead to different cooling effects at various positions inside the lower heating chamber 130, reducing the controllability of cooling inside the lower heating chamber 130. Therefore, it is necessary to adjust the diverter plate 245 to improve the cooling effect on the lower heating chamber 130. For example, in a certain embodiment, the distance between the first air outlet 242 of the diverter plate 245 and the air inlet 131 is smaller than the distance between the second air outlet 243 and the air inlet 131. At this time, the intersection connection of the diverter plate 245 can be adjusted to be closer to the first air outlet 242 relative to the second air outlet 243 to improve the uniformity of the cooling effect of the cooling device 200.

[0081] As can be seen from the foregoing, in the present application, the intersection and connection of the first wind plate 2451 and the second wind plate 2452 can realize the boundary of the cooling air to be treated, so as to obtain the various air flows flowing to different secondary heat exchangers 250 and air outlets. Therefore, the setting position of the intersection and connection determines the air volume flowing to different air outlets. In practical applications, the setting position of the diverter plate 245 can be adjusted according to actual needs, that is, the setting position of the first wind plate 2451 and the second wind plate 2452 can be adjusted so that the intersection and connection of the two have different setting positions, so as to adjust the air volume distribution of the diverter device 240 to each air outlet, thereby realizing the adjustment of the air volume flowing to different secondary heat exchangers 250. Optionally, the diverter plate 245 of the diverter device 240 can be arranged in the diverter cavity 244 to be translated toward the first air outlet 242 or the second air outlet 243, that is, the diverter plate 245 and the supporting plate 246 can be relatively moved to make it close to or away from a certain secondary heat exchanger 250, so as to increase or decrease the ventilation volume of a certain secondary heat exchanger 250, thereby realizing the adjustment of the ventilation volume to different heat exchangers. For example, in one embodiment, the intersection of the first air plate 2451 and the second air plate 2452 is set at the midpoint of the first air inlet 241 to divide the air flow of the gas to be cooled into two parts, and then when the first air plate 2451 and the second air plate 2452 have the same angle with the air inlet direction, the first air outlet 242 and the second air outlet 243 of the cooling device 200 have the same gas flow and flow rate, and the secondary heat exchanger 250 corresponding to each air outlet also has the same ventilation volume, which helps to improve the uniformity of the cooling effect of the air flow at each air outlet of the cooling device 200. For example, in another embodiment, the intersection is set away from the midpoint of the first air inlet 241, that is, the intersection is set away from the midpoint of the distance between the first air outlet 242 and the second air outlet 243 to meet the corresponding application requirements.

[0082] Furthermore, in this embodiment, the deflection angle of the first wind guide surface 24511 and the second wind guide surface 24521 and the setting position of the intersection also determine the air volume distribution and flow state of the air to different air outlets, wherein the deflection angle is the angle between the first wind guide surface 24511 / the second wind guide surface 24521 and the air inlet direction. In practical applications, the air volume distribution and flow state can be adjusted by adjusting the setting position and deflection degree of the first wind guide surface 24511 and the second wind guide surface 24521. Figure 7As shown, when the diverter plate 245 is fixed at the center position in the diverter cavity 244, that is, the diverter plate 245 is at the midpoint of the first air inlet 241, and the first air guide surface 24511 and the second air guide surface 24521 have the same degree of deflection, the air volume flowing to the first air outlet 242 and the second air outlet 243 is the same, that is, the air volume flowing to the secondary heat exchanger 250 at each air outlet is the same. At this time, the deflection angle of the first air guide surface 24511 or the second air guide surface 24521 can be adjusted to adjust the pressure loss at one end, thereby adjusting the air volume at both ends. Of course, the degree of deflection of the first air guide surface 24511 and the second air guide surface 24521 may also be different. For example, Figure 8 As shown, in one embodiment, the splitter plate 245 is fixedly arranged at a left position in the splitter cavity 244, that is, the splitter plate 245 is located at a left position of the first air inlet 241, and the air volume on the right side is greater than the air volume on the left side. The pressure on the left and right sides can be adjusted by adjusting the degree of deflection of the second air guide surface 24521 toward the second air outlet 243, that is, adjusting the size of h in the figure, so as to make the air volume at both ends uniform and thus achieve uniform distribution of the air volume. Fig. 9 As shown, in another embodiment, the diverter plate 245 is fixedly arranged at a right position in the diverter cavity 244, that is, the diverter plate 245 is located at a right position of the first air inlet 241, and the air outlet on the left side is greater than the air outlet on the right side. The air volume distribution on the left and right sides can be adjusted by adjusting the degree of deflection of the first air guide surface 24511 toward the first air outlet 242, that is, adjusting the size of h in the figure.

[0083] Optionally, the angle between the first wind guide surface 24511 / the second wind guide surface 24521 and the wind inlet direction ranges from 1° to 30°. In practical applications, the deflection angles of the first wind guide surface 24511 and the second wind guide surface 24521 can be adjusted as required. Of course, the angle between the first wind guide surface 24511 / the second wind guide surface 24521 and the wind inlet direction is not limited to the above range. In other embodiments, it can also be other data ranges. The present invention does not limit this. In practical applications, it can be set according to actual conditions.

[0084] In this embodiment, the end of the diverter plate 245 away from the first air inlet 241 is connected to the supporting plate 246 for supporting the diverter plate 245 through an adjustable connecting component 247, so as to adjust the setting position of the diverter plate 245 by means of the adjustable connecting component 247, and then dynamically adjust the distribution of air volume according to demand to meet different heat dissipation requirements of the equipment. For example, when the diverter plate 245 is set at the center of the diverter cavity 244, due to the influence of factors such as the direction, distance or shielding of the first air outlet 242 and the second air outlet 243, the background pressure of the two air outlets is different, that is, the pressure loss or wind resistance is different. The diverter plate 245 can be adjusted eccentrically through the adjustable connecting component 247 to make the air volume on both sides the same, so as to make the ventilation volume flowing to each secondary heat exchanger 250 the same, so as to improve the heat exchange utilization efficiency of each secondary heat exchanger 250 in the cooling device 200 and ensure the adequacy of heat exchange.

[0085] like Figure 4 and Figure 5 As shown, the adjustable connecting assembly 247 includes: a first connecting structure 2471 of the diverter plate 245 and a second connecting structure 2472 of the supporting plate 246, the first connecting structure 2471 is arranged at one end of the diverter plate 245 away from the first air inlet 241, the first connecting structure 2471 is provided with a first through hole 24711, and the second connecting structure 2472 is correspondingly provided with a fastening hole 24721, the first through hole 24711 and / or the fastening hole 24721 are waist-shaped holes, and the fixing bolt passes through the first through hole 24711 and is fixedly connected at the fastening hole 24721. As can be seen from the above, the adjustable connection assembly 247 combines the first connection structure 2471 of the diverter plate 245 and the second connection structure 2472 of the carrier plate 246, and makes the fastening position of the fixing bolt adjustable by means of the first through hole 24711 and / or the fastening hole 24721 of the waist-shaped hole structure, thereby making the fixed position of the diverter plate 245 on the carrier plate 246 adjustable, so as to adjust the ventilation volume of each air outlet. The adjustable connection assembly 247 makes full use of the original structure of the diverter plate 245 and the carrier plate 246, simplifies the component composition of the diverter device 240, and facilitates the processing and preparation of the diverter device 240.

[0086] like Figure 4 As shown, in this embodiment, the second connection structure 2472 is a part of the supporting plate 246, and a circular fastening hole 24721 is formed on the second connection structure 2472. Figure 5As shown, the first connection structure 2471 of the adjustable connection assembly 247 is the bottom part of the first deflection surface 24512 and the second deflection surface 24522, and a waist-shaped first through hole 24711 is provided on the first connection structure 2471. Different fastening positions are selected on the first through hole 24711, and the splitter plate 245 is fixed to the carrier plate 246 by connecting and fixing at the fastening position with a fixing bolt. When the position of the splitter plate 245 needs to be adjusted, the fixing bolt is loosened to adjust the fastening position, and then the fixing screw is tightened to achieve fixation.

[0087] On the other hand, in practical applications, in order to reduce the floor space of the equipment, the cooling device 200 needs to be arranged as compactly as possible, and its diversion device 240 also needs to reduce the space occupied as much as possible. However, when performing equipment maintenance on the chamber and other parts of the semiconductor process equipment, the internal space is small and it is not convenient to maintain the equipment. The cooling device 200 needs to be removed as a whole to increase the maintenance space. Based on this, the utility model provides an installation and adjustment mechanism 290 for the air duct of the cooling device 200 (see Figure 2 ), the installation adjustment mechanism 290 is used to align and connect the second air inlet 211 of the air inlet duct 210 of the cooling device 200 with the air outlet of the target to be cooled, so as to dismantle and install the cooling device 200 as a whole.

[0088] Specifically, Figure 2 As shown, the installation adjustment mechanism 290 includes: a slidable bottom plate 291, and the bottom plate 291 is configured to move the cooling device 200 so that the first air inlet 241 of the air duct of the cooling device 200 is aligned and connected with the air outlet of the target to be cooled. The slidable bottom plate 291 allows the cooling device 200 to be easily and quickly separated from the target to be cooled, i.e., the process chamber 100. When the system needs maintenance, the cooling device 200 can be quickly pulled out, which is convenient for the maintenance of the cooling device 200 itself or other equipment in the system, and increases the flexibility of equipment maintenance and installation. Further, in this embodiment, the bottom plate 291 is supported by a plurality of wheels 292, so that the cooling channel can be movably arranged in the circulating air cavity 310. When maintaining the system equipment, the cooling device 200 can be quickly disassembled from the high-temperature process chamber 100, the external cooling water pipeline, the equipment frame, etc., and then removed as a whole to provide more space for equipment maintenance; when installing the system equipment, other equipment besides the cooling device 200 can be installed, and then the cooling device 200 as a whole can be docked and installed with other equipment to facilitate the assembly and installation of the overall system.

[0089] In this embodiment, the bottom plate 291 is used to carry the heat exchanger assembly and the air inlet duct 210. The bottom plate 291 is made of metal material. The bearing plate 246 for carrying the diverter plate 245 is connected to the bottom plate 291 through a bolt assembly, which improves the detachability of the cooling device 200 components for the maintenance of the device. Of course, the two can also be connected by other methods (such as welding), which can be selected according to actual conditions. On the other hand, the bearing plate 246 and the bottom plate 291 can also be the same structure or the two can be set as an integrated structure to simplify the overall structure and reduce the assembly process.

[0090] Furthermore, a position fine-adjustment mechanism 293 for supporting the cooling device 200 is provided on the bottom plate 291, and the position fine-adjustment mechanism 293 can make the cooling device 200 movable and fixed relative to the bottom plate 291 in the horizontal and / or vertical direction. When the cooling device 200 and the air outlet of the object to be cooled are assembled, there may be a slight position difference. At this time, the spatial position of the cooling device 200 can be adjusted by the position fine-adjustment mechanism 293, so that the second air inlet 211 of the air inlet duct 210 of the cooling device 200 is aligned with the air outlet of the object to be cooled, so that the two can be connected and installed.

[0091] It should be noted that the cooling device 200 and its diversion device 240 and installation adjustment mechanism 290 of the utility model are not limited to the above-mentioned epitaxial growth equipment. In other embodiments, they can also be applied to other types of semiconductor process equipment, such as atomic layer deposition equipment or epitaxial growth equipment composed of other structures, etc. The utility model does not impose any restrictions on this.

[0092] To sum up, in a cooling device 200 and its diverter device 240, an installation adjustment mechanism 290 and semiconductor process equipment of the utility model, the diverter device 240 of the cooling device 200 combines the first wind plate 2451 and the second wind plate 2452, so that the intersection of the first wind plate 2451 and the second wind plate 2452 is arranged close to the first air inlet 241 and there is an angle between the two wind plates, which can realize the diversion of the cooling air and guide the diverted cooling air to different air outlets, and then flow to the corresponding heat exchanger, which helps to improve the overall heat exchange efficiency of the cooling device 200 and ensure the stability of the cooling effect of the cooling device 200.

[0093] Furthermore, the installation position of the diverter device 240 can be adjusted, thereby adjusting the ventilation volume to different air outlets and corresponding heat exchangers. In actual applications, it can be adjusted according to needs to meet different application requirements.

[0094] Furthermore, the installation adjustment mechanism 290 of the cooling device 200 enables the second air inlet 211 of the air inlet duct 210 of the cooling device 200 to be aligned and connected with the air outlet of the target to be cooled, so that the cooling device 200 can be dismantled and installed as a whole, thereby increasing the flexibility of maintenance and installation of the cooling device 200 and other components.

[0095] It should be noted that, in this article, the terms "include", "comprises", "has" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or terminal device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or terminal device. In the absence of further restrictions, the elements defined by the sentence "includes..." or "comprising..." do not exclude the existence of other elements in the process, method, article or terminal device including the elements.

[0096] In the description of this application, the terms "first", "second", etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include one or more of the features.

[0097] Although the content of the utility model has been described in detail through the above preferred embodiments, it should be appreciated that the above description should not be considered as a limitation of the utility model. After reading the above content, various modifications and substitutions of the utility model will be obvious to those skilled in the art. Therefore, the protection scope of the utility model should be limited by the attached claims.

Claims

1. A flow diversion device, characterized in that: The diversion device comprises a first air inlet, a first air outlet, a second air outlet and a diversion cavity, the diversion cavity takes in air through the first air inlet and discharges air through the first air outlet and the second air outlet, The first air outlet and the second air outlet have different air outlet directions. A diverter plate is provided in the diverter cavity. The splitter plate includes a first wind plate and a second wind plate, The first wind plate is configured to guide the incoming air at least partially to the first air outlet, and the second wind plate is configured to guide the incoming air at least partially to the second air outlet, and the first wind plate and the second wind plate are intersected and connected at one end close to the first air inlet.

2. The flow dividing device according to claim 1, characterized in that: The intersection is arranged away from the midpoint of the distance between the first air outlet and the second air outlet.

3. The flow dividing device according to claim 1, characterized in that: The diverter plate can be arranged in the diverter cavity to move toward the first air outlet or the second air outlet.

4. The flow dividing device according to claim 1, characterized in that: One end of the diverter plate away from the first air inlet is connected to a first connecting structure, and a supporting plate for supporting the diverter plate is connected to the first connecting structure via an adjustable connecting component.

5. The flow dividing device according to claim 4, characterized in that: The adjustable connection assembly comprises: The first connecting structure and the second connecting structure of the supporting plate, the first connecting structure is provided with a first through hole, the second connecting structure is correspondingly provided with a fastening hole, the first through hole and / or the fastening hole are waist-shaped holes, and the fixing bolt passes through the first through hole and is fixedly connected at the fastening hole.

6. The flow dividing device according to claim 1, characterized in that: The first wind plate and / or the second wind plate comprises a wind guiding surface and a deflecting surface, wherein the wind guiding surface is closer to the first air inlet than the deflecting surface. The wind guiding surface is used to divide the incoming wind into a first wind and a second wind, and the deflecting surface is used to deflect the first wind and the second wind toward the wind outlet directions of the first air outlet and the second air outlet, respectively.

7. The flow dividing device according to claim 6, characterized in that: The angle between the wind guide surface and the wind inlet direction ranges from 1° to 30°.

8. The flow dividing device according to claim 6, characterized in that: The deflection surface is an arc transition surface to connect the wind guide surface to the wind outlet direction.

9. The flow dividing device according to claim 8, characterized in that: The ratio of the arc radius of the arc transition surface to the wind guiding length of the wind guiding surface is 0.1 to 3.

10. An installation and adjustment mechanism for an air duct of a cooling device, characterized in that: The installation and adjustment mechanism comprises: A slidable bottom plate is configured to move the cooling device so that the second air inlet of the air inlet duct of the cooling device is aligned and connected with the air outlet of the target to be cooled.

11. The air duct installation and adjustment mechanism according to claim 10, characterized in that: The bottom plate is provided with a position fine-adjustment mechanism for supporting the cooling device, and the position fine-adjustment mechanism can enable the cooling device to be movably fixed relative to the bottom plate in the horizontal and / or vertical direction.

12. The air duct installation and adjustment mechanism according to claim 10, characterized in that: The base plate is supported by a plurality of wheels.

13. The air duct installation and adjustment mechanism according to claim 10, characterized in that: The second air inlet of the air inlet duct is provided with a buckle for detachably fixing the air inlet of the duct to the air outlet of the target to be cooled.

14. A cooling device, characterized in that: Include: An air inlet duct, wherein the air inlet duct sucks in air to be cooled; The air inlet duct is connected to a heat exchanger assembly, The heat exchanger assembly is provided with a primary heat exchanger, a fan compartment and a diverter device as claimed in any one of claims 1 to 9 in sequence along the flow direction of the air to be cooled, and a secondary heat exchanger is provided outside the first air outlet and the second air outlet of the diverter device.

15. The cooling device according to claim 14, characterized in that Also includes: The installation adjustment mechanism according to any one of claims 10 to 13 is used to align and connect the second air inlet of the air inlet duct of the cooling device with the exhaust port of the target to be cooled.

16. The cooling device according to claim 14, characterized in that Also includes: At least two air outlet buffer plates are arranged at the air outlet position of the secondary heat exchanger.

17. The cooling device according to claim 16, characterized in that A noise reduction structure is provided between the air outlet buffer plate and the heat exchanger.

18. The cooling device according to claim 15, characterized in that The primary heat exchanger and / or the secondary heat exchanger is a water-cooled heat exchanger.

19. The cooling device according to claim 18, characterized in that Also includes: The heat exchanger water leakage detection device is arranged on the bottom plate.

20. The cooling device according to claim 14, characterized in that The air inlet and outlet of the heat exchanger assembly and the fan compartment are provided with temperature sensors.

21. The cooling device according to claim 15, characterized in that A wind pressure detector is arranged in the second air inlet of the air inlet duct.

22. The cooling device according to claim 14, characterized in that The air inlet duct is sequentially provided with an air duct elbow and a pressure diffuser section along the flow direction of the air to be cooled, and the pressure diffuser section is connected to the primary heat exchanger.

23. The cooling device according to claim 18, characterized in that The water-cooled heat exchanger is provided with a quick-connect connector extending outwardly.

24. A semiconductor process equipment, characterized in that: Include: A process chamber for performing a process, wherein the process chamber has an air inlet and an exhaust port; An outer shell, the process chamber is located in the outer shell, a circulating air cavity is formed between the outer shell and the process chamber, and the air inlet is communicated with the circulating air cavity; The cooling device according to any one of claims 14 to 23 is movably located in the circulating air cavity so that the second air inlet of the air inlet duct of the cooling device is connected to the exhaust port of the process chamber.

25. The semiconductor process equipment according to claim 24, characterized in that: The distance between the first air outlet and the air inlet is smaller than the distance between the second air outlet and the air inlet, and the intersection of the diverter plate is arranged close to the first air outlet relative to the second air outlet.

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