Vacuum suction pen detection device

Abstract

The utility model discloses a vacuum suction pen detection device, which comprises a main body structure, wherein an airflow channel is arranged in the main body structure; the vacuum detector is arranged in an airflow channel of the main body structure; the first airflow port and the second airflow port are both in air communication with the airflow channel in the main body structure; the first airflow port is connected with a vacuum pump, and the second airflow port is used for being communicated with a vacuum pumping end of a to-be-tested vacuum suction pen; the flat plate adsorption structure is arranged on the main body structure and is used for being attached and adsorbed with a suction cup of the vacuum suction pen to be tested; the controller is connected with the vacuum detector; the alarm is connected with the controller; and the controller is used for controlling the alarm to give an alarm prompt when the negative pressure data measured by the vacuum detector is smaller than the set negative pressure. According to the vacuum suction pen detection device provided by the invention, the adsorption capacity of the vacuum suction pen on the wafer can be detected, and the problem that the wafer falls off when the wafer is carried by the vacuum suction pen is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of vacuum suction pens, in particular to a vacuum suction pen detection device. Background Art

[0002] The vacuum pen is a tool used to transport wafers in the semiconductor processing field; a vacuum pipe is arranged inside the vacuum pen, and a gas connection with the vacuum pipe is arranged at the end of the vacuum pen; when the suction cup of the vacuum pen is attached to the side of the wafer and the vacuum pipe is evacuated, the suction cup of the vacuum pen can generate a large negative pressure adsorption force on the wafer, thereby realizing the transportation of the wafer.

[0003] However, in actual applications, if there is a fault in the vacuum suction pen itself, resulting in unstable suction force on the wafer during wafer transportation, it may affect the normal transportation of the wafer product and even directly cause the wafer to fall, resulting in economic losses. Utility Model Content

[0004] The utility model aims to provide a vacuum suction pen detection device, which can detect the vacuum degree of the vacuum suction pen and provide a reliable reference basis for determining whether the vacuum suction pen can stably adsorb wafers.

[0005] In order to solve the above technical problems, the utility model provides a vacuum pen detection device, comprising:

[0006] A main structure with an air flow channel disposed therein;

[0007] A vacuum detector disposed in the air flow channel of the main structure;

[0008] a first air flow port and a second air flow port both of which are in air communication with the air flow channel in the main structure; the first air flow port is connected to a vacuum pump, and the second air flow port is used to be in air communication with a vacuum suction end of a vacuum suction pen to be tested;

[0009] A flat adsorption structure is arranged on the main structure, and is used for adhering to the suction cup of the vacuum suction pen to be tested;

[0010] A controller connected to the vacuum detector and an alarm connected to the controller;

[0011] The controller is used to control the alarm to issue an alarm prompt when the negative pressure data measured by the vacuum detector is smaller than the set negative pressure.

[0012] In an optional embodiment of the present application, the vacuum suction pen detection device further includes a display screen arranged on the main structure and connected to the vacuum detector, for displaying detection data of the vacuum detector.

[0013] In an optional embodiment of the present application, a support structure is further provided on the main structure, and the support structure is higher than the flat plate adsorption structure;

[0014] The support structure is used to support the vacuum suction pen to be tilted at a set angle when the suction cup of the vacuum suction pen to be tested is adsorbed on the flat plate adsorption structure.

[0015] In an optional embodiment of the present application, a pen suction detector is provided on the support structure; the pen suction detector is connected to the controller;

[0016] When the suction pen detector detects that the vacuum suction pen to be tested is arranged on the support structure, the controller controls the vacuum pump to start evacuating the gas channel in the main structure.

[0017] In an optional embodiment of the present application, the suction pen detector is a photoelectric sensor.

[0018] In an optional embodiment of the present application, the flat plate adsorption structure includes a glass flat plate and an annular structure arranged around the edge of the glass flat plate; the annular structure has a notch at at least one side position of the glass flat plate.

[0019] In an optional embodiment of the present application, a thin film pressure sensor is further provided on the side of the glass plate corresponding to the notch of the annular structure.

[0020] In an optional embodiment of the present application, the second air flow port is connected to the vacuum suction pen to be tested through a vacuum hose.

[0021] In an optional embodiment of the present application, the alarm is a buzzer.

[0022] In an optional embodiment of the present application, the air flow channel of the main structure is also connected to an air leakage pipe port, and an electromagnetic valve is provided on the air leakage pipe port.

[0023] The utility model provides a vacuum suction pen detection device, comprising a main structure with an air flow channel arranged inside; a vacuum detector arranged in the air flow channel of the main structure; a first air flow port and a second air flow port both of which are in air communication with the air flow channel in the main structure; the first air flow port is connected to a vacuum pump, and the second air flow port is used for being in air communication with a vacuum exhaust end of a vacuum suction pen to be tested; a flat adsorption structure arranged on the main structure, used for adhering to a suction cup of the vacuum suction pen to be tested; a controller connected to the vacuum detector and an alarm connected to the controller; the controller is used for controlling the alarm to issue an alarm prompt when the negative pressure data measured by the vacuum detector is less than the set negative pressure.

[0024] The vacuum suction pen detection device provided in the present application forms an air flow channel in the main structure that can be connected to the vacuum suction end of the vacuum suction pen to be tested. A vacuum detector is also arranged in the air flow channel, and the air flow channel is connected to a vacuum pump, so that the vacuum pump can evacuate the vacuum channel of the vacuum suction pen to be tested through the air flow channel; in addition, a flat plate adsorption structure simulating a wafer is also arranged on the main structure, and the suction cup of the vacuum suction pen to be tested can be attached to the flat plate adsorption structure to simulate the state of the suction cup adsorbing the wafer; when the vacuum pump evacuates the air flow channel in the main structure, According to the negative pressure data measured by the vacuum detector, it is possible to determine whether the vacuum degree in the airflow channel can meet the requirements. If the measured negative pressure data is not less than the set negative pressure, it obviously indicates that there is no vacuum leakage problem in the vacuum channel of the vacuum suction pen and it can meet the requirements for adsorbing the wafer; conversely, if the measured negative pressure data is less than the set negative pressure, it means that the negative pressure in the airflow channel cannot reach the required vacuum degree, and the adsorption force of the vacuum suction pen to transport the wafer is insufficient; thereby, the detection of the vacuum suction pen's adsorption ability on the wafer is realized, avoiding problems such as wafer falling when the vacuum suction pen is transporting the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the utility model or the technical solutions of the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 A schematic diagram of the structure of a vacuum pen detection device provided in an embodiment of the present application;

[0027] Figure 2 A schematic diagram of the side structure of a vacuum pen detection device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0028] In the process of adsorbing and transporting wafers by the vacuum suction pen, to ensure that the wafers can be transported smoothly and stably, the suction cup of the vacuum suction pen is required to have a stable and sufficiently large adsorption force on the wafers; and this adsorption force is determined by the vacuum degree of the vacuum channel in the vacuum suction pen. Only when the vacuum degree of the vacuum channel in the vacuum suction pen reaches a sufficient size and can remain stable when the vacuum is evacuated, can the stable adsorption force on the wafer be guaranteed. However, in actual applications, the vacuum channel of the vacuum suction pen may have air leakage, the suction cup is damaged, the suction cup cannot be opened normally, etc., resulting in poor airtightness of the space formed between the vacuum channel and the suction cup. That is, when the vacuum channel of the vacuum suction pen is evacuated, the vacuum degree in the vacuum channel is difficult to meet the needs of stable wafer transportation.

[0029] To this end, the present application provides a technical solution that can detect the vacuum degree in the vacuum channel of a vacuum suction pen, which can provide a reference for determining whether the vacuum suction pen is available, avoid the problem of wafers falling during the wafer transportation process by the vacuum suction pen, and reduce the economic losses caused by the inability of the vacuum suction pen to transport wafers normally to a certain extent.

[0030] In order to enable those skilled in the art to better understand the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present invention.

[0031] like Figure 1 and Figure 2 As shown, Figure 1 This is a schematic diagram of the structure of the vacuum pen detection device provided in the embodiment of the present application. Figure 2 A schematic diagram of the side structure of a vacuum pen detection device provided in an embodiment of the present application.

[0032] In a specific embodiment of the present application, the vacuum pen detection device may include:

[0033] A main structure 2 having an air flow channel disposed therein;

[0034] A vacuum detector provided in the air flow channel of the main structure 2;

[0035] A first airflow port 21 and a second airflow port 22 are both connected to the airflow channel in the main structure 2; the first airflow port 21 is connected to the vacuum pump, and the second airflow port 22 is used to be connected to the vacuum suction end of the vacuum suction pen 1 to be tested;

[0036] A flat adsorption structure 23 is arranged on the main structure 2, and is used to fit and adsorb with the suction cup of the vacuum suction pen 1 to be tested;

[0037] A controller connected to the vacuum detector and an alarm connected to the controller;

[0038] The controller is used to control the alarm to sound an alarm when the negative pressure data measured by the vacuum detector is less than the set negative pressure.

[0039] like Figure 1 and Figure 2As shown, the main structure 2 in this embodiment is generally a rectangular parallelepiped structure. In practical applications, the main structure 2 can directly adopt a cavity object structure with good sealing performance, and the cavity inside the main structure 2 is also the airflow channel. In addition, the main structure 2 can also be a solid structure with holes drilled inside to form an airflow channel, which can also achieve the technical solution of this embodiment.

[0040] The main structure 2 is also provided with a first airflow port 21 and a second airflow port 22, wherein the first airflow port 21 is connected to the vacuum pump, and the second airflow port 22 is connected to the vacuum suction end of the vacuum suction pen 1 to be tested; thus, the vacuum pump, the airflow channel in the main structure 2, and the vacuum channel in the vacuum suction pen 1 to be tested can be connected in sequence; when the vacuum pump starts to evacuate, the vacuum degree in the airflow channel in the main structure 2 is the same as the vacuum degree of the vacuum main body mechanism; and a vacuum detector is provided in the airflow channel in the main structure 2, therefore, The vacuum detector can be used to measure the vacuum degree in the vacuum channel of the vacuum pen 1 to be tested when it is evacuated by the vacuum pump, and the magnitude of this vacuum degree is proportional to the suction force of the suction cup of the vacuum pen 1 to be tested on the wafer. When the negative pressure data measured by the vacuum detector is less than the set negative pressure, it means that the sealing of the vacuum channel in the vacuum pen 1 to be tested is insufficient and there is a vacuum leakage problem; on the contrary, when the negative pressure data measured by the vacuum detector is not less than the set negative pressure, it means that the sealing of the vacuum channel in the vacuum pen 1 to be tested is good, and under normal circumstances, the wafer can be stably adsorbed and transported. It can be understood that the set negative pressure in this embodiment should be the minimum negative pressure required for the vacuum pen 1 to be tested to stably adsorb the wafer, which can be set by the staff based on repeated tests or experience, and this application does not specifically limit this.

[0041] On this basis, in this embodiment, the vacuum detector and the controller are connected, and the controller is also connected to an alarm; after the vacuum detector measures the negative pressure data in the air flow channel in the main structure 2, the negative pressure data can be transmitted to the controller, and the controller compares the negative pressure data with the set negative pressure. Once the negative pressure data is less than the set negative pressure, the alarm is controlled to issue an alarm prompt to remind the staff that the vacuum suction pen 1 to be tested is currently unavailable.

[0042] The alarm in this embodiment can be a buzzer set on the main structure 2, or an LED light that displays the test results; when the negative pressure data measured by the vacuum detector is less than the set negative pressure, the LED light turns red, and when the negative pressure data measured by the vacuum detector is not less than the set negative pressure, the LED light turns green. Other forms of alarms can also be used in this application, which are not listed here one by one, as long as the staff can accurately know the test results.

[0043] like Figure 1and Figure 2 As shown, in actual application, the vacuum pen 1 to be tested and the second air flow port 22 of the air flow channel of the main structure 2 can be connected by a vacuum hose 24. In addition, in order to ensure that the vacuum pen 1 to be tested can be stably placed on the main structure 2, a support structure 25 capable of supporting the vacuum pen 1 to be tested is further provided on the main structure 2. It can be understood that the support structure 25 should cooperate with the flat plate adsorption structure 23, so that when the vacuum pen 1 to be tested is placed on the support structure 25, the suction cup of the vacuum pen 1 to be tested can be mounted and fitted on the flat plate adsorption structure 23. For example, the support structure 25 can be set to have a certain distance between it and the flat plate adsorption structure 23, and the position of the support structure 25 supporting the vacuum pen 1 to be tested should be higher than the flat plate adsorption structure 23, so that when the vacuum exhaust end of the vacuum pen 1 to be tested is set on the support structure 25, and the suction cup of the vacuum pen 1 to be tested is fitted on the flat plate adsorption structure 23, the vacuum pen 1 to be tested is tilted at a set angle as a whole. This is obviously more consistent with the state of the vacuum pen 1 to be tested when picking up the wafer, that is, the vacuum pen 1 to be tested can better simulate the state of adsorbing and transporting the wafer, and the vacuum degree result finally measured is more accurate and reliable.

[0044] Because the vacuum suction pen 1 to be tested is placed on the bracket of the main structure 2, the vacuum degree of the vacuum suction pen 1 to be tested can be detected. Therefore, in actual application, when the vacuum suction pen 1 to be tested is temporarily placed on the main structure 2 and not in use, the vacuum degree of the vacuum suction pen 1 to be tested can be detected by using a vacuum pump, the main structure 2 and a vacuum detector. If the vacuum degree of the vacuum suction pen is qualified, the suction cup of the vacuum suction pen 1 to be tested is attached to the wafer on the basis of maintaining the air flow channel in the vacuum suction pen 1 to be tested and the main structure 2 being connected, and the vacuum pump is directly started, and the vacuum suction pen 1 to be tested can start to absorb and transport the wafer; this is equivalent to realizing the on-the-spot detection of the vacuum suction pen 1 to be tested to a certain extent, even when the vacuum suction pen 1 to be tested is in use. During the process of the vacuum suction pen 1 adsorbing and transporting the wafer, the vacuum degree of the vacuum suction pen 1 to be tested can also be detected in real time, so as to realize online detection of the vacuum degree during the use of the vacuum suction pen 1 to be tested; therefore, during the process of transporting the wafer, if the wafer falls, the reason for the wafer falling can be more accurately judged based on the data detected by the vacuum detector, so as to provide effective data basis for ensuring the stable transport of the wafer by the vacuum suction pen; or during the process of transporting the wafer, when the vacuum detector detects that the negative pressure data is insufficient, an alarm can be issued through the alarm so that the staff can quickly take corresponding remedial measures (such as quickly putting down the wafer), thereby avoiding the economic loss caused by the wafer breaking to a certain extent.

[0045] Furthermore, in another optional embodiment of the present application, the vacuum pen detection device may further include:

[0046] A pen suction detector is provided on the support structure 25; the pen suction detector is connected to the controller;

[0047] When the suction pen detector detects that the vacuum suction pen 1 to be tested is arranged on the support structure 25 , the controller controls the vacuum pump to start evacuating the gas channel in the main structure 2 .

[0048] like Figure 1 As shown, the support structure 25 may have a U-shaped groove structure, and the U-shaped groove may support the vacuum suction pen 1 to be tested. Accordingly, the suction pen detector in this embodiment may be a photoelectric sensor, and the photoelectric sensor includes a laser transmitter and a laser receiver arranged on the side walls on both sides of the U-shaped groove; obviously, when the vacuum suction pen 1 to be tested is placed in the U-shaped groove, the laser light emitted by the laser transmitter will be blocked, and the laser receiver will not be able to receive the laser light, thereby determining that the vacuum suction pen 1 to be tested is placed on the main structure 2. Of course, in actual applications, a pressure sensor may also be arranged on the U-shaped groove, and by sensing the pressure change when the vacuum suction pen 1 to be tested is placed on the U-shaped groove, it is determined whether the vacuum suction pen 1 to be tested is placed on the main structure 2.

[0049] When the suction pen detector determines that the vacuum suction pen 1 to be tested is placed on the main structure 2, the controller can control the vacuum pump to automatically start to detect the vacuum degree of the vacuum suction pen 1 to be tested, and alarm through the alarm when the vacuum degree of the vacuum suction pen 1 to be tested does not meet the requirements. Therefore, after each use of the vacuum suction pen 1 to be tested, the staff can directly place it on the main structure 2, and the vacuum suction pen detection device can automatically start to detect the vacuum degree of the vacuum suction pen 1 to be tested, thereby providing reliable data basis for the next use of the vacuum suction pen 1 to be tested, and providing convenience for the use of the vacuum suction pen 1 to be tested.

[0050] As described above, when the vacuum suction pen 1 to be tested is placed on the main structure 2, the suction cup of the vacuum suction pen 1 to be tested should be adsorbed on the flat adsorption structure 23. In practical applications, the flat adsorption structure 23 may include a glass flat plate and an annular structure arranged around the edge of the glass flat plate; the annular structure has a notch at at least one side position of the glass flat plate.

[0051] It is understandable that during the process of the vacuum suction pen 1 to be tested adsorbing and transporting the wafer, the wafer is generally placed in a wafer disk groove with a notch on one side. Therefore, a ring structure is adopted to surround the glass plate and a notch is provided on one side of the glass plate, which is more in line with the state of the wafer when the vacuum suction pen 1 to be tested picks up the wafer. Therefore, when the vacuum degree of the vacuum suction pen 1 to be tested is tested, the state of adsorbing and transporting the wafer can be more realistically simulated.

[0052] On this basis, in another optional embodiment of the present embodiment, a thin film pressure sensor is further provided on the side of the notch of the annular structure of the glass plate.

[0053] In the above embodiments, the vacuum pen 1 to be tested is mainly used to detect the possibility of vacuum leakage. However, in actual applications, the vacuum pen 1 to be tested may not only leak vacuum, but also its internal vacuum channel may be blocked. Once the vacuum channel in the vacuum pen 1 to be tested is blocked, it is equivalent to the vacuum channel and the adsorption area of ​​the suction cup no longer being in a state of air connection. Therefore, even if the vacuum detector measures that the vacuum degree in the airflow channel connected to the vacuum channel meets the adsorption requirements, the suction cup of the vacuum pen 1 to be tested may have no adsorption force at all, or the adsorption force is insufficient. For this reason, a thin film pressure sensor is set on the side of the glass plate in this embodiment.

[0054] It can be understood that the position of the film pressure sensor is also the position where the suction cup of the vacuum suction pen 1 to be tested adsorbs on the glass plate when the vacuum suction pen 1 to be tested is placed on the main structure 2. Under normal circumstances, when the vacuum detector measures that the negative pressure data in the main structure 2 is not less than the set negative pressure, the adsorption force of the suction cup of the vacuum suction pen 1 to be tested on the glass plate should also be relatively large; and the adsorption force of the suction cup on the glass plate can be measured by the film pressure sensor set on the glass plate. Therefore, in the actual detection process of this embodiment, it can be determined whether the negative pressure data measured by the vacuum detector is not less than the set negative pressure. If so, it is further determined whether the pressure data measured by the film pressure sensor is greater than the set pressure. If the pressure data is not greater than the set pressure, it can be determined that the air path is blocked in the vacuum channel of the vacuum suction pen 1 to be tested. On the contrary, when the pressure data is greater than the set pressure, it can be determined that the working performance of the vacuum suction pen 1 to be tested is stable and can stably adsorb and transport wafers.

[0055] It can be seen that in this embodiment, not only can the vacuum leakage of the vacuum suction pen 1 to be tested be detected, but also the air path blockage in the vacuum suction pen 1 to be tested can be detected, thereby ensuring the comprehensiveness of the working performance detection of the vacuum suction pen 1 to be tested and improving the reliability of the detection result.

[0056] In addition, in another optional embodiment of the present embodiment, the vacuum suction pen detection device may further include a display screen 26 disposed on the main structure 2 and connected to the vacuum detector, for displaying detection data of the vacuum detector.

[0057] In this embodiment, a display screen 26 is provided on the side wall of the main structure 2, so that the negative pressure data measured by the vacuum detector can be directly displayed on the display screen 26, and the staff can also directly have a more intuitive understanding of the vacuum degree of the vacuum suction pen 1 to be tested through the negative pressure data displayed on the display screen 26. In addition, the display screen 26 can also be used as an interface for the staff to perform human-computer interaction operations. For example, the staff can control and input a more reasonable set negative pressure on the display screen 26 based on the different types of vacuum suction pens 1 to be tested and the different sizes and weights of wafers to be adsorbed.

[0058] In addition, after the vacuum pen 1 to be tested is tested, if the main structure 2 maintains a negative pressure state, it will obviously affect the removal of the vacuum pen 1 to be tested. To this end, in another optional embodiment of the present application, the air flow channel of the main structure 2 is also connected to a vent pipe port, and a solenoid valve is provided on the vent pipe port.

[0059] It can be understood that the solenoid valve can be electrically connected to the controller. Therefore, after the vacuum performance test such as the vacuum degree of the vacuum suction pen 1 to be tested is completed, the controller can further control the solenoid valve to open automatically and slowly, so as to gradually relieve the pressure of the air flow channel in the main structure 2 by utilizing the air relief pipe opening, so that the air pressure in the vacuum channel of the vacuum suction pen 1 to be tested and the air flow channel of the main structure 2 is basically the same as the ambient air pressure. At this time, the vacuum suction pen 1 to be tested can be taken and used.

[0060] In summary, the vacuum suction pen detection device provided in the present application forms an air flow channel in the main structure that can be connected to the vacuum exhaust end of the vacuum suction pen to be tested, and a vacuum detector is also arranged in the air flow channel, and the air flow channel is connected to the vacuum pump, so that the vacuum pump can evacuate the vacuum channel of the vacuum suction pen to be tested through the air flow channel; in addition, a flat adsorption structure simulating a wafer is also arranged on the main structure, and the suction cup of the vacuum suction pen to be tested can be attached to the flat adsorption structure to simulate the state of the suction cup adsorbing the wafer; when the vacuum pump evacuates the air flow channel in the main structure When the vacuum degree in the airflow channel can reach the requirement, it can be judged according to the negative pressure data measured by the vacuum detector. If the measured negative pressure data is not less than the set negative pressure, it obviously indicates that there is no vacuum leakage problem in the vacuum channel of the vacuum suction pen, and it can meet the requirement of adsorbing the wafer; on the contrary, if the measured negative pressure data is less than the set negative pressure, it indicates that the negative pressure in the airflow channel cannot reach the required vacuum degree, and the adsorption force of the vacuum suction pen to transport the wafer is insufficient; thereby, the adsorption capacity of the vacuum suction pen to the wafer is detected, and the problem of wafer falling when the vacuum suction pen is transporting the wafer is avoided.

[0061] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations. Moreover, the term "includes", "comprising" or any other variant thereof is intended to cover non-exclusive inclusion, so that the process, method, article or equipment comprising a series of elements are inherent to the elements. In the absence of more restrictions, the elements limited by the sentence "comprising one..." do not exclude the presence of other identical elements in the process, method, article or equipment comprising the elements. In addition, the above-mentioned technical solution provided in the embodiment of the present application is consistent with the corresponding technical solution in the prior art in principle, and the part is not described in detail, so as to avoid too much redundancy.

[0062] This article uses specific examples to illustrate the principles and implementation methods of the utility model. The above examples are only used to help understand the method and core ideas of the utility model. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the utility model, the utility model can also be improved and modified, and these improvements and modifications also fall within the scope of protection of the claims of the utility model.

Claims

1. A vacuum pen detection device, characterized in that: include: A main structure with an air flow channel disposed therein; A vacuum detector disposed in the air flow channel of the main structure; A first airflow port and a second airflow port both of which are in air communication with the airflow channel in the main structure; the first airflow port is connected to a vacuum pump, and the second airflow port is used to be in air communication with a vacuum suction end of a vacuum suction pen to be tested; A flat adsorption structure is arranged on the main structure, and is used for adhering to the suction cup of the vacuum suction pen to be tested; A controller connected to the vacuum detector and an alarm connected to the controller; The controller is used to control the alarm to issue an alarm prompt when the negative pressure data measured by the vacuum detector is smaller than the set negative pressure.

2. The vacuum pen detection device according to claim 1, characterized in that: It also includes a display screen which is arranged on the main structure and connected to the vacuum detector and is used to display the detection data of the vacuum detector.

3. The vacuum pen detection device according to claim 1, characterized in that: The main structure is also provided with a support structure, and the support structure is higher than the flat plate adsorption structure; The support structure is used to support the vacuum suction pen to be tilted at a set angle when the suction cup of the vacuum suction pen to be tested is adsorbed on the flat plate adsorption structure.

4. The vacuum pen detection device according to claim 3, characterized in that: The support structure is provided with a pen suction detector; the pen suction detector is connected to the controller; When the suction pen detector detects that the vacuum suction pen to be tested is arranged on the support structure, the controller controls the vacuum pump to start evacuating the gas channel in the main structure.

5. The vacuum pen detection device according to claim 4, characterized in that: The suction pen detector is a photoelectric sensor.

6. The vacuum pen detection device according to claim 1, characterized in that: The flat plate adsorption structure comprises a glass flat plate and an annular structure arranged around the edge of the glass flat plate; the annular structure has a notch at at least one side position of the glass flat plate.

7. The vacuum pen detection device according to claim 6, characterized in that: A thin film pressure sensor is also arranged on the side of the glass plate corresponding to the notch of the annular structure.

8. The vacuum pen detection device according to claim 1, characterized in that: The second air flow port is connected to the vacuum suction pen to be tested through a vacuum hose.

9. The vacuum pen detection device according to claim 1, characterized in that: The alarm is a buzzer.

10. The vacuum pen detection device according to claim 1, characterized in that: The air flow channel of the main structure is also connected to an air leakage pipe port, and an electromagnetic valve is arranged on the air leakage pipe port.

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