Workbench and film sticking machine

Abstract

The utility model provides a workbench and a film sticking machine. Wherein the workbench comprises a first frame body, a second frame body and a third frame body which are sequentially arranged in a sliding mode in the height direction, the third frame body is used for bearing a wafer, and a cutting groove and an adsorption groove are formed in the upper surface of the third frame body; a first lifting device for driving the second frame body to lift is arranged on the first frame body; a second lifting device used for driving the third frame body to ascend and descend is arranged on the second frame body, the second lifting device comprises a second motor arranged on the second frame body and at least three sets of second lead screw assemblies, and nuts in the second lead screw assemblies are rotationally arranged on the second frame body and are arranged in a linkage mode through first synchronous belt mechanisms. The same ends of the lead screws are connected with the position, away from the center of the plate face, of the third frame body, and the second motor drives the nut of one lead screw assembly so that the lead screws can synchronously drive the third frame body to ascend or descend. The workbench provided by the utility model is small in size so as to better adapt to small-size wafers.

Description

Technical Field

[0001] The present application belongs to the technical field of wafer production equipment, and more specifically, to a workbench and a film laminating machine. Background Art

[0002] Wafers come in many different sizes. Generally speaking, in the wafer laminating process, a laminating machine can only perform laminating operations on wafers within a specific size range. At the same time, due to the size limitations of various driving mechanisms, the size of each functional mechanism on the laminating machine is still relatively large. Even if the size of the wafer is small (such as 4-inch, 6-inch and other small-sized wafers), the laminating machine cannot achieve a more ideal miniaturization.

[0003] In the film laminating machine, the workbench that carries the wafer up or down to move to the film laminating plane has a great influence on the volume of the film laminating machine. Generally speaking, the workbench generally includes at least a carrier and a fixed frame, and a drive component is connected between the carrier and the fixed frame. The drive component can be a linear motor component or a screw assembly; at the same time, due to the assembly position restriction of the workbench in the film laminating machine, the drive component needs to be set in the positive projection area of ​​the carrier. However, no matter which of the aforementioned driving methods is used, if the same driving stroke and accuracy are to be achieved, the volume of the driving component is relatively large; if the volume of the driving component is to be miniaturized, the driving stroke and accuracy of the driving component do not meet the requirements. Utility Model Content

[0004] The purpose of the embodiments of the present application is to provide a workbench and a film laminating machine to solve the technical problem of the large size of the workbench and the film laminating machine in the prior art.

[0005] In order to achieve the above-mentioned purpose, the technical solution adopted in the first embodiment of the present application is to provide a workbench, which includes:

[0006] A first frame, a second frame and a third frame are sequentially slidably arranged in the height direction, the third frame is used to carry the wafer, and a cutting groove and an adsorption groove are arranged on the upper surface of the third frame;

[0007] A first lifting device for driving the second frame to lift is provided on the first frame;

[0008] A second lifting device for driving the third frame to lift is arranged on the second frame, the second lifting device includes a second motor and at least three sets of second screw rod assemblies arranged on the second frame, the nuts in each of the second screw rod assemblies are rotatably arranged on the second frame and are all linked by a first synchronous belt mechanism, the same end of the screw in each of the second screw rod assemblies is respectively connected to a point on the third frame away from the center of the plate surface, the second motor drives the nut of one of the screw rod assemblies so that each of the screw rods synchronously drives the third frame to rise or fall.

[0009] Optionally, the first lifting device includes a first motor and a first screw assembly disposed on the first frame, the screw on the first screw assembly is connected to the output shaft of the first motor, and the nut on the first screw assembly is fixedly connected to the second frame.

[0010] In the second aspect of the present application, a film laminating machine is provided, which includes a frame and a winding and unwinding module, a peeling plate, a first winding module, a second winding module, a film pressing module, a peeling module, a film cutting module, a loading module and the aforementioned workbench, all of which are arranged on the frame; the loading module is used to transfer the wafer loading to the workbench; the winding and unwinding module is used to release the film roll; the peeling plate is used to separate the bottom film layer and the adhesive layer on the film roll; the workbench is used to carry the wafer to move to the film laminating base surface for film laminating operation; the first winding module is used to Recycle the bottom film layer; the film pressing module is movably arranged between the unwinding module and the second winding module and can move along the film base surface to press the adhesive layer and adhere it to the wafer surface; the film cutting module is used to cut the adhesive layer pressed and adhered to the wafer surface around the shape of the wafer, so that the part of the adhesive layer that is not attached to the wafer surface forms a waste film tape; the stripping module is arranged between the film pressing module and the second winding module, and is used to strip the waste film tape from the surface of the third frame on the workbench; the second winding module is used to recycle the waste film tape.

[0011] Optionally, the stripping module is horizontally movably arranged between the unwinding module and the second winding module, and includes a movable frame and a separation film roller arranged on the movable frame, and a film pressing plate which is movably arranged on the movable frame in the transverse and longitudinal directions and is located above the separation film roller, and the film pressing plate can move laterally and longitudinally relative to the separation film roller to flatten the waste film tape.

[0012] Optionally, the film pressing plates are symmetrically arranged in two pieces and the two film pressing plates are arranged in linkage; and / or, a rack is arranged on the frame in the horizontal direction, and a third motor and a gear set are arranged on the movable frame, and the gear set is driven by the third motor and meshingly connected with the rack.

[0013] Optionally, a fourth motor and a third synchronous belt mechanism driven by the fourth motor are arranged on the movable frame, and two film pressing frames are arranged on the third synchronous belt mechanism. Each film pressing plate is movably arranged on each film pressing frame along the longitudinal direction, and the two film pressing frames are driven by the third synchronous belt mechanism to move toward or away from each other in the transverse direction at the same time.

[0014] Optionally, the film cutting module includes a cutting knife assembly and a cleaning assembly arranged on the frame; the cutting knife assembly includes a first driving module and a cutting knife module arranged on the first driving module, the first driving module is used to drive the cutting knife module to lift and rotate to cut the adhesive layer on the workbench; the cleaning assembly is arranged on one side of the cutting knife assembly, and it includes a second driving module and a cleaning module, the second driving module is used to drive the cleaning module to approach the cutting knife module to wipe and clean the cutting knife module.

[0015] Optionally, the cutting knife module includes a knife seat and a heating seat; the knife seat is rotatably arranged on the heating seat and a spring is connected to the heating seat; a knife collision sensor is fixedly arranged on the heating seat, and a sensor sheet is fixedly arranged on the knife seat.

[0016] Optionally, the second driving module includes a cylinder and a slide rail assembly, and the cleaning module is slidably arranged on the slide rail assembly; the cleaning module includes a cleaning seat and a vertical moving mechanism arranged on the cleaning seat, a clamping cylinder is arranged on the vertical moving mechanism, and a cleaning film is arranged on the clamping cylinder.

[0017] Optionally, the cutting radius of the cutting knife module can be adjusted; the cleaning module also includes a size adjustment mechanism arranged on the cleaning seat, the size adjustment mechanism includes a slide rail, a slide seat and a plunger arranged on the slide seat, a positioning plate is arranged on the cleaning seat, and positioning holes for inserting the plunger are arranged at different length positions of the positioning plate, and the vertical moving mechanism is arranged on the slide seat.

[0018] The workbench and film laminating machine provided in the embodiments of the present application have at least the following beneficial effects:

[0019] The workbench is provided with a first frame, a second frame and a third frame, the first frame and the second frame are connected by a first lifting device with a larger driving stroke and slightly lower driving accuracy, and the second frame and the third frame are connected by a second lifting device, and the second lifting device is provided with at least three sets of second screw rod assemblies, the screw rods in each second screw rod assembly are respectively connected to the third frame away from the center of the plate surface, and each nut is connected by a synchronous belt for synchronous rotation. In this way, when a smaller model of the second screw rod assembly can be selected, the second lifting device can maintain a better driving accuracy, which is conducive to the miniaturization of the workbench to better adapt to the film laminating operation of small-sized wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0021] Figure 1 and Figure 2 A three-dimensional diagram of a workbench in some embodiments of the present application;

[0022] Figure 3 A three-dimensional diagram of a film laminating machine in some embodiments of the present application;

[0023] Figure 4 A three-dimensional diagram of a partial structure of a film laminating machine in some embodiments of the present application;

[0024] Figure 5 and Figure 6 A three-dimensional diagram of a stripping module in some embodiments of the present application;

[0025] Figure 7 A three-dimensional diagram of a cleaning component in some embodiments of the present application;

[0026] Figure 8 A three-dimensional diagram of a partial structure of a cleaning component in some embodiments of the present application;

[0027] Fig. 9 A perspective view of a cutting blade assembly in some embodiments of the present application;

[0028] Fig.10 for Fig. 9 Enlarged view of point A in the middle. DETAILED DESCRIPTION

[0029] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0030] It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0031] It should be noted that when an element is referred to as being “fixed to” or “disposed on” another element, it may be directly on the other element or indirectly on the other element.

[0032] When an element is referred to as being “connected to” another element, it can be directly connected to the other element or indirectly connected to the other element.

[0033] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0034] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features.

[0035] In the description of the present application, “plurality” means two or more than two, unless otherwise clearly and specifically defined.

[0036] Please also read Figure 1 to Figure 2 Now, the workbench 100 provided in the embodiment of the first aspect of the present application is described.

[0037] It should be noted that the workbench 100 in this embodiment is used to be assembled in a film laminating machine to realize wafer loading and move the wafer to the film laminating base surface on the film laminating machine.

[0038] refer to Figure 1 and Figure 2 The workbench 100 described in the present application includes a first frame 110, a second frame 120 and a third frame 130 arranged in sequence in the height direction, wherein the third frame 130 is used to carry wafers, and an annular cutting groove 131 and an adsorption groove 132 are arranged on the upper surface of the third frame 130, and a negative pressure airway (not shown in the figure) connected to the adsorption groove 132 is arranged in the third frame 130.

[0039] It should be understood that the orthographic projection area of ​​the first frame 110 is larger than the orthographic projection areas of the second frame 120 and the third frame 130, and the orthographic projection areas of the second frame 120 and the third frame 130 are substantially the same. The first frame 110, the second frame 120 and the third frame 130 are arranged to slide relative to each other step by step in the height direction.

[0040] Among them, a first lifting device 140 for driving the second frame 120 to lift and lower is arranged on the first frame 110. The first lifting device 140 is used to drive the second frame 120 to move with low precision and large stroke, so that the third frame 130 can approach the film base surface as soon as possible. In some embodiments, the first lifting device 140 is a first motor 141 and a first screw assembly 142, wherein the first motor 141 is fixedly arranged below the first frame 110 and is located in the positive projection area of ​​the first frame 110, and the output shaft of the first motor 141 is arranged along the axis of the first frame 110, and the first screw assembly 142 includes a first screw and a first nut, the first screw is fixedly connected to the output shaft of the first motor 141, and the first nut is fixedly arranged on the second frame 120.

[0041] A second lifting device 150 for driving the third frame 130 to lift is provided on the second frame 120. The second lifting device 150 includes a second motor 151 and at least three sets of second screw rod 1521 components 152. The second motor 151 is provided on the second frame 120 and the orthographic projection area of ​​the second motor 151 is inside the orthographic projection area of ​​the first frame 110. The second screw rod 1521 components 152 include a second screw rod 1521 and a second nut 1522. The second nut 1522 is rotatably provided on the second frame 120, and the top end of the second screw rod 1521 is fixedly connected to the third frame 130. When the second nut 1522 rotates, it pushes the second screw rod 1521 to rise or fall.

[0042] In a specific embodiment, four groups of second screw rods 1521 assemblies 152 are provided, and the top ends of the four second screw rods 1521 are respectively connected to the four corners of the third frame 130; at the same time, each second nut 1522 is connected through a first synchronous belt mechanism 153, and the first synchronous belt mechanism 153 includes a first pulley arranged on the outside of each second nut 1522 and a first synchronous belt mechanism 153 wound between each first pulley; one of the second nuts 1522 is connected to the output shaft of the second motor 151 through a second synchronous belt mechanism 155, so that when the second motor 151 rotates, it can synchronously drive the four second screw rods 1521 to rise or fall, thereby realizing the rise or fall of the third frame 130.

[0043] Furthermore, a plurality of tensioning wheels 154 are disposed on the second frame 120 , and each tensioning wheel 154 is used to tension the first synchronous belt to improve the driving efficiency of the first synchronous belt mechanism 153 on each second screw rod 1521 .

[0044] By configuring the second lifting device 150 in this way, firstly, the driving load of the third frame 130 is borne by the four second screw rods 1521, and the driving load of each second screw rod 1521 is relatively low, so that the second screw rod 1521 can be selected with a smaller size model to effectively reduce the volume while ensuring the stroke accuracy; secondly, the second nuts 1522 are connected by the first synchronous belt mechanism 153, so that the second motor 151 only needs to drive one second nut 1522 to rotate to realize the synchronous rise or fall of each second screw rod 1521, thereby reducing the number of second motors 151, which is conducive to the miniaturization of the equipment.

[0045] refer to Figures 3 to 10 In the second embodiment of the present application, a film laminating machine is proposed, which includes a frame 210 and a winding module 220, a peeling plate 230, a first winding module 240, a second winding module 250, a film pressing module 260, a peeling module 300, a film cutting module 400, a loading module 270 and the workbench 100 of the aforementioned embodiment arranged on the frame 210.

[0046] refer to Figure 3 to Figure 4 It can be understood that the film laminating machine in this embodiment is used to laminat small-sized wafers (such as 4-inch, 6-inch, etc.). Specifically, the film to be laminat is a DFR dry film, which includes a base film layer, a photoresist film and a cover film from bottom to top. It should be understood that in the laminating operation process, the photoresist film and the cover film are collectively referred to as an adhesive layer. When cutting, the photoresist film and the cover film are cut through at the same time.

[0047] Among them, the loading module 270 is used to transfer the wafer to the workbench 100, which includes a material box arranged on the rack 210 and a transfer robot arranged on the rack 210. The transfer robot picks up the wafer from the material box by suction and places the wafer on the upper surface of the third frame 130 on the workbench 100, so that it is adsorbed and fixed by the adsorption groove 132 on the third frame 130.

[0048] The unwinding module 220 is used to release the film roll, which includes a unwinding roller and a plurality of film guide rollers, and a tension roller arranged between two adjacent film guide rollers. The unwinding roller is used to install the film roll and to release the film roll. The film roll is wound around each film guide roller in turn, and the middle section of the film roll is wound around the tension roller to maintain good tension.

[0049] The peeling plate 230 is disposed between the unwinding module 220 , the first winding module 240 and the workbench 100 , and is used to separate the film roll so as to separate the adhesive layer and the bottom film layer on the film roll, thereby performing the subsequent film laminating operation.

[0050] The first winding module 240 is used to recycle the bottom film layer, which includes a first winding roller, a plurality of film guide rollers and a tension roller. The bottom film layer separated by the stripping plate 230 is wound around the film guide rollers and the tension rollers and then wound around the first winding roller to collect the bottom film layer.

[0051] The laminating module 260 is horizontally movable on the frame 210, and is used to press the adhesive layer onto the upper surface of the wafer placed on the workbench 100. Specifically, the laminating module 260 includes a laminating roller that can move vertically and a film guide roller disposed on one side of the laminating roller. Furthermore, a heating strip is disposed in the film guide roller, so that when the film guide roller rolls the wafer surface, the heating strip can make the adhesive layer adhere more firmly to the wafer surface.

[0052] The film cutting module 400 is used to cut the adhesive layer attached to the wafer so that the area of ​​the adhesive layer not covering the wafer (that is, the area covering the circular outside of the cutting groove 131 on the third frame 130 of the workbench) is separated from the area covering the wafer, and the area covering the circular outside of the cutting groove 131 on the third frame 130 of the workbench is also the waste film tape.

[0053] The stripping module 300 is disposed between the laminating module 260 and the second winding module 250 , and is used to strip the waste film tape from the area outside the ring of the cutting groove 131 on the third frame 130 on the workbench.

[0054] The second winding module 250 is used to recycle the waste film tape, which includes a second winding roller, a plurality of film guide rollers and a tension roller. The waste film tape formed after being cut by the film cutting module 400 is peeled off by the stripping module 300, and then is wound around the film guide rollers and the tension rollers and finally wound on the second winding roller to realize the collection of the waste film tape.

[0055] It should be understood that, generally speaking, the center position of the width on the adhesive layer coincides with the center of a circle on the wafer. After the adhesive layer is cut and peeled off from the waste film tape, a circular cutting hole of the same size as the wafer is formed in an array along its length direction on the waste film tape. At the same time, due to the small size of the wafer, the width of the film tape is also correspondingly small. A narrow and long area with a smaller width is formed between the two sides of the cutting hole on the waste film tape and the edge of the waste film tape. During the peeling and winding process of the waste film tape, wrinkles appear in the narrow and long area and it is easy to wind up in the width direction, thereby affecting the winding flatness of the second winding roller when winding up the waste film tape.

[0056] refer to Figures 4 to 6To this end, in some embodiments, the stripping module 300 is horizontally movably arranged between the unwinding module 220 and the second winding module 250, and includes a movable frame 310 and a separation film roller 320 arranged on the movable frame 310, and a film pressing plate 331 which is movably arranged on the movable frame 310 in the horizontal and vertical directions and is located above the separation film roller 320. The waste film tape is passed between the separation film roller 320 and the film pressing plate 331, and the film pressing plate 331 can move in the horizontal and vertical directions relative to the separation film roller 320 to flatten the narrow and long areas on the waste film tape on both sides of the cutting hole.

[0057] Specifically, when the stripping module 300 moves in the horizontal direction, it strips the waste film tape from the upper surface of the third frame 130; when the film pressing plate 331 moves longitudinally relative to the separation film roller 320, the film pressing plate 331 approaches the waste film tape to roughly flatten the waste film tape on the separation film roller 320; when the film pressing plate 331 moves transversely relative to the separation film roller 320, the film pressing plate 331 flattens the waste film tape transversely to avoid wrinkles and winding in the narrow area on the waste film tape.

[0058] refer to Figure 5 and Figure 6 Further, in some embodiments, a rack 211 is arranged horizontally on the frame 210, and a third motor (not shown) and a gear set 341 are arranged on the movable frame 310. The gear set 341 is driven by the third motor and meshes with the rack 211. When the third motor rotates, the gear set 341 is driven to rotate, so that the movable frame 310 can move horizontally along the rack 211 to realize the stripping of the waste film tape.

[0059] refer to Figure 5 and Figure 6 Further, in some embodiments, the film pressing plates 331 are symmetrically arranged with two pieces and the two film pressing plates 331 are arranged in linkage. Specifically, a fourth motor 351 and a third synchronous belt mechanism 352 driven by the fourth motor 351 are arranged on the movable frame 310, and the third synchronous belt mechanism 352 includes a third pulley and a third synchronous belt. The two film pressing frames 332 are arranged on two different belt segments with opposite moving directions on the third synchronous belt. In this way, when the third pulley drives the third synchronous belt to rotate, the two film pressing frames 332 can move synchronously toward or away from each other. In addition, each film pressing plate 331 is movably arranged on each film pressing frame 332 along the longitudinal direction. Specifically, a cylinder 333 is arranged on the film pressing frame 332, and the cylinder 333 is used to push the film pressing plate 331 downward to achieve the flattening operation of the waste film belt.

[0060] refer to Figures 7 to 10 In some embodiments, the film cutting module 400 includes a cutting blade assembly 410 and a cleaning assembly 420 disposed on the frame 210 .

[0061] refer to Fig. 9 and Fig.10 , the cutting blade assembly 410 includes a first driving module 411 and a cutting blade assembly 412 disposed on the first driving module 411. The first driving module 411 is used to drive the cutting blade assembly 412 to rise and fall to approach or move away from the film base surface, and also drives the cutting blade assembly 412 to rotate to cut the adhesive layer around the center of the wafer on the workbench 100. Specifically, the first driving module 411 can be a fifth motor 4111, a third screw assembly 4112, and a fourth synchronous belt mechanism 4113 connecting the fifth motor 4111 and the third screw assembly 4112, and a sixth motor 4114 disposed on the nut of the third screw assembly 4112. The cutting blade assembly 412 is driven by the sixth motor 4114 to rotate around the center of the wafer for cutting.

[0062] refer to Figure 3 , Figure 7 and Figure 8 The cleaning component 420 is disposed on one side of the cutting blade component 410 , and includes a second driving module 421 and a cleaning module 422 . The second driving module 421 is used to drive the cleaning module 422 to approach the cutting blade module 412 to wipe and clean the cutting blade module 412 . Specifically, the second driving module 421 includes a cylinder 4211 and a slide rail assembly 4212, the cleaning module 422 is arranged on the slide rail assembly 4212 so as to be pushed by the cylinder 4211 and thus moved to the cleaning position; the cleaning module 422 includes a cleaning seat 4221 and a vertical moving mechanism 4222 arranged on the cleaning seat 4221, a clamping cylinder 4223 is arranged on the vertical moving mechanism 4222, and a cleaning film 4224 is arranged on the clamping cylinder 4223. When the cleaning module 422 is driven to the cleaning position by the cylinder 4211, the vertical moving mechanism 4222 drives the clamping cylinder 4211 to rise to approach the cutting knife module 412 and brush the cutting debris on the cutting knife module 412. It can be understood that the vertical driving mechanism 4222 can be a cylinder.

[0063] refer to Fig. 9 and Fig.10 Furthermore, in some embodiments, the cutting knife module 412 includes a knife seat 4121 and a heating seat 4122, the blade is fixedly disposed on the knife seat 4121, and the heating seat 4122 is used to heat the knife seat 4121 so that the blade can melt the adhesive layer when cutting the adhesive layer, thereby improving the cutting efficiency.

[0064] refer to Fig. 9 and Fig.10Further, in some embodiments, the knife seat 4121 is rotatably arranged on the heating seat 4122. Specifically, a guide bolt 4124 is connected between the knife seat 4121 and the heating seat 4122, and the axis of the guide bolt 4124 is parallel to the rotation radial direction of the cutting knife module 412; at the same time, a spring 4123 is connected between the knife seat 4121 and the heating seat 4122. In addition, a knife collision sensor 4126 is fixedly arranged on the heating seat 4122, and a sensor sheet 4125 is arranged on the knife seat 4121. Specifically, when the knife holder 4121 is in the initial position, the sensing sheet 4125 is located in the sensing area of ​​the knife collision sensor 4126; when the first driving module 411 drives the cutting knife module 412 to rotate around the center of the wafer to cut the adhesive layer, if the knife holder 4121 hits a foreign object, the knife holder 4121 can rotate relative to the heating seat 4122. At the same time, the sensing sheet 4125 is separated from the sensing area of ​​the knife collision sensor 4126, and the first driving module 411 stops driving the cutting knife module 412 to avoid the knife holder 4121 from being subjected to excessive impact force and causing the knife to break; when the knife holder 4121 rotates relative to the heating seat 4122, the spring 4123 can pull the knife holder 4121 back to its original position.

[0065] refer to Figures 7 to 10 Further, in some embodiments, the first driving module 411 also includes a linear motor 4115, which is disposed at the driving end of the sixth motor 4114, and the cutting knife module 412 is disposed at the driving end of the linear motor 4116 to adjust the cutting radius. Correspondingly, the cleaning module 422 also includes a size adjustment mechanism 4225 disposed on the cleaning seat 4221, and the size adjustment mechanism 4225 includes a slide rail 42251 disposed on the cleaning seat 4221, a slide seat 42252, and a plunger 42253 disposed on the slide seat 42252. A positioning plate 42254 is disposed on the cleaning seat 4221, and positioning holes for inserting the plunger 42253 are disposed at different length positions of the positioning plate 42254, and a vertical moving mechanism 4222 is disposed on the slide seat 42252. When the linear motor 4115 drives the cutting knife module 412 to move to different cutting radius positions, the slide 42252 can be slid along the slide rail 42251 until the plunger 42253 thereon is inserted into other positioning holes. That is, when the cylinder 4211 pushes the cleaning module 422 to slide to the cleaning position and the plunger 42253 is inserted into different positioning holes, the cleaning film 4224 on the clamping cylinder 4223 can contact the knife seats 4121 located at different cutting radius positions, thereby achieving the cleaning of the knife seats 4121 adapted to different cutting radii.

[0066] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A workbench, characterized in that: include: A first frame, a second frame and a third frame are sequentially slidably arranged in the height direction, the third frame is used to carry the wafer, and a cutting groove and an adsorption groove are arranged on the upper surface of the third frame; A first lifting device for driving the second frame to lift is provided on the first frame; A second lifting device for driving the third frame to lift is arranged on the second frame, the second lifting device includes a second motor and at least three sets of second screw rod assemblies arranged on the second frame, the nuts in each of the second screw rod assemblies are rotatably arranged on the second frame and are all linked by a first synchronous belt mechanism, the same end of the screw in each of the second screw rod assemblies is respectively connected to a point on the third frame away from the center of the plate surface, the second motor drives the nut of one of the screw rod assemblies so that each of the screw rods synchronously drives the third frame to rise or fall.

2. The workbench according to claim 1, characterized in that: The first lifting device includes a first motor and a first screw assembly arranged on the first frame, the screw on the first screw assembly is connected to the output shaft of the first motor, and the nut on the first screw assembly is fixedly connected to the second frame.

3. A film laminating machine, characterized in that: It comprises a frame and a winding and unwinding module, a stripping plate, a first winding and rewinding module, a second winding and rewinding module, a film pressing module, a stripping module, a film cutting module, a feeding module and a workbench according to claim 1 or 2, all of which are arranged on the frame; The loading module is used to transfer the wafer loading to the workbench; the unwinding module is used to release the film roll; the workbench is used to carry the wafer to the film laminating base surface for film laminating operation; the stripping plate is used to separate the bottom film layer and the adhesive layer on the film roll; the first rewinding module is used to recover the bottom film layer; the film pressing module is movably arranged between the unwinding module and the second rewinding module and can move along the film laminating base surface to press the adhesive layer and adhere it to the wafer surface; The film cutting module is used to cut the adhesive layer pressed and attached to the surface of the wafer around the shape of the wafer, so that the part of the adhesive layer not attached to the surface of the wafer forms a waste film tape; the stripping module is arranged between the film pressing module and the second winding module, and is used to strip the waste film tape from the surface of the third frame on the workbench; the second winding module is used to recycle the waste film tape.

4. The film laminating machine according to claim 3, characterized in that: The stripping module is horizontally movably arranged between the unwinding module and the second winding module, and includes a movable frame and a separation film roller arranged on the movable frame, and a film pressing plate which is movably arranged on the movable frame in the transverse and longitudinal directions and is located above the separation film roller. The film pressing plate can move in the transverse and longitudinal directions relative to the separation film roller to flatten the waste film tape.

5. The film laminating machine according to claim 4, characterized in that: The film pressing plates are symmetrically arranged in two pieces and the two film pressing plates are arranged in linkage; and / or, a rack is arranged on the frame in the horizontal direction, and a third motor and a gear set are arranged on the movable frame, and the gear set is driven by the third motor and meshed with the rack.

6. The film laminating machine according to claim 5, characterized in that: A fourth motor and a third synchronous belt mechanism driven by the fourth motor are arranged on the movable frame, two film pressing frames are arranged on the third synchronous belt mechanism, each of the film pressing plates is movably arranged on each of the film pressing frames along the longitudinal direction, and the two film pressing frames are driven by the third synchronous belt mechanism to move toward or away from each other in the transverse direction at the same time.

7. The film laminating machine according to claim 3, characterized in that: The film cutting module includes a cutting knife assembly and a cleaning assembly arranged on the frame; the cutting knife assembly includes a first driving module and a cutting knife module arranged on the first driving module, and the first driving module is used to drive the cutting knife module to rise and fall and rotate to cut the adhesive layer on the workbench; The cleaning assembly is arranged at one side of the cutting blade assembly, and comprises a second driving module and a cleaning module. The second driving module is used to drive the cleaning module to approach the cutting blade module to wipe and clean the cutting blade module.

8. The film laminating machine according to claim 7, characterized in that: The cutting knife module comprises a knife seat and a heating seat; the knife seat is rotatably arranged on the heating seat and a spring is connected between the knife seat and the heating seat; a knife collision sensor is fixedly arranged on the heating seat, and a sensor sheet is fixedly arranged on the knife seat.

9. The film laminating machine according to claim 7, characterized in that: The second driving module includes a cylinder and a slide rail assembly, and the cleaning module is slidably arranged on the slide rail assembly; the cleaning module includes a cleaning seat and a vertical moving mechanism arranged on the cleaning seat, a clamping cylinder is arranged on the vertical moving mechanism, and a cleaning film is arranged on the clamping cylinder.

10. The film laminating machine according to claim 9, characterized in that: The cutting radius of the cutting knife module can be adjusted; the cleaning module also includes a size adjustment mechanism arranged on the cleaning seat, the size adjustment mechanism includes a slide rail, a slide seat and a plunger arranged on the slide seat, a positioning plate is arranged on the cleaning seat, and positioning holes for inserting the plunger are arranged at different length positions of the positioning plate, and the vertical moving mechanism is arranged on the slide seat.

Images