Laser cutting equipment for wafer
By designing a lifting and rotating platform and sliding device in the laser cutting equipment, the wafer can be cut while the laser device is still moving, which solves the problem of inconsistent cutting width caused by changes in the laser flight optical path and improves the processing quality of the wafer.
Patent Information
- Application Number
- CN202421594735.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-05
- Publication Date
- 2025-05-13
- Estimated Expiration
- 2034-07-05
AI Technical Summary
When cutting wafers, existing laser cutting equipment requires focus, the laser device changes in the laser flight optical path, resulting in inconsistent cutting width and affecting production quality.
A laser cutting device including a work table, a laser device, a sliding device and a lifting and rotating platform is designed. The laser device is fixed above the lifting and rotating platform. The sliding device drives the lifting and rotating platform to slide, and the wafer rotates and lifts and moves on the lifting and rotating platform to avoid laser focus caused by the movement of the laser device itself.
By keeping the laser device still, the laser does not need to be focused when the wafer is moving, the optical path is stable, and the cutting width is consistent, which improves production quality.
Smart Images
Figure CN222857023U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of cutting machines, and in particular to a laser cutting device for wafers. Background Art
[0002] At present, there are two general ways to scribing wafers: mechanical scribing and laser scribing. Laser scribing is divided into laser hidden scribing and laser full scribing. There will be criss-crossing scribing lanes on the wafer. The scribing lanes are the boundaries of the individual chips to be cut. Generally, the wafer is scribed along the scribing lanes.
[0003] Common laser cutting equipment includes a workbench and a laser device, which is slidably set on the workbench. The wafer is placed on the workbench, and the laser device pre-sets the cutting path. The laser device continuously moves according to the cutting path to cut the wafer.
[0004] The above-mentioned existing technical solutions have the following defects: the wafer is placed on the workbench, and the laser device cuts the wafer along a set path. The laser device needs to be focused, which will produce a flying light path, resulting in inconsistent cutting width of the wafer by the laser, affecting production quality, so there is still room for improvement. Utility Model Content
[0005] In order to improve the processing quality of wafers, the present application provides a laser cutting device for wafers.
[0006] The laser cutting device for wafers provided in the present application adopts the following technical solution:
[0007] A laser cutting device for wafers comprises a workbench, a laser device, a sliding device and a lifting and rotating platform, wherein the laser device and the sliding device are both fixed on the workbench, the lifting and rotating platform is arranged on the sliding device, the laser device is located above the lifting and rotating platform, the sliding device drives the lifting and rotating platform to slide under the laser device, and the lifting and rotating platform is used to place wafers and can drive the wafers to rotate and lift.
[0008] By adopting the above technical solution, during processing, the wafer is placed on the lifting and rotating platform, the lifting and rotating platform and the sliding device jointly shift the wafer, and the laser device performs a slicing operation on the wafer. The laser device remains stationary during slicing, and the wafer is moving. The laser does not need to be focused due to the movement of the laser device itself. The laser has no flying light path, the laser is more stable, and the cutting width is more consistent, thereby improving the production quality.
[0009] Preferably, the laser device includes a laser, a beam expander, a scanning galvanometer and a focusing mirror. The laser is fixed on the workbench, the beam expander is fixedly connected to the laser, the scanning galvanometer is fixedly connected to the beam expander, the focusing mirror is vertically fixed to the scanning galvanometer, and the focusing mirror is located above the lifting and rotating platform.
[0010] By adopting the above technical solution, the laser emitted by the laser passes through the beam expander, the scanning galvanometer and finally the focusing lens to be focused and hit the wafer placed on the lifting and rotating platform, thereby dividing the wafer. The laser does not need to be focused due to the movement of the laser device itself, which reduces additional structural investment and makes the structure simpler.
[0011] Preferably, a suction cup is provided on the lifting and rotating platform.
[0012] By adopting the above technical solution, the suction cup can play a role of adsorbing and fixing the wafer, which is beneficial to the processing of the wafer.
[0013] Preferably, the lifting and rotating platform includes a direct-drive turntable motor, the suction cup is fixedly connected to the direct-drive turntable motor, and the suction cup is horizontally arranged below the focusing mirror.
[0014] By adopting the above technical solution, a direct-drive turntable motor is used to perform lifting and rotating operations on the suction cup, which has a high degree of automation and stable performance.
[0015] Preferably, the suction cup is provided with a plurality of vacuum adsorption holes.
[0016] By adopting the above technical solution, the provision of the vacuum adsorption hole enables the suction cup to adsorb and fix the wafer, thereby improving the stability of the wafer during processing.
[0017] Preferably, a plurality of the vacuum adsorption holes are arranged in a crisscross pattern.
[0018] By adopting the above technical solution, a number of vacuum adsorption holes are arranged in a criss-cross pattern so that the suction cup can adsorb and fix different positions of the wafer, further improving the stability of the wafer during processing.
[0019] Preferably, two direct-drive turntable motors are provided, and the two direct-drive turntable motors are arranged side by side on the sliding device, and the sliding device drives the two direct-drive turntable motors to slide, and the focusing lens is located above the two direct-drive turntable motors.
[0020] By adopting the above technical solution, two direct-drive turntable motors are arranged side by side on the sliding device, and the sliding device drives the two direct-drive turntable motors to slide alternately under the focusing mirror so that the wafer can be cut continuously, thereby improving the processing efficiency of the wafer.
[0021] Preferably, the sliding device comprises a double-mover linear motor, and the two direct-drive turntable motors are respectively fixed on two movers of the double-mover linear motor.
[0022] By adopting the above technical solution, a double-actuator linear motor is used to drive the two direct-drive turntable motors, which has a high degree of automation, smooth operation and stable performance.
[0023] To summarize, the present application includes at least one of the following beneficial technical effects: during processing, the wafer is placed on a lifting and rotating platform, the lifting and rotating platform and the sliding device jointly shift the wafer, and the laser device performs a slicing operation on the wafer. During slicing, the laser device remains stationary while the wafer is moving. The laser does not need to be focused due to the movement of the laser device itself. The laser has no flying light path, so the laser is more stable, and the cutting width is more consistent, thereby improving production quality. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] Figure 1 It is a schematic diagram of the overall structure of the laser cutting equipment of an embodiment of the present application.
[0025] Figure 2 It is a schematic diagram of the coordination relationship between the suction cup and the lifting and rotating platform of an embodiment of the present application.
[0026] Explanation of the reference numerals: 1. workbench; 2. laser device; 21. laser; 22. beam expander; 23. scanning galvanometer; 24. focusing mirror; 3. sliding device; 4. lifting and rotating platform; 5. suction cup; 6. vacuum adsorption hole. DETAILED DESCRIPTION
[0027] The following is combined with Figure 1-2 This application is described in further detail.
[0028] The present application embodiment discloses a laser cutting device for wafers. Figure 1 and Figure 2A laser cutting device for wafers includes a workbench 1, a laser device 2, a sliding device 3 and a lifting and rotating platform 4. The workbench 1 is arranged horizontally, the laser device 2 and the sliding device 3 are both fixed on the workbench 1, the sliding device 3 is arranged horizontally, the lifting and rotating platform 4 is arranged on the sliding device 3, and the laser device 2 is located above the lifting and rotating platform 4. During processing, the operator places the wafer to be cut on the lifting and rotating platform 4, and the sliding device 3 drives the lifting and rotating platform 4 to slide under the laser device 2. When the lifting and rotating platform 4 drives the wafer to move directly under the laser device 2, the laser device 2 performs a cutting operation on the wafer. When the laser device 2 cuts, the lifting and rotating platform 4 drives the wafer to rotate and rise, so that the wafer is cut into a specified shape. When the laser device 2 cuts, the laser device 2 remains stationary, and the wafer is moving. The laser does not need to be focused due to the movement of the laser device 2 itself. The laser has no flying light path, the laser is more stable, and the cutting width is more consistent, which improves the production quality.
[0029] Specifically, the laser device 2 includes a laser 21, a beam expander 22, a scanning galvanometer 23 and a focusing mirror 24. The laser 21 is fixed on the workbench 1, the laser 21 is horizontally arranged, the beam expander 22 is arranged parallel to the laser 21, one end of the beam expander 22 is fixedly connected to the laser 21, the scanning galvanometer 23 is fixedly connected to the other end of the beam expander 22, the focusing mirror 24 is vertically arranged, the focusing mirror 24 is fixed to the bottom of the scanning galvanometer 23, and the focusing mirror 24 is located above the lifting and rotating platform 4. The laser emitted by the laser 21 passes through the beam expander 22, then passes through the scanning galvanometer 23, and finally is focused by the focusing mirror 24 and hits the wafer on the lifting and rotating platform 4, thereby performing a wafer division operation.
[0030] Furthermore, the lifting and rotating platform 4 includes a direct-drive turntable motor, and two direct-drive turntable motors are provided. The sliding device 3 includes a double-motor linear motor, and the two direct-drive turntable motors are respectively fixed on the two movers of the double-motor linear motor, and the double-motor linear motor drives the two direct-drive turntable motors to slide. A suction cup 5 is fixed on the direct-drive turntable motor, and the suction cup 5 is horizontally arranged below the focusing mirror 24, and the suction cup 5 adsorbs and fixes the wafer. A plurality of vacuum adsorption holes 6 are provided on the suction cup 5, and the plurality of vacuum adsorption holes 6 are arranged crisscross. The plurality of vacuum adsorption holes 6 are all connected to an external vacuum pump so that the suction cup 5 has an adsorption function. The wafer is placed on the suction cup 5, and the laser cuts the wafer. When cutting, the suction cup 5 adsorbs and fixes the wafer, which improves the stability of the wafer during processing and is conducive to better processing.
[0031] The implementation principle of a wafer laser cutting device in the embodiment of the present application is as follows:
[0032] During processing, the operator places the wafer to be diced on the suction cup 5, and the double-actuator linear motor drives the two suction cups 5 to slide under the focusing mirror 24. When the suction cup 5 drives the wafer to move to directly below the focusing mirror 24, the laser 21 emits a laser that passes through the beam expander 22, the scanning galvanometer 23, and finally the focusing mirror 24 to focus on the wafer on the suction cup 5, thereby dividing the wafer. During laser dicing, the direct-drive turntable motor drives the wafer to rotate and rise, so that the wafer is diced into a specified shape. During laser dicing, the focusing mirror 24 remains stationary and the wafer is moving. The laser does not need to be focused separately due to the movement of the focusing mirror 24 itself, so that the laser has no flying light path, and the laser is more stable, so that the cutting width is more consistent, thereby improving the production quality.
[0033] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.
Claims
1. A laser cutting device for wafers, characterized in that: The invention comprises a workbench (1), a laser device (2), a sliding device (3) and a lifting and rotating platform (4); the laser device (2) and the sliding device (3) are both fixed on the workbench (1); the lifting and rotating platform (4) is arranged on the sliding device (3); the laser device (2) is located above the lifting and rotating platform (4); the sliding device (3) drives the lifting and rotating platform (4) to slide under the laser device (2); and the lifting and rotating platform (4) is used for placing wafers and can drive the wafers to rotate and rise.
2. The laser cutting device for wafer according to claim 1, characterized in that: The laser device (2) comprises a laser (21), a beam expander (22), a scanning galvanometer (23) and a focusing mirror (24); the laser (21) is fixed on the workbench (1); the beam expander (22) is fixedly connected to the laser (21); the scanning galvanometer (23) is fixedly connected to the beam expander (22); the focusing mirror (24) is vertically fixed to the scanning galvanometer (23); and the focusing mirror (24) is located above the lifting and rotating platform (4).
3. The laser cutting device for wafer according to claim 2, characterized in that: A suction cup (5) is provided on the lifting and rotating platform (4).
4. The laser cutting device for wafer according to claim 3, characterized in that: The lifting and rotating platform (4) comprises a direct-drive turntable motor, the suction cup (5) is fixedly connected to the direct-drive turntable motor, and the suction cup (5) is horizontally arranged below the focusing mirror (24).
5. The laser cutting device for wafer according to claim 3, characterized in that: The suction cup (5) is provided with a plurality of vacuum adsorption holes (6).
6. The laser cutting device for wafer according to claim 5, characterized in that: A plurality of the vacuum adsorption holes (6) are arranged in a crisscross pattern.
7. The laser cutting device for wafer according to claim 4, characterized in that: The two direct-drive turntable motors are provided, and the two direct-drive turntable motors are arranged side by side on the sliding device (3). The sliding device (3) drives the two direct-drive turntable motors to slide, and the focusing lens (24) is located above the two direct-drive turntable motors.
8. The laser cutting device for wafer according to claim 4, characterized in that: The sliding device (3) comprises a double-moving element linear motor, and the two direct-drive turntable motors are respectively fixed on two moving elements of the double-moving element linear motor.