Die adsorption structure for PCBA (Printed Circuit Board Assembly) forming and positioning

Abstract

The utility model discloses a mold adsorption structure for PCBA (printed circuit board assembly) forming and positioning, which comprises a lower mold component and an upper mold component which are clamped with each other. The lower die assembly comprises a first bottom plate, a lower die base is fixedly connected to the first bottom plate, a cavity is formed in the lower die base, an air channel is formed in the lower die base and communicates with the cavity, a sliding mechanism is installed on the lower die base, and the sliding mechanism corresponds to the cavity. The upper mold assembly comprises a second bottom plate, an upper mold base is fixedly connected to the second bottom plate, the upper mold base corresponds to the lower mold base, an air compressor is arranged on one side of the second bottom plate, an air pipe is connected to the air compressor, one end of the air pipe is inserted into the air channel, an injection molding pipe is installed on the lower mold base, and the injection molding pipe corresponds to the cavity. The PCBA forming mold has the advantages of being easy to operate and good in forming effect, tilting of the PCBA can be reduced, the PCBA is not prone to being scratched by the mold, and therefore the PCBA forming mold can be used in various occasions.

Description

Technical Field

[0001] The utility model belongs to the technical field of molds, and in particular relates to a mold adsorption structure for PCBA molding positioning. Background Art

[0002] PCBA refers to printed circuit board assembly, which is one of the most important components in electronic devices. PCBA mainly consists of three parts: printed circuit board, electronic components and solder. It has the functions of providing circuit connection, protecting components and heat dissipation. It is widely used as an important component of 3C products such as computers and related products, communication products and consumer electronics.

[0003] Often, PCBA molding does not require full overmolding like other connector products, and sometimes only a part of the PCBA needs to be molded. However, the current structure of the injection mold makes it difficult to position the PCBA in the cavity, which can easily cause the PCBA to warp and the mold to scratch the PCBA.

[0004] Therefore, in view of the above technical problems, it is necessary to provide a mold adsorption structure for PCBA molding positioning.

[0005] The information disclosed in this background technology section is only intended to increase the understanding of the overall background of the present invention, and should not be regarded as acknowledging or suggesting in any form that the information constitutes the prior art already known to a person skilled in the art. Utility Model Content

[0006] The utility model aims to provide a mold adsorption structure for PCBA molding positioning, which can solve the problem of PCBA molding warping in the mold cavity and the mold scratching the PCBA.

[0007] In order to achieve the above purpose, the technical solution provided by a specific embodiment of the utility model is as follows:

[0008] A mold adsorption structure for PCBA molding positioning includes: a lower mold assembly and an upper mold assembly, wherein the lower mold assembly and the upper mold assembly are engaged with each other;

[0009] The lower mold assembly comprises a first bottom plate, a lower mold seat is fixedly connected to the first bottom plate, a mold cavity is provided on the lower mold seat, an air passage is provided in the lower mold seat, the air passage is connected to the mold cavity, and a sliding mechanism is installed on the lower mold seat, and the sliding mechanism corresponds to the mold cavity;

[0010] The upper mold assembly includes a second bottom plate, an upper mold seat is fixedly connected to the second bottom plate, the upper mold seat corresponds to the lower mold seat, an air compressor is provided on one side of the second bottom plate, an air pipe is connected to the air compressor, and one end of the air pipe is inserted into the airway.

[0011] In one or more embodiments of the present invention, an injection tube is installed on the lower mold base, and the injection tube corresponds to the cavity. The PCBA in the cavity can be injection molded through the injection tube.

[0012] In one or more embodiments of the utility model, a sealing groove is cut on the bottom wall of the cavity, and the sealing groove is arranged outside the air passage, and the sealing groove is used to place a sealing ring, so that the sealing ring is not easy to shake when placed in the cavity;

[0013] A sealing ring is installed in the sealing groove, so that the air compressor is not prone to leakage when adsorbing the PCBA in the cavity, thereby ensuring the fixing effect of the PCBA in the cavity.

[0014] In one or more embodiments of the present utility model, the lower mold base is provided with a sliding groove for accommodating a sliding block;

[0015] The sliding mechanism comprises a sliding block, which is arranged in a sliding groove. The sliding block is used to install a pressing plate and is also used to assist in fixing the lower mold assembly and the upper mold assembly.

[0016] In one or more embodiments of the present invention, a pair of fixing plates are installed in the sliding groove, and the pair of fixing plates are symmetrically arranged on both sides of the sliding block, and the fixing plates are used to fix the sliding block so that the sliding block can slide stably in the sliding groove.

[0017] In one or more embodiments of the present invention, a limiting member is installed on the lower mold seat, and the limiting member corresponds to the sliding block. The limiting member is used to limit the sliding block so that the sliding block is not easy to slide out of the sliding groove.

[0018] In one or more embodiments of the present invention, a pressing plate is installed on the slider, one end of the pressing plate is arranged in the cavity, and the pressing plate is used to fix the PCBA so that the PCBA is not easy to warp in the cavity.

[0019] In one or more embodiments of the utility model, the slider is provided with a relief groove for the oblique rod to pass through so as to fix the slider, so that the pressing plate on the slider can be inserted into the cavity, and the PCBA can be fixed by the pressing plate;

[0020] A pair of side walls of the avoidance groove are both installed with fixing columns. When the inclined rod is inserted into the avoidance groove, the pair of fixing columns can resist the inclined rod, thereby fixing the inclined rod to ensure the firmness of the connection between the lower mold assembly and the upper mold assembly.

[0021] In one or more embodiments of the utility model, a plurality of positioning pins are installed on the upper mold base, and a positioning hole matching the positioning pins is provided on the lower mold base. By inserting the positioning pins into the positioning holes, the lower mold assembly and the upper mold assembly can be assembled.

[0022] In one or more embodiments of the utility model, an inclined rod is installed on the upper mold seat, one end of which is arranged in the avoidance groove and corresponds to the fixed column, and a pair of pressure blocks are connected to the upper mold seat, and the pressure blocks correspond to the slider.

[0023] Compared with the prior art, the mold adsorption structure for PCBA molding and positioning of the utility model has the advantages of simple operation and good molding effect. It can not only reduce the warping of PCBA, but also make it difficult for the mold to scratch the PCBA, thereby meeting the use of various occasions. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0025] Figure 1 An exploded view of a mold adsorption structure for PCBA molding positioning in one embodiment of the utility model;

[0026] Figure 2 for Figure 1 Schematic diagram of the structure at A in the middle;

[0027] Figure 3 A three-dimensional diagram of a lower mold assembly of a mold adsorption structure for PCBA molding positioning in one embodiment of the utility model;

[0028] Figure 4 for Figure 3 Schematic diagram of the structure at B in the middle;

[0029] Figure 5 A three-dimensional diagram of an upper mold assembly of a mold adsorption structure for PCBA molding positioning in one embodiment of the utility model;

[0030] Figure 6 It is a three-dimensional diagram of the mold adsorption structure for PCBA molding positioning in one embodiment of the utility model.

[0031] Description of main reference numerals:

[0032] 1-lower mold assembly, 101-first bottom plate, 102-lower mold seat, 103-cavity, 104-injection tube, 105-sealing groove, 106-sealing ring, 107-airway, 108-slider, 109-fixed plate, 110-limiting member, 111-pressing plate, 112-avoiding groove, 113-fixing column, 2-upper mold assembly, 201-second bottom plate, 202-upper mold seat, 203-locating pin, 204-oblique rod, 205-pressing block, 3-air compressor, 301-trachea. DETAILED DESCRIPTION

[0033] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0034] like Figures 1 to 6 As shown, a mold adsorption structure for PCBA molding positioning in an embodiment of the utility model includes a lower mold assembly 1, an upper mold assembly 2 and an air compressor 3, and the lower mold assembly 1 and the upper mold assembly 2 are engaged with each other.

[0035] The lower mold assembly 1 includes a first bottom plate 101 , a lower mold base 102 is fixedly connected to the first bottom plate 101 , a cavity 103 is provided on the lower mold base 102 , and the cavity 103 is used to place the PCBA so as to perform injection molding on the PCBA.

[0036] In addition, an injection tube 104 is installed on the lower mold base 102 , and the injection tube 104 corresponds to the cavity 103 . The PCBA in the cavity 103 can be injection molded through the injection tube 104 .

[0037] Specifically, a sealing groove 105 is bored on the bottom wall of the cavity 103 , and the sealing groove 105 is arranged outside the air passage 107 . The sealing groove 105 is used to place a sealing ring 106 , so that the sealing ring 106 is not easy to shake when placed in the cavity 103 .

[0038] In addition, a sealing ring 106 is installed in the sealing groove 105 , so that the air compressor 3 is not prone to leaking when adsorbing the PCBA in the cavity 103 , thereby ensuring the fixing effect of the PCBA in the cavity 103 .

[0039] like Figures 1 to 6As shown, an air channel 107 is provided in the lower mold base 102, and the air channel 107 is connected to the cavity 103. When the air compressor 3 is running, the air compressor 3 can absorb the PCBA in the cavity 103 through the air pipe 301 and the air channel 107, so that the PCBA is not easy to warp during injection molding, thereby ensuring the subsequent molding effect of the PCBA.

[0040] like Figures 1 to 6 As shown, a sliding mechanism is installed on the lower mold base 102, and the sliding mechanism corresponds to the cavity 103. The sliding mechanism is used to further fix the PCBA, reduce the probability of warping of the PCBA, and further reduce the probability of the lower mold assembly 1 or the upper mold assembly 2 damaging the PCBA.

[0041] The lower mold base 102 is provided with a sliding groove for accommodating a slider 108. The sliding mechanism includes a slider 108, which is arranged in the sliding groove. The slider 108 is used to install a pressing plate 111 and to assist in fixing the lower mold assembly 1 and the upper mold assembly 2.

[0042] Preferably, the shape of the slider 108 is as follows Figure 3 shown.

[0043] In addition, a pair of fixing plates 109 are installed in the sliding groove, and the pair of fixing plates 109 are symmetrically arranged on both sides of the sliding block 108, that is, Figure 3 In the position shown, the fixing plate 109 is used to fix the slider 108 so that the slider 108 can stably slide in the sliding groove.

[0044] Specifically, a limiting member 110 is installed on the lower mold base 102 , and the limiting member 110 corresponds to the slider 108 . The limiting member 110 is used to limit the slider 108 so that the slider 108 is not easy to slide out of the sliding groove.

[0045] In addition, a pressing plate 111 is installed on the slider 108, and one end of the pressing plate 111 is arranged in the cavity 103. The pressing plate 111 is used to fix the PCBA so that the PCBA is not easy to warp in the cavity 103, which can not only ensure the molding effect of the PCBA, but also reduce the probability of the lower mold assembly 1 or the upper mold assembly 2 damaging the PCBA.

[0046] like Figures 1 to 6 As shown, the slider 108 is provided with a avoiding groove 112 for the oblique rod 204 to pass through so as to fix the slider 108, so that the pressing plate 111 on the slider 108 can be inserted into the cavity 103, and the PCBA can be fixed by the pressing plate 111.

[0047] Among them, a pair of side walls of the avoidance groove 112 are installed with fixing columns 113. When the inclined rod 204 is inserted into the avoidance groove 112, the pair of fixing columns 113 can resist the inclined rod 204, and then fix the inclined rod 204 to ensure the firmness of the connection between the lower mold assembly 1 and the upper mold assembly 2.

[0048] like Figures 1 to 6 As shown, the upper mold assembly 2 includes a second bottom plate 201, and an upper mold seat 202 is fixedly connected to the second bottom plate 201, and the upper mold seat 202 corresponds to the lower mold seat 102. When the lower mold seat 102 contacts the upper mold seat 202, a cavity 103 can be formed.

[0049] Among them, a plurality of positioning pins 203 are installed on the upper mold base 202, and a positioning hole matching the positioning pins 203 is provided on the lower mold base 102. By inserting the positioning pins 203 into the positioning holes, the assembly of the lower mold assembly 1 and the upper mold assembly 2 can be realized.

[0050] In addition, an inclined rod 204 is installed on the upper mold seat 202, one end of the inclined rod 204 is arranged in the avoidance groove 112 and corresponds to the fixed column 113. When the lower mold assembly 1 and the upper mold assembly 2 are assembled, the inclined rod 204 will be inserted into the avoidance groove 112. The inclined rod 204 can be used to resist the slider 108, so that the slider 108 is not easy to slide in the sliding groove, and the amount can ensure the fixing effect of the pressing plate 111 on the PCBA. At the same time, the fixed column 113 will also resist the inclined rod 204, which can increase the assembly firmness of the lower mold assembly 1 and the upper mold assembly 2.

[0051] Specifically, a pair of pressing blocks 205 are connected to the upper mold seat 202, and the pressing blocks 205 correspond to the slider 108. When the lower mold assembly 1 and the upper mold assembly 2 are assembled, the pressing blocks 205 will press against one end of the slider 108 close to the stopper 110, thereby further fixing the slider 108.

[0052] Preferably, the pressing block 205 is a ladder-shaped structure, which can be matched with the sliding block 108, so that the sliding block 108 is not easy to slide in the sliding groove.

[0053] like Figures 1 to 6 As shown, an air compressor 3 is provided on one side of the second bottom plate 201, and an air pipe 301 is connected to the air compressor 3, and one end of the air pipe 301 is inserted into the air channel 107. When the air compressor 3 is running, the air compressor 3 can absorb the PCBA placed in the cavity 103 through the air pipe 301 and the air channel 107, so as to fix the PCBA, so that the PCBA is not prone to warping, and the injection molding effect of the PCBA is guaranteed, and the probability of the lower mold assembly 1 or the upper mold assembly 2 scratching the PCBA can also be reduced.

[0054] During specific use, the sealing ring 106 is installed in the sealing groove 105 in the lower mold base 102, so that the sealing ring 106 is not easy to shake, thereby ensuring the sealing effect, and the air pipe 301 is connected to the airway 107 and the air compressor 3 respectively.

[0055] Place the PCBA into the cavity 103 and onto the upper side of the sealing ring 106, manually move the slider 108 so that the slider 108 moves in the sliding groove until one end of the pressing plate 111 connected to the slider 108 can be inserted into the cavity 103 and fix the PCBA so that the PCBA is not easily lifted. Align the positioning pin 203 on the upper mold seat 202 and insert it into the positioning hole on the lower mold seat 102. At this time, the inclined rod 204 will be inserted into the avoidance groove 112, and a pair of pressing blocks 205 will be pressed on the slider 108, thereby realizing the assembly of the lower mold assembly 1 and the upper mold assembly 2.

[0056] The air compressor 3 is operated, and the air compressor 3 can absorb the PCBA through the air pipe 301 and the air channel 107, so that the PCBA is not easy to be lifted, and the PCBA can be further fixed. The PCBA in the cavity 103 is injection molded through the injection tube 104.

[0057] After the PCBA injection molding is completed, the lower mold assembly 1 is separated from the upper mold assembly 2, the air compressor 3 is turned off, and the molded PCBA is taken out. The overall operation is simple, the molding effect is good, and it can be used in a variety of occasions.

[0058] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0059] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A mold adsorption structure for PCBA molding positioning includes a lower mold assembly and an upper mold assembly, wherein the lower mold assembly and the upper mold assembly are engaged with each other, and the characteristics are as follows: The lower mold assembly comprises a first bottom plate, a lower mold seat is fixedly connected to the first bottom plate, a mold cavity is provided on the lower mold seat, an air passage is provided in the lower mold seat, the air passage is connected to the mold cavity, and a sliding mechanism is installed on the lower mold seat, and the sliding mechanism corresponds to the mold cavity; The upper mold assembly includes a second bottom plate, an upper mold seat is fixedly connected to the second bottom plate, the upper mold seat corresponds to the lower mold seat, an air compressor is provided on one side of the second bottom plate, an air pipe is connected to the air compressor, and one end of the air pipe is inserted into the airway.

2. The mold adsorption structure for PCBA molding positioning according to claim 1, characterized in that: An injection tube is installed on the lower mold seat, and the injection tube corresponds to the mold cavity.

3. The mold adsorption structure for PCBA molding positioning according to claim 1, characterized in that: A sealing groove is cut on the bottom wall of the cavity, the sealing groove is arranged outside the air passage, and a sealing ring is installed in the sealing groove.

4. The mold adsorption structure for PCBA molding positioning according to claim 1, characterized in that: The lower mold seat is provided with a sliding groove, and the sliding mechanism comprises a sliding block, and the sliding block is arranged in the sliding groove.

5. The mold adsorption structure for PCBA molding positioning according to claim 4, characterized in that: A pair of fixing plates are installed in the sliding groove, and the pair of fixing plates are symmetrically arranged on both sides of the sliding block.

6. The mold adsorption structure for PCBA molding positioning according to claim 5, characterized in that: A limiting member is installed on the lower mold seat, and the limiting member corresponds to the sliding block.

7. The mold adsorption structure for PCBA molding positioning according to claim 6, characterized in that: A pressing plate is installed on the sliding block, and one end of the pressing plate is arranged in the cavity.

8. The mold adsorption structure for PCBA molding positioning according to claim 7, characterized in that: The sliding block is provided with a avoiding groove, and a pair of side walls of the avoiding groove are both installed with fixing columns.

9. The mold adsorption structure for PCBA molding positioning according to claim 1, characterized in that: A plurality of positioning pins are installed on the upper mold base, and positioning holes matching the positioning pins are provided on the lower mold base.

10. The mold adsorption structure for PCBA molding positioning according to claim 8, characterized in that: An inclined rod is installed on the upper mold seat, one end of which is arranged in the avoidance groove and corresponds to the fixed column. A pair of pressing blocks are connected to the upper mold seat, and the pressing blocks correspond to the sliding block.

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