Integrally-formed chip inductor with high sealing strength

Abstract

The integrally-formed chip inductor comprises a conductive chip, an inductor body and a sealing cover, a positioning column is fixed to the middle of the upper end of the conductive chip, external threads are arranged on the outer walls of the upper end and the lower end of the positioning column, a sealing gasket is attached to the conductive chip along the periphery of the positioning column, and the sealing gasket is connected with the inductor body. The outer wall of the positioning column is sleeved with an inductor, the outer wall of the inductor is sleeved with a sealing cover for sealing protection, a heat dissipation cover for heat dissipation protection is embedded in the middle of the upper end of the sealing cover, and an inner cover is fixed to the position, along the positioning column, of the sealing cover. When the integrally-formed chip inductor with the high sealing strength is used, the conductive chip serves as a component making contact with a target circuit board, the bottom of the conductive chip is provided with a contact, the contact is fixedly connected with the target circuit board in a tin soldering mode, installation and connection of the chip inductor are met, and it is ensured that filtering and oscillation can be effectively conducted on the target circuit board.

Description

Technical Field

[0001] The utility model relates to the technical field of patch inductors, in particular to an integrally formed patch inductor with high sealing strength. Background Art

[0002] Chip inductors are also called power inductors, high current inductors and surface mount high power inductors. They have the characteristics of miniaturization, high quality, high energy storage and low resistance. Any current in the circuit of the chip inductor will generate a magnetic field, and the magnetic flux of the magnetic field will act on the circuit. The power chip inductor is mainly composed of a magnetic core and copper wire. It mainly plays a filtering and oscillation role in the circuit.

[0003] The utility model relates to the technical field of inductance, specifically to a chip inductor (CN210156239U), specifically a chip inductor; comprising an inductor core, on which a tinned enameled wire is wound, and on both ends of the inductor core are sleeved tinned iron caps, and on both ends of the tinned enameled wire are respectively welded to the tinned iron caps; the utility model can realize that a winding machine automatically winds the tinned enameled wire on the inductor core, and at the same time completes the welding of the pins, and the production efficiency is very high. When used on a circuit board, the chip can be automatically soldered by a chip mounter, and there is no need to use wave soldering equipment, manual shearing of the pins, and no unnecessary shearing materials. However, in use, the chip inductor generally adopts a semi-wrapped packaging design, which causes the chip inductor to be used in an exposed state for a long time, and dust may enter, causing the coil surface to contact dust, thereby causing the possibility of overload damage.

[0004] To this end, we propose an integrated chip inductor with high sealing strength. Utility Model Content

[0005] The purpose of the utility model is to provide an integrated chip inductor with high sealing strength to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an integrated molded chip inductor with high sealing strength, comprising a conductive patch, an inductor and a sealing cover, a positioning column is fixed to the middle of the upper end of the conductive patch, and the upper and lower outer walls of the positioning column are provided with external threads, the conductive patch is affixed with a sealing gasket along the four sides of the positioning column, the outer wall of the positioning column is sleeved with an inductor, the outer wall of the inductor is sleeved with a sealing cover for sealing protection, a heat dissipation cover for heat dissipation protection is embedded in the middle of the upper end of the sealing cover, an inner cover is fixed to the sealing cover at the connection along the positioning column, and the inner wall of the inner cover is provided with an internal thread hole matching the external thread.

[0007] Furthermore, the conductive patch is installed at a preset position of the target circuit board through electrodes, and the conductive patch is electrically connected to the target circuit board.

[0008] Furthermore, the contact pins of the inductor are connected to the electrodes of the conductive patch.

[0009] Furthermore, the conductive patch is detachably connected to the sealing cover through a thread via a positioning column and an external thread, and the sealing cover and the sealing gasket are in an interference fit connection.

[0010] Furthermore, the conductive patch is fixedly connected to the nut, and the conductive patch is threadedly connected to the positioning column through the nut.

[0011] Compared with the prior art, the beneficial effect of the utility model is that when the one-piece molded chip inductor with high sealing strength is used, the conductive patch serves as a contact component with the target circuit board, and a contact is provided at the bottom. The contact is fixedly connected to the target circuit board by soldering, which satisfies the installation connection of the chip inductor and ensures that the target circuit board can be effectively filtered and oscillated.

[0012] This connection method uses interference fit and threaded connection to assist each other, so that the sealing cover is tightly fixed on the conductive patch, and to ensure that the inductor can dissipate heat well, the inductor can transfer heat to the heating element, and the heat dissipation cover on the top can fully dissipate the heat energy generated by the heating element, meeting the use requirements of the patch inductor filtering and oscillation.

[0013] The entire positioning column is an insulating columnar body, which is fixedly connected to the nut on the conductive patch through a threaded connection, supports the conductive patch, and facilitates the connection and installation of the inductor and the sealing cover. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the internal structure of the utility model;

[0015] Figure 2 This is a schematic diagram of the external structure of the utility model;

[0016] Figure 3 This is a schematic diagram of the internal structure of the sealing cover of the utility model;

[0017] Figure 4 This is a schematic diagram of the conductive patch structure of the utility model;

[0018] Figure 5 This is a schematic diagram of the conductive patch and inductor connection structure of the utility model.

[0019] In the figure: 1. Conductive patch; 11. Positioning column; 12. External thread; 13. Sealing gasket; 2. Inductor; 3. Sealing cover; 31. Inner cover; 32. Internal thread hole; 4. Heat dissipation cover. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] See also Figure 1-3 The utility model provides a technical solution: an integrated molded chip inductor with high sealing strength, comprising a conductive patch 1, an inductor 2 and a sealing cover 3, a positioning column 11 is fixed to the middle of the upper end of the conductive patch 1, and the upper and lower outer walls of the positioning column 11 are provided with external threads 12, a sealing gasket 13 is attached to the conductive patch 1 along the periphery of the positioning column 11, the outer wall of the positioning column 11 is sleeved with the inductor 2, the outer wall of the inductor 2 is sleeved with a sealing cover 3 for sealing protection, a heat dissipation cover 4 for heat dissipation protection is embedded in the middle of the upper end of the sealing cover 3, and the sealing cover 3 is attached along the positioning column 11. An inner cover 31 is fixed at the connection, and an inner wall of the inner cover 31 is provided with an internal threaded hole 32 matching the external thread 12. The conductive patch 1 is installed at a preset position of the target circuit board through an electrode, and the conductive patch 1 is electrically connected to the target circuit board. The contact pins of the inductor 2 are connected to the electrodes of the conductive patch 1. The conductive patch 1 serves as a contact component with the target circuit board, and a contact is provided at the bottom. The contact is fixedly connected to the target circuit board by soldering, which meets the installation connection of the patch inductor and ensures that the target circuit board can be effectively filtered and oscillated.

[0022] The conductive patch 1 is detachably connected to the sealing cover 3 through the positioning column 11 and the external thread 12, and the sealing cover 3 is connected to the sealing gasket 13 through an interference fit. The entire sealing cover 3 is formed by integral stamping, and an insulating layer is applied to the surface. At the same time, to ensure the connection strength, an internal thread hole 32 matching the external thread 12 is opened on the top inner wall side of the sealing cover 3. During assembly, the sealing cover 3 can be covered on the conductive patch 1 through a threaded connection, and the sealing cover 3 is connected to the bottom of the conductive patch 1 through the sealing gasket 13. This connection method adopts an interference fit connection and a threaded connection to assist each other, so that the sealing cover 3 is tightly fixed on the conductive patch 1, and to ensure that the inductor 2 can dissipate heat well and the inductor 2 can transfer heat to the heating element, it is ensured that the heat dissipation cover 4 on the top can fully dissipate the heat energy generated by the heating element to meet the use requirements of patch inductor filtering and oscillation.

[0023] The conductive patch 1 is fixedly connected to the nut, and the conductive patch 1 is threadedly connected to the positioning column 11 through the nut. The entire positioning column 11 is an insulating columnar body, which is fixedly connected to the nut on the conductive patch 1 through a threaded connection, and supports the conductive patch 1, facilitating the connection and installation of the inductor 2 and the sealing cover 3. At the same time, the positioning column 11 can effectively support the inductor 2, ensuring that the coils on the inductor 2 are evenly distributed on the outer wall of the positioning column 11, meeting heat conduction, and facilitating subsequent heat exchange treatment with the heat dissipation cover 4.

[0024] Working principle: For this type of one-piece molded chip inductor with high sealing strength, first, thread the positioning column 11 along the nut on the conductive patch 1. At this time, press down the inductor 2, and the contact pins of the inductor 2 are connected to the electrodes of the conductive patch 1. Then, an internal threaded hole 32 matching the external thread 12 is opened on the top inner wall side of the sealing cover 3. During assembly, the sealing cover 3 can be threadedly connected. The sealing cover 3 is covered on the conductive patch 1. The sealing cover 3 is connected to the bottom of the conductive patch 1 through the sealing gasket 13. The interference connection and the threaded connection assist each other. The sealing cover 3 is tightly fixed on the conductive patch 1. Finally, the conductive patch 1 is installed at the preset position of the target circuit board through the electrode.

Claims

1. An integrated molded chip inductor with high sealing strength, comprising a conductive chip (1), an inductor (2) and a sealing cover (3), characterized in that: A positioning column (11) is fixed at the middle of the upper end of the conductive patch (1), and the upper and lower outer walls of the positioning column (11) are provided with external threads (12); a sealing gasket (13) is attached to the conductive patch (1) along the four sides of the positioning column (11); an inductor (2) is sleeved on the outer wall of the positioning column (11); a sealing cover (3) for sealing protection is sleeved on the outer wall of the inductor (2); a heat dissipation cover (4) for heat dissipation protection is embedded in the middle of the upper end of the sealing cover (3); an inner cover (31) is fixed to the sealing cover (3) at the connection point of the positioning column (11), and an inner thread hole (32) matching the external thread (12) is provided on the inner wall of the inner cover (31).

2. The one-piece molded chip inductor with high sealing strength according to claim 1, characterized in that: The conductive patch (1) is installed at a preset position of a target circuit board via electrodes, and the conductive patch (1) and the target circuit board are electrically connected.

3. The one-piece molded chip inductor with high sealing strength according to claim 1, characterized in that: The contact pins of the inductor (2) are connected to the electrodes of the conductive patch (1).

4. The one-piece molded chip inductor with high sealing strength according to claim 1, characterized in that: The conductive patch (1) is detachably connected to the sealing cover (3) via a positioning column (11) and an external thread (12), and the sealing cover (3) and the sealing gasket (13) are in interference connection.

5. The one-piece molded chip inductor with high sealing strength according to claim 1, characterized in that: The conductive patch (1) and the nut are fixedly connected, and the conductive patch (1) is threadedly connected to the positioning column (11) via the nut.

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