Wafer moving device

Abstract

The utility model provides a wafer moving device. The wafer moving device comprises a substrate and an air channel strip installed on the substrate. An adsorption hole and an air guide hole which penetrate through the base plate are formed in the base plate; the side, facing the base plate, of the air channel strip is provided with an air channel groove along the outer contour, and the air channel groove is communicated with the adsorption holes and the air guide holes. According to the wafer moving device, the air channel grooves are formed in the air channel strips, only the adsorption holes and the air guide holes are machined in the substrate, machining stress caused by large-area machining does not exist on the substrate, the influence of the machining stress on the flatness can be avoided, and the flatness can meet the use requirement. In addition, the air channel strip is arranged according to the outline of the air channel groove, so that stress influence on the substrate is avoided.

Description

Technical Field

[0001] The present application belongs to the technical field of handling equipment, and in particular, relates to a wafer handling device. Background Art

[0002] In the semiconductor field, wafer forks are commonly used to move wafers. They are usually made of silicon carbide or alumina ceramics, which are very expensive to process and are very easy to break, so metal wafer forks are often used for testing during the testing phase.

[0003] In some technologies, when a metal fork is used to move the wafer, the wafer often fails to be adsorbed and cannot be moved due to the poor surface flatness of the metal fork. Utility Model Content

[0004] In view of the above problems, the present application provides a wafer moving device, which can solve the problem that large-area processing of the wafer fork surface causes processing stress to affect flatness.

[0005] The wafer moving device provided in some embodiments of the present application includes a substrate and an airway strip installed on the surface of the substrate; the substrate is provided with adsorption holes and air guide holes that pass through the substrate; on the side of the airway strip facing the substrate, the airway strip is provided with airway grooves along the outer contour, and the airway grooves connect the adsorption holes and the air guide holes.

[0006] According to the wafer moving device provided in some embodiments of the present application, the airway strip includes an airway piece and a covering piece, and the airway groove runs through the airway piece; the covering piece covers the first side of the airway groove and is sealed with the airway piece; the substrate covers the second side of the airway groove and is sealed with the airway piece.

[0007] According to the wafer moving device provided in some embodiments of the present application, a first adhesive layer is provided between the airway strip and the substrate; and a second adhesive layer is provided between the cover and the airway member.

[0008] According to the wafer moving device provided in some embodiments of the present application, the substrate includes a mounting portion, a first adsorption portion and a second adsorption portion; the first adsorption portion and the second adsorption portion are respectively connected to the mounting portion, and a gap is provided between the first adsorption portion and the second adsorption portion.

[0009] According to the wafer moving device provided in some embodiments of the present application, one adsorption hole is located on the first adsorption part, two adsorption holes are located on the second adsorption part, and the air guide hole is located on the mounting part.

[0010] According to the wafer moving device provided in some embodiments of the present application, the substrate is a metal sheet fork, the thickness of the substrate is greater than the thickness of the airway strip; the thickness of the airway part is greater than the thickness of the cover part; the material of the substrate is an ultra-flat aluminum plate.

[0011] The wafer moving device provided in some embodiments of the present application also includes a suction cup, which is installed on the side of the substrate away from the airway strip; the suction cup includes a disc body, a boss and an air hole, and the air hole passes through the disc body and the boss; the boss is located in the adsorption hole, and the boss is fixedly connected to the adsorption hole; the first end face of the disc body is in contact with the substrate, and the second end face of the disc body is provided with a conical hole, and the conical hole is communicated with the air hole.

[0012] According to the wafer moving device provided in some embodiments of the present application, the boss includes a positioning portion, and a peripheral surface of the positioning portion is in contact with a peripheral surface of the adsorption hole.

[0013] According to the wafer moving device provided in some embodiments of the present application, the boss includes a connecting portion, the positioning portion is located between the connecting portion and the disk body; the outer contour area of ​​the connecting portion is smaller than the outer contour area of ​​the positioning portion; and a connecting medium is filled between the outer peripheral surface of the connecting portion and the adsorption hole.

[0014] According to the wafer moving device provided in some embodiments of the present application, a circumferential surface of the connecting portion is provided with a receiving groove, and the number of the receiving grooves is multiple, and the multiple receiving grooves are distributed in an array on the circumferential surface of the connecting portion; the connecting medium is glue.

[0015] According to the wafer moving device provided in some embodiments of the present application, the substrate also includes a first marking line, which is located on the first adsorption portion and on a side of the substrate away from the airway strip, and is used to locate the outer contour of the wafer.

[0016] According to the wafer moving device provided in some embodiments of the present application, the substrate also includes a second marking line, which is located on the second adsorption portion and on a side of the substrate away from the airway strip, and is used to locate the outer contour of the wafer.

[0017] According to the wafer moving device provided in some embodiments of the present application, the substrate further includes a third marking line, and the third marking line is located on the mounting portion and on a side of the substrate away from the airway strip, for locating the position of the wafer.

[0018] The technical solution provided by the embodiments of the present disclosure brings at least the following beneficial effects:

[0019] Some embodiments of the present application provide a wafer moving device, which includes a substrate and an airway strip mounted on the substrate. The airway groove is opened on the airway strip, and only adsorption holes and air guide holes are processed on the substrate, so that there is no processing stress caused by large-area processing on the substrate, which can avoid the influence of processing stress on flatness, so that the flatness can meet the use requirements. In addition, the airway strip is set according to the contour of the airway groove, and will not cause stress to the substrate.

[0020] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] By reading the detailed description of the preferred embodiment below, various other advantages and benefits will become clear to those of ordinary skill in the art. The accompanying drawings are only used for the purpose of illustrating the preferred embodiment and are not considered to be limitations of the present application. In addition, the same reference symbols are used to represent the same components throughout the accompanying drawings.

[0022] Figure 1 The structure of the wafer transfer device of some embodiments of the present application is shown in FIG. Figure 1 ;

[0023] Figure 2 The structure of the wafer transfer device of some embodiments of the present application is shown in FIG. Figure 2 ;

[0024] Figure 3 The structure of the substrate of some embodiments of the present application is shown in FIG. Figure 1 ;

[0025] Figure 4 The structure of the substrate of some embodiments of the present application is shown in FIG. Figure 2 ;

[0026] Figure 5 This is a schematic diagram of the structure of the airway components of some embodiments of the present application;

[0027] Figure 6 This is a schematic diagram of the structure of the cover of some embodiments of the present application;

[0028] Figure 7 Schematic diagram of the structure of the suction cup in some embodiments of the present application Figure 1 ;

[0029] Figure 8 Schematic diagram of the structure of the suction cup in some embodiments of the present application Figure 2 ;

[0030] Fig. 9A schematic cross-sectional view of a suction cup according to some embodiments of the present application;

[0031] Fig.10 A schematic cross-sectional view of a wafer moving device at a second adsorption portion according to some embodiments of the present application;

[0032] Fig.11 This is a schematic diagram of the connection of the suction cup at the second adsorption portion in some embodiments of the present application;

[0033] Fig.12 This is a cross-sectional schematic diagram of some embodiments of the present application when the suction cup is connected to the second adsorption part.

[0034] In the attached picture:

[0035] 1-substrate; 11-mounting part; 12-first adsorption part; 13-second adsorption part; 14-air guide hole; 15-adsorption hole; 16-second marking line; 17-third marking line; 18-first marking line;

[0036] 2-airway strip; 21-airway piece; 211-airway groove; 22-covering piece;

[0037] 3-suction cup; 31-disc body; 311-conical hole; 312-first end surface; 313-second end surface; 32-air hole; 33-boss; 331-positioning part; 332-connecting part; 3321-accommodating groove. DETAILED DESCRIPTION

[0038] The following embodiments of the technical solution of the present application are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present application.

[0039] It should be noted that, unless otherwise specified, the technical terms or scientific terms used in the embodiments of the present application should have the common meanings understood by technicians in the field to which the embodiments of the present application belong.

[0040] In the description of the embodiments of the present application, the orientations or positional relationships indicated by technical terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", and "circumferential" are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the embodiments of the present application.

[0041] In addition, the technical terms "first", "second", etc. are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined.

[0042] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0043] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0044] In the semiconductor field, the forks used to move wafers are usually made of silicon carbide or alumina ceramic materials, which have high processing costs and are very easy to break. In some related technologies, metal forks are tried as a replacement. Metal forks are usually milled from metal materials into thin plates that meet thickness requirements, and then airway grooves are milled on the metal thin plates. Some metal forks are also made using 3D printing technology. However, no matter which processing technology (3D printing and / or milling) is used, there will always be processing stress when large-area processing is performed on the upper and / or lower surfaces of the metal fork, and when airway grooves are opened on the surface of the metal fork. Due to the existence of processing stress, the metal fork is easily deformed, resulting in poor flatness. The flatness cannot meet the use requirements, and the adsorption often fails when the wafer is adsorbed under negative pressure.

[0045] Some embodiments of the present application provide a wafer moving device, which can solve the problem of processing stress affecting flatness due to large-area processing on the wafer fork surface.

[0046] Please refer to Figures 1 to 6 ,in, Figure 1 The structure of the wafer transfer device of some embodiments of the present application is shown in FIG. Figure 1; Figure 2 The structure of the wafer transfer device of some embodiments of the present application is shown in FIG. Figure 2 ; Figure 3 The structure of the substrate of some embodiments of the present application is shown in FIG. Figure 1 ; Figure 4 The structure of the substrate of some embodiments of the present application is shown in FIG. Figure 2 ; Figure 5 This is a schematic diagram of the structure of the airway components of some embodiments of the present application; Figure 6 This is a schematic diagram of the structure of the cover of some embodiments of the present application.

[0047] like Figure 1 and Figure 2 As shown, in some embodiments of the present application, the wafer moving device includes a substrate 1 and an airway strip 2 installed on the surface of the substrate 1; the substrate 1 is provided with adsorption holes 15 and air guide holes 14 that pass through the substrate 1; on the side of the airway strip 2 facing the substrate 1, the airway strip 2 is provided with an airway groove 211 along the outer contour, and the airway groove 211 connects the adsorption holes 15 and the air guide holes 14.

[0048] The substrate 1, as the main body of the wafer moving device, is made of a metal plate. The airway strip 2, as a component for forming an airway, is installed on the substrate 1. The adsorption holes 15 and the air guide holes 14 on the substrate 1 pass through the substrate 1, and the airway grooves 211 are connected to the adsorption holes 15 and the air guide holes 14 on the surface of the substrate 1, thereby forming an airway for negative pressure adsorption. The adsorption holes 15 can adsorb wafers under the action of negative pressure, the airway grooves 211 can serve as a gas flow path, and the air guide holes 14 can draw air from the adsorption holes 15 through the airway grooves 211 under the action of negative pressure, thereby forming a negative pressure at the adsorption holes 15 that can adsorb wafers.

[0049] In the above structure, only air guide holes 14 and adsorption holes 15 are processed on the substrate 1, and the proportion of the air guide holes 14 and the adsorption holes 15 on the surface of the substrate 1 is small, and there is no processing stress caused by large-area processing (such as milling to form airways) on the substrate 1. The airway groove 211 is opened on the airway strip 2, and is not opened on the substrate 1. The processing stress generated by processing the airway groove 211 will not be reflected on the substrate 1, and the airway strip 2 is set according to the contour of the airway groove 211. When installed on the substrate 1, it will not cause a large-area impact on the substrate 1, and will not cause the substrate 1 to be deformed by force. Therefore, the substrate 1 can avoid the influence of processing stress and assembly force on flatness, and its surface flatness can meet the use requirements, and the adsorption is better during use, and the cost is low.

[0050] like Figure 5 and Figure 6As shown, in some embodiments of the present application, the airway strip 2 includes an airway piece 21 and a covering piece 22, and the airway groove 211 runs through the airway piece 21; the covering piece 22 covers the first side of the airway groove 211 and is sealed with the airway piece 21; the substrate 1 covers the second side of the airway groove 211 and is sealed with the airway piece 21.

[0051] The airway member 21 is plate-shaped, has thickness, and is processed with an airway groove 211 in the thickness direction, and the airway groove 211 runs through the airway member 21. The cover member 22 is plate-shaped, covers the airway member 21, and together forms an airway strip 2 with an airway groove 211 opened on one side.

[0052] In the above structure, the airway strip 2 is designed to be a combination of an airway piece 21 and a cover piece 22 along the depth direction of the airway groove 211. Compared with processing the entire airway strip 2, it can not only reduce the processing difficulty and select a variety of processing methods, but also reduce the impact of processing stress on the airway strip 2, ensuring that the surface flatness of the airway piece 21 meets the requirements. When processing the airway piece 21, since the airway groove 211 thereon passes through the airway piece 21, a variety of processing schemes can be selected when processing the airway groove 211. For example, wire cutting can be used, milling can be used, and even stamping and then milling the surface can be used.

[0053] In some embodiments of the present application, there may be multiple airway grooves 211. When there are multiple airway grooves 211, adjacent airway grooves 211 with the same extension direction are arranged side by side, and at this time, the width of the airway strip 2 can be widened accordingly.

[0054] In some embodiments of the present application, a first adhesive layer is provided between the airway strip 2 and the substrate 1 ; and a second adhesive layer is provided between the cover 22 and the airway member 21 .

[0055] The air duct member 21 is bonded to the substrate 1 , and the cover member 22 is bonded to the air duct member 21 . Both the first bonding layer and the second bonding layer are made of structural adhesive with a certain toughness, and both can form bonding layers.

[0056] In the above structure, the airway piece 21 and the substrate 1, and the airway piece 21 and the cover 22 are all connected by bonding, which can ensure the sealing of the outside of the airway groove 211 to avoid air leakage. The first adhesive layer and the second adhesive layer are both structural adhesives that can form an adhesive layer, which have toughness and can reduce the bonding stress inside the airway strip 2 and between the airway strip 2 and the substrate 1, thereby ensuring that the substrate 1 has good flatness.

[0057] like Figure 3 and Figure 4As shown, in some embodiments of the present application, the substrate 1 includes a mounting portion 11, a first adsorption portion 12 and a second adsorption portion 13. The first adsorption portion 12 and the second adsorption portion 13 are respectively connected to the mounting portion 11, and a gap is provided between the first adsorption portion 12 and the second adsorption portion 13.

[0058] When the first adsorption part 12 and the second adsorption part 13 are connected to the mounting part 11, a fork shape with an opening (corresponding to the interval) can be formed. The first adsorption part 12 and the second adsorption part 13 can be used to adsorb wafers, and the mounting part 11 can be used as a connection position for the wafer moving device to connect to an external structure. For example, a fixing hole can be processed on the mounting part 11 for the external structure to be pierced and fixed.

[0059] In the above structure, the wafer is adsorbed by the first adsorption part 12 and the second adsorption part 13, and there is a gap between the first adsorption part 12 and the second adsorption part 13, which can reduce the contact area between the wafer moving device and the wafer during use and avoid interference with the wafer as much as possible.

[0060] In some embodiments of the present application, one adsorption hole 15 is located on the first adsorption portion 12 , two adsorption holes 15 are located on the second adsorption portion 13 , and the air hole 32 and the air guide hole 3214 are located on the mounting portion 11 .

[0061] The air guide holes 14 draw air under negative pressure, and can draw air from one adsorption hole 15 on the first adsorption part 12 and from two adsorption holes 15 on the second adsorption part 13 through the airway groove 211 , thereby forming negative pressure at the three adsorption holes 15 to adsorb the wafer.

[0062] In the above structure, one adsorption hole 15 is set on the first adsorption part 12, and two adsorption holes 15 are set on the second adsorption part 13, with a total of three adsorption holes 15 to adsorb the wafer, and a three-point adsorption form is adopted to adsorb and move the wafer, which can not only achieve firm adsorption of the wafer, but also avoid excessive constraint on the wafer, and can effectively avoid the influence of the flatness error of the first adsorption part 12 and the second adsorption part 13 on the moving operation.

[0063] In some embodiments of the present application, the substrate 1 is a metal sheet fork, and the thickness of the substrate 1 is greater than the thickness of the airway strip 2 ; the thickness of the airway piece 21 is greater than the thickness of the covering piece 22 .

[0064] The substrate 1 is a metal fork that can be used to move wafers. In other embodiments of the present application, the metal fork can use an ultra-flat aluminum plate as a substrate to process the substrate 1. During processing, the outer contour of the substrate 1 can be cut using a slow wire cutting process. Since the surface flatness of the ultra-flat aluminum plate itself can meet the requirements, the upper and lower surfaces of the substrate 1 do not need to be processed on a large scale, and only the adsorption holes 15 and the air guide holes 14 need to be processed. In addition, the ultra-flat aluminum plate as a substrate itself can also meet the requirements of thin thickness and light weight.

[0065] In the above structure, the thickness of the substrate 1 is greater than the thickness of the airway strip 2, and in the airway strip 2, the thickness of the airway component 21 is greater than the thickness of the cover 22. By setting the thickness of the substrate 1, the airway component 21, and the cover 22, it is possible to reasonably plan the structure of the wafer moving device, reduce the space occupied by the wafer moving device, and meet the space requirements for wafer moving.

[0066] Please refer to Figures 7 to 12 ,in, Figure 7 Schematic diagram of the structure of the suction cup in some embodiments of the present application Figure 1 ; Figure 8 Schematic diagram of the structure of the suction cup in some embodiments of the present application Figure 2 ; Fig. 9 A schematic cross-sectional view of a suction cup according to some embodiments of the present application; Fig.10 A schematic cross-sectional view of a wafer moving device at a second adsorption portion according to some embodiments of the present application; Fig.11 This is a schematic diagram of the connection of the suction cup at the second adsorption portion in some embodiments of the present application; Fig.12 This is a cross-sectional schematic diagram of some embodiments of the present application when the suction cup is connected to the second adsorption part.

[0067] like Figure 2 , Figure 7 , Figure 8 and Fig. 9 As shown, in some embodiments of the present application, a suction cup 3 is further included, and the suction cup 3 is installed on the side of the substrate 1 away from the airway strip 2. The suction cup 3 includes a disc body 31, a boss 33 and an air hole 32, the boss 33 protrudes outward from the first end surface 312 of the disc body 31, and the air hole 32 passes through the disc body 31 and the boss 33. The boss 33 is located in the adsorption hole 15 and is fixedly connected to the adsorption hole 15. The first end surface 312 of the disc body 31 is attached to the substrate 1, and the second end surface 313 of the disc body 31 is provided with a tapered hole 311, and the tapered hole 311 is communicated with the air hole 32.

[0068] The suction cup 3 is installed at the adsorption hole 15 and is located on the side of the substrate 1 away from the airway strip 2. It can be used as the part where the wafer moving device contacts the wafer. The air hole 32 of the suction cup 3 passes through the disk body 31 and the boss 33, and can communicate with the adsorption hole 15. Under the action of negative pressure, the second end face 313 of the disk body 31 is prompted to adsorb the wafer. The second end face 313, as the contact surface with the wafer, can be ground and polished to ensure that the flatness and roughness meet expectations. The boss 33 is fixedly connected to the adsorption hole 15, for example, it can be fixedly connected in the form of a snap connection, or it can be fixedly connected in the form of an adhesive connection.

[0069] In the above structure, the suction cup 3 is installed in the adsorption hole 15 through the boss 33, and the suction cup 3 can be radially positioned to ensure the installation accuracy of the suction cup 3 in the adsorption hole 15, and avoid the airtightness between the suction cup 3 and the adsorption hole 15 when the wafer is adsorbed. The first end face 312 of the disk body 31 is attached to the substrate 1, and the suction cup 3 can be axially positioned to ensure that the protruding height of the suction cup 3 on the substrate 1 meets the expectation. When there are multiple suction cups 3, it can also ensure that the flatness of the second end faces 313 of the multiple suction cups 3 meets the adsorption requirements. The second end face 313 of the disk body 31 is provided with a tapered hole 311, which can firstly increase the volume of the negative pressure cavity at the suction cup 3 and improve the adsorption force, and secondly reduce the area of ​​the second end face 313 of the disk body 31, thereby reducing the contact area between the adsorption surface (second end face 313) and the wafer, and reducing the processing area of ​​the second end face 313.

[0070] like Fig. 9 and Fig.10 As shown, in some embodiments of the present application, the boss 33 includes a positioning portion 331 , and the circumference of the positioning portion 331 is in contact with the circumference of the adsorption hole 15 .

[0071] The circumferential surface of the positioning portion 331 of the boss 33 fits with the circumferential surface of the adsorption hole 15, which means that the positioning portion 331 can just be placed into the adsorption hole 15 without causing deformation of the positioning portion 331 and / or the adsorption hole 15, and the radial position of the suction cup 3 can be fixed to ensure that the suction cup 3 has no radial displacement, for example, the adsorption hole 15 can be transitionally matched with the positioning portion 331.

[0072] In the above structure, the circumferential surface of the positioning portion 331 fits with the circumferential surface of the adsorption hole 15, which can firstly provide precise radial positioning for the suction cup 3, and secondly reduce the gap between the suction cup 3 and the adsorption hole 15, thereby ensuring the reliability of the wafer adsorption work.

[0073] like Fig. 9 , Fig.11 and Fig.12 As shown, in some embodiments of the present application, the boss 33 includes a connecting portion 332, and the positioning portion 331 is located between the connecting portion 332 and the disk body 31. The outer contour area of ​​the connecting portion 332 is smaller than the outer contour area of ​​the positioning portion 331, and the outer peripheral surface of the connecting portion 332 and the adsorption hole 15 are filled with a connecting medium.

[0074] The circumference of the positioning portion 331 fits the circumference of the adsorption hole 15 , and the outer contour area of ​​the connecting portion 332 is smaller than that of the positioning portion 331 , so that there is a gap between the connecting portion 332 and the positioning portion 331 , and the gap is filled with a connecting medium.

[0075] In the above structure, the positioning portion 331 is used to radially position the suction cup 3, and the connecting portion 332 is used as a connecting medium to connect the substrate 1 and the suction cup 3, which can ensure the firmness of the suction cup 3 installed on the suction hole 15. In addition, the connecting medium filled between the connecting portion 332 and the suction hole 15 can also seal the gap between the suction cup 3 and the suction hole 15 to ensure air tightness.

[0076] In some embodiments of the present application, the boss 33 is cylindrical as a whole, and the air hole 32 is coaxially opened. The boss 33 includes two sections with different outer diameters in the axial direction, wherein the section with a larger outer diameter is connected to the disc body 31. The positioning portion 331 is a section with a larger outer diameter, and the connecting portion 332 is a section with a smaller outer diameter.

[0077] In the above structure, the outer peripheral surface of the positioning portion 331 is a cylindrical surface, and the outer peripheral surface of the connecting portion 332 is also a cylindrical surface. In the processing technology of the outer peripheral surface forming, a turning process can be used to complete it. In addition, the positioning portion 331 and the connecting portion 332 form two outer peripheral surfaces with different diameters, so that the outer diameter of the boss 33 only includes two sizes, so that the outer peripheral surface processing process of the boss can be completed by using an ordinary lathe, without using a CNC lathe, which can save processing costs.

[0078] like Figure 7 and Fig.11 As shown, in some embodiments of the present application, a accommodating groove 3321 is provided on the circumferential surface of the connecting portion 332, and there are multiple accommodating grooves 3321, which are distributed in an array on the circumferential surface of the connecting portion 332; the connecting medium is glue.

[0079] When the suction cup 3 is connected to the adsorption hole 15 on the substrate 1, at least each receiving groove 3321 is filled with glue to achieve the adhesive connection of the suction cup 3 on the substrate 1, and the design of the receiving groove 3321 can provide a receiving space for the glue.

[0080] In the above structure, by designing the receiving groove 3321 to provide a receiving space for glue, more glue can be injected between the connecting part 332 and the adsorption hole 15, ensuring that sufficient glue is filled between the adsorption hole 15 and the connecting part 332, avoiding the lack of glue due to surface tension, and effectively preventing the suction cup 3 from debonding and falling off.

[0081] like Figure 2 and Figure 4 As shown, in some embodiments of the present application, the substrate 1 further includes a first marking line 18 , and the first marking line 18 is located on the first adsorption portion 12 , on a side of the substrate 1 facing away from the airway strip 2 .

[0082] The first marking line 18 can be formed on the surface of the substrate 1 by using a silk screen printing process. The first marking line 18 is a line located on the first adsorption portion 12 .

[0083] In the above structure, when the wafer is adsorbed, the first marking line 18 can be used as a positioning reference to locate the outer contour of the wafer.

[0084] like Figure 2 and Figure 4 As shown, in some embodiments of the present application, the substrate 1 further includes a second marking line 16 , and the second marking line 16 is located on the second adsorption portion 13 , on a side of the substrate 1 facing away from the airway strip 2 .

[0085] The second marking line 16 can be formed on the surface of the substrate 1 by using a silk screen printing process. The second marking line 16 is a line located on the second adsorption portion 13 .

[0086] In the above structure, the second marking line 16 can be used together with the first marking line 18 as a reference to locate the outer contour of the wafer, thereby improving the positioning accuracy when the wafer is moved.

[0087] like Figure 2 and Figure 4 As shown, in some embodiments of the present application, the substrate 1 further includes a third marking line 17 , and the third marking line 17 is located on the mounting portion 11 , on a side of the substrate 1 facing away from the airway strip 2 .

[0088] The third marking line 17 can be formed on the surface of the substrate 1 by using a silk screen printing process. The third marking line 17 is a line located on the mounting portion 11 .

[0089] In the above structure, the third marking line 17 can cooperate with the first marking line and the second marking line 16 to position the wafer, and can accurately locate the position of the wafer. For example, the third marking line 17 can be used to align the notch of the wafer, and the first marking line 18 and the second marking line 16 can be used to align the outer circle of the wafer.

[0090] In some embodiments of the present application, a method for manufacturing a wafer moving device is also provided, including a method for manufacturing a substrate 1 , a method for manufacturing a suction cup 3 , and a method for manufacturing an airway strip 2 .

[0091] Regarding the manufacturing method of the substrate 1: the substrate 1 is made of an ultra-flat aluminum plate, and the outer contour, adsorption holes 15, air guide holes 14 and fixing holes are processed by slow wire cutting. Because the ultra-flat aluminum plate is used without secondary surface processing, the processing stress during large-area processing can be avoided, ensuring that the flatness of the substrate 1 after processing meets the expectations, and then ensuring that the height of the second end faces 313 of the three suction cups 3 is consistent. The first marking line 18, the second marking line 16, and the third marking line 17 are formed on the substrate 1 by screen printing. On the premise of meeting the technical parameters, the slow wire cutting process can be replaced by ordinary wire cutting process.

[0092] Regarding the manufacturing method of the suction cup 3: The suction cup 3 has a small structure and high rigidity, and can be processed by conventional precision machining methods, wherein the first end face 312 and the second end face 313 of the disk body 31 are ground to ensure good surface flatness and roughness; the second end face 313 is polished at the same time to ensure airtightness during adsorption. The first end face 312 of the suction cup 3 directly abuts the surface of the substrate 1 to ensure that the heights of the second end faces 313 of the three suction cups 3 are consistent, so that the wafer can be well adsorbed. The suction cup 3 adopts a stepped structure, with a positioning portion 331, a connecting portion 332, and a receiving groove 3321, which can ensure the firmness of the connection; the suction cup 3 is processed with a tapered hole 311, especially to ensure the machining accuracy of the second end face 313 and the first end face 312, which can ensure the reliability of wafer adsorption.

[0093] Regarding the manufacturing method of the airway strip 2: Both the airway component 21 and the cover component 22 are processed by wire cutting, which can greatly reduce the processing stress. The airway component 21 and the cover component 22 adopt a gluing process to form the airway groove 211, and the substrate 1 and the airway strip 2 adopt a gluing process to form the airway. During gluing, a structural adhesive with a certain toughness is used to further reduce the bonding stress between the substrate 1 and the airway strip 2, thereby ensuring that the aluminum substrate 1 has good flatness. On the premise of meeting the technical parameters, wire cutting can be replaced by ordinary wire cutting technology. The thickness of the airway component 21 and the cover component 22 can be adjusted according to demand, and the thickness of the cover component 22 is less than the thickness of the airway component 21.

[0094] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the claims and specification of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. A wafer transfer device, characterized in that: include: A substrate and an airway strip mounted on a surface of the substrate; The substrate is provided with adsorption holes and air guide holes penetrating the substrate; On the side of the airway strip facing the substrate, an airway groove is opened along the outer contour of the airway strip, and the airway groove communicates with the adsorption hole and the air guide hole.

2. The wafer transfer device according to claim 1, characterized in that: The airway strip comprises an airway piece and a covering piece, and the airway groove passes through the airway piece; The covering member covers the first side of the airway groove and is sealed with the airway member; The substrate covers the second side of the airway groove and is sealed with the airway component.

3. The wafer transfer device according to claim 2, characterized in that: A first adhesive layer is provided between the airway strip and the substrate; A second adhesive layer is provided between the cover member and the airway member.

4. The wafer transfer device according to claim 2, characterized in that: The substrate is a metal sheet fork, and the thickness of the substrate is greater than the thickness of the airway strip; The thickness of the airway member is greater than the thickness of the covering member; The substrate is made of an ultra-flat aluminum plate.

5. The wafer transfer device according to claim 1, characterized in that: The substrate comprises a mounting portion, a first adsorption portion and a second adsorption portion; The first adsorption part and the second adsorption part are respectively connected to the mounting part, and a gap is provided between the first adsorption part and the second adsorption part; One of the adsorption holes is located on the first adsorption portion, two of the adsorption holes are located on the second adsorption portion, and the air guide hole is located on the mounting portion.

6. The wafer transfer device according to claim 5, characterized in that: The substrate further comprises a first marking line, a second marking line and / or a third marking line; The first marking line for positioning the outer contour of the wafer is located on the first adsorption portion; The second marking line for positioning the outer contour of the wafer is located on the second adsorption portion; The third marking line for locating the wafer position is located on the mounting portion; The first marking line, the second marking line, and the third marking line are all located on a side of the substrate facing away from the airway strip.

7. The wafer transfer device according to claim 1, characterized in that: Also includes a suction cup, the suction cup is mounted on a side of the substrate away from the airway strip; The suction cup comprises a disc body, a boss and an air hole, wherein the air hole passes through the disc body and the boss; The boss is located in the adsorption hole, and the boss is fixedly connected to the adsorption hole; The first end surface of the disk body is in contact with the substrate, and the second end surface of the disk body is provided with a tapered hole, which is communicated with the air hole.

8. The wafer transfer device according to claim 7, characterized in that: The boss includes a positioning portion, and a peripheral surface of the positioning portion is in contact with a peripheral surface of the adsorption hole.

9. The wafer transfer device according to claim 8, characterized in that: The boss includes a connecting portion, and the positioning portion is located between the connecting portion and the disk body; The outer contour area of ​​the connecting portion is smaller than the outer contour area of ​​the positioning portion, and a receiving groove is provided on the peripheral surface of the connecting portion; A connection medium is filled between the outer peripheral surface of the connection part and the adsorption hole.

10. The wafer transfer device according to claim 9, characterized in that: There are a plurality of accommodating grooves, and the plurality of accommodating grooves are distributed in an array on the peripheral surface of the connecting portion; The connecting medium is glue.

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