Optical coupler device

Abstract

The utility model discloses an optocoupler device which comprises a first support and a second support, the first support comprises a first die bonding portion, the second support comprises a second die bonding portion, and the first die bonding portion and the second die bonding portion are oppositely arranged. A first chip is bonded on the first die bonding part, a chip electrode of the first chip is connected with the first die bonding part based on a first bonding wire, a second chip is bonded on the second die bonding part, a chip electrode of the second chip is connected with the second die bonding part based on a second bonding wire, and the first chip and the second chip are oppositely arranged; the optical coupler device further comprises a protection layer, and the protection layer wraps the first die bonding part, the second die bonding part, the first chip, the first bonding wire, the second chip and the second bonding wire. The optical coupler device further comprises a packaging layer, and the packaging layer wraps the protection layer. The utility model has the advantages of simple structure, simple manufacturing process, and good stability and reliability.

Description

Technical Field

[0001] The utility model relates to an optical coupling device in the technical field, in particular to an optical coupling device. Background Art

[0002] Optocouplers are devices that use light as a medium to transmit electrical signals. Usually, light-emitting chips, such as infrared LEDs, and photosensitive chips, such as semiconductor tubes such as photodiodes and triodes, are encapsulated in the same housing. When an electrical signal is input at the input end, the light-emitting chip emits light, and the photosensitive chip generates photocurrent after receiving the light, and outputs it from the output end, thereby realizing "electric-light-electric" control. Optocouplers have the characteristics of no contact, strong anti-interference ability, insulation between the input and output ends, and unidirectional signal transmission, so they are widely used in many fields.

[0003] The main structure of existing optocoupler devices is an independent design, such as Figure 1 As shown, the light emitting chip 11 and the photosensitive chip 12 are placed on the bent brackets respectively and arranged opposite to each other. A protective silicone layer 13 is arranged around the light emitting chip 11. The protective silicone layer 13 covers the light emitting chip 11 and the welding wire 14 connecting the light emitting chip 11 and the corresponding bracket. After the upper and lower laminations are completed, two packaging processes are performed to form an inner packaging layer 15 and an outer packaging layer 16. Although the structure and process of this device are relatively mature, the structure is relatively complex, the production process is more, and the production cost is high, resulting in certain problems in its stability and reliability. Utility Model Content

[0004] The purpose of the utility model is to overcome the deficiencies of the prior art. The utility model provides an optical coupling device with a simple structure, a simple manufacturing process, a low manufacturing cost, and good stability and reliability.

[0005] The utility model provides an optical coupling device, the optical coupling device comprises a first bracket and a second bracket, the first bracket comprises a first crystal-fixing portion, the second bracket comprises a second crystal-fixing portion, the first crystal-fixing portion and the second crystal-fixing portion are arranged opposite to each other;

[0006] A first chip is bonded to the first bonding part, and a chip electrode of the first chip is connected to the first bonding part based on a first bonding wire; a second chip is bonded to the second bonding part, and a chip electrode of the second chip is connected to the second bonding part based on a second bonding wire; the first chip and the second chip are arranged opposite to each other;

[0007] The optical coupling device further includes a protective layer, wherein the protective layer covers the first and second crystal-bonding parts, the first chip, the first bonding wire, the second chip, and the second bonding wire;

[0008] The optical coupling device further includes a packaging layer, and the packaging layer covers the protective layer.

[0009] Furthermore, the first bracket further includes a first pin and a first bending portion, the first pin is connected to the first bending portion, and the first bending portion is connected to the first die-bonding portion;

[0010] The second bracket further includes a second pin and a second bending portion, the second pin is connected to the second bending portion, and the second bending portion is connected to the second die-bonding portion;

[0011] The packaging layer covers the first bending portion and the second bending portion.

[0012] Furthermore, the first crystal-fixing portion is provided with a plurality of through holes, and the through holes penetrate the first crystal-fixing portion;

[0013] The second crystal-bonding portion is provided with a plurality of through holes, and the through holes penetrate through the second crystal-bonding portion.

[0014] Furthermore, the diameter of the through hole is 0.1 mm-1 mm.

[0015] Furthermore, the protection layer fills the through hole and extends to the back side of the first die-bonding portion and the back side of the second die-bonding portion.

[0016] Furthermore, the first solid crystal portion includes a first electrode and a second electrode, the first chip is bonded to the first electrode, the chip electrode of the first chip is connected to the second electrode based on the first welding wire, the first electrode is an irregular polygon, and the first chip and the second chip arranged on the first electrode are staggered and relatively arranged.

[0017] Furthermore, a first protrusion is provided on the first electrode, and a second protrusion is provided on the second electrode.

[0018] Furthermore, the material of the encapsulation layer is epoxy resin doped with silicon dioxide powder.

[0019] Furthermore, the material of the protective layer is a silicone-based material.

[0020] Furthermore, the first chip is a light-emitting chip, and the second chip is a photosensitive chip;

[0021] Or the first chip is a photosensitive chip, and the second chip is a light-emitting chip.

[0022] The utility model provides an optocoupler device, which is provided with a silicone protective layer that completely covers a first chip, a second chip and corresponding welding wires, can protect the first chip and the second chip at the same time, and improve the stability and reliability of the device; after the silicone protective layer is provided, only one packaging layer needs to be provided, the device structure is simpler, the manufacturing process is simpler, and the manufacturing cost is lower; a through hole is provided on the solid crystal part, so that the silicone protective layer fills the through hole, effectively reducing the stress of the device structure, improving the bonding force between the silicone protective layer and the bracket, and having good stability and reliability; the first electrode is provided as an irregular polygon, so that the first chip and the second chip are staggered and relatively provided, which greatly reduces the thickness of the optocoupler device, and is conducive to the development of the device in the direction of thinning; a protruding structure is provided on the first electrode and the second electrode, which improves the stability of the welding wire, and at the same time extends the path for water vapor to enter, enhances air tightness, and improves the stability and reliability of the optocoupler device. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 It is a schematic diagram of the structure of an optocoupler device in the prior art;

[0025] Figure 2 This is a schematic diagram of the structure of the optocoupler device in the first embodiment of the utility model;

[0026] Figure 3 This is a schematic diagram of the first bracket structure in the first embodiment of the utility model;

[0027] Figure 4 It is a schematic diagram of the structure of the optocoupler device in the second embodiment of the present utility model. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0029] Embodiment 1

[0030] Embodiment 1 of the present invention provides an optocoupler device, which includes a first bracket and a second bracket, wherein the first bracket includes a first crystal-bonding portion, the second bracket includes a second crystal-bonding portion, and the first crystal-bonding portion and the second crystal-bonding portion are arranged opposite to each other; a first chip is bonded to the first crystal-bonding portion, and a chip electrode of the first chip is connected to the first crystal-bonding portion based on a first welding wire, a second chip is bonded to the second crystal-bonding portion, and a chip electrode of the second chip is connected to the second crystal-bonding portion based on a second welding wire, and the first chip and the second chip are arranged opposite to each other; the optocoupler device also includes a protective layer, which covers the first crystal-bonding portion and the second crystal-bonding portion, as well as the first chip, the first welding wire, the second chip and the second welding wire; the optocoupler device also includes an encapsulation layer, which covers the protective layer.

[0031] In an optional implementation of this embodiment, Figure 2 As shown, Figure 2 The schematic diagram of the structure of the optocoupler device in the first embodiment of the utility model is shown.

[0032] In an optional implementation of this embodiment, the optical coupling device includes a first bracket 2 , and the first bracket 2 includes a first crystal-fixing portion 23 .

[0033] In an optional implementation of this embodiment, the optical coupling device includes a second bracket 3, and the second bracket 3 includes a second solid crystal portion 33.

[0034] In an optional implementation of this embodiment, the first crystal-bonding portion 23 and the second crystal-bonding portion 33 are arranged opposite to each other.

[0035] In an optional implementation of this embodiment, a first chip 24 is bonded to the first die-bonding portion 23 , and a chip electrode of the first chip 24 is connected to the first die-bonding portion 23 via a first bonding wire 25 .

[0036] In an optional implementation of this embodiment, a second chip 34 is bonded to the second die-bonding portion 33 , and a chip electrode of the second chip 34 is connected to the second die-bonding portion 33 via a second bonding wire 35 .

[0037] In an optional implementation of this embodiment, the first chip 24 and the second chip 34 are arranged opposite to each other.

[0038] In an optional implementation of the present embodiment, the optocoupler device further includes a protective layer 4, which covers the first crystal-bonding portion 23 and the second crystal-bonding portion 33, as well as a first chip 24 and a first welding wire 25 arranged on the first crystal-bonding portion 23, and a second chip 34 and a second welding wire 35 arranged on the second crystal-bonding portion 33.

[0039] Here, the protective layer 4 is provided to completely cover the two chips and the bonding wires. Compared with the prior art in which the protective layer only covers the light-emitting chip and part of the bonding wires, the device structure can be effectively protected and the reliability and stability of the device can be improved.

[0040] In an optional implementation of this embodiment, the optical coupling device further includes a packaging layer 5 , and the packaging layer 5 covers the protective layer 4 .

[0041] Only one packaging layer is required here. Compared with setting two packaging layers in the prior art, the structure is simpler, the manufacturing process is simpler, and the manufacturing cost is lower.

[0042] In an optional implementation of the present embodiment, the first bracket 2 further includes a first pin 21 and a first bending portion 22 , the first pin 21 is connected to the first bending portion 22 , and the first bending portion 22 is connected to the first die-bonding portion 23 .

[0043] Specifically, there is a bending angle between the first pin 21 and the first bending portion 22 , and there is a bending angle between the first crystal-bonding portion 23 and the first bending portion 22 .

[0044] In an optional implementation of the present embodiment, the second bracket 3 further includes a second pin 31 and a second bending portion 32 , the second pin 31 is connected to the second bending portion 32 , and the second bending portion 32 is connected to the second die-bonding portion 33 .

[0045] Specifically, there is a bending angle between the second pin 31 and the second bending portion 32 , and there is a bending angle between the second crystal-bonding portion 33 and the second bending portion 32 .

[0046] In an optional implementation of this embodiment, the encapsulation layer 5 covers the first bending portion 22 and the second bending portion 32 .

[0047] Specifically, the first pin 21 and the second pin 31 extend out of the packaging layer 5 .

[0048] In an optional implementation of the present embodiment, a plurality of through holes 6 are provided on the first crystal-bonding portion 23 , and the through holes 6 penetrate the first crystal-bonding portion 23 ; a plurality of through holes 6 are provided on the second crystal-bonding portion 33 , and the through holes 6 penetrate the second crystal-bonding portion 33 .

[0049] Specifically, Figure 2 As shown, the first die-bonding portion 23 is provided with two through holes 6 , which are respectively provided on both sides of the first chip 24 , and the second die-bonding portion 33 is provided with two through holes 6 , which are respectively provided on both sides of the second chip 34 .

[0050] Furthermore, the protection layer 4 fills the through hole 6 and extends to the back surface of the first die-bonding portion 23 and the back surface of the second die-bonding portion 33 .

[0051] Specifically, the number of through holes 6 provided in the first crystal-bonding portion 23 and the second crystal-bonding portion 33 is at least two. When through holes 6 are provided, the protection layer 4 extends to the back side of the corresponding crystal-bonding portion by filling the through holes 6 .

[0052] Furthermore, the diameter of the through hole 6 is 0.1 mm-1 mm, and can be a value among 0.1 mm, 0.5 mm, 1 mm, etc., and is set according to actual design requirements.

[0053] Here, a through hole is provided in the solid crystal part, and the protective layer can reduce the stress generated, improve the bonding strength between the protective layer and the bracket, and improve the stability and reliability of the device structure.

[0054] In an optional implementation of this embodiment, the material of the protective layer 4 is a silicone-based material, preferably silicone.

[0055] In an optional implementation of the present embodiment, the viscosity of the silicone material of the protective layer 4 is 10000-30000, which can be a value among 10000, 20000, 30000, etc., determined according to actual design requirements.

[0056] In an optional implementation of this embodiment, the protective layer 4 is a transparent silicone layer, or a red silicone layer doped with red pigment.

[0057] In an optional implementation of this embodiment, Figure 3 As shown, Figure 3 The schematic diagram of the first bracket structure in the first embodiment of the utility model is shown. Figure 3 2 is a top view of the first bracket. The first die-bonding portion 23 includes a first electrode 26 and a second electrode 27 . The first chip 24 is bonded to the first electrode 26 . The chip electrode of the first chip 24 is connected to the second electrode 27 based on the first bonding wire 25 .

[0058] In an optional implementation of this embodiment, the first pin 21 includes a first branch pin 211 and a second branch pin 212 , the first electrode 26 is connected to the first branch pin 211 , and the second electrode 27 is connected to the second branch pin 212 .

[0059] In an optional implementation of the present embodiment, the first electrode 26 is an irregular polygon, and the first chip 24 and the second chip 34 disposed on the first electrode 26 are disposed opposite to each other in a staggered manner.

[0060] Specifically, Figure 2 and Figure 3 As shown, when the first electrode 26 is an irregular polygon, the bonding position of the first chip 24 on the first electrode 26 and the bonding position of the second chip are arranged opposite to each other in a staggered manner.

[0061] The first chip and the second chip are arranged relative to each other in a staggered manner, which can greatly reduce the thickness of the optocoupler device. Under the premise that the overall insulation withstand voltage level of the optocoupler device is not reduced, the vertical distance between the two chip placement surfaces and the thickness of the finished product are reduced by 57%, which is conducive to the development of the device towards thinning.

[0062] In an optional implementation of this embodiment, a first protrusion 28 is provided on the first electrode 26 , and a second protrusion 29 is provided on the second electrode 27 .

[0063] Specifically, the length l of the first protrusion 28 is 1 It is 0.1mm-0.3mm, and can be a value among 0.1mm, 0.2mm, 0.3mm, etc., determined according to actual design requirements.

[0064] Furthermore, the length l of the second protrusion 29 is 2 It is 0.05mm-0.2mm, and can be a value among 0.05mm, 0.1mm, 0.2mm, etc., determined according to actual design requirements.

[0065] Here, a protruding structure is provided on the first electrode and the second electrode to improve the stability of the welding wire, and at the same time extend the path for water vapor to enter, increase the bonding force between the colloid and the bracket, enhance the air tightness, and improve the stability and reliability of the optocoupler device.

[0066] In an optional implementation of this embodiment, the surfaces of the first electrode 26 and the second electrode 27 are plated with silver.

[0067] In an optional implementation of this embodiment, the first welding wire 25 and the second welding wire 35 are made of gold, silver, copper or alloy.

[0068] In an optional implementation of this embodiment, the material of the encapsulation layer 5 is epoxy resin doped with silicon dioxide powder.

[0069] Specifically, the doping ratio of the silicon dioxide powder in the epoxy resin of the encapsulation layer 5 is 70%-95%, which can be a value among 70%, 80%, 90%, 95%, etc., determined according to actual design requirements.

[0070] In an optional implementation of this embodiment, the encapsulation layer 5 is a white encapsulation layer.

[0071] Here, the material of the encapsulation layer is set to epoxy resin doped with silicon dioxide powder, which can effectively block and reflect the light emitted by the light-emitting chip, thereby improving the working efficiency and working accuracy of the optocoupler device.

[0072] In an optional implementation of this embodiment, the first bracket 2 is an IR bracket, and the second bracket 3 is a PT bracket, or the first bracket 2 is a PT bracket, and the second bracket 3 is an IR bracket.

[0073] In an optional implementation of this embodiment, the first chip 24 is a light-emitting chip and the second chip 34 is a photosensitive chip, or the first chip 24 is a photosensitive chip and the second chip 34 is a light-emitting chip.

[0074] Specifically, in this embodiment, the first bracket 2 is an IR bracket, the second bracket 3 is a PT bracket, the first chip 24 is a light-emitting chip, and the second chip 34 is a photosensitive chip.

[0075] In an optional implementation of this embodiment, the first bracket 2 and the second bracket 3 are made of copper, iron, or iron plated with copper.

[0076] In summary, the first embodiment of the utility model provides an optocoupler device, which is provided with a silicone protective layer that completely covers the first chip, the second chip and the corresponding welding wires, which can protect the first chip and the second chip at the same time, thereby improving the stability and reliability of the device; after the silicone protective layer is provided, only one packaging layer needs to be provided, the device structure is simpler, the manufacturing process is simpler, and the manufacturing cost is lower; a through hole is provided on the solid crystal part so that the silicone protective layer fills the through hole, thereby effectively reducing the stress of the device structure, improving the bonding force between the silicone protective layer and the bracket, and having good stability and reliability; the first electrode is provided as an irregular polygon, so that the first chip and the second chip are staggered and relatively provided, thereby greatly reducing the thickness of the optocoupler device, which is conducive to the development of the device towards thinning; a protruding structure is provided on the first electrode and the second electrode, thereby improving the stability of the welding wire, while extending the path for water vapor to enter, enhancing the airtightness, and improving the stability and reliability of the optocoupler device.

[0077] Embodiment 2

[0078] Embodiment 2 of the present utility model provides an optocoupler device, which includes a first bracket and a second bracket, wherein the first bracket includes a first crystal-bonding portion, the second bracket includes a second crystal-bonding portion, and the first crystal-bonding portion and the second crystal-bonding portion are arranged opposite to each other; a first chip is bonded to the first crystal-bonding portion, and a chip electrode of the first chip is connected to the first crystal-bonding portion based on a first welding wire, a second chip is bonded to the second crystal-bonding portion, and a chip electrode of the second chip is connected to the second crystal-bonding portion based on a second welding wire, and the first chip and the second chip are arranged opposite to each other; the optocoupler device also includes a protective layer, which covers the first crystal-bonding portion and the second crystal-bonding portion, as well as the first chip, the first welding wire, the second chip and the second welding wire; the optocoupler device also includes an encapsulation layer, which covers the protective layer.

[0079] In an optional implementation of this embodiment, Figure 4 As shown, Figure 4 The schematic diagram of the structure of the optocoupler device in the second embodiment of the present utility model is shown.

[0080] In an optional implementation of this embodiment, the optical coupling device includes a first bracket 2 , and the first bracket 2 includes a first crystal-fixing portion 23 .

[0081] In an optional implementation of this embodiment, the optical coupling device includes a second bracket 3, and the second bracket 3 includes a second solid crystal portion 33.

[0082] In an optional implementation of this embodiment, the first crystal-bonding portion 23 and the second crystal-bonding portion 33 are arranged opposite to each other.

[0083] In an optional implementation of this embodiment, a first chip 24 is bonded to the first die-bonding portion 23 , and a chip electrode of the first chip 24 is connected to the first die-bonding portion 23 via a first bonding wire 25 .

[0084] In an optional implementation of this embodiment, a second chip 34 is bonded to the second die-bonding portion 33 , and a chip electrode of the second chip 34 is connected to the second die-bonding portion 33 via a second bonding wire 35 .

[0085] In an optional implementation of this embodiment, the first chip 24 and the second chip 34 are arranged opposite to each other.

[0086] It should be noted that the first chip 24 and the second chip 34 are arranged opposite to each other.

[0087] In an optional implementation of the present embodiment, the optocoupler device further includes a protective layer 4, which covers the first crystal-bonding portion 23 and the second crystal-bonding portion 33, as well as a first chip 24 and a first welding wire 25 arranged on the first crystal-bonding portion 23, and a second chip 34 and a second welding wire 35 arranged on the second crystal-bonding portion 33.

[0088] Here, the protective layer 4 is provided to completely cover the two chips and the bonding wires. Compared with the prior art in which the protective layer only covers the light-emitting chip and part of the bonding wires, the device structure can be effectively protected and the reliability and stability of the device can be improved.

[0089] In an optional implementation of this embodiment, the optical coupling device further includes a packaging layer 5 , and the packaging layer 5 covers the protective layer 4 .

[0090] Only one packaging layer is required here. Compared with setting two packaging layers in the prior art, the structure is simpler, the manufacturing process is simpler, and the manufacturing cost is lower.

[0091] In an optional implementation of the present embodiment, the first bracket 2 further includes a first pin 21 and a first bending portion 22 , the first pin 21 is connected to the first bending portion 22 , and the first bending portion 22 is connected to the first die-bonding portion 23 .

[0092] Specifically, there is a bending angle between the first pin 21 and the first bending portion 22 , and there is a bending angle between the first crystal-bonding portion 23 and the first bending portion 22 .

[0093] In an optional implementation of the present embodiment, the second bracket 3 further includes a second pin 31 and a second bending portion 32 , the second pin 31 is connected to the second bending portion 32 , and the second bending portion 32 is connected to the second die-bonding portion 33 .

[0094] Specifically, there is a bending angle between the second pin 31 and the second bending portion 32 , and there is a bending angle between the second crystal-bonding portion 33 and the second bending portion 32 .

[0095] In an optional implementation of this embodiment, the encapsulation layer 5 covers the first bending portion 22 and the second bending portion 32 .

[0096] Specifically, the first pin 21 and the second pin 31 extend out of the packaging layer 5 .

[0097] In an optional implementation of the present embodiment, a plurality of through holes 6 are provided on the first crystal-bonding portion 23 , and the through holes 6 penetrate the first crystal-bonding portion 23 ; a plurality of through holes 6 are provided on the second crystal-bonding portion 33 , and the through holes 6 penetrate the second crystal-bonding portion 33 .

[0098] Specifically, Figure 4 As shown, the first die-bonding portion 23 is provided with two through holes 6 , which are respectively provided on both sides of the first chip 24 , and the second die-bonding portion 33 is provided with two through holes 6 , which are respectively provided on both sides of the second chip 34 .

[0099] Furthermore, the protection layer 4 fills the through hole 6 and extends to the back surface of the first die-bonding portion 23 and the back surface of the second die-bonding portion 33 .

[0100] Specifically, the number of through holes 6 provided in the first crystal-bonding portion 23 and the second crystal-bonding portion 33 is at least two. When through holes 6 are provided, the protection layer 4 extends to the back side of the corresponding crystal-bonding portion by filling the through holes 6 .

[0101] Furthermore, the diameter of the through hole 6 is 0.1 mm-1 mm, and can be a value among 0.1 mm, 0.5 mm, 1 mm, etc., and is set according to actual design requirements.

[0102] Here, a through hole is provided in the solid crystal part, and the protective layer can reduce the stress generated, improve the bonding strength between the protective layer and the bracket, and improve the stability and reliability of the device structure.

[0103] In an optional implementation of this embodiment, the material of the protective layer 4 is a silicone-based material, preferably silicone.

[0104] In an optional implementation of the present embodiment, the viscosity of the silicone material of the protective layer 4 is 10000-30000, which can be a value among 10000, 20000, 30000, etc., determined according to actual design requirements.

[0105] In an optional implementation of this embodiment, the protective layer 4 is a transparent silicone layer, or a red silicone layer doped with red pigment.

[0106] In an optional implementation of this embodiment, the material of the encapsulation layer 5 is epoxy resin doped with silicon dioxide powder.

[0107] Specifically, the doping ratio of the silicon dioxide powder in the epoxy resin of the encapsulation layer 5 is 70%-95%, which can be a value among 70%, 80%, 90%, 95%, etc., determined according to actual design requirements.

[0108] In an optional implementation of this embodiment, the encapsulation layer 5 is a white encapsulation layer.

[0109] Here, the material of the encapsulation layer is set to epoxy resin doped with silicon dioxide powder, which can effectively block and reflect the light emitted by the light-emitting chip, thereby improving the working efficiency and working accuracy of the optocoupler device.

[0110] In an optional implementation of this embodiment, the first bracket 2 is an IR bracket, and the second bracket 3 is a PT bracket, or the first bracket 2 is a PT bracket, and the second bracket 3 is an IR bracket.

[0111] In an optional implementation of this embodiment, the first chip 24 is a light-emitting chip and the second chip 34 is a photosensitive chip, or the first chip 24 is a photosensitive chip and the second chip 34 is a light-emitting chip.

[0112] Specifically, in this embodiment, the first bracket 2 is an IR bracket, the second bracket 3 is a PT bracket, the first chip 24 is a light-emitting chip, and the second chip 34 is a photosensitive chip.

[0113] In an optional implementation of this embodiment, the first bracket 2 and the second bracket 3 are made of copper, iron, or iron plated with copper.

[0114] In summary, the second embodiment of the utility model provides an optocoupler device, which is provided with a silicone protective layer that completely covers the first chip, the second chip and the corresponding welding wires, which can protect the first chip and the second chip at the same time, and improve the stability and reliability of the device; after the silicone protective layer is provided, only one packaging layer needs to be provided, the device structure is simpler, the manufacturing process is simpler, and the manufacturing cost is lower; a through hole is provided on the solid crystal part, so that the silicone protective layer fills the through hole, which effectively reduces the stress of the device structure, improves the bonding force between the silicone protective layer and the bracket, and has good stability and reliability.

[0115] The above is a detailed introduction to an optocoupler device provided in an embodiment of the present invention. Specific examples are used in this article to illustrate the principle and implementation method of the present invention. The description of the above embodiments is only used to help understand the method and core idea of ​​the present invention. At the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. An optical coupler device, characterized in that: The optical coupling device comprises a first bracket and a second bracket, the first bracket comprises a first crystal-bonding portion, the second bracket comprises a second crystal-bonding portion, and the first crystal-bonding portion and the second crystal-bonding portion are arranged opposite to each other; A first chip is bonded to the first bonding part, and a chip electrode of the first chip is connected to the first bonding part based on a first bonding wire; a second chip is bonded to the second bonding part, and a chip electrode of the second chip is connected to the second bonding part based on a second bonding wire; the first chip and the second chip are arranged opposite to each other; The optical coupling device further includes a protective layer, wherein the protective layer covers the first and second crystal-bonding parts, the first chip, the first bonding wire, the second chip, and the second bonding wire; The optical coupling device further includes a packaging layer, and the packaging layer covers the protective layer.

2. The optocoupler device according to claim 1, characterized in that: The first bracket further includes a first pin and a first bending portion, the first pin is connected to the first bending portion, and the first bending portion is connected to the first die-bonding portion; The second bracket further includes a second pin and a second bending portion, the second pin is connected to the second bending portion, and the second bending portion is connected to the second die-bonding portion; The packaging layer covers the first bending portion and the second bending portion.

3. The optical coupler device according to claim 1, characterized in that: The first crystal-fixing part is provided with a plurality of through holes, and the through holes penetrate the first crystal-fixing part; The second crystal-bonding portion is provided with a plurality of through holes, and the through holes penetrate through the second crystal-bonding portion.

4. The optical coupler device according to claim 3, characterized in that: The diameter of the through hole is 0.1 mm-1 mm.

5. The optical coupler device according to claim 3, characterized in that: The protection layer fills the through hole and extends to the back surface of the first die-bonding portion and the back surface of the second die-bonding portion.

6. The optocoupler device according to claim 1, wherein: The first solid crystal portion includes a first electrode and a second electrode, the first chip is bonded to the first electrode, the chip electrode of the first chip is connected to the second electrode based on the first welding wire, the first electrode is an irregular polygon, and the first chip and the second chip arranged on the first electrode are staggered and arranged relative to each other.

7. The optical coupler device according to claim 6, characterized in that: The first electrode is provided with a first protrusion, and the second electrode is provided with a second protrusion.

8. The optocoupler device according to claim 1, characterized in that: The material of the encapsulation layer is epoxy resin doped with silicon dioxide powder.

9. The optical coupler device according to claim 8, characterized in that: The material of the protective layer is a methyl silicon-based material.

10. The optocoupler device according to claim 1, characterized in that: The first chip is a light-emitting chip, and the second chip is a photosensitive chip; Or the first chip is a photosensitive chip, and the second chip is a light-emitting chip.

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