LED lamp bead support, LED lamp bead and display module

Abstract

The utility model discloses an LED lamp bead support, an LED lamp bead and a display module, the LED lamp bead support comprises a support body and pins, the support body comprises a bottom plate and a surrounding plate which are connected with each other, and a packaging cavity is defined between the bottom plate and the surrounding plate and used for packaging a light-emitting chip. The pins are connected with the bottom plate and extend to the packaging cavity so as to be electrically connected with the light-emitting chip. The projection of the coaming towards the bottom plate is larger than the edge of the bottom plate. When the support is applied to an LED lamp bead, the projection area, facing the bottom plate, of the surrounding plate is larger than the edge of the bottom plate, so that the surrounding plate can effectively cover the pins, the situation that the pins are exposed to the outer side of the support body can be effectively reduced or avoided, then the situation that solder paste is exposed to the outer side of the support body can be effectively reduced or avoided, and therefore the service life of the LED lamp bead is prolonged. When the liquid crystal composition is applied to LED lamp beads of a display screen, the contrast ratio of the display screen can be well ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of LEDs, and in particular to an LED lamp bead bracket, an LED lamp bead and a display module. Background Art

[0002] With the rapid development of economy, LED lamp beads have evolved from being used only for lighting or indication to LED display screens, which are used in brand promotion, corporate promotion and urban beautification.

[0003] In the related art, during the application of LED lamp beads, the pins of the LED lamp beads are usually soldered to the pads of the circuit board through solder paste. However, during the soldering process of LED lamp beads, tin creeping usually occurs. If the tin creeping problem is serious, a large area of ​​tin paste is exposed, and the tin paste is white. When applied to LED display screens, the large area of ​​exposed tin paste seriously affects the contrast of the LED display screen. Utility Model Content

[0004] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model proposes an LED lamp bead bracket, an LED lamp bead and a display module, wherein the LED lamp bead bracket can reduce the exposed area of ​​solder paste or avoid the exposed solder paste.

[0005] In a first aspect, an embodiment of the present application provides an LED lamp bead bracket, comprising:

[0006] The support body comprises a bottom plate and a surrounding plate connected to each other, wherein a packaging cavity is defined between the bottom plate and the surrounding plate for packaging the light-emitting chip;

[0007] A pin connected to the bottom plate and extending to the packaging cavity to be electrically connected to the light-emitting chip;

[0008] Wherein, the projection area of ​​the enclosure toward the base plate is larger than the edge of the base plate.

[0009] According to some embodiments of the present invention, from one end of the enclosure close to the bottom plate to the other end, at least a section of the outer side of the enclosure is gradually expanded relative to the bottom plate.

[0010] According to some embodiments of the present invention, the outer side of the enclosure plate extends outward at least 4um to 6um relative to the base plate.

[0011] According to some embodiments of the utility model, the pin includes an extension portion and a hook portion, the extension portion is connected to the base plate, and the hook portion is connected to an end of the extension portion away from the base plate; wherein, from one end close to the base plate to the other end, the extension portion is arranged to extend inwardly at an angle.

[0012] According to some embodiments of the present invention, the inward inclination angle of the extension portion is set between 3 degrees and 8 degrees.

[0013] According to some embodiments of the present invention, the hooking portion is extended in a direction inclined close to the bottom plate.

[0014] In a second aspect, an embodiment of the present application provides an LED lamp bead, comprising:

[0015] The above-mentioned LED lamp bead bracket;

[0016] The light emitting chip is packaged in the packaging cavity of the LED lamp bead bracket.

[0017] In a third aspect, an embodiment of the present application provides a display module, including:

[0018] A circuit board having a pad;

[0019] An ink layer is disposed on a side of the circuit board having the pad, and the circuit board and the ink layer are spaced apart by a set distance;

[0020] The above-mentioned LED lamp bead, the pin of the LED lamp bead is connected to the soldering pad using solder paste.

[0021] According to some embodiments of the present invention, the set distance is set between 30um and 40um.

[0022] According to some embodiments of the present invention, the ink layer is arranged higher than the pad, and the height difference is set between 23um-25um.

[0023] It can be seen from the above technical scheme that the embodiments of the present application have the following advantages: when applied to LED lamp beads, the projection area of ​​the enclosure toward the base plate is larger than the edge of the base plate. In this way, the enclosure can effectively cover the pins, thereby effectively reducing or avoiding the pins from being exposed to the outside of the bracket body, and further effectively reducing or avoiding the solder paste from being exposed to the outside of the bracket body. Therefore, when applied to LED lamp beads on a display screen, the contrast of the display screen can be better guaranteed. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a schematic diagram of the structure of the first LED lamp bead bracket according to an embodiment of the utility model;

[0025] Figure 2 This is a schematic diagram of the structure of a second LED lamp bead bracket according to an embodiment of the utility model;

[0026] Figure 3 This is a schematic diagram of the structure of a third LED lamp bead bracket according to an embodiment of the utility model;

[0027] Figure 4 The figure is a schematic diagram of the structure of a circuit board according to an embodiment of the utility model. DETAILED DESCRIPTION

[0028] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0029] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, upper, lower, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0030] In the description of the present utility model, "several" means more than one, "many" means more than two, "greater than", "less than", "exceed" etc. are understood to exclude the number itself, and "above", "below", "within" etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used to distinguish the technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0031] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0032] In the description of the utility model, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0033] The utility model is further described in detail below in conjunction with the accompanying drawings.

[0034] See also Figure 1, an LED lamp bead bracket 100 provided by an embodiment of the utility model includes a bracket body 110 and a pin 120, wherein the bracket body 110 includes a bottom plate 111 and a surrounding plate 112 connected to each other, and a packaging cavity 113 is defined between the bottom plate 111 and the surrounding plate 112 for packaging a light-emitting chip. The pin 120 is connected to the bottom plate 111 and extends to the packaging cavity 113 to be electrically connected to the light-emitting chip. The projection area of ​​the surrounding plate 112 toward the bottom plate 111 is larger than the edge of the bottom plate 111.

[0035] Among them, the pin 120 is usually connected to the edge of the bottom plate 111. When the pin 120 is soldered to the pad 210 through solder paste, the pin 120 is prone to tin climbing, resulting in a large area of ​​solder paste exposed outside the bracket body 110. When applied to a display screen, the contrast of the display screen is seriously affected.

[0036] In the present application, the projection area of ​​the enclosure 112 toward the base plate 111 is larger than the edge of the base plate 111. With this arrangement, the enclosure 112 can effectively cover the pins 120, thereby effectively reducing or avoiding the pins 120 being exposed to the outside of the bracket body 110, and further effectively reducing or avoiding the solder paste being exposed to the outside of the bracket body 110. Therefore, when applied to LED lamp beads in display screens, the contrast of the display screen can be better guaranteed.

[0037] In a possible embodiment, at least a section of the outer side of the enclosing plate 112 is gradually expanded from one end of the enclosing plate 112 close to the bottom plate 111 to the other end.

[0038] For example, refer to Figure 1 , the outer side of the enclosure 112 is expanded outward as a whole, so that the projection area of ​​the enclosure 112 toward the bottom plate 111 can cover the pins 120 on the bottom plate 111; or, refer to Figure 2 , a section of the outer side of the enclosing plate 112 close to the bottom plate 111 is gradually expanded outward, and another section of the outer side of the enclosing plate 112 remains unchanged, so that the projection area of ​​the enclosing plate 112 toward the bottom plate 111 can cover the pins 120 on the bottom plate 111; or, refer to Figure 3 , a section of the outer side of the enclosure 112 close to the bottom plate 111 remains unchanged, and the other section is gradually expanded outward, so that the projection area of ​​the enclosure 112 toward the bottom plate 111 can cover the pins 120 on the bottom plate 111. Of course, other structural forms are not excluded.

[0039] Further, the outer side of the enclosure 112 is extended outward by at least 4um to 6um, for example, the enclosure 112 is extended outward by 4um, 5um, 6um, etc. relative to the bottom plate 111. It can be understood that the outer side of the enclosure 112 is extended outward by at least 4um. In this way, the enclosure 112 can effectively block the pins 120, thereby effectively reducing or preventing the solder paste from being exposed to the outer side of the bracket body 110. The outer side of the enclosure 112 is extended outward by at least 6um. When applied to the circuit board 200, the enclosure 112 occupies less space on the circuit board 200, thereby ensuring that a sufficient number of LED lamp beads can be densely installed on the circuit board 200.

[0040] In other possible embodiments, annular protrusions are disposed around the surrounding plate 112 , and a projection area of ​​the surrounding plate 112 toward the bottom plate 111 may be increased, so that the surrounding plate 112 can cover the pins 120 .

[0041] In some embodiments, reference Figure 1 and Figure 4 The pin 120 includes an extension portion 121 and a hook portion 122, the extension portion 121 is connected to the bottom plate 111, and the hook portion 122 is connected to one end of the extension portion 121 away from the bottom plate 111; wherein, from one end close to the bottom plate 111 to the other end, the extension portion 121 is arranged to extend inwardly at an angle.

[0042] Commonly, the extension portion 121 is usually connected to the edge of the bottom plate 111 and is set to expand outward. In the present application, the extension portion 121 is set to shrink inward. In this way, the bottom plate 111 and the enclosure 112 can effectively reduce the exposure of solder paste to the outside of the bracket body 110. At the same time, since the bottom plate 111 and the enclosure 112 have a better covering effect on the pins 120, the enclosure 112 does not need to expand outward to a larger size during design. For example, it only needs to expand outward by between 4um and 6um to ensure the covering effect on the pins 120. On the premise of preventing the solder paste from being exposed to the outside of the bracket body 110, it is ensured that the enclosure 112 will not expand outward excessively, thereby ensuring that the size of the LED lamp beads will not be too large, and further ensuring that the circuit board 200 can densely arrange the LED lamp beads.

[0043] In addition, by providing a hook portion 122 at the end of the extension portion 121, when the pin 120 is welded to the soldering pad 210, the hook portion 122 can be firmly connected to the soldering pad 210 using solder paste, thereby ensuring that the LED lamp bead bracket 100 is firmly connected to the circuit board 200. More specifically, the LED lamp bead is firmly fixed on the circuit board 200, thereby ensuring the service life of the display module.

[0044] Further, the inward inclination angle of the extension 121 is set between 3 degrees and 8 degrees, for example, the extension 121 is inwardly inclined at 3 degrees, 4 degrees, 5 degrees, 6 degrees, 7 degrees, 8 degrees, etc. It can be understood that the inward inclination angle of the extension 121 is set at least 3 degrees, and the inclination angle of the extension 121 is large enough. In this way, when the pin 120 is connected to the pad 210 using solder paste, although the pin 120 has the problem of solder creeping, the enclosure 112 can better cover the diffused solder paste, thereby effectively reducing the solder paste exposed to the outside of the bracket body 110. In addition, the inward inclination angle of the extension 121 is less than or equal to 8, and the inclination angle of the extension 121 is small enough. In this way, the pin 120 is substantially vertical to the bottom plate 111, so that the pin 120 can be conveniently connected to the pad 210 using solder paste.

[0045] Furthermore, the hooking portion 122 is extended obliquely toward the bottom plate 111. The hooking portion 122 adopts such a structural form, which is equivalent to a barb structure, so that the hooking portion 122 can be firmly connected to the pad 210 by solder paste, thereby ensuring that the LED lamp bead can be firmly connected to the circuit board 200.

[0046] The present application discloses an LED lamp bead, comprising the above-mentioned LED lamp bead bracket 100 and a light-emitting chip, wherein the light-emitting chip is packaged in a packaging cavity of the LED lamp bead bracket.

[0047] It is understandable that the LED lamp beads adopt the above-mentioned LED lamp bead bracket 100. When the LED lamp bead bracket 100 is designed, the projection area of ​​the enclosure 112 toward the bottom plate 111 is larger than the edge of the bottom plate 111. In this way, the enclosure 112 can effectively cover the pins 120, thereby effectively reducing or avoiding the pins 120 from being exposed to the outside of the bracket body 110, and further effectively reducing or avoiding the solder paste from being exposed to the outside of the bracket body 110. Therefore, when the LED lamp beads of the present application are applied to the display screen, the contrast of the display screen can be better guaranteed.

[0048] The present application discloses a display module, referring to Figure 1 and Figure 4 , including a circuit board 200, an ink layer 300 and the above-mentioned circuit board 200, wherein the circuit board 200 has a soldering pad 210, the ink layer 300 is arranged on a side of the circuit board 200 having the soldering pad 210, the circuit board 200 and the ink layer 300 are arranged at a set distance, and the pin 120 of the LED lamp bead bracket 100 is connected to the soldering pad 210 using solder paste.

[0049] Specifically, the ink layer 300 and the pad 210 are arranged at a set distance, and the set distance is strictly controlled. The gap between the ink layer 300 and the pad 210 can absorb the ink layer 300 overflowing from the pad 210, so that the ink layer 300 limits the diffusion of the solder paste, thereby ensuring that the solder paste can be evenly distributed on the pad 210 and around the pad 210. Therefore, when the LED lamp beads are soldered with the pad 210 using the solder paste, the solder paste is evenly distributed on the pad 210 and around the pad 210, which can effectively reduce the migration of the solder paste in one direction, thereby ensuring that the LED lamp beads will not be too much offset during welding, and further ensuring that the LED lamp beads are arranged more neatly. At the same time, during the welding process of the LED lamp beads, the gap between the ink layer 300 and the pad 210 absorbs the overflowed solder paste and has a certain limiting effect on the diffusion of the solder paste, thereby preventing the solder paste from over-migrating, thereby ensuring that the LED lamp beads are not prone to over-migrating, thereby further ensuring that the LED lamp beads are arranged more neatly.

[0050] In addition, during the soldering process of the pin 120 of the LED lamp bead, the solder paste is prone to diffusion, resulting in a large range of solder paste exposed outside the LED lamp bead, which seriously affects the contrast of the display screen when applied to the display screen. In the present application, the ink layer 300 and the pad 210 are arranged at intervals, and the gap between the ink layer 300 and the pad 210 can effectively absorb the diffused solder paste, thereby preventing the solder paste from excessively diffusing outward, so that the contrast of the display screen will not be greatly affected when applied to the display screen.

[0051] Further, the set distance is set between 30um and 40um, for example, the set distance is set at 30um, 33um, 35um, 38um, 40um, etc.

[0052] It can be understood that the distance between the pad 210 and the ink layer 300 is set to at least 30um, so that there is a large enough gap between the two to accommodate the overflowed solder paste; and the spacing distance between the pad 210 and the ink layer 300 is set to be less than or equal to 40um, so that there is a small enough gap between the two, and the ink layer 300 can cover a large area of ​​the surface of the circuit board 200. When applied to a display screen, the ink layer 300 can preferably keep the display screen in a black screen state, and when the display screen is in an open state, the ink layer 300 can absorb scattered light to avoid the display screen having a strong glare effect when used, ensuring the comfort of the display screen; of course, the ink layer 300 also has other effects, which will not be described in detail.

[0053] In addition, the distance is set to at least 30um. In the subsequent solder paste printing process, even if there is a problem of printing deviation, this distance can prevent the solder paste from falling on the surface of the ink layer 300, thereby improving the fault tolerance rate.

[0054] In some embodiments, the ink layer 300 is disposed above the pad 210 .

[0055] It is understandable that the height of the ink layer 300 is higher than the pad 210. With this arrangement, when the solder paste is printed on the surface of the pad 210 or when the LED lamp beads are soldered, the solder paste is not easy to diffuse to the front of the ink layer 300, thereby ensuring the anti-dizziness effect of the ink layer 300.

[0056] In addition, the ink layer 300 is arranged higher than the pad 210, and the edge of the pad 210 is interfered by the ink layer 300, which easily causes the solder paste to fail to be printed on the edge area of ​​the pad 210. Based on the above problems, the ink layer 300 is arranged at a distance from the pad 210, so that the interference of the ink layer 300 on the printing head can be reduced, thereby ensuring that the printing head can print the solder paste on the edge area of ​​the pad 210 better.

[0057] In a further embodiment, the height difference between the ink layer 300 and the pad 210 is set between 23um and 25um, for example, the height difference is set at 23um, 24um, 25um, etc.

[0058] In a specific application process, before the pin 120 is connected to the pad 210, the printing device usually uses a printing screen to evenly apply the solder paste to the surface of the pad 210. Specifically, the height difference between the ink layer 300 and the pad 210 is H1, and the height of the printing screen is H2, H1>H2, wherein the thickness of the printing screen is generally 20um, and the thickness of the ink layer 300 above the pad 210 is theoretically 3um to 5um greater than the thickness of the printing screen, therefore, the thickness of the ink above the pad 210 needs to be controlled between 23um and 25um. It is understandable that the printing head squeezes the area of ​​the printing screen corresponding to the pad 210, and this part of the printing screen deforms toward the pad 210. When the printing screen is close to or in contact with the pad 210, the printing head can apply the solder paste to the surface of the pad 210 through the printing screen. At this time, the ink layer 300 is higher than the printing screen in the corresponding area of ​​the pad 210 . With this configuration, the ink layer 300 has a better limiting effect on the solder paste, so as to limit the solder paste from spreading to the front side of the ink layer 300 .

[0059] In practical applications, the LED display screen adopts the above-mentioned display module. Among them, in the design of the circuit board 200, the ink layer 300 and the pad 210 are set at a set distance, and the set distance is strictly controlled. The gap between the ink layer 300 and the pad 210 can absorb the ink layer 300 overflowing from the pad 210. Therefore, the ink layer 300 limits the diffusion of the solder paste, thereby ensuring that the solder paste can be evenly distributed on the pad 210 and around the pad 210. Therefore, when the LED lamp beads are soldered with the pad 210 using solder paste, the solder paste is evenly distributed on the pad 210 and around the pad 210, which can effectively reduce the migration of the solder paste in one direction, thereby ensuring that the LED lamp beads will not be too much offset during soldering, and further ensuring that the LED lamp beads are arranged more neatly. In the design of the LED lamp beads, the projection area of ​​the enclosure 112 toward the bottom plate 111 is larger than the edge of the bottom plate 111. In this way, the enclosure 112 can effectively cover the pins 120, thereby effectively reducing or avoiding the pins 120 being exposed outside the bracket body 110, and further effectively reducing or avoiding the solder paste being exposed outside the bracket body 110. Therefore, the LED display screen adopts the above-mentioned structural form in the circuit board 200 and the LED lamp beads, thereby ensuring that the LED lamp beads can be neatly arranged and reducing the exposed solder paste, thereby ensuring the contrast of the LED display screen.

[0060] The technical means disclosed in the solution of the utility model are not limited to the technical means disclosed in the above-mentioned implementation mode, but also include technical solutions composed of any combination of the above technical features. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the utility model, and these improvements and modifications are also regarded as the protection scope of the utility model.

Claims

1. An LED lamp bead bracket, characterized in that: include: The support body comprises a bottom plate and a surrounding plate connected to each other, wherein a packaging cavity is defined between the bottom plate and the surrounding plate for packaging the light-emitting chip; A pin connected to the bottom plate and extending to the packaging cavity to be electrically connected to the light-emitting chip; Wherein, the projection area of ​​the enclosure toward the base plate is larger than the edge of the base plate.

2. The LED lamp bead bracket according to claim 1, characterized in that: From one end of the enclosure close to the bottom plate to the other end, at least one section of the outer side of the enclosure is gradually expanded relative to the bottom plate.

3. The LED lamp bead bracket according to claim 2, characterized in that: The outer side of the enclosure plate extends outward at least 4um to 6um relative to the base plate.

4. An LED lamp bead bracket according to any one of claims 1 to 3, characterized in that: The pin includes an extension portion and a hooking portion, wherein the extension portion is connected to the base plate, and the hooking portion is connected to an end of the extension portion away from the base plate; wherein the extension portion is arranged to extend inwardly at an angle from one end close to the base plate to the other end.

5. The LED lamp bead bracket according to claim 4, characterized in that: The inward inclination angle of the extension portion is set between 3 degrees and 8 degrees.

6. The LED lamp bead bracket according to claim 4, characterized in that: The hooking portion is arranged to extend obliquely in a direction close to the bottom plate.

7. An LED lamp bead, characterized in that: include: The LED lamp bead bracket according to any one of claims 1 to 6; The light emitting chip is packaged in the packaging cavity of the LED lamp bead bracket.

8. A display module, characterized in that: include: A circuit board having a pad; An ink layer is disposed on a side of the circuit board having the pad, and the pad and the ink layer are spaced apart by a set distance; The LED lamp bead as described in claim 7, wherein the pins of the LED lamp bead are connected to the pads using solder paste.

9. The display module according to claim 8, characterized in that: The set distance is set between 30um and 40um.

10. A display module according to any one of claims 8 or 9, characterized in that: The ink layer is arranged higher than the pad, and the height difference is arranged between 23um and 25um.

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