Surface-treated copper foil, copper-clad plate and circuit board

Abstract

The utility model provides a surface treatment copper foil, copper clad laminate and circuit board, the surface treatment copper foil comprises a copper foil matrix and a surface polarization layer, the surface polarization layer comprises a plurality of polarization particles, the plurality of polarization particles are distributed on the surface of the copper foil matrix at intervals, the plurality of polarized particles are bent along a preset direction to form a whisker-shaped part, and the bending directions of two adjacent polarized particles are the same or opposite. According to the surface-treated copper foil, the plurality of polarized particles are bent along the preset direction to form the whisker-shaped parts, so that the bonding force between the resin and the surface of the copper foil substrate is increased.

Description

Technical Field

[0001] The utility model relates to the technical field of copper foil, in particular to a surface treated copper foil, a copper clad plate and a circuit board. Background Art

[0002] In recent years, there has been an increase in high-frequency devices such as servers / routers and smartphones that exceed 1GHz, and the copper foil that actually circulates high-frequency signals also requires excellent transmission characteristics. At the same time, the peel strength, which is an indicator of reliability, is still required to be above a certain level, and it is required to take into account both transmission characteristics and peel strength at a high level. Usually, in order to improve the adhesion between the resin substrate and the copper foil surface, a surface polarization layer is formed on the copper foil surface by electroplating, etching, etc., to obtain a physical bonding effect with the resin substrate, thereby improving the adhesion.

[0003] The rough surface of the copper foil after the surface polarization layer is pressed with epoxy resin, and the copper foil tensile force (copper foil peeling force) can reach 0.0858N / mm. However, when matched with fluororesin series, hydrocarbon series, ABS series, polyimide resin series, modified hydrocarbon resin series, and modified polyimide resin series, the tensile force is less than 0.0858N / mm, which cannot meet the production standards. Although the copper teeth formed by the copper foil after the surface polarization layer are rough and have good adhesion, they cannot be used in high-frequency and high-speed products, and the insertion loss is poor. Utility Model Content

[0004] Aiming at the problem in the prior art that the rough surface of copper foil has poor adhesion after being combined with resin and affects signal transmission, the utility model provides a surface treated copper foil, a copper clad laminate and a circuit board.

[0005] The utility model provides a surface-treated copper foil, comprising a copper foil substrate and a surface polarization layer, wherein the surface polarization layer comprises a plurality of polarized particles, the plurality of polarized particles are distributed at intervals on the surface of the copper foil substrate, the plurality of polarized particles are bent along a preset direction to form a tentacle-like portion, and the bending directions of two adjacent polarized particles are the same or opposite.

[0006] Optionally, the distance between the projection of the end of the tentacle-shaped portion in the direction of the surface of the copper foil substrate and the root of the polarized particle is 0.01-5.5 μm.

[0007] Optionally, a side of the tentacle-like portion facing away from the surface of the copper foil substrate is parallel to the surface of the copper foil substrate, or a tangent line of a side of the tentacle-like portion facing away from the surface of the copper foil substrate is parallel to the surface of the copper foil substrate.

[0008] Optionally, the end of the tentacle-shaped portion is a smooth surface.

[0009] Optionally, the distribution density of the polarized particles is 50 to 1000 particles per square micron.

[0010] Optionally, the heights of the plurality of polarized particles are the same.

[0011] Optionally, the distance between two adjacent polarized particles is 0.01-5.5 μm.

[0012] On the other hand, the utility model also provides a copper clad laminate, comprising any one of the surface treated copper foils described above.

[0013] On the other hand, the utility model further provides a circuit board, comprising the copper clad board as described above.

[0014] In the utility model, a plurality of polarized particles are bent along a preset direction to form tentacle-like portions, and the bending directions of two adjacent polarized particles are the same or opposite, so that a space for partially wrapping the resin is formed between the two adjacent polarized particles, which facilitates the dense filling and die-casting of the resin, increases the adhesion between the resin and the surface of the copper foil substrate, and further ensures that the resin and the surface of the copper foil substrate have a high peeling force under high and low temperature conditions. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic structural diagram of a surface-treated copper foil provided by an embodiment of the utility model;

[0016] Figure 2 It is a schematic structural diagram of a surface-treated copper foil provided by another embodiment of the utility model;

[0017] Figure 3 It is a schematic structural diagram of a surface-treated copper foil provided by another embodiment of the utility model;

[0018] Figure 4 This is an electron microscope image of a surface-treated copper foil provided by an embodiment of the utility model.

[0019] The reference numerals in the drawings of the specification are as follows:

[0020] 1. Copper foil substrate; 2. Polarized particles; 21. Tentacle-like portion. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0022] In order to illustrate the technical solution of the present utility model, specific embodiments are provided below for illustration.

[0023] like Figure 1-Figure 3 As shown, a surface-treated copper foil of one embodiment of the utility model includes a copper foil substrate 1 and a surface polarization layer, wherein the surface polarization layer includes a plurality of polarized particles 2, and the plurality of polarized particles 2 are distributed at intervals on the surface of the copper foil substrate 1, and the plurality of polarized particles 2 are bent along a preset direction to form a tentacle-like portion 21, and the bending directions of two adjacent polarized particles 2 are the same or opposite.

[0024] It should be noted here that Figure 1 to Figure 3 The polarized particles 2 shown are schematic diagrams of polarized ions 2 located in the same row or column on the surface of the copper foil substrate 1 .

[0025] In the embodiment of the utility model, a plurality of polarized particles 2 are bent along a preset direction to form tentacle-like portions 21, and the bending directions of two adjacent polarized particles 2 are the same or opposite, so that a space for partially wrapping the resin is formed between the two adjacent polarized particles 2, which facilitates the dense filling and die-casting of the resin, increases the adhesion between the resin and the surface of the copper foil substrate 1, and further ensures that the resin and the surface of the copper foil substrate 1 have a higher peeling force under high and low temperature conditions.

[0026] In some embodiments of the present invention, the distance between the projection of the end of the tentacle-like portion 21 in the surface direction of the copper foil substrate 1 and the root of the polarized particle 2 is 0.01 to 5.5 μm, ensuring that the tentacle-like portion 21 can partially wrap the resin on the surface of the copper foil substrate 1 and increase the adhesion between the resin and the copper foil substrate 1.

[0027] like Figure 1-Figure 3 As shown, in some embodiments of the present invention, the side of the tentacle-like portion 21 facing away from the surface of the copper foil substrate 1 is parallel to the surface of the copper foil substrate 1, or the tangent of the side of the tentacle-like portion 21 facing away from the surface of the copper foil substrate 1 is parallel to the surface of the copper foil substrate 1, so as to avoid the polarized particles protruding from the surface polarization layer due to their shape, thereby ensuring that the signal insertion loss of the copper foil is not affected.

[0028] like Figure 1-Figure 3 As shown, in some embodiments of the present invention, the end of the tentacle-like portion 21 is a rounded surface, so that the polarized particles 2 have no edges and corners, avoiding affecting the signal of the copper foil, so that the copper foil can maintain a fast transmission signal of 300G.

[0029] In some embodiments of the present invention, the distribution density of the polarized particles 2 is 50 to 1000 particles per square micron. By controlling the distribution of the polarized particles 2, the consistency of the bonding force between the copper foil and the resin is ensured.

[0030] like Figure 1-Figure 3As shown, in some embodiments of the present invention, the heights of the plurality of polarized particles 2 are the same. The polarized particles 2 have the same height and the same bending direction, which can ensure the consistency of the electrical and physical properties of the copper foil.

[0031] Furthermore, the height of the tentacle-like portion 21 is 0.2 to 2.5 μm.

[0032] In some embodiments of the present invention, the distance between two adjacent polarized particles 2 is 0.01-5.5 μm, ensuring that the two adjacent polarized particles 2 can partially wrap the resin on the surface of the copper foil substrate 1 and increase the adhesion between the resin and the copper foil substrate 1 .

[0033] Preferably, the distance between the roots of two adjacent polarized particles 2 is 0.1-0.2 μm.

[0034] Specifically, the preparation process of the surface polarization layer in the copper foil is:

[0035] placing the raw foil into a polarization solution for polarization treatment;

[0036] During the polarization treatment, electromagnetic oscillation waves are applied to the green foil in the polarization liquid, so that curved polarized particles are formed on the surface of the green foil;

[0037] The raw foil after polarization treatment is sequentially cured, blackened, galvanized, anti-oxidized, sprayed with coupling agent and dried to obtain copper foil.

[0038] The polarization treatment includes a first polarization treatment, a second polarization treatment and a third polarization treatment;

[0039] The first polarization treatment is to place the raw foil in a first polarization solution at 33-60°C and a current density of 25-35A / dm 2 , Second stage current density 8-15A / m 2 Electroplating is carried out under the following conditions;

[0040] The second polarization treatment is to place the raw foil after the first polarization treatment into a second polarization solution at 25-32°C and a current density of 30-50A / dm 2 , Second stage current density 6-12A / m 2 Electroplating is carried out under the following conditions;

[0041] The third polarization treatment is to place the raw foil after the second polarization treatment into the third polarization solution at 33-60°C and a current density of 30-55A / dm 2 , Second stage current density 8-18A / m 2 Electroplating was performed under the following conditions.

[0042] On the other hand, an embodiment of the present invention further provides a copper clad laminate, comprising any one of the surface-treated copper foils described above.

[0043] On the other hand, an embodiment of the present invention further provides a circuit board, comprising the copper clad board as described above.

[0044] The above embodiments are only used to illustrate the technical solutions of the utility model, rather than to limit them. Although the utility model is described in detail with reference to the above embodiments, a person skilled in the art should understand that the technical solutions described in the above embodiments can still be modified, or the technical features thereof can be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the utility model, and should be included in the protection scope of the utility model.

Claims

1. A surface treated copper foil, characterized in that: It includes a copper foil substrate and a surface polarization layer, wherein the surface polarization layer includes a plurality of polarized particles, and the plurality of polarized particles are distributed on the surface of the copper foil substrate at intervals, and the plurality of polarized particles are bent along a preset direction to form tentacle-like portions, and the bending directions of two adjacent polarized particles are the same or opposite.

2. The surface-treated copper foil according to claim 1, characterized in that: The distance between the projection of the end of the tentacle-shaped portion in the direction of the surface of the copper foil substrate and the root of the polarized particle is 0.01 to 5.5 μm.

3. The surface treated copper foil according to claim 2, characterized in that: The side of the tentacle-like portion facing away from the copper foil substrate surface is parallel to the copper foil substrate surface, or the tangent line of the side of the tentacle-like portion facing away from the copper foil substrate surface is parallel to the copper foil substrate surface.

4. The surface-treated copper foil according to claim 1, characterized in that: The end of the tentacle-shaped portion is a smooth surface.

5. The surface-treated copper foil according to claim 1, characterized in that: The distribution density of the polarized particles is 50 to 1000 particles per square micron.

6. The surface-treated copper foil according to claim 1, characterized in that: The heights of the plurality of polarizable particles are the same.

7. The surface-treated copper foil according to claim 1, characterized in that: The distance between two adjacent polarized particles is 0.01-5.5 μm.

8. A copper clad laminate, characterized in that: The surface-treated copper foil comprises the surface-treated copper foil according to any one of claims 1 to 7.

9. A circuit board, characterized in that: Including the copper clad laminate as described in claim 8.

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