I-shaped heat conduction device
By designing a working thermal conductivity device, using a symmetrical radiator structure and an aluminum substrate to connect LEDs, the problem of untimely heat dissipation of existing LED lamps is solved, and the effective heat dissipation and normal operation of components are achieved.
Patent Information
- Application Number
- CN202421739574.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-22
- Publication Date
- 2025-05-16
- Estimated Expiration
- 2034-07-22
AI Technical Summary
Due to structural design problems in existing LED lamps, the connection surface between the LED lamps and the power supply is large, which makes heat unable to be dissipated in time, resulting in excessive temperature and the lamp components may work abnormally or fail.
A working-type thermal conductivity device is designed, using the left radiator and the right radiator to set up a symmetrical setting to form an I-shaped radiator structure, the power supply is fixed to the radiator, the aluminum substrate is connected to the LED, and the heat dissipation effect is enhanced through the heat sink and the baffle.
It reduces the heat conduction area, reduces heat interference, ensures that heat can be dissipated in time, avoids excessive temperature, ensures that LED lamp components work normally, and improves reliability and application prospects.
Smart Images

Figure CN222881121U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of LED lamps, in particular to an industrial-type heat conduction device. Background Art
[0002] LED lamps are widely used for lighting and supplementary lighting in various types of places. They are also suitable for lighting plants. Some plants only need LEDs with different lamp beads in areas where sunlight is not needed to simulate a spectrum suitable for plant growth, so that they can quickly grow, bloom, and bear fruit. They are not affected by seasonal factors and can be planted all year round. At present, due to structural design problems, the connection surface between LED lamps and power supplies is large. When the lamp is in use, both the LED and the power supply generate heat, which interfere with each other, and the heat cannot be dissipated outward in time, resulting in excessive temperature, and the lamp components will work abnormally or fail. Based on this, it is particularly necessary to design a new type of heat conduction device. Utility Model Content
[0003] In view of the deficiencies in the prior art, the purpose of the utility model is to provide an I-type heat conduction device with a simple structure, reasonable design, reduced heat conduction area, reduced heat interference, able to dissipate heat in a timely manner, ensure the normal operation of components, strong practicality, and easy to promote and use.
[0004] In order to achieve the above-mentioned purpose, the utility model is implemented through the following technical scheme: an I-shaped heat conduction device, including a left radiator, a right radiator, a power supply, a cover plate, an aluminum substrate, an LED, a radiator baffle and a dimming knob. The left radiator and the right radiator are symmetrically arranged to form an I-shaped radiator structure. A power supply is placed at the connection between the left radiator and the right radiator, a cover plate is installed on the upper part of the power supply, the power supply is connected to the aluminum substrate through a power cord, the aluminum substrate is fixedly installed on the bottom of the left radiator and the right radiator by screws, and the bottom of the aluminum substrate is connected to the LED; radiator baffles are installed on the sides of the left radiator and the right radiator by screws, and a dimming knob for adjusting the brightness of the light source is installed in the middle of the radiator baffle.
[0005] Preferably, the left radiator and the right radiator are respectively provided with left radiating fins and right radiating fins, and the left radiating fins and the right radiating fins are evenly spaced and arranged on their respective radiators to improve the heat dissipation effect.
[0006] Preferably, one end of the power cord is connected to the power supply, and the other end of the power cord passes through the left radiator and is connected to the aluminum substrate. A wire plug for protecting the wires is provided at the connection between the power cord and the left radiator, and a plastic wire cover is provided at the connection between the power cord and the aluminum substrate.
[0007] The beneficial effects of the utility model are as follows: the device adopts an I-type structure, which can reduce the heat conduction area, reduce the heat interference between the LED lamp and the power supply, dissipate heat in time, ensure the normal operation of the lamp components, have high reliability, and have broad application prospects. BRIEF DESCRIPTION OF THE DRAWINGS
[0008] The utility model is described in detail below with reference to the accompanying drawings and specific implementation methods;
[0009] Figure 1 This is a schematic diagram of the installation of the left radiator and the right radiator of the utility model;
[0010] Figure 2 It is a structural schematic diagram of the utility model;
[0011] Figure 3 for Figure 2 Top view of the . DETAILED DESCRIPTION
[0012] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.
[0013] Reference Figure 1-3 The present specific implementation adopts the following technical scheme: an I-shaped heat conduction device, comprising a left radiator 1, a right radiator 2, a power supply 3, a cover plate 4, an aluminum substrate 5, an LED 6, a radiator baffle 7 and a dimming knob 8. The left radiator 1 and the right radiator 2 are symmetrically arranged to form an I-shaped radiator structure. The power supply 3 is placed at the connection between the left radiator 1 and the right radiator 2. The cover plate 4 is installed on the upper part of the power supply 3. The power supply 3 is connected to the aluminum substrate 5 through a power line 9. The aluminum substrate 5 is fixedly installed on the bottom of the left radiator 1 and the right radiator 2 by screws 10, and the bottom of the aluminum substrate 5 is connected to the LED 6; the radiator baffle 7 is installed on the side of the left radiator 1 and the right radiator 2 by screws 10, and the dimming knob 8 for adjusting the brightness of the light source is installed in the middle of the radiator baffle 7.
[0014] It is worth noting that one end of the power cord 9 is connected to the power source 3, and the other end of the power cord 9 passes through the left radiator 1 and is connected to the aluminum substrate 5. A wire plug 13 for protecting the wires is provided at the connection between the power cord 9 and the left radiator 1, and a plastic wire cover 14 is provided at the connection between the power cord 9 and the aluminum substrate 5.
[0015] The heat conduction device of this specific embodiment adopts an I-type structure. The left radiator 1 and the right radiator 2 of the device are symmetrical. The power supply 3 is fixed on the left radiator 1 and the right radiator 2. The left radiator 1 and the right radiator 2 are respectively provided with a left radiator 11 and a right radiator 12. The left radiator 11 and the right radiator 12 are evenly spaced and arranged on the corresponding radiators to ensure the heat dissipation effect. After the device is powered on, the power supply 3 supplies power to the aluminum substrate 5, and the electricity is conducted to the LED 6 through the aluminum substrate 5, so that the LED lamp emits light. In this process, the power supply 3 and the LED 6 both generate heat, and the generated heat is dissipated through the left and right radiator bodies and the left radiator 11 and the right radiator 12.
[0016] The technical advantages of this specific implementation are: ① reducing the connection surface between the LED and the power supply, reducing the area of heat conduction, so that the heat generated by the power supply and the LED do not interfere with each other, and other parts will not be disturbed by excessive heat.
[0017] ② Ensure that the generated heat can be dissipated outwards reasonably, so as not to cause the temperature of the device to be too high, so that the components can work normally and will not fail.
[0018] ③ The use of a symmetrical radiator structure can reduce mold opening costs, lower production costs, and has broad market application prospects.
[0019] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.
Claims
1. A heat conducting device of an industrial type, characterized in that: The invention comprises a left radiator (1), a right radiator (2), a power source (3), a cover plate (4), an aluminum substrate (5), an LED (6), a radiator baffle (7) and a dimming knob (8). The left radiator (1) and the right radiator (2) are symmetrically arranged to form an I-shaped radiator structure. The power source (3) is placed at the connection between the left radiator (1) and the right radiator (2). The cover plate (4) is installed on the upper part of the power source (3). The power source (3) is connected to the aluminum substrate (5) through a power line (9). The aluminum substrate (5) is fixedly installed on the bottom of the left radiator (1) and the right radiator (2) through screws (10). The bottom of the aluminum substrate (5) is connected to the LED (6). The radiator baffle (7) is installed on the side of the left radiator (1) and the right radiator (2) through screws (10). The dimming knob (8) for adjusting the brightness of the light source is installed in the middle of the radiator baffle (7).
2. A heat conducting device according to claim 1, characterized in that: The left radiator (1) and the right radiator (2) are respectively provided with a left radiator fin (11) and a right radiator fin (12); the left radiator fin (11) and the right radiator fin (12) are evenly spaced and arranged on the respective radiators.
3. A heat conducting device according to claim 1, characterized in that: One end of the power line (9) is connected to the power source (3), and the other end of the power line (9) passes through the left radiator (1) and is connected to the aluminum substrate (5). A wire protection plug (13) for protecting the wires is provided at the connection between the power line (9) and the left radiator (1).
4. The heat conducting device of claim 1, characterized in that: A plastic wire cover (14) is provided at the connection between the power wire (9) and the aluminum substrate (5).