Semiconductor rotation positioning module

Abstract

The utility model discloses a semiconductor rotation positioning module, which comprises a bottom plate, a servo motor is embedded and fixed in the center of the top of the bottom plate, the top output end of the servo motor is fixedly connected with a turntable, a semiconductor chip is erected on the turntable, the outer side of the turntable is rotatably connected with an annular frame, and the annular frame is fixedly connected with the bottom plate. A plurality of electric push rods are symmetrically fixed to the outer side of the ring frame in a cross mode, pressure induction push plates are fixedly connected to the output ends of the opposite sides of the electric push rods, the adjacent pressure induction push plates are erected in a right-angle mode, and the tops of the electric push rods are electrically matched with driving control units; the driving control units are electrically connected with pressure induction push plates correspondingly connected with electric push rods of the driving control units, a plurality of Y-shaped supports are fixed to the top of the outer side of the base in a cross symmetry mode, the top ends of the Y-shaped supports are fixedly connected with the electric push rods and an annular frame correspondingly, the whole feeding mode that positioning is conducted firstly, then picking is conducted, and then transferring is conducted is adopted, so that the feeding cost is reduced; and a stable feeding route is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to a semiconductor rotation positioning module. Background Art

[0002] Semiconductors refer to materials with electrical conductivity between conductors and insulators at room temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, high-power power conversion and other fields. For example, semiconductor chips that can realize certain functions are made by etching and wiring on semiconductor sheets. In the process of sorting, testing and packaging of semiconductor chips, in order to ensure that they are neatly arranged or the test points are accurate, a clamping and positioning mechanism is often needed to accurately place them in the packaging area or processing point to facilitate subsequent packaging or testing. The existing transfer of chips mostly adopts cross-claw clamping or nozzle adsorption, but the chips are mostly placed freely before transfer. When clamping or adsorbing them, such mechanisms need to ensure that they are located directly above the chip. This requires high-precision positioning and recognition equipment to cooperate with image acquisition equipment to meet the requirements, which is costly, and the feeding route will change with the change of the chip placement position, which also requires algorithm support, and the route is unstable. In addition, during testing, the distribution of various components on the chip is different, so the orientation when placed at the test point also needs to be unified. The existing clamping mechanism can only position and clamp them, and cannot change their orientation, which affects the test efficiency. Utility Model Content

[0003] The purpose of the utility model is to provide a semiconductor rotation positioning module, which adopts a loading method of first positioning, then picking up, and then transferring, so as to reduce the loading cost, ensure the stability of the loading route, improve the loading quality, and can change and adjust the orientation of the workpiece, so as to facilitate the rapid positioning and loading of some directional workpieces and improve the loading efficiency.

[0004] To achieve the above-mentioned purpose, a semiconductor rotation positioning module is provided, comprising a bottom plate, a base is fixedly connected to the top left side of the bottom plate, a servo motor is embedded and fixed at the top center of the base, a turntable is fixedly connected to the top output end of the servo motor, a semiconductor chip is mounted on the turntable, a ring frame is rotatably connected to the outer side of the turntable, a plurality of electric push rods are cross-symmetrically fixed to the outer side of the ring frame, the output ends of the opposite sides of the electric push rods are fixedly connected to pressure-sensitive push plates, the pressure-sensitive push plates are adjacent to each other and are arranged at right angles, the tops of the electric push rods are electrically matched with drive control units, and the drive control units are electrically connected to the pressure-sensitive push plates corresponding to the electric push rods, a plurality of Y-shaped brackets are cross-symmetrically fixed to the outer top of the base, the tops of the Y-shaped brackets are respectively fixedly connected to the electric push rods and the ring frame, and the top right side of the bottom plate is fixedly connected to an electric drive rotation The top output end of the electrically driven rotating seat is fixedly connected with a lifting cylinder, the top output end of the lifting cylinder is fixedly connected with a ring seat, the left center of the ring seat is fixedly connected with a cross frame, the left side of the cross frame is fixedly connected with a micro vacuum pump, the bottom exhaust end of the micro vacuum pump is connected and fixed with an exhaust pipe, the bottom end of the exhaust pipe is connected and fixed with a suction nozzle, and the suction nozzle is arranged directly above the turntable, and the turntable is provided with a pressure-sensitive push plate to automatically mechanically clamp the freely placed semiconductor chip and position it at the top center of the turntable, and then the micro vacuum pump cooperates with the suction nozzle to suck the semiconductor chip according to a fixed route for loading and processing, and the overall loading method of first positioning, then picking up and then transferring is adopted to reduce the loading cost, ensure the stability of the loading route, and improve the loading quality, and the turntable can change and adjust the orientation of the workpiece, which is convenient for rapid positioning and loading of some directional workpieces and improves the loading efficiency.

[0005] According to the semiconductor rotation positioning module, the inner edge of the bottom end of the suction nozzle is provided with a rounded corner, the outer edge of the bottom end of the suction nozzle is fixedly connected with a rubber gasket, and the lower side of the rubber gasket is in buffer contact with the surface of the semiconductor chip.

[0006] According to the semiconductor rotation positioning module, the bottom of the horizontal frame is fixed with limit rods symmetrically, and the bottom ends of the limit rods are relatively far away and fixedly connected to the output end of the lifting cylinder and the exhaust pipe respectively.

[0007] According to the semiconductor rotation positioning module, a layer of sliding film is adhered and covered on the top surface of the turntable, and the semiconductor chip slides freely horizontally on the sliding film.

[0008] According to the semiconductor rotation positioning module, adjacent electric push rods are fixedly connected with limit rings, and the limit rings are located on the same center of a circle.

[0009] According to the semiconductor rotation positioning module, the opposite sides of the pressure sensing push plate are fixedly connected with buffer pads, and the opposite sides of the buffer pads are correspondingly in compression contact with the side edges of the semiconductor.

[0010] According to the semiconductor rotation positioning module, opposite sides of the buffer pad are both covered with films, and the films have horizontal stripes.

[0011] Compared with the prior art, the beneficial effects of the utility model are:

[0012] In the utility model, a turntable is provided in cooperation with a pressure-sensitive push plate to automatically mechanically clamp freely placed semiconductor chips and position them at the top center of the turntable, and then a micro vacuum pump cooperates with a suction nozzle to suck the semiconductor chips along a fixed route for loading and processing. The overall loading method of first positioning, then picking up, and then transferring is adopted, which reduces the loading cost, ensures the stability of the loading route, and improves the loading quality. In addition, the turntable can change and adjust the direction of the workpiece, which is convenient for rapid positioning and loading of some directional workpieces, thereby improving the loading efficiency.

[0013] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The present invention is further described below with reference to the accompanying drawings and embodiments;

[0015] Figure 1 This is a schematic diagram of the connection structure between a servo motor and a turntable in a semiconductor rotation positioning module of the utility model;

[0016] Figure 2 This is a schematic diagram of the installation structure of a micro vacuum pump in a semiconductor rotation positioning module of the utility model;

[0017] Figure 3 This is a schematic diagram of the distribution of a pressure-sensing push plate in a semiconductor rotation positioning module of the utility model;

[0018] Figure 4 It is an overall schematic diagram of a semiconductor rotation positioning module of the utility model.

[0019] In the figure: 1. pad; 2. base; 3. servo motor; 4. turntable; 5. ring frame; 6. electric push rod; 7. pressure sensing push plate; 8. drive control unit; 9. Y-shaped bracket; 10. electric drive rotating seat; 11. lifting cylinder; 12. ring seat; 13. cross frame; 14. micro vacuum pump; 15. exhaust pipe; 16. suction nozzle; 17. rubber gasket; 18. limit frame rod; 19. sliding membrane; 20. limit ring; 21. buffer pad. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] See also Figure 1-4 The utility model provides a technical solution: a semiconductor rotation positioning module, including a bottom plate 1, a base 2 is fixedly connected to the left side of the top of the bottom plate 1, a servo motor 3 is embedded and fixed at the center of the top of the base 2, a turntable 4 is fixedly connected to the top output end of the servo motor 3, a semiconductor chip is mounted on the turntable 4, a ring frame 5 is rotatably connected to the outside of the turntable 4, a plurality of electric push rods 6 are cross-symmetrically fixed to the outside of the ring frame 5, the output ends of the opposite sides of the electric push rods 6 are fixedly connected to pressure-sensitive push plates 7, the pressure-sensitive push plates 7 are arranged at right angles to each other, the tops of the electric push rods 6 are electrically matched with drive control units 8, and the drive control units 8 are electrically connected to the pressure-sensitive push plates 7 corresponding to the electric push rods 6, a plurality of Y-shaped brackets 9 are cross-symmetrically fixed to the top of the outer side of the base 2, and the tops of the Y-shaped brackets 9 are respectively connected to the electric The push rod 6 is fixedly connected to the ring frame 5, and an electrically driven rotating seat 10 is fixedly connected to the top right side of the bottom plate 1, and a lifting cylinder 11 is fixedly connected to the top output end of the electrically driven rotating seat 10, and a ring seat 12 is fixedly connected to the top output end of the lifting cylinder 11, and a cross frame 13 is fixedly connected to the left center of the ring seat 12, and a micro vacuum pump 14 is fixedly connected to the left side of the cross frame 13, and a vacuum pipe 15 is connected and fixed to the bottom end of the vacuum pipe 15, and a suction nozzle 16 is connected and fixed, and the suction nozzle 16 is erected just above the turntable 4, and a limiting frame rod 18 is fixedly fixed to the bottom of the cross frame 13 symmetrically, and the bottom ends of the limiting frame rod 18 are relatively far away and respectively fixedly connected to the output end of the lifting cylinder 11 and the vacuum pipe 15, and a feeding method of first positioning, then picking up, and then transferring is adopted to reduce the feeding cost, ensure the stability of the feeding route, and improve the feeding quality.

[0022] The inner edge of the bottom end of the suction nozzle 16 is provided with a rounded corner, and the outer edge of the bottom end of the suction nozzle 16 is fixedly connected with a rubber gasket 17. The lower side of the rubber gasket 17 is in buffer contact with the surface of the semiconductor chip, ensuring the adsorption sealing while protecting the components on the surface of the semiconductor chip.

[0023] The top surface of the turntable 4 is covered with a slip film 19 , and the semiconductor chip slides freely horizontally on the slip film 19 , thereby reducing the friction loss of the semiconductor chip when sliding horizontally on the upper surface of the turntable.

[0024] The adjacent electric push rods 6 are fixedly connected with limit rings 20 , and the limit rings 20 are located on the same center of a circle to ensure the stability of the output direction between the electric push rods.

[0025] The opposite side of the pressure-sensing push plate 7 is fixedly connected with a buffer pad 21, and the opposite side of the buffer pad 21 corresponds to the squeeze contact with the side of the semiconductor. The opposite side of the buffer pad 21 is covered with a film, and the film has horizontal stripes, which provides flexible contact protection for the side of the semiconductor chip and facilitates its sliding along the horizontal direction.

[0026] Working principle: In the utility model, the semiconductor chip is freely placed on the upper side of the turntable 4, and the servo motor 3 drives the turntable 4 to rotate to adjust the pointing direction of the semiconductor chip, and then the electric push rods 6 on the left and right sides of the ring frame 5 are started to make the pressure-sensitive push plates 7 on them move synchronously in opposite directions. When the pressure-sensitive push plate 7 on one side contacts the side of the semiconductor chip, a signal is transmitted to the drive control unit 8 on it, and then the electric push rods 6 are controlled to stop running until the pressure-sensitive push plate 7 on the other side also contacts the semiconductor chip and transmits a signal to the drive control unit 8 on it, so as to complete the left and right center positioning of the semiconductor chip, and then start The electric push rods 6 on the front and rear sides of the ring frame 5 make the pressure-sensitive push plates 7 on it move in opposite directions synchronously, and the center positioning of the semiconductor chip in the front and rear directions is completed after the above steps. The two together complete the center positioning operation of the semiconductor chip on the turntable 4, and then the micro vacuum pump 14 cooperates with the suction nozzle 16 to suck the semiconductor chip to the processing position according to a fixed route for loading and processing. The overall loading method of first positioning, then picking up, and then transferring is adopted to reduce the loading cost, ensure the stability of the loading route, and improve the loading quality. The turntable 4 can change and adjust the direction of the workpiece, which is convenient for rapid positioning and loading of some directional workpieces, thereby improving the loading efficiency.

[0027] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A semiconductor rotation positioning module, comprising a base plate (1), characterized in that: The left side of the top of the bottom plate (1) is fixedly connected to a base (2), a servo motor (3) is embedded and fixed at the top center of the base (2), a turntable (4) is fixedly connected to the top output end of the servo motor (3), and a semiconductor chip is mounted on the turntable (4); The outer side of the turntable (4) is rotatably connected to a ring frame (5), and a plurality of electric push rods (6) are cross-symmetrically fixed to the outer side of the ring frame (5). The output ends of the opposite sides of the electric push rods (6) are fixedly connected to pressure-sensitive push plates (7), and the adjacent pressure-sensitive push plates (7) are erected at right angles. The tops of the electric push rods (6) are electrically matched with drive control units (8), and the drive control units (8) are electrically connected to the pressure-sensitive push plates (7) corresponding to the electric push rods (6). The top of the outer side of the base (2) is cross-symmetrically fixed to a plurality of Y-shaped brackets (9), and the tops of the Y-shaped brackets (9) are respectively fixedly connected to the electric push rods (6) and the ring frame (5); The top right side of the bottom plate (1) is fixedly connected to an electrically driven rotating seat (10), the top output end of the electrically driven rotating seat (10) is fixedly connected to a lifting cylinder (11), the top output end of the lifting cylinder (11) is fixedly connected to a ring seat (12), the left center of the ring seat (12) is fixedly connected to a cross frame (13), the left side of the cross frame (13) is fixedly connected to a micro vacuum pump (14), the bottom exhaust end of the micro vacuum pump (14) is connected to and fixed with an exhaust pipe (15), the bottom end of the exhaust pipe (15) is connected to and fixed with a suction nozzle (16), and the suction nozzle (16) is mounted directly above the turntable (4).

2. A semiconductor rotation positioning module as claimed in claim 1, characterized in that: The inner edge of the bottom end of the suction nozzle (16) is provided with a rounded corner, and the outer edge of the bottom end of the suction nozzle (16) is fixedly connected with a rubber gasket (17), and the lower side of the rubber gasket (17) is in buffer contact with the surface of the semiconductor chip.

3. A semiconductor rotation positioning module as claimed in claim 1, characterized in that: A limiting frame rod (18) is fixed symmetrically to the bottom of the horizontal frame (13), and the bottom ends of the limiting frame rods (18) are relatively far apart and are respectively fixedly connected to the output end of the lifting cylinder (11) and the exhaust pipe (15).

4. A semiconductor rotation positioning module as claimed in claim 1, characterized in that: The top surface of the turntable (4) is covered with a slip film (19), and the semiconductor chip slides freely horizontally on the slip film (19).

5. A semiconductor rotation positioning module as claimed in claim 1, characterized in that: The adjacent electric push rods (6) are fixedly connected to limit rings (20), and the limit rings (20) are located on the same center of a circle.

6. A semiconductor rotation positioning module as claimed in claim 1, characterized in that: The opposite side of the pressure sensing push plate (7) is fixedly connected to a buffer pad (21), and the opposite side of the buffer pad (21) is in corresponding extrusion contact with the side edge of the semiconductor.

7. A semiconductor rotation positioning module as claimed in claim 6, characterized in that: The opposite side of the buffer pad (21) is covered with a film, and the film has horizontal stripes.

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