Constant-voltage forward-installed COB light source structure

Abstract

The utility model relates to the technical field of COB light sources, and particularly discloses a constant-voltage normally-installed COB light source structure, which comprises a mirror surface aluminum substrate, a BT circuit copper layer and a normally-installed LED chip are arranged on the mirror surface aluminum substrate, a power supply input bonding pad, an LED link bonding pad and an IC link bonding pad are arranged on the BT circuit copper layer, a constant-current IC chip is arranged on the IC link bonding pad, and a power supply output bonding pad is arranged on the power supply input bonding pad. The normal LED chip is in bonding connection with the LED link bonding pad through a gold wire, and the LED link bonding pad is electrically connected with the power supply input bonding pad and the IC link bonding pad respectively. According to the utility model, the constant-current IC chip is arranged on the BT circuit copper layer, the constant-current IC chip can be installed without special slotting, and the constant-current IC chip does not need to be welded with a gold wire, so that the production is convenient, the production cost is reduced, the production efficiency can be greatly improved, and the production efficiency is relatively high.

Description

Technical Field

[0001] The utility model relates to the technical field of COB light sources, in particular to a constant voltage positive mounted COB light source structure. Background Art

[0002] COB (i.e. Chip on Board), chip on board packaging, is one of the bare chip mounting technologies. The semiconductor chip is interlocked and mounted on the printed circuit board. The electrical connection between the chip and the substrate is achieved by wire stitching and covered with resin to ensure reliability. COB usually includes a substrate, on which a light-emitting area, a cold light positive electrode pad, a cold light negative electrode pad, a warm light positive electrode pad, a warm light negative electrode pad and a conductive circuit are provided; COB is widely used due to its long life, pollution-free and high light efficiency. The Chinese utility model patent with patent application number 202420352678.5 discloses a constant voltage COB light source device, which is provided with a light source groove and a mounting groove recessed in the surface on the substrate assembly, the light source assembly is located in the light source groove, and the constant current assembly is located in the mounting groove, and the dam ring is arranged in the light source groove, thereby improving the brightness of the COB light source, being able to emit light evenly and optimizing the light emission effect. However, the existing COB light source device needs to be provided with a constant current device mounting groove to install the constant current device, and the constant current device needs to be electrically connected to the light source component by soldering gold wire, which is more troublesome to produce, increases production costs, reduces production efficiency, and leads to low production efficiency. Utility Model Content

[0003] The technical problem to be solved by the utility model is that, in view of the above-mentioned defects of the prior art, a constant voltage positive-mounted COB light source structure is provided to solve the technical problems of inconvenient production and low production efficiency of the existing constant voltage COB light source device. By setting the constant current IC chip on the BT circuit copper layer, there is no need to specially open a groove to install the constant current IC chip, and the constant current IC chip does not need to be welded with gold wire, which is convenient for production and reduces production costs, and can greatly improve production efficiency, with high production efficiency.

[0004] In order to solve the above technical problems, the technical solution of the utility model is:

[0005] A constant voltage upright COB light source structure comprises a mirror aluminum substrate, a BT circuit copper layer and an upright LED chip are arranged on the mirror aluminum substrate, a power input pad, an LED link pad and an IC link pad are arranged on the BT circuit copper layer, a constant current IC chip is arranged on the IC link pad, the upright LED chip and the LED link pad are connected by gold wire bonding, and the LED link pad is electrically connected to the power input pad and the IC link pad respectively.

[0006] Preferably, the front-mounted LED chip comprises a plurality of LED chip groups, and the LED chip groups are composed of a plurality of LED light-emitting wicks connected in series in sequence.

[0007] Preferably, the upper surface of the mirror aluminum substrate is a reflective surface.

[0008] Preferably, the power input pad comprises a positive power pad and a negative power pad, and the positive power pad and the negative power pad are symmetrically arranged at opposite corners of the mirror aluminum substrate.

[0009] Preferably, the LED light wicks are evenly distributed at the center of the mirror aluminum substrate.

[0010] Preferably, the power input pad, LED link pad and IC link pad are all soldered on the BT circuit copper layer, and the constant current IC chip is soldered on the IC link pad.

[0011] By adopting the above technical scheme, the utility model provides a constant voltage upright COB light source structure, which has the following beneficial effects: a BT circuit copper layer and an upright LED chip are arranged on the mirror aluminum substrate in the constant voltage upright COB light source structure, a power input pad, an LED link pad and an IC link pad are arranged on the BT circuit copper layer, a constant current IC chip is arranged on the IC link pad, the upright LED chip and the LED link pad are connected by gold wire bonding, the LED link pad is electrically connected to the power input pad and the IC link pad respectively, and the constant current IC chip is directly arranged on the BT circuit copper layer, and the constant current IC chip is electrically connected to the LED link pad through the BT circuit copper layer, and there is no need to specially groove to install the constant current IC chip, that is, there is no need to perform inverted notch processing, and the constant current IC chip does not need to be welded with gold wire, which saves production steps, is more convenient for production, reduces production costs, can greatly improve production efficiency, and has high production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is an exploded view of the utility model;

[0013] Figure 2 This is a schematic diagram of the planar structure of the utility model;

[0014] In the figure, 1-mirror aluminum substrate, 2-BT line copper layer, 3-upright LED chip, 4-power input pad, 5-LED link pad, 6-IC link pad, 7-gold wire bonding, 8-constant current IC chip. DETAILED DESCRIPTION

[0015] The specific implementation methods of the present invention are further described below in conjunction with the accompanying drawings. It should be noted that the description of these implementation methods is used to help understand the present invention, but does not constitute a limitation of the present invention. In addition, the technical features involved in each implementation method of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0016] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0017] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0018] like Figure 1-2 As shown, the constant voltage positive COB light source structure includes a mirror aluminum substrate 1, on which a BT circuit copper layer 2 and a positive LED chip 3 are arranged, on which a power input pad 4, an LED link pad 5 and an IC link pad 6 are arranged, on which a constant current IC chip 8 is arranged, and the positive LED chip 3 and the LED link pad 5 are connected by a gold wire bonding 7, and the LED link pad 5 is electrically connected to the power input pad 4 and the IC link pad 6 respectively. It can be understood that the mirror aluminum substrate 1 is arranged in a square shape, and the cross-section of the mirror aluminum substrate 1 is a square, or a rectangle, etc. The power pad can be used to connect to an external power supply; the constant current IC chip 8 can be a constant current diode, or a general MOS tube, etc., and the number can be a single chip or multiple chips, which is not limited by the utility model.

[0019] Specifically, the upright LED chip 3 includes several groups of LED chips, which are composed of several LED light-emitting wicks connected in series in sequence; the upper surface of the mirror aluminum substrate 1 is a reflective surface; the power input pad 4 includes a positive power pad and a negative power pad, which are symmetrically arranged on the diagonal of the mirror aluminum substrate 1; the LED light-emitting wicks are evenly distributed at the center of the mirror aluminum substrate 1, and extend from the center to the outer edge of the mirror aluminum substrate 1; the power input pad 4, the LED link pad 5 and the IC link pad 6 are all welded on the BT line copper layer 2, and the constant current IC chip 8 is welded on the IC link pad 6, and the constant current IC chip can be welded with solder paste or silver glue. It can be understood that the LED light-emitting wick can be a general LED wick, etc., and can have chips of other colors, and can achieve single-color or two-color light emission, etc., which is not limited by the present utility model.

[0020] It can be understood that the utility model has a reasonable design and a unique structure. By directly setting the constant current IC chip 8 on the BT circuit copper layer 2, the constant current IC chip 8 is electrically connected to the LED link pad 5 through the BT circuit copper layer 2. There is no need to specially cut grooves to install the constant current IC chip 8, that is, there is no need to perform inverted notch processing, and the constant current IC chip 8 does not need to be welded with gold wire, which saves production steps, is more convenient for production, reduces production costs, can greatly improve production efficiency, and has high production efficiency.

[0021] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. For those skilled in the art, various changes, modifications, substitutions and variations of these embodiments are made without departing from the principles and spirit of the present invention, and still fall within the scope of protection of the present invention.

Claims

1. A constant voltage front mounted COB light source structure, characterized in that: It includes a mirror aluminum substrate, on which a BT circuit copper layer and a front-mounted LED chip are arranged, on which the BT circuit copper layer are arranged a power input pad, an LED link pad and an IC link pad, on which a constant current IC chip is arranged, the front-mounted LED chip and the LED link pad are connected by gold wire bonding, and the LED link pad is electrically connected to the power input pad and the IC link pad respectively.

2. The constant voltage front mounted COB light source structure according to claim 1, characterized in that: The front-mounted LED chip comprises a plurality of LED chip groups, and the LED chip groups are composed of a plurality of LED light-emitting wicks connected in series in sequence.

3. The constant voltage front mounted COB light source structure according to claim 1, characterized in that: The upper surface of the mirror aluminum substrate is a reflective surface.

4. The constant voltage front mounted COB light source structure according to claim 1, characterized in that: The power input pad includes a positive power pad and a negative power pad, and the positive power pad and the negative power pad are symmetrically arranged on the diagonals of the mirror aluminum substrate.

5. The constant voltage front mounted COB light source structure according to claim 2, characterized in that: The LED light wicks are evenly distributed at the center of the mirror aluminum substrate.

6. The constant voltage front mounted COB light source structure according to claim 1, characterized in that: The power input pad, LED link pad and IC link pad are all welded on the BT circuit copper layer, and the constant current IC chip is welded on the IC link pad.

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