Positioning device for brushing solder paste on circuit board

Abstract

The utility model discloses a positioning device for brushing solder paste on a circuit board, which comprises a bottom box, a supporting base plate is arranged at the upper end of the bottom box in a matched manner, a fixing frame is clamped at the upper end of the bottom box, the circuit board is placed at the upper end of the supporting base plate, and the circuit board is positioned between the supporting base plate and the fixing frame. A plurality of air suction holes are formed in the upper end of the supporting base plate in a penetrating mode, the lower ends of the air suction holes are communicated with the bottom box, the interior of the bottom box is of a hollow structure, and the lower end of the bottom box is connected with an air suction pipe. According to the utility model, the air pump is started to work, and then air on the upper side of the supporting base plate gradually flows downwards, so that the air suction holes in the supporting base plate continuously suck external air; and gas on the circuit board can flow into the bottom box along the through holes in the circuit board and the gap between the circuit board and the supporting base plate, so that the circuit board can be quickly positioned by the upper end surface of the supporting base plate.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board positioning, in particular to a positioning device for brushing solder paste on a circuit board. Background Art

[0002] Circuit boards are an important part of modern electronic devices. Parts are concentrated on one side and wires are concentrated on the other side, which is a single-sided board. When single-layer wiring cannot meet the needs of electronic products, double-sided boards are used. Both sides have copper cladding and wiring, and the lines between the two layers can be connected through vias to form the required network connection. When soldering electronic components on the circuit board, the metal contact points on the circuit board need to be treated with solder paste;

[0003] However, in the process of applying solder paste, since the overall weight of the circuit board is relatively light, the entire circuit board is prone to deviate during the application of solder paste, and a positioning device is required to position the entire circuit board. However, due to the low gravity of the circuit board itself, the entire circuit board is not easy to align with the edge of the positioning table during the positioning process, resulting in poor positioning of the circuit board and difficulty in achieving rapid positioning, resulting in low overall positioning efficiency. Therefore, it does not meet existing needs. In this regard, we propose a positioning device for applying solder paste to a circuit board. Utility Model Content

[0004] The purpose of the utility model is to provide a positioning device for brushing solder paste on a circuit board, so as to solve the problems raised in the above background technology that during the positioning process, the entire circuit board is not easy to align with the edge of the positioning table, resulting in poor circuit board positioning effect, and it is difficult to achieve rapid positioning, resulting in low overall positioning efficiency, etc.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a positioning device for brushing solder paste on a circuit board, comprising a bottom box, a supporting pad is provided at the upper end of the bottom box, a fixing frame is clamped at the upper end of the bottom box, a circuit board is placed at the upper end of the supporting pad, the circuit board is located between the supporting pad and the fixing frame, a plurality of suction holes are penetrated at the upper end of the supporting pad, the lower ends of the suction holes are connected to the bottom box, the interior of the bottom box is set as a hollow structure, and a suction pipe is connected to the lower end of the bottom box.

[0006] Preferably, buckles are connected to both sides of the bottom box, and the upper ends between the two buckles are snap-connected to the two sides of the fixing frame.

[0007] Preferably, the four end corners of the fixing frame are vertically penetrated with limit grooves, the four end corners of the circuit board are penetrated with slots, and the four end corners on the upper end of the supporting pad are fixedly connected with limit blocks.

[0008] Preferably, the slot on the circuit board is mounted on the limiting block, and the limiting groove on the fixing frame is mounted on the limiting block.

[0009] Preferably, an air diversion mechanism is provided inside the bottom box, a diversion pipe is provided inside the air diversion mechanism, and the bottom end inside the diversion pipe is fixedly connected to the air intake pipe.

[0010] Preferably, the outside of the air intake pipe is connected to an air pump.

[0011] Preferably, support columns are fixedly connected to the four end corners of the lower end of the bottom box.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] 1. The utility model opens the air pump connected to the air suction pipe at the lower end of the external bottom box to make the air pump work. At this time, the gas located on the upper side of the support pad gradually flows downward, so that the gas enters the interior of the bottom box, and the gas inside the air suction pipe is discharged outward through the air pump, thereby realizing that the air suction holes on the support pad continuously suck the external gas. At this time, when the entire circuit board is placed on the support pad, the gas on the circuit board will flow into the bottom box along the through holes on the circuit board and the interval between the circuit board and the support pad, thereby realizing the rapid positioning of the upper end of the support pad facing the circuit board;

[0014] 2. The utility model sets the slot on the circuit board on the limit block, and the limit slot on the fixed frame is set on the limit block, so that the whole circuit board is fixed on the support pad, and the fixed frame is inserted on the upper end of the circuit board, and the buckles on both sides of the bottom box are clamped to the whole fixed frame, which greatly improves the fixing performance of the whole fixed frame on the circuit board. Through this arrangement, the positioning performance of the circuit board between the support pad and the fixed frame is greatly improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the utility model;

[0016] Figure 2 It is an exploded view of the utility model as a whole;

[0017] Figure 3 For this utility model Figure 2 A magnified view of the three-dimensional structure at center A;

[0018] Figure 4 It is a side cutaway view of the utility model as a whole.

[0019] In the figure: 1. fixing frame; 2. circuit board; 3. buckle; 4. limit block; 5. bottom box; 6. limit groove; 7. air intake pipe; 8. support pad; 9. slot; 10. air diversion mechanism; 11. diversion pipe; 12. air intake hole. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0021] See also Figures 1 to 4 The utility model provides an embodiment: a positioning device for brushing solder paste on a circuit board, comprising a bottom box 5, a supporting pad 8 is provided at the upper end of the bottom box 5, a fixing frame 1 is clamped at the upper end of the bottom box 5, a circuit board 2 is placed at the upper end of the supporting pad 8, the circuit board 2 is located between the supporting pad 8 and the fixing frame 1, a plurality of air suction holes 12 are penetrated at the upper end of the supporting pad 8, the lower end of the air suction hole 12 is connected to the bottom box 5, the four end corners of the lower end of the overall bottom box 5 are fixedly connected with support columns, so that the air suction pipe 7 can be connected to the lower end of the bottom box 5, the interior of the bottom box 5 is set as a hollow structure, and the setting of the hollow structure of the bottom box 5 allows the air inside the air to overflow and flow outward, so that the air suction pipe 7 can perform air extraction operation on the inside of the bottom box 5;

[0022] The lower end of the bottom box 5 is connected to an air intake pipe 7, and buckles 3 are connected to both sides of the bottom box 5. The upper ends between the two buckles 3 are snap-connected to the two sides of the fixed frame 1. An air diversion mechanism 10 is provided inside the bottom box 5. A diversion pipe 11 is provided inside the air diversion mechanism 10. The bottom end of the diversion pipe 11 is fixedly connected to the air intake pipe 7. The diversion pipes 11 are evenly distributed at the lower ends of the air intake holes 12, so that the inside of the diversion pipe 11 can inhale air to the circuit board 2 through the air intake holes 12. At the same time, the uniform distribution of the diversion pipes 11 improves the uniformity of air intake. The outside of the air intake pipe 7 is connected to an air pump.

[0023] When in use, first place the whole support pad 8 on the bottom box 5 so that the whole support pad 8 covers the bottom box 5, and open the air pump connected to the air suction pipe 7 at the lower end of the external bottom box 5 to make the air pump work. At this time, the gas located on the upper side of the support pad 8 gradually flows downward, and then the air suction pipe 7 at the special-shaped lower end of the bottom box 5 makes the gas inside the air suction pipe 7 be discharged outward through the air pump, thereby realizing the air suction holes 12 on the support pad 8 to continuously suck the external gas. At this time, when the whole circuit board 2 is placed on the support pad 8, the gas on the circuit board 2 will flow into the bottom box 5 along the through holes on the circuit board 2 and the interval between the circuit board 2 and the support pad 8, thereby realizing the rapid positioning of the upper end of the support pad 8 facing the circuit board 2;

[0024] By vertically penetrating limiting grooves 6 at the four end corners of the fixing frame 1, and penetrating slots 9 at the four end corners of the circuit board 2, the four end corners of the upper end of the support pad 8 are fixedly connected to the limiting blocks 4, wherein the slots 9 on the circuit board 2 are sleeved on the limiting blocks 4, and the limiting grooves 6 on the fixing frame 1 are sleeved on the limiting blocks 4, so that the entire circuit board 2 is fixed on the supporting pad 8, and the fixing frame 1 is inserted on the upper end of the circuit board 2, and the buckles 3 on both sides of the bottom box 5 are clamped to the entire fixing frame 1, which greatly improves the fixing performance of the entire fixing frame 1 on the circuit board 2. Through this arrangement, the positioning performance of the circuit board 2 between the supporting pad 8 and the fixing frame 1 is greatly improved;

[0025] The overall fixing frame 1 is set as a frame structure, and the fixing frame 1 positions the edge of the upper end of the circuit board 2, so that the metal contact points on the circuit board 2 are exposed, and the staff can directly apply solder paste on the circuit board to achieve the solder paste application operation on the metal contact points on the circuit board.

[0026] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

Claims

1. A positioning device for applying solder paste to a circuit board, comprising a bottom box (5), characterized in that: The upper end of the bottom box (5) is provided with a supporting pad (8), the upper end of the bottom box (5) is clamped with a fixing frame (1), a circuit board (2) is placed on the upper end of the supporting pad (8), the circuit board (2) is located between the supporting pad (8) and the fixing frame (1), a plurality of air intake holes (12) are penetrated through the upper end of the supporting pad (8), the lower ends of the air intake holes (12) are connected to the bottom box (5), the interior of the bottom box (5) is provided with a hollow structure, and the lower end of the bottom box (5) is connected with an air intake pipe (7).

2. A positioning device for applying solder paste to a circuit board according to claim 1, characterized in that: Buckles (3) are connected to both sides of the bottom box (5), and the upper ends between the two buckles (3) are connected to both sides of the fixed frame (1) by buckling.

3. A positioning device for applying solder paste to a circuit board according to claim 2, characterized in that: The four end corners of the fixed frame (1) are vertically penetrated by limit grooves (6), the four end corners of the circuit board (2) are penetrated by slots (9), and the four end corners of the upper end of the support pad (8) are fixedly connected to the limit blocks (4).

4. A positioning device for brushing solder paste on a circuit board according to claim 3, characterized in that: The slot (9) on the circuit board (2) is mounted on the limiting block (4), and the limiting groove (6) on the fixing frame (1) is mounted on the limiting block (4).

5. A positioning device for brushing solder paste on a circuit board according to claim 4, characterized in that: An air diversion mechanism (10) is provided inside the bottom box (5), a diversion pipe (11) is provided inside the air diversion mechanism (10), and the bottom end inside the diversion pipe (11) is fixedly connected to the air intake pipe (7).

6. A positioning device for brushing solder paste on a circuit board according to claim 5, characterized in that: The outside of the air suction pipe (7) is connected to an air pump.

7. A positioning device for brushing solder paste on a circuit board according to claim 1, characterized in that: The four end corners of the lower end of the bottom box (5) are all fixedly connected with support columns.

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