Infrared thermopile sensor

Abstract

The utility model provides an infrared thermopile sensor, which comprises a tube cap, a glass tube seat, a pin column and a chip assembly, the tube cap comprises a tube cap step and a tube cap side wall, the upper part of the tube cap side wall is connected with the tube cap step, and the lower part of the tube cap side wall is provided with a tube cap opening; the glass tube seat is arranged in the tube cap side wall through the tube cap opening; the pin column penetrates through the glass tube seat, and the upper part of the pin column is positioned above the glass tube seat; the chip assembly comprises a circuit board and a chip arranged on the circuit board, the circuit board is connected with the upper portion of the pin column, the chip assembly is located between the tube cap step and the glass tube base, and a gap is formed between the chip assembly and the glass tube base, so that the heat conductivity coefficient of each structure of the sensor is greatly reduced, and the heat conductivity coefficient of each structure of the sensor is greatly improved. And the thermal shock resistance of the sensor is effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of sensors, in particular to an infrared thermopile sensor. Background Art

[0002] An infrared thermopile sensor is a sensor that converts infrared radiation into electrical signals based on the principle of thermoelectric effect. It mainly includes a tube cap, a tube socket and a chip. For example, the laser chip packaging structure disclosed in publication number CN214176407U has a chip directly fixed on the tube socket, and the tube socket and the tube cap are both made of materials with good thermal conductivity. Therefore, the thermal conductivity coefficient of the tube socket and the tube cap is large, and the chip is not insulated. In addition, the side wall of the tube cap is thinner, and the heat conduction is faster. Therefore, the existing infrared thermopile sensor has poor resistance to external thermal shock in the use environment. Utility Model Content

[0003] The purpose of the utility model is to provide an infrared thermopile sensor to address the deficiencies in the prior art, which greatly reduces the thermal conductivity of each structure of the sensor and effectively improves the performance of the sensor in resisting thermal shock.

[0004] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0005] An infrared thermopile sensor, comprising:

[0006] A pipe cap, the pipe cap comprising a pipe cap step and a pipe cap side wall, the upper portion of the pipe cap side wall is connected to the pipe cap step, and the lower portion of the pipe cap side wall is provided with a pipe cap opening;

[0007] A glass tube seat, the glass tube seat is arranged inside the tube cap side wall through the tube cap opening;

[0008] A pin column, wherein the pin column passes through the glass tube holder, and the upper part of the pin column is located above the glass tube holder;

[0009] A chip assembly, the chip assembly includes a circuit board and a chip arranged on the circuit board, the circuit board is connected to the upper part of the pin column, the chip assembly is located between the tube cap step and the glass tube seat, and a gap is arranged between the chip assembly and the glass tube seat.

[0010] As a preferred embodiment, the number of the pin columns is multiple, the chip includes a TPS chip and an NTC chip, and the TPS chip and the NTC chip are respectively connected to different pin columns.

[0011] As a preferred embodiment, the middle portion of the pin column is fixed inside the glass tube holder, and the chip assembly is supported by the pin column and suspended above the glass tube holder.

[0012] As a preferred embodiment, the circuit board adopts a FR4 circuit board.

[0013] As a preferred embodiment, the length of the pin column is 16-17 mm.

[0014] As a preferred embodiment, it also includes:

[0015] A packaging ring is arranged between the glass tube seat and the side wall of the tube cap.

[0016] As a preferred embodiment, the packaging ring is engaged with the outer wall of the glass tube holder, and the packaging ring and the glass tube holder are inserted into the inner side wall of the tube cap as a whole.

[0017] As a preferred embodiment, the packaging ring is made of SPCC material.

[0018] As a preferred embodiment, the thickness of the glass tube holder is 2-3 mm.

[0019] As a preferred embodiment, the tube cap is made of stainless steel.

[0020] As a preferred embodiment, it also includes:

[0021] A filter is fixed on the tube cap step.

[0022] Compared with the prior art, this technical solution has the following advantages:

[0023] The chip is connected to the pin column through the circuit board, so that the chip is suspended above the glass tube holder to achieve the effect of isolating the chip.

[0024] By increasing the length of the pin column, the chip is further away from the glass tube holder, thereby achieving a better isolation effect.

[0025] The glass tube seat is made of glass, and by increasing the thickness of the glass tube seat, the thermal mass is further increased so that the external heat radiation comes more slowly.

[0026] The pipe cap is made of stainless steel, so that the pipe cap has a good heat insulation effect.

[0027] The present invention is further described below with reference to the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 This is a schematic diagram of the structure of the infrared thermopile sensor of the utility model;

[0029] Figure 2This is a temperature rise comparison diagram of the infrared thermopile sensor optimized by the utility model and the NTC sensor in the conventional structure.

[0030] In the figure: 100, tube cap; 110, tube cap step; 111, mounting hole; 111a, upper hole; 111b, lower hole; 120, tube cap side wall; 130, tube cap opening; 200, glass tube holder; 300, chip assembly; 310, circuit board; 320, chip; 321, TPS chip; 322, NTC chip; 400, pin column; 500, packaging ring; 600, filter. DETAILED DESCRIPTION

[0031] The following description is used to disclose the utility model so that those skilled in the art can implement the utility model. The preferred embodiments described below are only examples, and those skilled in the art can think of other obvious variations. The basic principles of the utility model defined in the following description can be applied to other embodiments, variations, improvements, equivalents, and other technical solutions that do not deviate from the spirit and scope of the utility model.

[0032] like Figure 1 As shown, the infrared thermopile sensor comprises:

[0033] A pipe cap 100, the pipe cap 100 comprises a pipe cap step 110 and a pipe cap side wall 120, the upper portion of the pipe cap side wall 120 is connected to the pipe cap step 110, and the lower portion of the pipe cap side wall 120 is provided with a pipe cap opening 130;

[0034] A glass tube holder 200, wherein the glass tube holder 200 is disposed inside the tube cap side wall 120 through the tube cap opening 130;

[0035] A pin column 400, wherein the pin column 400 passes through the glass tube holder 200, and the upper portion of the pin column 400 is located above the glass tube holder 200;

[0036] The chip assembly 300 includes a circuit board 310 and a chip 320 disposed on the circuit board 310. The circuit board 310 is connected to the upper part of the pin column 400. The chip assembly 300 is located between the tube cap step 110 and the glass tube seat 200. A gap is set between the chip assembly 300 and the glass tube seat 200.

[0037] The existing tube holder material is SPCC (cold-rolled carbon steel sheet and steel strip), while the glass tube holder 200 of this embodiment is made of glass material, and the thermal conductivity of glass material is several dozen times lower than that of SPCC material, and has a good thermal insulation effect. In addition, the chip 320 transfers signals through the circuit board 310, and the circuit board 310 is supported by the pin column 400, so that a gap is set between the circuit board 310 and the glass tube holder 200 to achieve the purpose of thermal insulation, greatly reducing the thermal conductivity of each structure of the sensor, and effectively improving the performance of the sensor in resisting thermal shock.

[0038] like Figure 1 As shown, the thickness of the tube cap step 110 must meet the requirements of the installation of the filter 600, wherein a mounting hole 111 is opened at the center of the tube cap step 110, and the mounting hole 111 includes an upper hole 111a and a lower hole 111b that are connected to each other. The filter 600 is installed in the upper hole 111a, and the diameter of the lower hole 111b is smaller than that of the upper hole 111a to meet the requirements of the filter 600 being adapted to be installed in the upper hole 111a, and the filter 600 passes through the lower hole 111b to allow infrared light of a specific wavelength to pass through. The filter can enhance the intensity of the infrared signal, so that the sensor can detect the target object at a farther distance and improve the detection range.

[0039] refer to Figure 1 The thickness of the upper portion of the tube cap side wall 120 connected to the tube cap step 110 is greater than the thickness of the lower portion of the tube cap side wall 120 to enhance the connection strength between the tube cap side wall 120 and the tube cap step 110 while ensuring the stability of the installation of the filter 600.

[0040] The cap side wall 120 and the cap step 110 may be integrally formed and made of stainless steel to replace conventional SPCC material, wherein the thermal conductivity of stainless steel is about one third of that of SPCC, so that the cap 100 has a good thermal insulation effect.

[0041] like Figure 1 As shown, the shapes of the glass tube holder 200 and the tube cap side wall 120 are adapted to each other, and the cross-sections of the two can be circular. The glass tube holder 200 can be placed inside the tube cap side wall 120 through the tube cap opening 130 .

[0042] In addition to being made of glass to achieve good heat insulation, the glass tube holder 200 can be thicker to further increase the thermal mass and slow down the external heat radiation. The thickness of the glass tube holder 200 is increased from 1.0 mm to 2-3 mm, preferably 2.7 mm.

[0043] like Figure 1As shown, the infrared thermopile sensor also includes:

[0044] The packaging ring 500 is disposed between the glass tube holder 200 and the tube cap side wall 120 .

[0045] The packaging is performed by adding a layer of the packaging ring 500 on the outside of the glass tube holder 200 . Specifically, the packaging ring 500 is engaged with the outer wall of the glass tube holder 200 . The packaging ring 500 and the glass tube holder 200 are inserted into the tube cap side wall 120 as a whole.

[0046] refer to Figure 1 The outer wall of the glass tube holder 200 is completely wrapped by the packaging ring 500. The lower part of the tube cap side wall 120 is bent outward, and the lower part of the packaging ring 500 is also bent outward, and the tube cap side wall 120 and the lower part of the packaging ring 500 are bent to overlap each other.

[0047] The packaging ring 500 is made of SPCC material.

[0048] like Figure 1 As shown, there are multiple pin columns 400 , and the chip 320 includes a TPS chip 321 and an NTC chip 322 . The TPS chip 321 and the NTC chip 322 are connected to different pin columns 400 , respectively.

[0049] The pin column 400 serves to connect and support the chip assembly 300, so that the chip assembly 300 is suspended above the glass tube holder 200, and the circuits can be interconnected. The infrared thermopile chip is a semiconductor device that converts infrared radiation into electrical signals. It mainly uses the principle of thermoelectric effect to induce temperature changes by sensing infrared radiation, thereby generating a voltage signal. Specifically, when infrared radiation irradiates the chip, the temperature inside the material will rise, and the thermoelectric potential generated by this temperature difference will cause the movement of charges, thereby generating a current or voltage signal.

[0050] The TPS chip 321 is a type of power management chip widely used in electronic devices. The NTC chip is made of semiconductor materials with negative temperature coefficient characteristics. Common materials include metal oxides, such as nickel oxide, manganese oxide, and cobalt oxide. When the temperature of these materials rises, the internal carrier concentration increases, resulting in a decrease in resistivity. Therefore, as the temperature rises, the resistance value of the NTC chip decreases.

[0051] refer to Figure 1, the overall length of the pin column is divided into upper, middle and lower parts, wherein the length of the lower part of the pin column is the distance from the bottom surface of the glass tube holder 200 to the lower part of the pin column, which is about 14mm. The middle part of the pin column is located inside the glass tube holder 200, that is, the length of the middle part of the pin column is equal to the thickness of the glass tube holder 200, which is about 2.7mm. The length of the upper part of the pin column is the distance from the top surface of the glass tube holder 200 to the upper part of the pin column, and the upper part of the pin column is connected to the circuit board 310, wherein the length of the upper part of the pin column can be determined by the engineer according to the actual design of the product, which is generally 0.5mm, and the design of this embodiment is about 1.5mm. Make the chip 320 farther away from the glass tube holder 200 to achieve a better isolation effect.

[0052] Continue to refer Figure 1 The middle part of the pin column 400 is fixed inside the glass tube holder 200 , and the chip assembly 300 is supported by the pin column 400 and suspended above the glass tube holder 200 .

[0053] The circuit board 310 is made of FR4 (flame resistant material grade 4). The thermal conductivity of FR4 is also very poor. The purpose of heat insulation is further achieved by suspending the chip 320.

[0054] The assembly method of the infrared thermopile sensor is as follows:

[0055] First, a combination of the pin column 400 and the glass tube holder 200 is provided, wherein the middle portion of the pin column 400 is fixed inside the glass tube holder 200, and the upper portion of the pin column 400 is above the glass tube holder 200;

[0056] Then, the chip assembly 300 is connected to the upper part of the pin column 400, wherein the circuit board 310 is located between the chip 320 and the pin column 400;

[0057] The chip assembly 300, the glass tube holder 200 and the pin column 400 are placed as a whole through the tube cap opening 130 into the inside of the tube cap side wall 120 to assemble an infrared thermopile sensor, wherein the chip 320 of the chip assembly 300 is suspended above the glass tube holder 200 through the pin column 400.

[0058] In summary, the chip 320 is connected to the pin column 400 through the circuit board 310, so that the chip 320 is suspended above the glass tube holder 200, thereby achieving the effect of isolating the chip 320. By increasing the length of the pin column 400, the chip 320 is further away from the glass tube holder 200, thereby achieving a better isolation effect. The glass tube holder 200 is made of glass, and by increasing the thickness of the glass tube holder 200, the thermal mass is further increased to make the external heat radiation come slower. The tube cap is made of stainless steel, so that the tube cap 100 has a good thermal insulation effect. The heat capacity of the sensor itself is increased, the thermal conductivity of each structure of the sensor is greatly reduced, the sensor's resistance to thermal shock is effectively improved, and the sensor detection accuracy is improved. For reference Figure 2 ,Through the heat transfer simulation of the two sensor structures before and after, it can be seen that the ,anti-thermal shock effect of the optimized structure is greatly improved in the ,same time period.

[0059] The embodiments described above are only used to illustrate the technical ideas and features of the utility model, and their purpose is to enable technicians in this field to understand the content of the utility model and implement it accordingly. The patent application scope of the utility model cannot be limited only by this embodiment, that is, any equivalent changes or modifications made according to the spirit disclosed by the utility model still fall within the patent scope of the utility model.

Claims

1. An infrared thermopile sensor, characterized in that: include: A pipe cap (100), the pipe cap (100) comprising a pipe cap step (110) and a pipe cap side wall (120), the upper portion of the pipe cap side wall (120) being connected to the pipe cap step (110), and the lower portion of the pipe cap side wall (120) being provided with a pipe cap opening (130); A glass tube seat (200), the glass tube seat (200) being arranged inside the tube cap side wall (120) through the tube cap opening (130); A pin column (400), wherein the pin column (400) passes through the glass tube holder (200), and the upper part of the pin column (400) is located above the glass tube holder (200); A chip assembly (300) comprising a circuit board (310) and a chip (320) arranged on the circuit board (310), wherein the circuit board (310) is connected to the upper part of the pin column (400), the chip assembly (300) is located between the tube cap step (110) and the glass tube holder (200), and a gap is arranged between the chip assembly (300) and the glass tube holder (200).

2. The infrared thermopile sensor according to claim 1, characterized in that: The number of the pin columns (400) is plural, and the chip (320) includes a TPS chip (321) and an NTC chip (322), and the TPS chip (321) and the NTC chip (322) are respectively connected to different pin columns (400).

3. The infrared thermopile sensor according to claim 1, characterized in that: The middle part of the pin column (400) is fixed inside the glass tube holder (200), and the chip assembly (300) is supported by the pin column (400) and suspended above the glass tube holder (200).

4. The infrared thermopile sensor according to claim 1, characterized in that: The length of the pin column (400) is 16-17 mm.

5. The infrared thermopile sensor according to claim 1, characterized in that: Also includes: A packaging ring (500) is arranged between the glass tube seat (200) and the tube cap side wall (120).

6. The infrared thermopile sensor according to claim 5, characterized in that: The packaging ring (500) is engaged with the outer wall of the glass tube seat (200), and the packaging ring (500) and the glass tube seat (200) are inserted into the inside of the tube cap side wall (120) as a whole.

7. The infrared thermopile sensor according to claim 5, characterized in that: The packaging ring (500) is made of SPCC material.

8. The infrared thermopile sensor according to claim 1, characterized in that: The glass tube holder (200) has a thickness of 2 to 3 mm.

9. The infrared thermopile sensor according to claim 1, characterized in that: The pipe cap (100) is made of stainless steel.

10. The infrared thermopile sensor according to claim 1, characterized in that: Also includes: A filter (600) is fixed on the tube cap step (110).

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