Linear cutting cooling device and linear cutting equipment

Abstract

The utility model provides a wire cutting cooling device and wire cutting equipment, and belongs to the technical field of silicon wafer cutting equipment, the wire cutting cooling device comprises a cutting fluid tank, a guide plate and an adjusting mechanism; the adjusting mechanism is connected to the cutting fluid tank and comprises a connecting base, a rotating assembly and a lifting assembly, and the connecting base is connected with the cutting fluid tank in a clamped mode; one end of the rotating component is connected with the connecting seat which is driven to rotate by the rotating driver; the lifting assembly is connected to the other end of the rotating assembly and drives the rotating assembly to move through a lifting driver. The wire cutting equipment comprises the wire cutting cooling device, a detection mechanism and a control system, and the control system controls the wire cutting cooling device to operate so as to adjust the drop point of the cooling liquid. The position and the angle of the guide plate can be adjusted according to the specifications and the cutting process of different silicon single crystal rods, so that the drop point of cooling liquid can be adjusted along with the guide plate, the cooling liquid is ensured to fully participate in the cutting process, and the cutting quality of silicon wafers is improved; the whole cutting device is simple in structure, stable in connection, convenient to use and capable of achieving continuous automatic operation.

Description

Technical Field

[0001] The utility model belongs to the technical field of silicon wafer cutting equipment, in particular to a wire cutting cooling device and wire cutting equipment. Background Art

[0002] The cooling device is an essential accessory in the silicon wafer cutting process. The coolant cools and lubricates the steel wire through the cooling device. The purpose is to reduce the heat generated by the friction between the steel wire and the silicon wafer, and clean the silicon powder wrapped on the surface of the steel wire and the silicon powder mixed between the silicon wafers, so as to improve the lubrication effect of the steel wire, ensure the cutting speed of the steel wire, and also reduce the wire breakage rate of the steel wire. At present, the main cooling method is a large-flow overflow method. However, since the current position of the cooling device is fixed and inconvenient, the angle and distance of the sprayed cutting fluid are also unchanged. With the changes in the wire bow during the cutting process, the sprayed cutting fluid often deviates from the single crystal silicon rod, resulting in insufficient lubrication and cooling of the steel wire, resulting in wire breakage and poor silicon wafer surface, resulting in unstable quality of the silicon wafer after cutting, and the yield cannot be guaranteed. In addition, the cooling device needs to be adjusted during the material lifting and preparation stages to provide operating space. The prior art usually manually raises the nozzle after cutting is completed, and then lowers the nozzle during cutting. This method can neither make adjustments during the cutting process nor waste labor hours each time the nozzle is disassembled and assembled, affecting the cutting efficiency. At the same time, frequent disassembly and assembly of the nozzle will inevitably cause its position to gradually shift, resulting in the inability of the sprayed cutting fluid to be accurately sprayed onto the steel wire. Utility Model Content

[0003] In order to solve the above technical problems, the present invention provides a wire cutting cooling device, a wire cutting equipment and a method of use, which can automatically adjust the position and angle of the cutting liquid tank and the guide plate according to the cutting process, thereby adjusting the landing point of the coolant, so that the diamond wire in the entire cutting process is in the best liquid-carrying state, thereby improving the cutting quality of the silicon wafer.

[0004] The technical solution adopted by the utility model is: a wire cutting cooling device, including a cutting liquid tank and a guide plate arranged at the liquid outlet of the cutting liquid tank, and also including an adjustment mechanism, which is connected to the cutting liquid tank and includes a rotating component and a lifting component, which are respectively used to adjust the angle and position of the cutting liquid tank.

[0005] Furthermore, the adjustment mechanism also includes a connecting seat, which is clamped with the cutting liquid tank; the rotating assembly is connected to the connecting seat, and the connecting seat is driven to rotate by a rotating driver.

[0006] Furthermore, the rotating assembly includes a rotating shaft, which is driven to rotate by the rotating driver and one end of which is connected to the connecting seat.

[0007] Furthermore, the rotating assembly also includes a rotating sleeve, and the rotating shaft passes through one end of the rotating sleeve and is connected to the connecting seat.

[0008] Furthermore, the lifting assembly includes a lifting block, a guide rod and a lifting driver, the lifting block is connected to the rotating assembly; the guide rod is movably connected to the lifting block, and the lifting driver drives the lifting block to move along the guide rod.

[0009] Furthermore, the guide rod is threadedly connected to the lifting block, and the lifting driver is connected to the guide rod and drives the guide rod to rotate.

[0010] Furthermore, the connecting seat comprises a first adjusting seat, and the first adjusting seat is provided with a connecting groove; ear plates are provided at both ends of the cutting liquid groove, and the ear plates can be inserted into the connecting groove through the opening of the connecting groove.

[0011] Furthermore, the connecting seat also includes a second adjustment seat, and the second adjustment seat and the first adjustment seat are provided with matching clamping strips and guide grooves for clamping; the guide groove is perpendicular to the connecting groove.

[0012] A wire cutting device is provided with the above-mentioned wire cutting cooling device, and also includes a detection mechanism and a control system. The detection mechanism is used to detect the wire bow of the diamond wire during the cutting process. The control system receives the signal of the detection mechanism and controls the operation of the wire cutting cooling device to adjust the landing point of the coolant.

[0013] The advantages and positive effects of the present invention are as follows: due to the adoption of the above-mentioned technical scheme, the position and angle of the cutting liquid tank and the guide plate can be adjusted according to the specifications and cutting process of different single crystal silicon rods, so that the landing point of the coolant can be adjusted accordingly, ensuring that the coolant fully participates in the cutting process, cools and lubricates the diamond wire, and makes the diamond wire in the entire cutting process in the best liquid-carrying state, thereby improving the cutting quality of the silicon wafer; by setting the first connecting seat and the connecting groove, single crystal silicon rods of various specifications can be cooled during cutting; by setting the adjustment mechanism, the cutting liquid tank and the guide plate are driven to move and rotate, so that the landing point of the coolant can be adjusted according to the cutting process; the overall cutting device has a simple structure, a stable connection, and is easy to use, and can realize continuous automatic operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a structural schematic diagram of a specific embodiment of the utility model;

[0015] Figure 2 It is a structural side view of a specific embodiment of the utility model;

[0016] Figure 3It is a schematic diagram of the structure of the regulating mechanism of a specific embodiment of the utility model;

[0017] Figure 4 This is a schematic diagram of the connecting seat structure of a specific embodiment of the utility model;

[0018] Figure 5 This is a schematic diagram of the structure of the first adjustment base of a specific embodiment of the utility model;

[0019] Figure 6 It is a schematic diagram of the structure of the first adjustment socket of a specific embodiment of the utility model.

[0020] Figure 7 The utility model is a wire cutting device and a schematic diagram of its use according to a specific embodiment of the utility model.

[0021] In the figure:

[0022] 10. Cutting liquid tank 20, nozzle 30, guide plate

[0023] 40. Adjustment mechanism 41. Connecting seat 411. First adjustment seat

[0024] 4111, connecting groove 4112, clamping strip 412, second adjustment clamping seat

[0025] 4121, connecting plate 4122, connecting block 4123, guide groove

[0026] 42. Rotating assembly 421. Rotating shaft 422. Rotating jacket

[0027] 423, rotary driver 43, lifting assembly 431, lifting block

[0028] 432, guide rod 433, lifting drive 50, installation panel

[0029] 51, limit block 60, main roller 70, diamond wire

[0030] 80. Material holder 90. Single crystal silicon rod 100. Detection mechanism DETAILED DESCRIPTION

[0031] The embodiments of the present utility model are described below in conjunction with the accompanying drawings.

[0032] like Figure 1 , Figure 2As shown, the present invention proposes a wire cutting cooling device for silicon wafer wire cutting equipment, comprising a cutting liquid tank 10 and a guide plate 30 arranged at the liquid outlet of the cutting liquid tank 10, wherein a nozzle 20 is arranged in the cutting liquid tank 10. When in use, the coolant enters the nozzle 20 from the liquid inlet pipe, and then flows out from the nozzle 20 into the cutting liquid tank 10, and gradually rises in the cutting liquid tank 10, flows out from the liquid outlet, flows along the guide plate 30 to the single crystal silicon rod 90 and the diamond wire 70, and cools and lubricates the diamond wire 70; the wire cutting cooling device proposed in the present application can adjust the position and angle of the cutting liquid tank 10 and the guide plate 30 as the cutting process progresses, so that the landing point of the coolant can be adjusted according to the position of the single crystal silicon rod 90 and the diamond wire 70, to ensure that the coolant fully participates in the cutting process, cools and lubricates the diamond wire 70, so that the diamond wire 70 is in the best liquid-carrying state during the entire cutting process, thereby improving the cutting quality of the silicon wafer.

[0033] A wire cutting cooling device, such as Figure 1 , Figure 2 As shown, it includes a cutting liquid tank 10, a guide plate 30 and an adjusting mechanism 40, wherein the cutting liquid tank 10 and the guide plate 30 are prior art and are not described in detail herein; the adjusting mechanism 40 is connected to the cutting liquid tank 10, and includes a rotating component 42 and a lifting component 43, which are respectively used to adjust the angle and position of the cutting liquid tank 10, so that the coolant can be sprayed onto the single crystal silicon rod 90 and the diamond wire 70 all the time as the cutting process progresses.

[0034] Furthermore, the adjustment mechanism 40 also includes a connecting seat 41, which is clamped with the cutting liquid tank 10; the rotating component 42 is connected to the connecting seat 41, and the rotating component 42 includes a rotating driver 423, which drives the connecting seat 41 to rotate through the rotating driver 423, thereby driving the cutting liquid tank 10 to rotate synchronously, and finally realizing the adjustment of the angle of the guide plate 30, thereby adjusting the spraying angle of the coolant.

[0035] Furthermore, the rotating assembly 42 includes a rotating shaft 421, such as Figure 3 As shown, the rotating shaft 421 is driven to rotate by a rotating driver 423, and one end of the rotating shaft 421 is connected to the connecting seat 41;

[0036] Specifically, the rotating shaft 421 is arranged along the length direction of the cutting liquid tank 10, one end of the connecting seat 41 is connected to the output end of the rotating shaft 421, and the other end is connected to the side end face of the cutting liquid tank 10, so that the cutting liquid tank 10 can rotate around the axis where the rotating shaft 421 is located, driving the guide plate 30 to rotate synchronously and adjust the spraying angle of the coolant.

[0037] Furthermore, the rotating assembly 42 further includes a rotating sleeve 422, in which the rotating shaft 421 is rotatably disposed, and one end of the rotating shaft 421 passes through the rotating sleeve 422 and is connected to the connecting seat 41; the rotating sleeve 422 is connected to the lifting assembly 43. The rotating sleeve 422 fixes and protects the rotating shaft 421 inside it, thereby achieving a stable connection between the rotating assembly 42 and the connecting seat 41.

[0038] The position of the rotation driver 423 in the present application is not limited, and it can be set inside the rotation sleeve 422 or outside the rotation sleeve 422.

[0039] There is a gap between the rotating sleeve 422 and the connecting seat 41 . When the rotating shaft 421 drives the connecting seat 41 to rotate, there is no friction between the connecting seat 41 and the rotating sleeve 422 .

[0040] In a specific embodiment, in order to prevent the length of the adjusting mechanism 40 from being too long and affecting the length of the overall device, the lifting assembly 43 and the connecting seat 41 are respectively arranged at the opposite ends of the rotating sleeve 422, and the rotating driver 423 is arranged on the outside of the rotating sleeve 422 and is located between the lifting assembly 43 and the connecting seat 41. It is connected to the rotating shaft 421 through a steering gear, which is more conducive to saving space; according to actual needs, the rotating shaft driver can be arranged in the outer shell, and the outer shell is detachably connected to the rotating sleeve 422, which is convenient for assembling the overall device and protecting the rotating driver 423.

[0041] Furthermore, the lifting assembly 43 in the present application includes a lifting block 431, a guide rod 432 and a lifting driver 433. Figure 3 As shown, the lifting block 431 is connected to the rotating assembly 42 , and the lifting assembly 43 is firmly connected to the rotating assembly 42 ; the guide rod 432 is movably connected to the lifting block 431 , and the lifting driver 433 can drive the lifting block 431 to move along the guide rod 432 .

[0042] Specifically, the lifting block 431 is connected to the other end of the rotating component 42 opposite to the connecting seat 41, and the guide rod 432 is perpendicular to the rotating shaft 421 and passes through the lifting block 431. When the lifting block 431 moves along the guide rod 432, it can drive the rotating component 42, the connecting seat 41 and the cutting liquid tank 10 to move synchronously, and finally realize that the guide plate 30 can move along the length direction of the guide rod 432; at the same time, through the rotating component 42, the guide plate 30 can rotate around a fixed axis in a direction perpendicular to the guide rod 432. It can be understood that the fixed axis coincides with the axis of the rotating shaft 421.

[0043] The present application drives the rotating component 42 to move through the lifting driver 433, and then drives the connecting seat 41 and the cutting liquid tank 10 to move, so as to adjust the position of the guide plate 30. Finally, through the cooperation of the rotating component 42 and the lifting component 43, the position and angle of the cutting liquid tank 10 and the guide plate 30 are adjusted in coordination, so that the coolant can be sprayed onto the single crystal silicon rod 90 and the diamond wire 70 all the time as the cutting process progresses.

[0044] The lifting block 431, guide rod 432 and lifting driver 433 in the present application can adopt sliding fit, thread fit or gear fit or other setting methods in the prior art, and can be selected according to actual needs, as long as the lifting block 431 can be moved along the guide rod 432.

[0045] Specifically, Figure 1 , Figure 2 and Figure 3 As shown, the cutting liquid tank 10 is generally a rectangular structure, the guide plate 30 is arranged along its length direction, and the connecting seat 41 is relatively arranged on the outside of the two side end surfaces on both sides of the length direction of the cutting liquid tank 10, and the distance between the two is matched with the length of the cutting liquid tank 10, so that the cutting liquid tank 10 can be installed on the connecting seat 41 in a snap-in manner to achieve convenient installation and disassembly; the rotating component 42 is arranged at the other end of the connecting seat 41 opposite to the cutting liquid tank 10, and the lifting component 43 is arranged at the other end of the rotating component 42 opposite to the connecting seat 41, so that the adjusting mechanism 40 can extend along the direction of the cutting liquid tank 10, and the overall layout is more compact, reducing space occupancy.

[0046] In a preferred embodiment, the guide rod 432 is threadedly connected to the lifting block 431 , and the lifting driver 433 is connected to the guide rod 432 and drives the guide rod 432 to rotate, so that the lifting block 431 can move along the guide rod 432 .

[0047] Specifically, the lifting drive 433 can be disposed at one end of the guide rod 432, or connected to the guide rod 432 via a steering gear; Figure 2 As shown, the mounting seat of the lifting driver 433 is arranged on the mounting plate of the wire cutting device; in a specific embodiment, the guide rod 432 is arranged along the height direction of the wire cutting device and is parallel to the mounting plate, the lifting driver 433 is arranged at one end of the guide rod 432, the rotating shaft of the lifting driver 433 is connected to the guide rod 432, and the mounting plate is also provided with a limit block 51, the limit block 51 is connected to the other end of the guide rod 432 relative to the lifting driver 433, and is used to limit the deviation of the guide rod 432, and at the same time limit the lifting block 431 to move between the lifting driver 433 and the limit block 51.

[0048] In other embodiments of the present application, when the mounting base of the lifting drive 433 is set on the mounting plate of the wire cutting equipment, its rotating shaft is perpendicular to the mounting plate and the guide rod 432, and is threadedly connected to the guide rod 432 through a steering gear, driving the guide rod 432 to rotate.

[0049] like Figure 4 As shown, the connecting seat 41 in the present application includes a first adjustment seat 411, and the first adjustment seat 411 is provided with a connecting groove 4111; ear plates are provided at both ends of the cutting liquid tank 10, and the ear plates can be inserted into the connecting groove 4111 through the opening of the connecting groove 4111.

[0050] Specifically, the ear plate is arranged on the side end plate of the cutting liquid trough 10 and protrudes outward; the ear plate is arranged along the height direction of the cutting liquid trough 10, and the connecting groove 4111 is a U-shaped groove, and its width is consistent with the thickness of the ear plate. The ear plate can enter the bottom of the connecting groove 4111 from the opening of the connecting groove 4111, and the operator can easily fix the cutting liquid trough 10 to the first adjustment seat 411; in order to ensure that the cutting liquid trough 10 will not fall out of the connecting groove 4111 during the movement and rotation, the ear plate and the connecting groove 4111 are also provided with matching through holes and are fixed with bolts.

[0051] Furthermore, if Figure 4 As shown, the connection grooves 4111 are provided in plurality and have different depths. Specifically, the first adjustment base 411 is provided with a plurality of connection grooves 4111, the depth of the connection grooves 4111 is set along the height direction of the cutting liquid tank 10, and the plurality of connection grooves 4111 are distributed along the width direction of the cutting liquid tank 10. When in use, the cutting liquid tank 10 is inserted into different connection grooves 4111, so that the position of the cutting liquid tank 10 in the height direction and the width direction can be adjusted, thereby adjusting the position of the guide plate 30, and realizing the adjustment of the cutting liquid spraying position.

[0052] In a specific embodiment, the connection groove 4111 is set to match the single crystal silicon rods 90 of different specifications. When the single crystal silicon rods 90 of different specifications are cut using wire cutting equipment, the cutting liquid groove 10 is inserted into the corresponding connection groove 4111, so that the cutting liquid groove 10 can not only achieve position changes along the length direction of the guide rod 432, but also achieve position changes along its own width direction, and can rotate around a fixed axis along its own length direction; through the cooperation of the connection groove 4111 with the rotating component 42 and the driving component, during the cutting process of single crystal silicon rods 90 of different specifications, the cutting liquid can be accurately sprayed on the single crystal silicon rods 90 and the diamond wire 70.

[0053] Furthermore, the connecting seat 41 also includes a second adjustment seat 412, and the second adjustment seat 412 and the first adjustment seat 411 are provided with matching clamping strips 4112 and guide grooves 4123 for clamping, the guide grooves 4123 are vertically arranged with the connecting grooves 4111, and the other side of the second adjustment seat 412 is connected to the rotating assembly 42.

[0054] Specifically, Figure 5 , Figure 6 As shown, one side of the first adjustment seat 411 is provided with a connecting groove 4111, which is connected to the cutting liquid tank 10; the other opposite side is connected to the second adjustment seat 412, and the two are respectively provided with a clamping strip 4112 and a guide groove 4123, and the clamping strip 4112 is clamped in the guide groove 4123 and can move along the guide groove 4123; the direction of the guide groove 4123 is perpendicular to the connecting groove 4111, that is, the guide groove 4123 is arranged along the width direction of the cutting liquid tank 10; when in use, the relative positions of the clamping strip 4112 and the guide groove 4123 can be adjusted as needed, so that the adjustment mechanism 40 can better adjust the position of the cutting liquid tank 10 to be suitable for single crystal silicon rods 90 of different specifications.

[0055] In a specific embodiment, the above-mentioned clamping strip 4112 is arranged on the first adjustment clamping seat 411, and a guide groove 4123 is arranged on one side of the second adjustment clamping seat 412. In order to realize the stable connection between the first adjustment clamping seat 411 and the second adjustment clamping seat 412, the two are provided with matching holes and can be fixed by bolt connection; or the first adjustment clamping seat 411, the second adjustment clamping seat 412 and the cutting liquid tank 10 are all provided with matching holes and are detachably connected together by bolts, so that the overall structural connection is more stable and convenient for assembly, maintenance and replacement.

[0056] In this embodiment, the number of the clamping strips 4112 and the guide grooves 4123 can be set as needed.

[0057] In a preferred embodiment, Figure 6 As shown, the second adjustment seat 412 includes a connecting plate 4121 and connecting blocks 4122 respectively arranged at opposite ends of the connecting plate 4121, and the two connecting blocks 4122 are arranged on the same side of the second adjustment seat 412, and the two are arranged at intervals; the guide groove 4123 is constructed on the connecting block 4122, and can be matched with the clamping strip 4112 of the first adjustment seat 411; the connecting plate 4121 is provided with a mounting hole matching the rotating shaft 421, and the rotating shaft 421 is connected to the connecting plate 4121 through the mounting hole, and the space between the two connecting blocks 4122 is sufficient to accommodate the rotating shaft 421 passing through the connecting hole.

[0058] The present application also proposes a wire cutting device, such as Figure 7As shown, the device is used to cut the single crystal silicon rod 90. It is equipped with the wire cutting cooling device proposed in the present application, and also includes a detection mechanism 100 and a control system (not shown). The detection mechanism 100 is used to detect the wire bow of the diamond wire 70 during the cutting process. The control system receives the signal of the detection mechanism 100 and controls the operation of the wire cutting cooling device to move and rotate the guide plate 30 to adjust the landing point of the coolant.

[0059] In the present application, the wire cutting cooling device is located above the main roller 60, and one or two wire cutting cooling devices can be provided as needed. When two wire cutting cooling devices are provided, the two wire cutting cooling devices are provided on opposite sides of the single crystal silicon rod 90, respectively, and can cooperate with each other to spray the cooling liquid on the single crystal silicon rod 90 and the diamond wire 70; when in use, the position and angle of the cooling liquid cutting groove are adjusted by the adjusting mechanism 40, so that the guide plate 30 can be moved up and down, left and right or rotated relative to the main roller 60, and the cooling liquid can be sprayed on the single crystal silicon rod 90 of different specifications when cutting, and in the cutting process, according to the position of the diamond wire 70 detected by the detection mechanism 100, the spraying point of the cooling liquid is adjusted so that the cooling liquid can be completely sprayed on the single crystal silicon rod 90 and the diamond wire 70, so as to ensure the cutting quality of the silicon wafer.

[0060] When used for cutting single crystal silicon rods 90 of different specifications, before cutting begins, the cutting liquid tank 10 can be inserted into different connection grooves 4111 of the first connection seat 41 as needed. For example, for a single crystal silicon rod 90 of smaller size, the cutting liquid tank 10 is inserted into the connection groove 4111 closer to the single crystal silicon rod 90; when a single crystal silicon rod 90 of larger size is used, the cutting liquid tank 10 is inserted into the connection groove 4111 farther away from the single crystal silicon rod 90, so as to better ensure the spraying of the cooling liquid during cutting.

[0061] During the cutting process, the posture of the diamond wire 70 gradually changes. After the detection mechanism 100 detects the change, it transmits a signal to the control system. The control system operates the adjustment mechanism 40 to move and rotate the guide plate 30. For example, when the contact position between the diamond wire 70 and the single crystal silicon rod 90 moves downward, the guide plate 30 is controlled to move downward and rotate in the direction in which the diamond wire 70 is tilted. This can ensure that the coolant can be completely sprayed onto the single crystal silicon rod 90 and the diamond wire 70, so that the diamond wire 70 is in the best liquid-carrying state during the entire cutting process.

[0062] A method for performing wire cutting using the above-mentioned wire cutting equipment, such as Figure 7 As shown, the following steps are included:

[0063] The cutting process of the single crystal silicon rod 90 includes a cutting preparation stage, a cutting stage, a main cutting stage, a cutting stage and a material lifting stage;

[0064] (1) In the cutting preparation stage, the height and angle of the cutting liquid tank 10 are adjusted according to the specifications of the single crystal silicon rod 90, so that the guide plate 30 is in the initial position. At this time, the diamond wire 70 is in a horizontal state, and the angle between the guide plate 30 and the horizontal direction is θ 1 ;

[0065] In this embodiment, the cutting preparation stage further includes installing the cutting liquid tank 10 on the adjustment mechanism 40 according to the specifications of the single crystal silicon rod 90 .

[0066] (2) During the knife-entering stage, the detection mechanism 100 detects that the diamond wire 70 is in a horizontal state, transmits a signal to the control system, and the control system controls the adjustment mechanism 40 to keep the guide plate 30 in the initial position;

[0067] (3) Main cutting stage, when the angle between the diamond wire 70 and the horizontal direction is θ 2 When the guide plate 30 is driven to rotate at an angle δ 1 , δ 1 With θ 2 Same size.

[0068] Specifically, in this stage, the diamond wire 70 is deflected, and when the detection mechanism 100 detects that the angle between the diamond wire 70 and the horizontal direction is θ 2 When the signal is transmitted to the control system, the control system controls the rotation driver 423 of the adjustment mechanism 40 to operate, so that the guide plate 30 rotates by an angle δ 1 , δ 1 With θ 2 The size is the same, and the direction of rotation is the same as the deflection direction of the diamond wire 70;

[0069] (4) In the knife-closing stage, the diamond wire 70 continues to deflect, and the detection mechanism 100 detects that the angle between the diamond wire 70 and the horizontal direction is θ 3 When the signal is transmitted to the control system, the control system controls the rotation driver 423 and the lifting driver 433 of the adjustment mechanism 40 to operate, so that the guide plate 30 rotates by an angle δ 2 , and descends to the first position; preferably, δ 2 Greater than θ 3 ;

[0070] (5) In the material lifting stage, the guide plate 70 is driven to rotate in the opposite direction to an angle of θ with the horizontal direction. 1 ; and drive the guide plate 70 to rise to the initial position.

[0071] Specifically, in order to facilitate the removal of the material holder 80 and the silicon wafer, the control system controls the rotation driver 423 to operate in the material removal stage, so that the guide plate 30 rotates in the reverse direction to an angle of θ with the horizontal direction. 1, and the lifting driver 433 is operated to raise the guide plate 30 to the initial position, so that the wire cutting cooling device is away from the single crystal silicon rod 90 to prevent the cutting liquid from being blocked by the material holder 80;

[0072] (6) Before the next cutting process begins, the guide plate 70 is driven to rise to the second position, which is higher than the initial position.

[0073] Specifically, the control system controls the lifting driver 433 to operate, so that the guide plate 30 continues to rise to the second position, providing sufficient operating space for the installation of the next single crystal silicon rod 90 to be cut, and the second position is higher than the initial position.

[0074] In a specific embodiment, the above method is used to cut the single crystal silicon rod 90, and the angle θ between the diamond wire 70 and the horizontal direction is 2 , and θ 3 and the angle θ between the guide plate 30 and the horizontal direction 1 , the rotation angle δ of the guide plate 30 1 and δ 2 The distances that the guide plate 30 descends and rises are all cutting process parameters and are set in advance in the control system. The entire cutting process is automatically controlled by the control system, which can achieve continuous operation and improve cutting efficiency.

[0075] In a specific embodiment, during the knife closing stage, the rotation angle δ of the guide plate 30 is 2 is the angle θ between the diamond wire 70 and the horizontal direction 3 Add 2°, and at the same time, the guide plate 30 drops 5mm to reach the first position; before the next cutting process starts, the guide plate 30 rises to the second position, and the second position is 150mm above the initial position.

[0076] Due to the adoption of the above technical scheme, the position and angle of the guide plate can be adjusted according to the specifications and cutting process of different single crystal silicon rods, so that the landing point of the coolant can be adjusted accordingly, ensuring that the coolant fully participates in the cutting process, cools and lubricates the diamond wire, and keeps the diamond wire in the best liquid-carrying state during the entire cutting process, thereby improving the cutting quality of the silicon wafer; by setting the first connecting seat and the connecting groove, single crystal silicon rods of various specifications can be cooled during cutting; by setting the adjusting mechanism, the cutting liquid tank and the guide plate are driven to move and rotate, so that the landing point of the coolant can be adjusted according to the cutting process; the overall cutting device has a simple structure, a stable connection, and is easy to use, and can realize continuous automatic operation.

[0077] The above is a detailed description of the embodiments of the utility model, but the contents are only preferred embodiments of the utility model and cannot be considered to limit the scope of implementation of the utility model. All equivalent changes and improvements made within the scope of application of the utility model should still fall within the scope of the patent coverage of the utility model.

Claims

1. A wire cutting cooling device, comprising a cutting liquid tank and a guide plate arranged at a liquid outlet of the cutting liquid tank, characterized in that: It also includes an adjusting mechanism, which is connected to the cutting liquid tank and includes a rotating component and a lifting component, which are respectively used to adjust the angle and position of the cutting liquid tank.

2. The wire cutting cooling device according to claim 1, characterized in that: The adjusting mechanism further comprises a connecting seat, which is engaged with the cutting liquid tank; the rotating assembly is connected with the connecting seat, and the connecting seat is driven to rotate by a rotating driver.

3. The wire cutting cooling device according to claim 2, characterized in that: The rotating assembly comprises a rotating shaft, which is driven to rotate by the rotating driver and one end of which is connected to the connecting seat.

4. The wire cutting cooling device according to claim 3, characterized in that: The rotating assembly also includes a rotating sleeve, and the rotating shaft passes through one end of the rotating sleeve and is connected to the connecting seat.

5. The wire cutting cooling device according to any one of claims 2 to 4, characterized in that: The lifting assembly comprises a lifting block, a guide rod and a lifting driver. The lifting block is connected to the rotating assembly; the guide rod is movably connected to the lifting block, and the lifting driver drives the lifting block to move along the guide rod.

6. The wire cutting cooling device according to claim 5, characterized in that: The guide rod is threadedly connected to the lifting block, and the lifting driver is connected to the guide rod and drives the guide rod to rotate.

7. The wire cutting cooling device according to any one of claims 2 to 4 and 6, characterized in that: The connecting seat comprises a first adjusting seat, and the first adjusting seat is provided with a connecting groove; ear plates are provided at both ends of the cutting liquid groove, and the ear plates can be inserted into the connecting groove through the opening of the connecting groove.

8. The wire cutting cooling device according to claim 7, characterized in that: The connecting seat also includes a second adjusting seat, and the second adjusting seat and the first adjusting seat are provided with matching clamping strips and guide grooves for clamping; the guide groove is perpendicular to the connecting groove.

9. A wire cutting device, characterized in that: The wire cutting cooling device is equipped with the wire cutting cooling device as described in any one of claims 1 to 8, and also includes a detection mechanism and a control system, wherein the detection mechanism is used to detect the wire bow of the diamond wire during the cutting process, and the control system receives the signal of the detection mechanism and controls the operation of the wire cutting cooling device to adjust the landing point of the coolant.

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