Heat conduction type sensor fixing device

By designing a thermally conductive sensor fixture, and using components such as sockets and wedge head slide rods to achieve rapid installation and disassembly, the problems of cumbersome disassembly and poor sealing in the prior art are solved, and the convenience of operation and sealing are improved.

CN222896118UActive Publication Date: 2025-05-23NANJING ANALYTICAL INSTR FACTORY
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Patent Information

Application Number
CN202421575638.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-05
Publication Date
2025-05-23
Estimated Expiration
2034-07-05

AI Technical Summary

Technical Problem

The installation method of existing thermal conductivity sensors is fixed by bolts, which leads to cumbersome disassembly during replacement, poor sealing and easy to damage.

Method used

A thermally conductive sensor fixing device is designed to improve gas sealing by setting up sockets in the tank or the position to be installed, and to use components such as wedge head slide rod, convex ring, fixing spring and wedge groove to achieve rapid installation and disassembly, combining rubber sealing ring and sealing ring to improve gas sealing.

Benefits of technology

It realizes the rapid and convenient installation and disassembly of thermally conductive sensors, which are convenient for maintenance and replacement, and improves sealing and avoids defects in bolt fixing methods.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a fixing device for a thermal conductivity type sensor, and belongs to mounting accessories of the thermal conductivity type sensor. According to the fixing device, a socket is arranged on a tank body or a to-be-installed position so as to fix the thermal conductivity type sensor; the socket is provided with a fixing assembly, the fixing assembly comprises a wedge head sliding rod, the wedge head sliding rod extends into a slot on the thermal conductivity type sensor to realize fixation, and a sealing layer is arranged at a fitting part of the socket and the thermal conductivity type sensor to realize sealing. Compared with an existing bolt fixing mode, the fixing device is more convenient and faster to use and easy to disassemble and assemble.
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Description

Technical Field

[0001] The utility model relates to the technical field of application of thermal conductivity sensors, in particular to a thermal conductivity sensor fixing device. Background Art

[0002] Many fields in industrial and agricultural production and daily life need to detect the state of concentration in order to achieve the purpose of automatic control. The thermal conductivity sensor is a sensor that measures the content of the substance being measured. The thermal conductivity sensor is based on the principle of the Wheatstone bridge. When the thermal conductivity of the detection is high, the heat will be more easily dissipated from the thermistor, and its resistance will decrease; the voltage difference generated in the Wheatstone bridge due to the change in the resistance of the thermistor can be measured, and then converted into a standard electrical signal after temperature compensation and linear correction, so as to analyze the content of the substance being measured.

[0003] In the prior art, the thermal conductivity sensor is often fixedly connected to the tank body or the contact surface by bolts. If the thermal conductivity sensor needs to be replaced due to aging or failure, the bolts fixing the thermal conductivity sensor need to be unscrewed one by one, and then the thermal conductivity sensor needs to be replaced. This installation method is relatively simple, but therefore does not provide sufficient protection for the sealing component, which is easy to be damaged and has poor sealing performance. Therefore, a thermal conductivity sensor fixing device is proposed to solve the above problems. Utility Model Content

[0004] The utility model aims to provide a thermal conductivity sensor fixing device to realize the rapid installation and disassembly of the thermal conductivity sensor on a tank body or a pipeline.

[0005] Technical solution: A thermal conductivity sensor fixing device, which fixes the thermal conductivity sensor by arranging a socket on the tank body or the position to be installed;

[0006] The socket is provided with a fixing assembly, and the fixing assembly includes a wedge slide bar, and the wedge slide bar is fixed by extending into a slot on the thermal conductivity sensor;

[0007] The fitting part between the socket and the thermal conductivity sensor is provided with a sealing layer.

[0008] Based on the above solution, further, the fixing assembly includes a wedge head slide bar, a convex ring, a fixing spring and a wedge-shaped groove;

[0009] The socket is slidably connected internally with wedge head slide bars distributed in a circular array and extending to the inner and outer sides thereof, the opposite side of the wedge head slide bars extends into the card slot, the outer side of the wedge head slide bars is fixedly connected with a convex ring located inside the socket, the opposite side of the convex ring is fixedly connected with a fixing spring located outside the wedge head slide bar, the fixing springs are located inside the socket, and the top of the wedge head slide bars is provided with a wedge-shaped groove adapted to the cylindrical shell.

[0010] Furthermore, the device is provided with a pressing assembly, and the pressing assembly controls the wedge head slide rod in the fixing assembly by pressing the columnar shell;

[0011] The pressing assembly includes a cylindrical shell, the top opening of the cylindrical shell is fitted to the side wall of the thermal conductivity sensor, and a fixing ring is provided at the contact position between the cylindrical shell and the thermal conductivity sensor, and the fixing ring restricts the cylindrical shell from falling off;

[0012] A pressing spring is arranged in the cylindrical shell, the pressing spring is located outside the thermal conductivity sensor, the lower end of the pressing spring abuts against a retaining ring, and the retaining ring can be located on the upper end surface of the socket;

[0013] The columnar shell is located correspondingly to the wedge-shaped groove at one end of the wedge head slide rod.

[0014] In order to achieve better gas sealing, a rubber sealing ring and / or a sealing ring is provided between the retaining ring and the upper end of the socket.

[0015] Furthermore, a chamfer is provided at the bottom edge of the columnar shell.

[0016] Preferably, the fixing ring and / or the slot are directly arranged on the thermal conductivity sensor, and are also arranged in the form of a sleeve, wherein the sleeve is fixed on the thermal conductivity sensor, and a fixing ring is fixed or a slot is arranged on the outside of the sleeve.

[0017] Preferably, the fixing assembly includes one or more fixing assemblies which are distributed in an annular manner on the outside of the thermal conductivity sensor and correspond to the card slots provided on the thermal conductivity sensor.

[0018] The card slot includes an annular groove arranged on the outer side of the thermal conductivity sensor to replace it.

[0019] Furthermore, the cylindrical shell is driven downward by pressing or rotating, and in the rotating mode, a threaded structure exists between the cylindrical shell and the outer wall of the socket. It is further pointed out that the fixed components distributed outside the thermal conductivity sensor can be synchronously operated by pressing the cylindrical shell.

[0020] Working principle: Install the thermal conductivity sensor, align the connecting plug with the socket, insert the connecting plug into the socket, make the sealing ring fit tightly with the rubber sealing ring, and then make the rubber sealing ring elastically deform. In the above process, when the connecting plug contacts the fixing component, the fixing component elastically deforms until the fixing component is aligned with the card slot. The fixing component restores the elastic deformation and enters the card slot, and the thermal conductivity sensor can be fixedly connected to the tank body or the contact surface. Remove the thermal conductivity sensor, press the pressing component to move the pressing component downward until the bottom of the pressing component contacts the fixing component, and then move the fixing component to the opposite side, so that the fixing component is separated from the card slot. At the same time, the rubber sealing ring restores the elastic deformation, and the connecting plug can be held to pull the thermal conductivity sensor out of the socket.

[0021] Beneficial effect: Compared with the existing method and device of installing and fixing the thermal conductivity sensor by bolts, the utility model can achieve fast and convenient installation and disassembly through the cooperation of the socket and the fixing component, which is convenient for subsequent maintenance and replacement operations. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the structure of the utility model;

[0023] Figure 2 It is an enlarged schematic diagram of the structure at a of the utility model;

[0024] Figure 3 This is a schematic diagram of the structure of the fixed component of the utility model;

[0025] Figure 4 This is a top view of the fixed component structure of the utility model;

[0026] Figure 5 This is a schematic diagram of the socket structure of the utility model;

[0027] Figure 6 It is a schematic diagram of the columnar shell structure of the utility model.

[0028] In the figure: 1. thermal conductivity sensor; 2. tank body; 3. connecting plug; 4. fixing ring; 5. pressing assembly; 501. retaining ring; 502. pressing spring; 503. cylindrical shell; 6. rubber sealing ring; 7. slot; 8. socket; 9. fixing assembly; 901. wedge head slide rod; 902. convex ring; 903. fixing spring; 904. wedge groove; 10. sealing ring. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0030] The thermal conductivity sensor fixing device provided by the utility model has the advantages of easy disassembly and assembly, and solves the problem that in the prior art, the thermal conductivity sensor and the tank body or the contact surface are often fixedly connected by bolts. If the thermal conductivity sensor needs to be replaced due to aging or failure, the bolts fixing the thermal conductivity sensor need to be unscrewed one by one, and then the thermal conductivity sensor needs to be replaced. This installation method is relatively cumbersome to disassemble.

[0031] In the embodiment, Figure 1-6 A thermal conductivity sensor fixing device is provided. The utility model comprises a thermal conductivity sensor 1 and a tank body 2 (to be installed). The lower part of the thermal conductivity sensor 1 is a connecting plug 3, and a fixing ring 4 is fixedly connected to the outer side of the connecting plug 3. A pressing component 5 tightly fitted with the bottom of the fixing ring 4 is provided on the outer side of the connecting plug 3. A rubber sealing ring 6 located on the outer side of the connecting plug 3 is provided at the bottom of the pressing component 5. A card slot 7 is opened on the outer side of the connecting plug 3 for fixing.

[0032] A hole is opened on the tank body 2 and a socket 8 adapted to the connecting plug 3 is provided. The interior of the socket 8 is provided with fixing components 9 distributed in a ring array and extending to the inner and outer sides thereof. The fixing components 9 include a wedge head slide bar 901, which can extend inwardly into the card slot 7. The fixing components 9 are all adapted to the pressing components 5, and a sealing ring 10 tightly fitting with the rubber sealing ring 6 is fixedly connected to the top of the socket 8.

[0033] The fixing assembly 9 includes a wedge slide 901, a convex ring 902, a fixing spring 903 and a wedge-shaped groove 904. The interior of the socket 8 is slidably connected with the wedge slides 901 distributed in a ring array and extending to the inside and outside thereof. The opposite side of the wedge slide 901 extends into the slot 7. The outer side of the wedge slide 901 is fixedly connected with the convex ring 902 located inside the socket 8. The opposite side of the convex ring 902 is fixedly connected with the fixing spring 903 located outside the wedge slide 901. The fixing springs 903 are all located inside the socket 8. The top of the wedge slide 901 is provided with a wedge-shaped groove 904 adapted to the cylindrical shell 503.

[0034] The operation of installing the thermal conductivity sensor 1 is as follows: align the connecting plug 3 with the socket 8, and insert the connecting plug 3 into the socket 8, so that the sealing ring 10 fits tightly with the rubber sealing ring 6, and then the rubber sealing ring 6 is elastically deformed. In the above process, when the connecting plug 3 contacts the wedge slide bar 901, the wedge slide bar 901 is moved to the opposite side thereof, and the convex ring 902 squeezes the fixing spring 903 at the same time to make the fixing spring 903 elastically deformed, until the wedge slide bar 901 is aligned with the card slot 7, so that the fixing spring 903 recovers its elastic shape, and the fixing spring 903 pushes the wedge slide bar 901 through the convex ring 902, so that the wedge slide bar 901 moves to the opposite side thereof, and the wedge slide bar 901 enters the card slot 7, and the thermal conductivity sensor 1 can be fixedly connected to the tank body or the contact surface 2;

[0035] The pressing assembly 5 includes a retaining ring 501, a pressing spring 502 and a cylindrical shell 503. The outer side of the connecting plug 3 is fixedly connected to the retaining ring 501 located below the fixing ring 4. The top of the retaining ring 501 is fixedly connected to the pressing spring 502 located on the outer side of the connecting plug 3. The top of the pressing spring 502 is fixedly connected to the cylindrical shell 503 which is slidably connected to the connecting plug 3. The bottom edge of the cylindrical shell 503 is provided with a chamfer.

[0036] Remove the thermal conductivity sensor 1, press the cylindrical shell 503 to move it downward until the bottom of the cylindrical shell 503 contacts the wedge-shaped groove 904, and then move the wedge head slide bar 901 to the opposite side, so that the wedge head slide bar 901 is separated from the card slot 7. At the same time, the rubber sealing ring 6 restores its elastic deformation, and the connecting plug 3 can be held to pull the thermal conductivity sensor 1 out of the socket 8.

[0037] It should be noted that although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A thermal conductivity sensor fixing device, characterized in that: The fixing device fixes the thermal conductivity sensor (1) by arranging a socket (8) on the tank body or the position to be installed; The socket (8) is provided with a fixing assembly (9), and the fixing assembly (9) comprises a wedge-head slide bar (901), and the wedge-head slide bar (901) is fixed by extending into a slot (7) on the thermal conductivity sensor (1); The fitting portion between the socket (8) and the thermal conductivity sensor (1) is provided with a sealing layer.

2. The thermal conductivity sensor fixing device according to claim 1, characterized in that: The fixing assembly (9) comprises a wedge-shaped sliding rod (901), a convex ring (902), a fixing spring (903) and a wedge-shaped groove (904); The socket (8) is internally slidably connected with wedge head slide bars (901) distributed in a circular array and extending to the inside and outside thereof, the opposite side of the wedge head slide bar (901) extends into the card slot (7), the outer side of the wedge head slide bar (901) is fixedly connected with a convex ring (902) located inside the socket (8), the opposite side of the convex ring (902) is fixedly connected with a fixing spring (903) located outside the wedge head slide bar (901), the fixing spring (903) is located inside the socket (8), and the top of the wedge head slide bar (901) is provided with a wedge-shaped groove (904) adapted to the columnar shell (503).

3. The thermal conductivity sensor fixing device according to claim 2, characterized in that: The device is provided with a pressing component (5), and the pressing component (5) controls the wedge head slide rod (901) in the fixing component (9) by pressing the columnar shell (503); The pressing assembly (5) comprises a cylindrical shell (503), the top opening of the cylindrical shell (503) being in contact with the side wall of the thermal conductivity sensor (1), and a fixing ring (4) being provided at the contact position between the cylindrical shell (503) and the thermal conductivity sensor (1), the fixing ring (4) preventing the cylindrical shell (503) from falling off; A pressing spring (502) is provided in the cylindrical shell (503), the pressing spring (502) is located outside the thermal conductivity sensor (1), the lower end of the pressing spring (502) is in contact with a retaining ring (501), and the retaining ring (501) can be located on the upper end surface of the socket (8); The columnar shell (503) corresponds to the position of the wedge-shaped groove (904) at one end of the wedge head sliding rod (901).

4. The thermal conductivity sensor fixing device according to claim 3, characterized in that: A rubber sealing ring (6) and / or a sealing ring (10) is provided between the retaining ring (501) and the upper end of the socket (8).

5. The thermal conductivity sensor fixing device according to claim 2, characterized in that: The bottom edge of the columnar shell (503) is provided with a chamfer.

6. The thermal conductivity sensor fixing device according to claim 1, characterized in that: The fixing ring (4) and / or the slot (7) may be directly arranged on the thermal conductivity sensor (1), or may be arranged in the form of a sleeve, wherein the sleeve is fixed on the thermal conductivity sensor (1), and the fixing ring (4) is fixed on the outside of the sleeve or the slot (7) is arranged.

7. The thermal conductivity sensor fixing device according to claim 1, characterized in that: The fixing assembly (9) includes one or more fixing assemblies (9) which are arranged in an annular manner on the outside of the thermal conductivity sensor (1) and correspond to the card slots (7) arranged on the thermal conductivity sensor (1).

8. The thermal conductivity sensor fixing device according to claim 1 or 7, characterized in that: The card slot (7) comprises an annular groove arranged on the outer side of the thermal conductivity sensor (1) as a replacement.

9. The thermal conductivity sensor fixing device according to claim 3, characterized in that: The method of driving the columnar shell (503) downwards includes pressing or rotating; In the rotating mode, the cylindrical shell (503) and the outer side wall of the socket (8) have a threaded structure.