Laminated plate with accelerated heat dissipation structure

Abstract

The utility model discloses a laminated plate with an accelerated heat dissipation structure, which comprises an upper copper foil and a lower copper foil, a first heat conducting plate and a second heat conducting plate are respectively adhered to the end faces, close to each other, of the upper copper foil and the lower copper foil, and a plurality of heat dissipation plates are fixedly connected between the first heat conducting plate and the second heat conducting plate. The first heat conduction plate and the second heat conduction plate are arranged on the upper copper foil and the lower copper foil respectively, the heat dissipation plates are vertically arranged, a heat dissipation seam is formed between every two adjacent heat dissipation plates, and a mounting groove is further formed between the upper copper foil and the lower copper foil. The heat of the upper copper foil and the heat of the lower copper foil are conducted through the first heat conduction plate and the second heat conduction plate, so that the heat is conducted to the heat dissipation plates; the heat dissipation seams formed between every two adjacent heat dissipation plates can rapidly volatilize heat on the heat dissipation plates, meanwhile, the motor is started to drive the fan to rotate, air is blown into the air channel, airflow in the air channel can flow to the heat dissipation seams along the air blowing seams, and hot air accumulated in the heat dissipation seams can rapidly flow out.

Description

Technical Field

[0001] The utility model relates to the technical field of laminated boards, in particular to a laminated board with a heat dissipation acceleration structure. Background Art

[0002] PCB, also known as printed circuit board or printed circuit board, is an important electronic component, a support for electronic components, and a provider of electrical connections for electronic components. A multilayer printed circuit board can also be called a build-up board, which refers to a printed circuit board with more than two layers. It is composed of connecting wires on several layers of insulating substrates and pads for assembling and welding electronic components. It has the function of conducting each layer of circuits and insulating each other.

[0003] The existing laminated board has poor heat dissipation effect. When in use, a large amount of heat will accumulate inside the laminated board and cannot be volatilized, which may easily cause the circuit board to burn or even cause a fire. Therefore, a laminated board with an accelerated heat dissipation structure is proposed. Utility Model Content

[0004] The purpose of the utility model is to provide a laminated board with a heat dissipation acceleration structure to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a laminate with an accelerated heat dissipation structure, comprising an upper copper foil and a lower copper foil, a first heat conducting plate and a second heat conducting plate are respectively adhered to the end surfaces of the upper copper foil and the lower copper foil that are close to each other, a plurality of heat dissipation plates are fixedly connected between the first heat conducting plate and the second heat conducting plate, the heat dissipation plates are vertically arranged, and a heat dissipation gap is formed between two adjacent heat dissipation plates, an installation groove is also opened between the upper copper foil and the lower copper foil, the installation groove is located at one end of the heat dissipation gap, and a heat dissipation mechanism is arranged in the installation groove.

[0006] As a further preferred embodiment of the present technical solution, the plurality of heat dissipation plates are distributed at equal intervals.

[0007] As a further preferred embodiment of the present technical solution, the heat dissipation mechanism consists of an L-shaped plate, a connecting plate and a fan, the connecting plate is fixedly connected to the side walls of the upper copper foil and the lower copper foil, and one end of the connecting plate close to the heat dissipation seam is fixedly connected to two L-shaped plates, an air duct is formed between the two L-shaped plates and the connecting plate, one end of the air duct is in a sealed state, a fan is provided at the other end of the air duct, the fan is connected to the inner wall of the air duct through a driving assembly, and an air blowing seam is formed between the two vertical plates of the two L-shaped plates, and the air blowing seam connects the air duct and the heat dissipation seam.

[0008] As a further preferred embodiment of the present technical solution, the two L-shaped plates are symmetrically distributed on the upper and lower sides of the side wall of the connecting plate.

[0009] As a further preferred embodiment of the present technical solution, the driving assembly consists of a mounting plate, a motor, and a cross; the mounting plate is fixedly connected to the inner wall of the air duct; a through slot is provided in the middle of the mounting plate; crosses are fixedly connected to both ends of the through slot; a fan is rotatably connected between the two crosses; a motor is also fixedly mounted on the side wall of one of the crosses, and the output shaft of the motor is fixedly connected to the fan.

[0010] As a further preferred embodiment of the present technical solution, the distance between two end surfaces of the two L-shaped plates that are away from each other is equal to the height of the mounting groove.

[0011] As a further preferred embodiment of the present technical solution, the width of the horizontal plate of the L-shaped plate is equal to the width of the mounting groove.

[0012] The utility model provides a laminated board with a heat dissipation acceleration structure, which has the following beneficial effects:

[0013] The utility model conducts the heat of the upper copper foil and the lower copper foil through the first heat conducting plate and the second heat conducting plate, so that the heat is conducted to the heat dissipation plate. The heat dissipation gap formed between two adjacent heat dissipation plates can quickly volatilize the heat on the heat dissipation plate. At the same time, the motor is started to drive the fan to rotate, so as to blow air into the air duct. The airflow in the air duct will flow to the heat dissipation gap along the blowing gap, so that the hot air accumulated in the heat dissipation gap can quickly flow out. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0015] Figure 2 It is a preliminary disassembly schematic diagram of the overall structure of the utility model;

[0016] Figure 3 It is a further disassembly schematic diagram of the overall structure of the utility model;

[0017] Figure 4 For this utility model Figure 2 The structural diagram of A in the figure;

[0018] In the figure: 1. upper copper foil; 2. L-shaped plate; 3. connecting plate; 4. air blowing slit; 5. heat dissipation slit; 6. mounting groove; 7. lower copper foil; 8. first heat conducting plate; 9. second heat conducting plate; 10. heat dissipation plate; 11. cross; 12. fan; 13. motor; 14. mounting plate; 15. through groove. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0020] The utility model provides a technical solution: Figures 1 to 4 As shown, in this embodiment, a laminate with an accelerated heat dissipation structure includes an upper copper foil 1 and a lower copper foil 7, and a first heat conducting plate 8 and a second heat conducting plate 9 are respectively adhered to the end surfaces of the upper copper foil 1 and the lower copper foil 7 that are close to each other. A plurality of heat dissipation plates 10 are fixedly connected between the first heat conducting plate 8 and the second heat conducting plate 9. The heat dissipation plates 10 are vertically arranged, and the plurality of heat dissipation plates 10 are evenly spaced. A heat dissipation gap 5 is formed between two adjacent heat dissipation plates 10. A mounting groove 6 is also opened between the upper copper foil 1 and the lower copper foil 7. The mounting groove 6 is located at one end of the heat dissipation gap 5, and a heat dissipation mechanism is arranged in the mounting groove 6.

[0021] The heat dissipation mechanism consists of an L-shaped plate 2, a connecting plate 3 and a fan 12. The connecting plate 3 is fixedly connected to the side walls of the upper copper foil 1 and the lower copper foil 7. One end of the connecting plate 3 close to the heat dissipation seam 5 is fixedly connected to two L-shaped plates 2. The two L-shaped plates 2 are symmetrically distributed on the upper and lower sides of the side wall of the connecting plate 3. An air duct is formed between the two L-shaped plates 2 and the connecting plate 3. One end of the air duct is in a sealed state. A fan 12 is provided at the other end of the air duct. The fan 12 is connected to the inner wall of the air duct through a driving assembly. An air blowing seam 4 is formed between the two vertical plates of the two L-shaped plates 2. The air blowing seam 4 connects the air duct and the heat dissipation seam 5.

[0022] The fan 12 is driven to rotate by the driving assembly, and the rotation of the fan 12 will blow air into the air duct, and the airflow in the air duct will flow along the blowing slit 4 to the heat dissipation slit 5, thereby quickly dissipating the hot air in the heat dissipation slit 5.

[0023] Among them, the driving component consists of a mounting plate 14, a motor 13, and a cross 11. The mounting plate 14 is fixedly connected to the inner wall of the air duct. A through slot 15 is opened in the middle of the mounting plate 14. The two ends of the through slot 15 are respectively fixedly connected to the cross 11. A fan 12 is rotatably connected between the two crosses 11. A motor 13 is also fixedly installed on the side wall of one of the crosses 11, and the output shaft of the motor 13 is fixedly connected to the fan 12.

[0024] The fan 12 can be driven by the motor 13 to blow air into the air duct.

[0025] The distance between the two end surfaces of the two L-shaped plates 2 that are far away from each other is equal to the height of the mounting groove 6 , and the width of the horizontal plate of the L-shaped plate 2 is equal to the width of the mounting groove 6 .

[0026] Such an arrangement can ensure that the outer surfaces of the two L-shaped plates 2 can be matched with the inner wall of the installation groove 6 .

[0027] The utility model provides a laminated board with a heat dissipation acceleration structure, and the specific working principle is as follows:

[0028] The heat of the upper copper foil 1 and the lower copper foil 7 is conducted through the first heat conducting plate 8 and the second heat conducting plate 9, so that the heat is conducted to the heat dissipation plate 10. The heat dissipation gap 5 formed between two adjacent heat dissipation plates 10 can quickly volatilize the heat on the heat dissipation plate 10. At the same time, the motor 13 is started to drive the fan 12 to rotate, so as to blow air into the air duct. The airflow in the air duct will flow to the heat dissipation gap 5 along the blowing gap 4, so that the hot air accumulated in the heat dissipation gap 5 can quickly flow out.

[0029] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A laminate having a heat dissipation accelerating structure, comprising an upper copper foil (1) and a lower copper foil (7), characterized in that: A first heat conducting plate (8) and a second heat conducting plate (9) are respectively adhered to the end surfaces of the upper copper foil (1) and the lower copper foil (7) that are close to each other; a plurality of heat dissipating plates (10) are fixedly connected between the first heat conducting plate (8) and the second heat conducting plate (9); the heat dissipating plates (10) are vertically arranged, and a heat dissipating seam (5) is formed between two adjacent heat dissipating plates (10); a mounting groove (6) is also provided between the upper copper foil (1) and the lower copper foil (7); the mounting groove (6) is located at one end of the heat dissipating seam (5), and a heat dissipating mechanism is provided in the mounting groove (6).

2. The laminate with a heat dissipation acceleration structure according to claim 1, characterized in that: The plurality of heat dissipation plates (10) are distributed at equal intervals.

3. The laminate with a heat dissipation accelerating structure according to claim 1, characterized in that: The heat dissipation mechanism is composed of an L-shaped plate (2), a connecting plate (3) and a fan (12); the connecting plate (3) is fixedly connected to the side walls of the upper copper foil (1) and the lower copper foil (7); one end of the connecting plate (3) close to the heat dissipation slit (5) is fixedly connected to two L-shaped plates (2); an air duct is formed between the two L-shaped plates (2) and the connecting plate (3); one end of the air duct is in a sealed state; a fan (12) is provided at the other end of the air duct; the fan (12) is connected to the inner wall of the air duct via a driving component; an air blowing slit (4) is formed between two vertical plates of the two L-shaped plates (2); the air blowing slit (4) connects the air duct and the heat dissipation slit (5).

4. The laminate with a heat dissipation acceleration structure according to claim 3, characterized in that: The two L-shaped plates (2) are symmetrically distributed on the upper and lower sides of the side wall of the connecting plate (3).

5. The laminate with a heat dissipation acceleration structure according to claim 3, characterized in that: The driving assembly is composed of a mounting plate (14), a motor (13), and a cross (11); the mounting plate (14) is fixedly connected to the inner wall of the air duct; a through slot (15) is provided in the middle of the mounting plate (14); the two ends of the through slot (15) are respectively fixedly connected to the cross (11); a fan (12) is rotatably connected between the two crosses (11); a motor (13) is also fixedly installed on the side wall of one of the crosses (11); and the output shaft of the motor (13) is fixedly connected to the fan (12).

6. The laminate with a heat dissipation accelerating structure according to claim 3, characterized in that: The distance between the two end surfaces of the two L-shaped plates (2) that are away from each other is equal to the height of the mounting groove (6).

7. The laminate with a heat dissipation acceleration structure according to claim 3, characterized in that: The width of the horizontal plate of the L-shaped plate (2) is equal to the width of the mounting groove (6).

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