Chip manufacturing equipment
Through the chip manufacturing equipment integrating a huge amount of transfer mechanism and laser crystal solidification mechanism, the problems of low production efficiency and poor soldering quality during Mini LED display chip packaging are solved, and an efficient and stable chip manufacturing process is achieved.
Patent Information
- Application Number
- CN202420765360.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-15
- Publication Date
- 2025-05-23
- Estimated Expiration
- 2034-04-15
AI Technical Summary
During the precision packaging process of Mini LED display chips, the visual alignment and loading and unloading steps between the huge transfer equipment and the high-temperature crystal solidification process in the prior art lead to too long production operation time, affecting production efficiency, and there is a false welding phenomenon in the crystal solidification process, resulting in unqualified electrical test performance.
Design a chip manufacturing equipment, combining a huge transfer mechanism and a laser crystal solidification mechanism, realize the integration of the huge transfer of the chip and the laser crystal solidification process, and realize the eutectic bonding of the chip through transparent pressure plates and laser devices to avoid dummy welding.
Improve production efficiency and yield, reduce production steps, ensure the welding quality and electrical performance of the chip, and avoid problems such as dummy welding and welding drift.
Smart Images
Figure CN222897504U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of chip technology, and in particular to a chip manufacturing device. Background Art
[0002] Mini LED display is an array composed of a large number of LED chip grains arranged in a certain order on the driving circuit substrate, and its packaging requires a precise welding process. Laser welding is a welding method that uses an instantaneous high-energy laser beam as a heat source. It has many advantages such as a small heat-affected area, fast welding speed, and high welding quality, which is well suited to the field of Mini LED precision packaging.
[0003] In the current Mini / Micro-LED mass transfer equipment, after completing the mass transfer of chips, a further high-temperature die bonding process needs to be performed on another device. In the two devices, multiple visual alignment and loading and unloading process steps are required, resulting in a long production operation time and affecting production efficiency. In addition, the die bonding process usually performs eutectic reflow on the transferred chips and substrates to achieve the interconnection of metal electrodes. However, in this process, due to the occurrence of cold solder joints and other phenomena, the cured chip array will fail the electrical test performance during the electrical test.
[0004] BACKGROUND OF THE PRESENT APPLICATION The above information disclosed is only for understanding the background of the concept of the present application and may contain information that does not constitute the prior art. Utility Model Content
[0005] Based on this, in order to solve the above problems, it is necessary to provide a chip manufacturing equipment.
[0006] A chip manufacturing device, comprising:
[0007] frame;
[0008] A mass transfer mechanism, which is disposed on the rack and is used to realize mass transfer of chips;
[0009] A laser crystal bonding mechanism, the laser crystal bonding mechanism includes a transparent pressure plate, a laser device and a bonding platform arranged on the frame, the bonding platform is located below the laser device, the bonding platform is used to receive the chip transferred by the mass transfer mechanism, the chip includes a substrate, a plurality of chip grains and flux arranged on the substrate, the transparent pressure plate is used to cover all the chip grains on the substrate, and the laser device is used to emit laser to the chip to achieve eutectic bonding of the chip.
[0010] The above chip manufacturing equipment includes at least the following beneficial effects: the chip manufacturing equipment of the present application combines the mass transfer mechanism and the laser crystal bonding mechanism into one, and the chip substrate after the mass chip transfer and AOI inspection can be directly transferred to the location of the laser crystal bonding mechanism, without the need to perform further high-temperature crystal bonding process on another device after completing the mass transfer of the chip as in the traditional solution, which is conducive to improving production efficiency and yield. It should be emphasized that the transparent pressure plate provided in the present application can press the chip on the bonding table, and the transparent pressure plate can uniformly apply pressure to the chip grains on the chip substrate, so that when the laser device emits laser to the chip for eutectic bonding, the welding pressure at various locations of the chip is controlled to be relatively consistent, which can avoid the generation of large thermal stress in the laser welding area, resulting in cold welding or welding drift of the chip grains.
[0011] In one embodiment, the transparent pressing plate is provided with air holes. It is understandable that if the transparent pressing plate is not provided with air holes, the pressing plate is not airtight, and welding whitening phenomenon will occur during welding, that is, the flux volatilization residue, these organic substances are deposited around the solder joints and on the chip surface, and are not easy to clean, affecting the welding effect and chip brightness; while the transparent pressing plate of this embodiment is provided with air holes, during the welding process, the objects generated by the volatilization of the flux can be discharged from the air holes in time, thereby avoiding the welding whitening phenomenon, which is conducive to improving the welding effect and chip brightness.
[0012] In one embodiment, the vent holes are arranged at the periphery of the chip crystal grain. Substances generated by the volatilization of the solder flux often appear at the gap between the chip crystal grain and the substrate, that is, at the periphery of the chip crystal grain. The vent holes are arranged there to facilitate the rapid escape of gas.
[0013] In one embodiment, the ventilation holes are provided in a plurality. Adding ventilation holes on the transparent pressing plate allows substances generated by the volatilization of the soldering flux to be discharged faster, further improving the soldering effect.
[0014] In one embodiment, the air vent is in the shape of an elongated strip, and the air vent is provided in plurality, and the plurality of the elongated air vents are arranged at intervals along their width direction, and the plurality of the chip grains are arranged in a plurality of rows on the chip, and the chip grains in any row are sandwiched between two of the elongated air vents.
[0015] In one embodiment, the width of the air vent is 0.2 mm-0.4 mm.
[0016] In one embodiment, the width of the air vent is 0.3 mm.
[0017] In one of the embodiments, the size of the transparent pressing plate is adapted to the size of the substrate.
[0018] In one embodiment, the transparent pressing plate is a transparent glass pressing plate, a transparent plastic pressing plate or a transparent stone crystal pressing plate.
[0019] In one embodiment, the laser device is an infrared laser device. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0021] Figure 1 A structural stereogram of a chip manufacturing device provided in one embodiment of the present application.
[0022] Figure 2 A structural stereoscopic diagram of a transparent pressure plate provided in one embodiment of the present application.
[0023] Figure 3 A top view of a transparent pressing plate provided in one embodiment of the present application pressing on a chip.
[0024] Reference numerals:
[0025] 10. Chip manufacturing equipment; 100. Rack; 200. Mass transfer mechanism; 300. Laser crystal bonding mechanism; 310. Transparent pressure plate; 311. Air vents; 320. Laser device; 330. Bonding station; 400. Chip; 410. Substrate; 420. Chip grain; D. Width. DETAILED DESCRIPTION
[0026] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.
[0027] See also Figure 1 , Figure 2 and Figure 3In some embodiments, the present application provides a chip manufacturing device 10, which includes a frame 100, a mass transfer mechanism 200 and a laser crystal bonding mechanism 300, wherein the mass transfer mechanism 200 is arranged on the frame 100 and is used to realize the mass transfer of chips 400; the laser crystal bonding mechanism 300 includes a transparent pressure plate 310, a laser device 320 arranged on the frame 100 and a bonding table 330, wherein the bonding table 330 is located below the laser device 320, and the bonding table 330 is used to receive the chip 400 transferred by the mass transfer mechanism 200, the chip 400 includes a substrate 410, a plurality of chip grains 420 arranged on the substrate 410, and a flux, the transparent pressure plate 310 is used to cover all the chip grains 420 on the substrate 410, and the laser device 320 is used to emit laser to the chip 400 to realize eutectic bonding of the chip 400.
[0028] The chip manufacturing equipment 10 mentioned above includes at least the following beneficial effects: the chip manufacturing equipment 10 of the present application combines the mass transfer mechanism 200 and the laser crystal bonding mechanism 300 into one, and the chip 400 substrate 410 after the mass chip 400 transfer and AOI inspection can be directly transferred to the location of the laser crystal bonding mechanism 300, without the need to perform further high-temperature crystal bonding process on another device after completing the mass transfer of the chip 400 as in the traditional solution, which is conducive to improving production efficiency and yield. It should be emphasized that the transparent pressure plate 310 set in the present application can press the chip 400 on the bonding table 330, and the transparent pressure plate 310 can uniformly apply pressure to the chip grain 420 on the substrate 410 of the chip 400, so that when the laser device 320 emits laser to the chip 400 for eutectic bonding, the welding pressure at various locations of the control chip 400 is relatively consistent, which can avoid the generation of large thermal stress in the laser welding area, resulting in cold welding or welding drift of the chip grain 420.
[0029] Specifically, Figure 2 and Figure 3 As shown, in some embodiments, the transparent pressing plate 310 is provided with air holes 311. It is understandable that if the transparent pressing plate 310 does not have air holes 311, the pressing plate is not airtight, and welding whitening phenomenon will occur during welding, that is, the flux volatilization residue, these organic substances are deposited around the solder joints and on the surface of the chip 400, and are not easy to clean, affecting the welding effect and the brightness of the chip 400; while the transparent pressing plate 310 of this embodiment is provided with air holes 311, during the welding process, the objects generated by the volatilization of the flux can be discharged from the air holes 311 in time, thereby avoiding the welding whitening phenomenon, which is conducive to improving the welding effect and the brightness of the chip 400.
[0030] More specifically, if Figure 2 and Figure 3As shown, in some embodiments, the vent holes 311 are provided in plurality. Adding the vent holes 311 on the transparent pressing plate 310 allows the substances generated by the volatilization of the soldering flux to be discharged faster, further improving the soldering effect.
[0031] More specifically, if Figure 3 As shown, in some embodiments, the vent holes 311 are provided at the periphery of the chip die 420. Substances generated by the volatilization of the solder flux often appear at the gap where the chip die 420 and the substrate 410 are combined, that is, at the periphery of the chip die 420, and the vent holes 311 are provided here to facilitate the rapid escape of gas.
[0032] More specifically, if Figure 3 As shown, in some embodiments, the air pore 311 is in the shape of an elongated strip, and the air pore 311 is provided in plurality, and the plurality of the elongated air pores 311 are arranged at intervals along the direction of their own width D, and the plurality of the chip grains 420 are arranged in multiple rows on the chip 400, and the chip grains 420 in any row are sandwiched between two of the elongated air pores 311.
[0033] Furthermore, in some embodiments, the width D of the air pore 311 is 0.2 mm-0.4 mm.
[0034] Furthermore, in some embodiments, the width D of the air pore 311 is 0.3 mm.
[0035] Furthermore, in some of the embodiments, the size of the transparent pressing plate 310 is adapted to the size of the substrate 410 .
[0036] Furthermore, in some of the embodiments, the transparent pressing plate 310 is a transparent glass pressing plate, a transparent plastic pressing plate or a transparent stone crystal pressing plate.
[0037] Furthermore, in some of the embodiments, the laser device 320 is an infrared laser device 320 .
[0038] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0039] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.
[0040] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.
[0041] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
[0042] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.
[0043] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.
[0044] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.
[0045] In the description of this specification, the description of reference terms "one embodiment", "other implementation methods", etc. means that the specific features, structures, materials or features described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by technicians in the technical field of the present application. The terms used herein in the specification of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application.
Claims
1. A chip manufacturing device, characterized in that: include: frame; A mass transfer mechanism, which is disposed on the rack and is used to realize mass transfer of chips; A laser crystal bonding mechanism, the laser crystal bonding mechanism includes a transparent pressure plate, a laser device and a bonding platform arranged on the frame, the bonding platform is located below the laser device, the bonding platform is used to receive the chip transferred by the mass transfer mechanism, the chip includes a substrate, a plurality of chip grains and flux arranged on the substrate, the transparent pressure plate is used to cover all the chip grains on the substrate, and the laser device is used to emit laser to the chip to achieve eutectic bonding of the chip.
2. The chip manufacturing equipment according to claim 1, characterized in that: The transparent pressing plate is provided with ventilation holes.
3. The chip manufacturing equipment according to claim 2, characterized in that: The vent holes are arranged at the periphery of the chip grain.
4. The chip manufacturing equipment according to claim 3, characterized in that: The ventilation holes are arranged in plurality.
5. The chip manufacturing equipment according to claim 3, characterized in that: The air holes are in the shape of long strips, and there are multiple air holes. The multiple air holes in the shape of long strips are arranged at intervals along their width direction. The multiple chip grains are arranged in multiple rows on the chip, and the chip grains in any row are sandwiched between two air holes in the shape of long strips.
6. The chip manufacturing equipment according to claim 5, characterized in that: The width of the vent hole is 0.2mm-0.4mm.
7. The chip manufacturing equipment according to claim 6, characterized in that: The width of the vent hole is 0.3 mm.
8. The chip manufacturing equipment according to any one of claims 1 to 7, characterized in that: The size of the transparent pressing plate is matched with the size of the substrate.
9. The chip manufacturing equipment according to any one of claims 1 to 7, characterized in that: The transparent pressing plate is a transparent glass pressing plate, a transparent plastic pressing plate or a transparent stone crystal pressing plate.
10. The chip manufacturing equipment according to any one of claims 1 to 7, characterized in that: The laser device is an infrared laser device.