Surface sand blasting treatment device for nickel and gold immersion circuit board processing

Abstract

The utility model relates to the technical field of circuit board processing, in particular to a surface sand blasting treatment device for processing a nickel-gold immersion circuit board, which comprises a conveying mechanism for conveying the nickel-gold immersion circuit board and an overturning mechanism for overturning the nickel-gold immersion circuit board, and the overturning mechanism is positioned on one side of the output end of the conveying mechanism. The overturning mechanism comprises a supporting frame, a driving assembly, a shaft rod, overturning limiting assemblies and an anti-falling assembly, the supporting frame, the driving assembly, the shaft rod, the overturning limiting assemblies and the anti-falling assembly are distributed in a diagonal bracing structure mode, the overturning limiting assemblies are located on the shaft rod in a diagonal bracing mode, each overturning limiting assembly comprises flange blocks which are arranged in a symmetrical structure mode, and overturning grooves for placing the nickel-gold immersion circuit board are horizontally formed in one sides of the two flange blocks; the inside of the flange block sleeves the outer circumferential wall of the shaft rod through a shaft sleeve; the overturning structure is simple, the nickel immersion gold circuit board with one side subjected to sand blasting is overturned through the stepping motor, the shaft rod, the flange block and the anti-falling limiting rod, the structure is simple, the mechanical structure is simplified, and the operation convenience is high.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board processing, in particular to a surface sandblasting treatment device for processing immersion nickel-gold circuit boards. Background Technique

[0002] Immersion nickel-gold is a precious metal, mainly used in the production of electronic circuit boards, electroplated alloys and contact materials, etc. Due to its excellent electrical conductivity, good ductility and chemical stability, it is considered an ideal material for making high-quality electronic components.

[0003] The surface sandblasting treatment for processing immersion nickel-gold circuit boards is to convey and flip the immersion nickel-gold circuit boards through a conveying and flipping assembly, and polish and clean them by spraying sand grains. This device can effectively remove oxides, oils and other pollutants on the surface of the circuit board, improve its electrical conductivity and adhesion, and provide a good foundation for subsequent processes.

[0004] A flipping device for a circuit board sandblaster described in the prior art includes a flipping device main body. The flipping device main body includes a horizontal telescopic cylinder. An electric rotating clamp is movably installed at one end of the horizontal telescopic cylinder, and a lifting base is fixedly connected to the end of the horizontal telescopic cylinder away from the electric rotating clamp. At the same time, a vertical telescopic cylinder is movably installed on the top of the lifting base. At the same time, the flipping device main body is located on one side inside the sandblasting machine box, and the automatic flipping of double-sided circuit boards can be realized through the provided flipping device main body, so that the double-sided sandblasting operation of double-sided circuit boards can be realized, and further, the copper surfaces on both sides of the double-sided circuit boards can be roughened and cleaned.

[0005] The flipping structure of the above-mentioned flipping device for a circuit board sandblaster is complex, with many equipment components such as a horizontal telescopic cylinder, an electric rotating clamp, a lifting base, and a vertical telescopic cylinder. The flipping structure is complex and the operation is inconvenient. Content of the Utility Model

[0006] The purpose of the utility model is to provide a surface sandblasting treatment device for processing immersion nickel-gold circuit boards, so as to solve the problems put forward in the above background technique.

[0007] To achieve the above purpose, the utility model provides the following technical solutions:

[0008] A surface sandblasting treatment device for processing nickel immersion gold circuit boards, comprising a conveying mechanism for conveying nickel immersion gold circuit boards and a flipping mechanism for flipping nickel immersion gold circuit boards. The flipping mechanism is located on one side of the output end of the conveying mechanism. The flipping mechanism includes support frames, a driving assembly, a shaft rod, a flipping limit assembly, and an anti-dropping assembly, which are distributed in a counter-bracing structure. The flipping limit assembly is symmetrically located on the shaft rod. Each flipping limit assembly includes flange blocks arranged in a symmetrical structure. On one side of the two flange blocks, a flipping groove for placing nickel immersion gold circuit boards is horizontally opened. The inside of the flange block is sleeved on the outer circumferential wall of the shaft rod through a shaft sleeve;

[0009] The anti-dropping assembly includes an anti-dropping limit rod, which is arranged in a Z-shaped structure. One end of the anti-dropping limit rod is connected to the outer wall of the flange block, and a support block is arranged at the other end of the anti-dropping limit rod.

[0010] As a preferred solution of the present utility model, the shaft rod is located between the two support frames, and both ends of the shaft rod are connected to the support frames through bearing seats.

[0011] As a preferred solution of the present utility model, the driving assembly is located on the outer wall of one side of the support frame. The driving assembly includes a stepping motor. One end of the shaft rod penetrates through the support frame and is connected to the output end of the stepping motor on its outer wall through a coupling.

[0012] As a preferred solution of the present utility model, the anti-dropping limit rod on the outer wall of the flange block of each flipping limit assembly is located above the flipping groove on the side close to the support frame, and the anti-dropping limit rod on the outer wall of the flange block of each flipping limit assembly is located below the flipping groove on the side far from the support frame.

[0013] As a preferred solution of the present utility model, the conveying mechanism includes a conveying frame, on which a return conveyor belt is connected through a driving shaft. A conveying guiding centering plate is arranged on the top of the conveyor belt. One side of the conveying guiding centering plate is in a V-shaped opening structure, and the bottom of the conveying guiding centering plate is connected to the inner wall of the bottom of the conveying frame through a support member.

[0014] As a preferred solution of the present utility model, the bottom of the flipping groove is on the same horizontal plane as the top of the conveyor belt.

[0015] Compared with the prior art, the beneficial effects of the present utility model are:

[0016] Aiming at the problems raised in the background art, the flipping structure of this application is simple. The nickel immersion gold circuit board after sandblasting on one side is flipped through a stepping motor, a shaft rod, flange blocks, and anti-dropping limit rods. The structure is relatively simple, the mechanical structure is simplified, and the operation convenience is high;

[0017] When it is necessary to flip a nickel-immersion gold circuit board that has been sandblasted on one side, the drive shaft drives the reciprocating conveyor belt on the conveying frame for conveying. The conveying guide centering plate guides and centers the nickel-immersion gold circuit board during the conveying process. At this time, the stepping motor drives the flipping groove of the flange block to face the side of the nickel-immersion gold circuit board on the conveyor belt. The conveyor belt pushes the nickel-immersion gold circuit board into the flipping groove. At this time, the anti-dropping limit rods located at the top and bottom of the flange block limit it. The stepping motor drives the shaft rod to rotate, further driving the nickel-immersion gold circuit board inside the flipping groove of the flange block to flip. During the flipping process, the anti-dropping limit rods contact the nickel-immersion gold circuit board to prevent the nickel-immersion gold circuit board from flipping and falling off, ensuring the safety and stability of the flipping. The flipping mechanism of this application not only ensures the convenience of operation but also improves the work efficiency. Description of the Drawings

[0018] Figure 1 Is an axonometric view of the overall structure of the present utility model;

[0019] Figure 2 Is a schematic structural view of the overall flipping mechanism of the present utility model;

[0020] Figure 3 Is a schematic structural view of the connection between the flipping limit component and the anti-dropping component of the present utility model and the shaft rod;

[0021] Figure 4 Is a schematic structural view of a part of the conveying guide centering plate and the conveying frame of the present utility model.

[0022] In the figure: 1. Conveying mechanism; 11. Conveying frame; 12. Conveyor belt; 13. Conveying guide centering plate; 2. Flipping mechanism; 21. Support frame; 22. Shaft rod; 23. Flipping limit component; 231. Flange block; 232. Flipping groove; 24. Anti-dropping component; 241. Anti-dropping limit rod; 242. Support block; 25. Stepping motor. Detailed Embodiment

[0023] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the embodiments of the present utility model.

[0024] Embodiment

[0025] Please refer to Figures 1-4, the present utility model provides a technical solution: a surface sandblasting treatment device for processing nickel - immersion gold circuit boards, including a conveying mechanism 1 for conveying the nickel - immersion gold circuit boards and a flipping mechanism 2 for flipping the nickel - immersion gold circuit boards. The flipping mechanism 2 is located on one side of the output end of the conveying mechanism 1. The flipping mechanism 2 includes support frames 21 arranged in a counter - support structure, a driving component, a shaft rod 22, a flipping limiting component 23, and an anti - detachment component 24. The flipping limiting component 23 is arranged in a counter - support manner on the shaft rod 22. The shaft rod 22 is located between the two support frames 21, and both ends of the shaft rod 22 are connected to the support frames 21 through bearing seats; the driving component is located on the outer wall of one side of the support frame 21. The driving component includes a stepping motor 25. One end of the shaft rod 22 passes through the support frame 21 and is connected to the output end of the stepping motor 25 on its outer wall through a coupling; each flipping limiting component 23 includes flange blocks 231 arranged in a symmetrical structure. A flipping groove 232 for placing the nickel - immersion gold circuit board is horizontally opened on one side of the two flange blocks 231. The inside of the flange blocks 231 is sleeved on the outer circumferential wall of the shaft rod 22 through a bushing; the anti - detachment component 24 includes an anti - detachment limiting rod 241 arranged in a Z - shaped structure. One end of the anti - detachment limiting rod 241 is connected to the outer wall of the flange block 231, and a support block 242 is arranged at the other end of the anti - detachment limiting rod 241; the anti - detachment limiting rod 241 on the outer wall of the flange block 231 of each group of flipping limiting components 23 is located above the flipping groove 232 on the side close to the support frame 21, and the anti - detachment limiting rod 241 on the outer wall of the flange block 231 of each group of flipping limiting components 23 is located below the flipping groove 232 on the side far from the support frame 21.

[0026] It should be noted that in this embodiment, the flipping structure of the present application is simple. The nickel - immersion gold circuit board after sandblasting on one side is flipped through the stepping motor 25, the shaft rod 22, the flange block 231, and the anti - detachment limiting rod 241. The structure is relatively simple, the mechanical structure is simplified, and the operation convenience is high;

[0027] When it is necessary to flip the nickel - immersion gold circuit board that has been sandblasted on one side, the driving shaft drives the return - type conveyor belt 12 on the conveying frame 11 for conveying, and the nickel - immersion gold circuit board is guided and centered during the conveying process through the conveying guiding and centering plate 13. At this time, the stepping motor 25 drives the flipping groove 232 of the flange block 231 to face the side of the nickel - immersion gold circuit board on the conveyor belt 12. The conveyor belt 12 pushes the nickel - immersion gold circuit board into the flipping groove 232. At this time, the anti - detachment limiting rods 241 at the top and bottom of the flange block 231 perform limiting. The stepping motor 25 drives the shaft rod 22 to rotate, further driving the nickel - immersion gold circuit board inside the flipping groove 232 of the flange block 231 to flip. During the flipping process, the anti - detachment limiting rod 241 contacts the nickel - immersion gold circuit board, preventing the nickel - immersion gold circuit board from flipping and falling off, ensuring the safety and stability of the flipping. The flipping mechanism 2 of the present application not only ensures the operation convenience but also improves the work efficiency;

[0028] Furthermore, the anti-detachment limit rod 241 on the outer wall of the flange block 231 of each set of flipping limit components 23 is located above the flipping groove 232 on the side close to the support frame 21, and the anti-detachment limit rod 241 on the outer wall of the flange block 231 of each set of flipping limit components 23 is located below the flipping groove 232 on the side away from the support frame 21. When the electroless nickel immersion gold circuit board is flipped, it is limited and supported by the anti-detachment limit rods 241 above the outer wall and below the inner wall of the two sets of flipping limit components 23. There is no need to use other flipping limit mechanisms, with a simple structure, fewer mechanical structures, and high operation convenience.

[0029] Please refer to Figure 1 and 4 , the conveying mechanism 1 includes a conveying frame 11, on which a return conveyor belt 12 is connected through a driving shaft. A conveying guiding centering plate 13 is arranged on the top of the conveyor belt 12. One side of the conveying guiding centering plate 13 is of a V-shaped opening structure, and the bottom of the conveying guiding centering plate 13 is connected to the inner wall of the bottom of the conveying frame 11 through a support member; the bottom of the flipping groove 232 is on the same horizontal plane as the top of the conveyor belt 12.

[0030] It should be noted that in this embodiment, the driving shaft drives the return conveyor belt 12 on the conveying frame 11 for conveying, and the electroless nickel immersion gold circuit board is guided and centered during the conveying process through the conveying guiding centering plate 13. At this time, the stepping motor 25 drives the flipping groove 232 of the flange block 231 towards the side of the electroless nickel immersion gold circuit board on the conveyor belt 12, and the conveyor belt 12 pushes the electroless nickel immersion gold circuit board into the flipping groove 232. After flipping, the conveying component on the other side conveys the flipped electroless nickel immersion gold circuit board to the sandblasting machine for sandblasting.

[0031] The working process of the present utility model:

[0032] During use, the driving shaft drives the return conveyor belt 12 on the conveying frame 11 for conveying, and the electroless nickel immersion gold circuit board is guided and centered during the conveying process through the conveying guiding centering plate 13. At this time, the stepping motor 25 drives the flipping groove 232 of the flange block 231 towards the side of the electroless nickel immersion gold circuit board on the conveyor belt 12, and the conveyor belt 12 pushes the electroless nickel immersion gold circuit board into the flipping groove 232. At this time, the anti-detachment limit rods 241 at the top and bottom of the flange block 231 perform limiting. The stepping motor 25 drives the shaft rod 22 to rotate, further driving the electroless nickel immersion gold circuit board inside the flipping groove 232 of the flange block 231 to flip. During the flipping process, the anti-detachment limit rod 241 contacts the electroless nickel immersion gold circuit board, preventing the electroless nickel immersion gold circuit board from flipping and falling off, ensuring the safety and stability of flipping. After flipping, the conveying component on the other side conveys the flipped electroless nickel immersion gold circuit board to the sandblasting machine for sandblasting.

[0033] Although the embodiments of the present utility model have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.

Claims

1. A surface sandblasting device for processing nickel-plated gold-plated circuit boards, comprising a conveying mechanism (1) for conveying nickel-plated gold-plated circuit boards and a flipping mechanism (2) for flipping nickel-plated gold-plated circuit boards, characterized in that: The flip mechanism (2) is located at one side of the output end of the conveying mechanism (1), and the flip mechanism (2) comprises a support frame (21), a driving component, a shaft (22), a flip limit component (23) and an anti-falling component (24) which are arranged in a supporting structure. The flip limit component (23) is arranged on the shaft (22) in a supporting structure. Each flip limit component (23) comprises a flange block (231) which is arranged in a symmetrical structure. A flip groove (232) for placing a nickel-plated gold circuit board is horizontally opened on one side of the two flange blocks (231). The interior of the flange block (231) is located on the outer circumferential wall of the shaft (22) through a shaft sleeve. The anti-falling component (24) comprises an anti-falling limiting rod (241), the anti-falling limiting rod (241) is arranged in a Z-shaped structure, one end of the anti-falling limiting rod (241) is connected to the outer wall of the flange block (231), and the other end of the anti-falling limiting rod (241) is provided with a supporting block (242).

2. The surface sandblasting device for processing nickel-gold-plated circuit boards according to claim 1, characterized in that: The shaft rod (22) is located between the two support frames (21), and both ends of the shaft rod (22) are connected to the support frames (21) via bearing seats.

3. The surface sandblasting device for processing nickel-gold-plated circuit boards according to claim 1, characterized in that: The driving assembly is located on an outer wall of one side of the support frame (21), and the driving assembly includes a stepping motor (25). One end of the shaft rod (22) passes through the support frame (21) and is connected to the output end of the stepping motor (25) on its outer wall through a coupling.

4. The surface sandblasting device for processing nickel-gold-plated circuit boards according to claim 1, characterized in that: The anti-falling limiting rod (241) on the outer wall of the flange block (231) of each group of the flip limiting components (23) is located above the flip groove (232) on the side close to the support frame (21), and the anti-falling limiting rod (241) on the outer wall of the flange block (231) of each group of the flip limiting components (23) is located below the flip groove (232) on the side away from the support frame (21).

5. The surface sandblasting device for processing nickel-gold-plated circuit boards according to claim 1, characterized in that: The conveying mechanism (1) comprises a conveying frame (11), the conveying frame (11) is connected to a return conveyor belt (12) via a driving shaft, a conveying guide centering plate (13) is arranged on the top of the conveying belt (12), one side of the conveying guide centering plate (13) is formed into a V-shaped opening structure, and the bottom of the conveying guide centering plate (13) is connected to the bottom inner wall of the conveying frame (11) via a supporting member.

6. The surface sandblasting device for processing nickel-gold-plated circuit boards according to claim 5, characterized in that: The bottom of the turnover groove (232) and the top of the conveyor belt (12) are on the same horizontal plane.

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