Heating sheet fixing module for wafer packaging and sealing device thereof

Abstract

The utility model relates to a heating sheet fixing module for wafer packaging. The heating sheet fixing module comprises a fixing block, a cushion block, a first fastening screw and a second fastening screw, the two ends of the heating piece are clamped into the fixing openings respectively, the cushion blocks are located in the fixing openings, the heating piece is located between the cushion blocks and the side walls of the fixing openings, and the second fastening screws penetrate through the second connecting holes and abut against the side walls of the cushion blocks. The sealing device and the two heating piece fixing modules for wafer packaging are symmetrically installed at the two ends of the machine table. The utility model has the advantages that when the heating sheet is installed, the cushion block is additionally arranged, so that the fixed contact area is large, the stability after fixation is strong, the heating sheet cannot be loosened after repeated pressing, and the replacement frequency of the heating sheet is reduced; the length can be fixed after the heating piece is installed, the installation difficulty is small, the heating piece can be replaced only by one person, and the replacement efficiency of the heating piece is improved; and by replacing the cushion blocks with different thicknesses, the length of the heating sheet can be flexibly adjusted according to the heat sealing requirements of different products.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer packaging, in particular to a heating plate fixing module for wafer packaging and a sealing device thereof. Background Art

[0002] In the wafer packaging production line, wafers need to be packed into bags, usually MBB bags. The material combination of MBB bags provides excellent moisture-proof, anti-static and light-shielding properties by combining materials such as PET, AL, PA and PE to prevent oxidation of the wafer surface. When sealing the bag, the bag needs to be heat-sealed with a heating plate to achieve sealing. The existing heating plate is fixed by pressing the pressure blocks at both ends. The length adjustment space of the heating plate is limited, and the fixing area at both ends is narrow. The heating plate is easy to loosen and fall off, and the nozzle position produces a "wavy" deformation. After heating and plastic sealing, wrinkles appear on the edge of the MBB bag, which affects the sealing performance of the bag and easily causes oxidation of the wafer surface.

[0003] In order to avoid wrinkles at the seal, the Chinese utility model patent: A hot press sealing device (authorization publication number: CN 211845165U) provides a solution to improve the seal wrinkles: the pressure plate can smooth the bag mouth to prevent the seal wrinkles from affecting the sealing, the slide bar slides in the track, and the spring and the sliding plate in the horizontal section of the track cooperate to press the slide bar so that the bag mouth is pressed. Although the above solution has alleviated the problem of the bag mouth being affected by wrinkles to a certain extent, the heating plate fixed by the pressure block requires two people to cooperate when the heating plate needs to be replaced, which is difficult to operate and has a long standby time, affecting the efficiency of the production line.

[0004] Therefore, for wafer packaging, the fixing structure of the heating plate needs to be further improved to improve the problem of bag mouth wrinkles caused by the loosening of the heating plate. Utility Model Content

[0005] The utility model aims to provide a heating plate fixing module for wafer packaging and a sealing device thereof, so as to increase the fixing strength of the heating plate, improve the stability of the heating plate during operation, and avoid loosening and deformation of the heating plate.

[0006] In order to achieve the above-mentioned utility model object, the first aspect of the utility model provides a heating plate fixing module for wafer packaging, including a fixing block, a cushion block, a first fastening screw, and a second fastening screw;

[0007] The fixing block is provided with a slot with one side open, and first connecting holes are provided on both sides of the slot; both ends of the machine platform are connected to the fixing block through the slot, and two first fastening screws pass through the corresponding first connecting holes to clamp the fixing block on the machine platform;

[0008] The fixing block is provided with a fixing opening for inserting the heating plate, a second connecting hole is provided on one side of the fixing opening, two ends of the heating plate are respectively inserted into the fixing opening, the cushion block is located in the fixing opening, the heating plate is located between the cushion block and the side wall of the fixing opening, and the second fastening screw passes through the second connecting hole and abuts against the side wall of the cushion block.

[0009] Preferably, the fixing block is made of polyetheretherketone.

[0010] As a further improvement of the utility model, the second fastening screws are all butterfly screws.

[0011] According to a second aspect of the utility model, a heating plate sealing device for wafer packaging is provided, comprising two heating plate fixing modules for wafer packaging, wherein the two heating plate fixing modules for wafer packaging are symmetrically installed at two ends of the machine, one heating plate fixing module for wafer packaging is used to fix one end of the heating plate, and the other heating plate fixing module for wafer packaging is used to fix the other end of the heating plate.

[0012] The utility model of the heating plate fixing module and sealing device for wafer packaging has fixing blocks placed at both ends of the machine through the card slots, and the fixing blocks are detachably fixed by the first fastening screws, which is convenient for maintenance. The fixing position of the fixing block can be selected to be about 1 cm lower than the heating plate on the machine, and then the heating plate is inserted into the fixing port, its length is determined, and a pad of suitable thickness is selected to cooperate with the second fastening screw to fasten the heating plate, which makes installation easier.

[0013] Compared with the prior art, the utility model has the following advantages for the heating plate fixing module and the sealing device for wafer packaging:

[0014] (1) When installing the heating plate, a pad is added, which has a large fixed contact area and strong stability after fixation. Repeated pressing will not cause the heating plate to loosen, reducing the replacement frequency of the heating plate. In addition, the heating plate can be installed first and then the length can be fixed, which is less difficult to install. Only one person is required to replace the heating plate, which improves the replacement efficiency of the heating plate.

[0015] (2) By replacing pads of different thicknesses, the length of the heating plate can be flexibly adjusted according to the heat sealing requirements of different products. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the structure of a heating plate fixing module and a sealing device for wafer packaging of the utility model;

[0017] Figure 2 It is a schematic diagram of the fixed block structure;

[0018] Figure 3 This is a schematic diagram of the fixed block installation structure;

[0019] Figure 4 This is a schematic diagram of the heating plate installation structure. DETAILED DESCRIPTION

[0020] The specific implementation of the utility model is further described in detail below with reference to the accompanying drawings.

[0021] like Figure 1-3 As shown, the first aspect of the utility model provides a heating plate fixing module for wafer packaging, comprising a fixing block 1, a cushion block 5, a first fastening screw 6, and a second fastening screw 7;

[0022] The fixing block 1 is provided with a slot 11 with an opening on one side, and first connecting holes 3 are provided on both sides of the slot 11; both ends of the machine platform 8 are connected to the fixing block 1 through the slot 11, and two first fastening screws 6 pass through the corresponding first connecting holes 3 to clamp the fixing block 1 on the machine platform 8;

[0023] The fixing block 1 is provided with a fixing opening 4 for inserting the heating plate 9, and a second connecting hole 2 is provided on one side of the fixing opening 4. The two ends of the heating plate 9 are respectively inserted into the fixing opening 4, and the cushion block 5 is located in the fixing opening 4. Figure 4 As shown, the heating plate 9 is located between the cushion block 5 and the side wall of the fixing opening 4 , and the second fastening screw 7 passes through the second connecting hole 2 and abuts against the side wall of the cushion block 5 .

[0024] The second aspect of the utility model provides a wafer packaging heating plate sealing device, including two wafer packaging heating plate fixing modules, the two wafer packaging heating plate fixing modules are symmetrically installed at both ends of the machine 8, one wafer packaging heating plate fixing module is used to fix one end of the heating plate 9, and the other wafer packaging heating plate fixing module is used to fix the other end of the heating plate 9.

[0025] The heating plate fixing module and sealing device for wafer packaging of the utility model are provided with fixing blocks 1 at both ends of the machine table 8 through the card slots 11, and the fixing blocks 1 are detachably fixed by the first fastening screws 6, which is convenient for maintenance. The fixing position of the fixing block 1 can be selected to be about 1 cm lower than the heating plate 9 on the machine table 8, and then the heating plate 9 is inserted into the fixing port 4, its length is determined, and the pad 5 of appropriate thickness is selected to cooperate with the second fastening screws 7 to fasten the heating plate 9, which makes the installation easier.

[0026] In this embodiment, the fixing block 1 is preferably made of polyetheretherketone (PEEK). PEEK has good insulation, heat resistance and flame retardancy, has both rigidity and toughness, and is wear-resistant, thus meeting the heat sealing requirements of MBB bags.

[0027] The second fastening screws 7 are all butterfly screws, which are convenient for manual operation and improve the efficiency of replacing the heating plate 9.

[0028] The preferred embodiments of the present invention have been specifically described above, but the present invention is not limited to the described embodiments. Those skilled in the art may make various equivalent modifications or substitutions without violating the spirit of the present invention, and these equivalent modifications or substitutions are all within the scope defined by the claims of this application.

Claims

1. A heating plate fixing module for wafer packaging, characterized in that: It includes a fixing block, a cushion block, a first fastening screw, and a second fastening screw; The fixing block is provided with a slot with one side open, and first connecting holes are provided on both sides of the slot; both ends of the machine platform are connected to the fixing block through the slot, and two first fastening screws pass through the corresponding first connecting holes to clamp the fixing block on the machine platform; The fixing block is provided with a fixing opening for inserting the heating plate, a second connecting hole is provided on one side of the fixing opening, the cushion block is located in the fixing opening, the heating plate is located between the cushion block and the side wall of the fixing opening, and the second fastening screw passes through the second connecting hole and abuts against the side wall of the cushion block.

2. The heating sheet fixing module for wafer packaging according to claim 1, characterized in that: The fixing block is made of polyetheretherketone.

3. The heating sheet fixing module for wafer packaging according to claim 1, characterized in that: The second fastening screws are all butterfly screws.

4. A heating plate sealing device for wafer packaging, characterized in that: It comprises two heating plate fixing modules for wafer packaging as described in any one of claims 1 to 3, wherein the two heating plate fixing modules for wafer packaging are symmetrically installed at two ends of the machine, one heating plate fixing module for wafer packaging is used to fix one end of the heating plate, and the other heating plate fixing module for wafer packaging is used to fix the other end of the heating plate.

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