Integrated circuit material sheet pushing spring protection structure

Abstract

The utility model relates to the technical field of circuit material sheet pushing, in particular to an integrated circuit material sheet pushing spring protection structure which comprises a connecting frame body, a supporting block is arranged at one end of the connecting frame body, one side of the supporting block is connected with an inductive head connected with main equipment, and a sliding rod is arranged on the lower end face of the supporting block in a sliding mode. A limiting block attached to one side of the supporting block is arranged at one end of the sliding rod, a baffle is slidably arranged at the end, away from the limiting block, of the sliding rod, a buffering mechanism connected with the baffle is arranged in the sliding rod, threaded rods are arranged on the upper end face of the limiting block and the upper end face of the supporting block, and the two threaded rods are connected through an extension spring. According to the utility model, when a material sheet is contacted with the baffle plate, a slight slow effect is achieved, the contact rigidity is reduced, the damage is prevented, when the impact force for pushing the material sheet is larger, the material sheet is slightly and slowly compressed, then the sliding rod is driven to slide backwards, and when the sensing head senses the movement of the sliding rod, the whole equipment stops running, so that the condition of continuous damage can be prevented.

Description

Technical Field

[0001] The utility model relates to a protection structure for a pushing spring of an integrated circuit wafer, in particular to a protection structure for a pushing spring of an integrated circuit wafer, belonging to the technical field of circuit wafer pushing. Background Art

[0002] Integrated circuit wafer equipment is an indispensable part of the integrated circuit production process. They involve multiple links and types. Among them, the equipment includes manufacturing equipment, packaging equipment, and testing equipment. When transporting circuit wafers in these equipment, some use a pushing structure to push the circuit wafers. In the existing pushing structure, when pushing the circuit wafer to the next process, the friction during pushing is an uncertain factor. Therefore, when pushing the circuit wafer, it may directly and rigidly contact the equipment in the next process. Since the circuit wafer has high precision and complex internal circuits, such direct rigid contact is very likely to damage the circuit wafer.

[0003] Therefore, there is an urgent need for a protection structure for a pushing spring of an integrated circuit wafer to solve the above problems. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a protection structure for a pushing spring of an integrated circuit wafer, which has a slightly slow effect when the wafer contacts the baffle, reduces the contact rigidity, and prevents damage. When the impact force of wafer pushing is large, the buffer structure compresses, and then drives the sliding rod to slide backward. When the induction head senses the movement of the sliding rod, the whole equipment stops running for maintenance, so as to prevent continuous damage.

[0005] To achieve the above purpose, the main technical solutions adopted by the utility model include: a protection structure for a pushing spring of an integrated circuit wafer, including a connecting frame body. One end of the connecting frame body is provided with a support block. One side of the support block is connected with an induction head connected to the main equipment. The lower end surface of the support block is slidably provided with a sliding rod. One end of the sliding rod close to the induction head is provided with a limiting block that fits with one side of the support block. One end of the sliding rod away from the limiting block is slidably provided with a baffle. A buffer mechanism connected to the baffle is arranged inside the sliding rod. Threaded rods are arranged on the upper end surfaces of both the limiting block and the support block, and the two threaded rods are connected by a tension spring.

[0006] Preferably, hooks for hanging on the threaded rods are arranged at both ends of the tension spring, and a compression cap is screwed on the threaded rod.

[0007] Preferably, a sliding groove for the sliding rod to slide is opened on the lower end surface of the support block. A second sliding groove is opened at one end of the sliding rod away from the limiting block, and a groove is opened inside the second sliding groove.

[0008] Preferably, the buffer mechanism includes a slider connected to the baffle and slidably connected to the second chute, and a compression spring disposed between the inner end of the slider and the groove, with the end of the compression spring away from the slider inside the groove.

[0009] Preferably, a limit chute communicating with the second chute is provided on the lower end surface of the sliding rod, and a limit slider slidably connected to the limit chute is provided on the lower end surface of the slider.

[0010] Preferably, a threaded hole penetrating the inner end of the slider is provided on the baffle, the position and number of the threaded holes correspond to those of the compression spring, a second threaded rod is screwed into the threaded hole, a magnetic plate adsorbed to the compression spring is provided at the inner end of the second threaded rod, a hidden groove is provided at the end of the baffle away from the slider, and an inner hexagonal groove is provided at the end of the second threaded rod away from the magnetic plate and penetrating into the hidden groove.

[0011] Preferably, the diameter of the threaded hole is larger than the diameter of the compression spring, and the diameter of the magnetic plate is smaller than the diameter of the threaded hole but not smaller than the diameter of the compression spring.

[0012] Preferably, the induction head is an infrared induction head connected to the device through a wire.

[0013] The utility model has at least the following beneficial effects:

[0014] 1. When the circuit chip is pushed to the position of the baffle by the previous process, the buffer mechanism is used to perform preliminary buffering on it, reduce the contact rigidity, and prevent damage. When the thrust is large, the buffer structure compresses, and then drives the sliding rod to slide backward. When the induction head senses the movement of the sliding rod, the entire device stops running for maintenance, so as to prevent continuous damage.

[0015] 2. When the elastic potential energy of the tension spring gradually weakens, unscrew the compression cap, then remove the tension spring, then connect the new tension spring to the two threaded rods using the hooks at both ends, and finally connect the compression cap to the threaded rod to achieve the rapid replacement of the tension spring.

[0016] 3. When the elastic potential energy of the compression spring weakens after long-term use, turn the second threaded rod and take it out. During the taking-out process, use the adsorption of the magnetic plate to take out the compression spring. Then take a new compression spring, put it into the threaded hole, and then screw the second threaded rod into the threaded hole and move inward to push the compression spring into the groove in the second chute, so as to achieve the fixation after the replacement of the compression spring. Description of the Drawings

[0017] The accompanying drawings described herein are used to provide a further understanding of the present application and form a part of the present application. The schematic embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation of the present application. In the drawings:

[0018] Figure 1 is a schematic three-dimensional structure diagram of the present utility model;

[0019] Figure 2 is a schematic cross-sectional view of the present utility model;

[0020] Figure 3 is a partial cross-sectional view of the present utility model;

[0021] Figure 4 is a schematic three-dimensional structure diagram of the present utility model;

[0022] Figure 5 is a partial schematic three-dimensional structure diagram of the present utility model;

[0023] Figure 6 is a schematic three-dimensional structure diagram of the sliding rod of the present utility model.

[0024] In the figure, 1 - connecting frame body; 2 - support block; 3 - sliding rod; 4 - induction head; 5 - limit block; 6 - baffle; 7 - buffer mechanism; 8 - threaded rod; 9 - tension spring; 10 - hook; 11 - compression cap; 12 - chute; 13 - second chute; 14 - groove; 15 - slider; 16 - compression spring; 17 - limit chute; 18 - limit slider; 19 - threaded hole; 20 - second threaded rod; 21 - magnetic plate; 22 - internal hexagonal groove; 23 - hidden groove; 24 - wire. Detailed implementation manners

[0025] The following will cooperate with the accompanying drawings and embodiments to detail the implementation manners of the present application, so as to fully understand the implementation process of how the present application uses technical means to solve technical problems and achieve technical effects and implement accordingly.

[0026] As Figures 1 - 6 shown, the integrated circuit chip pushing spring protection structure provided in this embodiment includes a connecting frame body 1. One end of the connecting frame body 1 is provided with a support block 2. One side of the support block 2 is connected with an induction head 4 connected to the main device. The induction head 4 is an infrared induction head connected to the device through a wire 24. The lower end surface of the support block 2 is slidably provided with a sliding rod 3, and a chute 12 for the sliding of the sliding rod 3 is opened on the lower end surface of the support block 2;

[0027] Further, as Figures 2 - 3As shown in the figure, a limiting block 5 that fits against one side of the support block 2 is provided at one end of the sliding rod 3 close to the induction head 4. A second chute 13 is formed at the end of the sliding rod 3 away from the limiting block 5. A groove 14 is formed inside the second chute 13. The groove 14 is used to limit the compression spring 16 to prevent it from shaking during extrusion.

[0028] Furthermore, as Figures 2 - 3 shown in the figure, a baffle 6 is slidably arranged at the end of the sliding rod 3 away from the limiting block 5. A buffer mechanism 7 connected to the baffle 6 is arranged inside the sliding rod 3. The buffer mechanism 7 includes a slider 15 connected to the baffle 6 and slidably connected to the second chute 13, and a compression spring 16 arranged between the inner end of the slider 15 and the groove 14. One end of the compression spring 16 away from the slider 15 is inside the groove 14. When the baffle 6 is squeezed by the circuit chip pushed over, the slider 15 slides in the second chute 13 and squeezes the compression spring 16. By utilizing the elastic property of the compression spring 16, it can make the circuit chip have a slightly slow effect when contacting the baffle 6, reduce the contact rigidity, and prevent damage.

[0029] Still further, as Figures 2 - 3 shown in the figure, a limiting chute 17 communicating with the second chute 13 is formed on the lower end surface of the sliding rod 3. A limiting slider 18 slidably connected to the limiting chute 17 is arranged on the lower end surface of the slider 15. The arrangement of the limiting slider 18 and the limiting chute 17 can limit the slider 15 and prevent the slider 15 from separating from the second chute 13.

[0030] Further, as Figures 2 - 3As shown in the figure, a threaded hole 19 penetrating the inner end of the slider 15 is provided on the baffle 6. The position and number of the threaded holes 19 correspond to those of the compression springs 16. A second threaded rod 20 is screwed into the threaded hole 19. A magnetic plate 21 adsorbed to the compression spring 16 is provided at the inner end of the second threaded rod 20. The magnetic plate 21 can adsorb the compression spring 16, which is convenient for removing and replacing the compression spring 16 later. A hidden groove 23 is provided at one end of the baffle 6 away from the slider 15. The end of the second threaded rod 20 away from the magnetic plate 21 penetrates into the hidden groove 23 and an internal hexagonal groove 22 is provided. The setting of the internal hexagonal groove 22 facilitates the rotation of the second threaded rod 20 by using an internal hexagonal wrench in the later stage. When the elastic potential energy of the compression spring 16 becomes weaker after long-term use, the second threaded rod 20 is rotated and taken out. During the taking-out process, the compression spring 16 is taken out by the adsorption of the magnetic plate 21. Then, a new compression spring 16 is taken and placed into the threaded hole 19. Then, the second threaded rod 20 is screwed into the threaded hole 19 and moves inward to push the compression spring 16 into the groove 14 in the second chute 13, so as to realize the fixation after the replacement of the compression spring 16. It should be noted that there are many ways to replace the compression spring 16. When some unskilled workers cannot ensure that the compression spring 16 is directly pushed into the groove 14 by the second threaded rod 20, other slender tools can be used to first send the compression spring 16 into the groove 14 and then install the second threaded rod 20;

[0031] Furthermore, as Figures 2 - 3 shown, the diameter of the threaded hole 19 is larger than the diameter of the compression spring 16, ensuring that the compression spring 16 can be squeezed by the second threaded rod 20 and the magnetic plate. The diameter of the magnetic plate 21 is smaller than the diameter of the threaded hole 19 but not smaller than the diameter of the compression spring 16, ensuring that the compression spring 16 can be adsorbed and squeezed at the same time;

[0032] As Figure 1 and Figure 4 shown, threaded rods 8 are provided on the upper end faces of the limit block 5 and the support block 2. The two threaded rods 8 are connected by a tension spring 9. Among them, hooks 10 for hanging on the threaded rods 8 are provided at both ends of the tension spring 9. A compression cap 11 is screwed onto the threaded rod 8. The tension spring 10 is hung on the two threaded rods 8 at both ends through the hooks 10 at both ends and finally fixed by the screwed compression cap 11, which is convenient for later replacement. When the elastic potential energy of the tension spring 9 gradually becomes weaker, the compression cap 11 is unscrewed, and the tension spring 9 is taken off. Then, the new tension spring 9 is connected to the two threaded rods 8 by the hooks 10 at both ends, and finally the compression cap 11 is connected to the threaded rod 8 to realize the rapid replacement of the tension spring 9;

[0033] When the circuit chip is pushed by the previous process to the position of the baffle 6, the buffer mechanism 7 is used to perform preliminary buffering on it, reduce the contact rigidity, and prevent damage. When the thrust is large, the buffer structure 7 compresses and then drives the slide bar to slide backward. When the induction head 4 senses the movement of the slide bar, the entire device stops running for maintenance, so as to prevent continuous damage.

[0034] As used in the specification and claims, certain terms are used to refer to specific components. Those skilled in the art should understand that hardware manufacturers may use different terms to refer to the same component. The specification and claims do not use the difference in names as a way to distinguish components, but use the difference in functions of components as the criterion for distinction. As mentioned throughout the specification and claims, "comprising" is an open-ended term and should be interpreted as "comprising but not limited to". "Substantially" means within an acceptable error range. Those skilled in the art can solve technical problems within a certain error range and basically achieve the technical effect.

[0035] It should be noted that the term "including", "comprising" or any other variant thereof is intended to cover non-exclusive inclusion, so that a commodity or system including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such a commodity or system. Without further limitation, an element defined by the statement "including one..." does not exclude the existence of another identical element in the commodity or system including the element.

[0036] The above description shows and describes several preferred embodiments of the present invention. However, as mentioned above, it should be understood that the present invention is not limited to the form disclosed herein, should not be regarded as excluding other embodiments, but can be used in various other combinations, modifications and environments, and can be changed within the scope of the inventive concept described herein through the above teachings or the technology or knowledge in the relevant field. And any changes and variations made by those skilled in the art without departing from the spirit and scope of the present invention shall fall within the protection scope of the appended claims of the present invention.

Claims

1. An integrated circuit chip push spring protection structure, comprising a connecting frame (1), characterized in that: A support block (2) is provided at one end of the connecting frame (1), and a sensing head (4) connected to a main device is connected to one side of the support block (2). A sliding rod (3) is slidably provided on the lower end surface of the support block (2), and a limit block (5) is provided at the end of the sliding rod (3) close to the sensing head (4) and is in contact with one side of the support block (2). A baffle (6) is slidably provided at the end of the sliding rod (3) away from the limit block (5), and a buffer mechanism (7) connected to the baffle (6) is provided inside the sliding rod (3). The upper end surfaces of the limit block (5) and the support block (2) are both provided with threaded rods (8), and the two threaded rods (8) are connected by a tension spring (9).

2. The integrated circuit chip push spring protection structure according to claim 1, characterized in that: Both ends of the tension spring (9) are provided with hooks (10) for hanging with the threaded rod (8), and a pressure cap (11) is screwed and connected on the threaded rod (8).

3. The integrated circuit chip push spring protection structure according to claim 1, characterized in that: The lower end surface of the support block (2) is provided with a sliding groove (12) for the sliding rod (3) to slide, and the end of the sliding rod (3) away from the limiting block (5) is provided with a second sliding groove (13), and a groove (14) is provided inside the second sliding groove (13).

4. The integrated circuit chip push spring protection structure according to claim 3, characterized in that: The buffer mechanism (7) comprises a slider (15) connected to the baffle (6) and slidably connected to the second slide groove (13), and a compression spring (16) arranged between the inner end of the slider (15) and the groove (14), wherein one end of the compression spring (16) away from the slider (15) is located inside the groove (14).

5. The integrated circuit chip push spring protection structure according to claim 4, characterized in that: The lower end surface of the slide rod (3) is provided with a limiting slide groove (17) which is in communication with the second slide groove (13), and the lower end surface of the slide block (15) is provided with a limiting slide block (18) which is slidably connected with the limiting slide groove (17).

6. The integrated circuit chip push spring protection structure according to claim 5, characterized in that: The baffle plate (6) is provided with a threaded hole (19) penetrating the inner end of the slider (15); the position and number of the threaded hole (19) correspond to the compression spring (16); the threaded hole (19) is screwed and connected with a second threaded rod (20); the inner end of the second threaded rod (20) is provided with a magnetic plate (21) adsorbed with the compression spring (16); the end of the baffle plate (6) away from the slider (15) is provided with a hidden groove (23); the end of the second threaded rod (20) away from the magnetic plate (21) penetrates into the hidden groove (23) and is provided with a hexagonal groove (22).

7. The integrated circuit chip push spring protection structure according to claim 6, characterized in that: The diameter of the threaded hole (19) is greater than the diameter of the compression spring (16), and the diameter of the magnetic plate (21) is smaller than the diameter of the threaded hole (19) but not smaller than the diameter of the compression spring (16).

8. The integrated circuit chip push spring protection structure according to claim 1, characterized in that: The sensor head (4) is an infrared sensor head connected to the device via a wire (24).

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