Solder strip annealing device and solder strip processing equipment

Abstract

The utility model discloses a solder strip annealing device and solder strip processing equipment, the solder strip annealing device comprises a cooling tank, a first conductive wheel, a conductive wheel assembly and an electromagnetic heating mechanism, the cooling tank is filled with cooling liquid, the first conductive wheel is arranged in the cooling tank, at least part of the first conductive wheel is located in the cooling liquid, and the electromagnetic heating mechanism is arranged on the conductive wheel assembly. The conductive wheel assembly is arranged on the outer side of the cooling groove and located above the first conductive wheel, and the electromagnetic heating mechanism is arranged above the cooling groove and located between the first conductive wheel and the conductive wheel assembly. When the solder strip annealing device works, the first conductive wheel and the conductive wheel assembly rotate, the solder strip moves to the electromagnetic heating mechanism through the conductive wheel assembly, the electromagnetic heating mechanism heats the solder strip, and the heated solder strip moves to the first conductive wheel. According to the solder strip annealing device, the electromagnetic annealing mode can greatly improve the heating efficiency, so that the production efficiency of the solder strip is improved, the emission of harmful gas can be reduced, and the environmental pollution is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of solder strip processing, in particular to a solder strip annealing device and a solder strip processing equipment. Background Art

[0002] In the prior art, the annealing process of photovoltaic solder strips generally adopts the short-circuit annealing method, that is, the positive and negative electrodes of a large-sized dry battery are short-circuited to form eddy currents in the current to heat the photovoltaic solder strips. However, due to the limited current output energy of the large-sized dry battery, it is impossible to improve the efficient heat, resulting in low heating efficiency of the short-circuit annealing method. At the same time, manual intervention is required, and automated continuous production cannot be achieved, resulting in low production efficiency of the solder strips. Moreover, the short circuit of the large-sized dry battery may cause safety problems such as fires, posing potential dangers to operators and equipment. Content of the Utility Model

[0003] The utility model aims to at least solve one of the technical problems existing in the prior art. For this reason, an object of the utility model is to provide a solder strip annealing device. The electromagnetic annealing method can greatly improve the heating efficiency, thereby improving the production efficiency of the solder strips. At the same time, the electromagnetic annealing method can reduce the emission of harmful gases and reduce environmental pollution.

[0004] Another object of the utility model is to provide a solder strip processing equipment including the above solder strip annealing device.

[0005] The solder strip annealing device according to the first aspect embodiment of the utility model includes: a cooling tank filled with coolant; a first conductive wheel disposed in the cooling tank, with at least a part of the first conductive wheel located in the coolant; a conductive wheel assembly disposed outside the cooling tank, with the conductive wheel assembly located above the first conductive wheel; an electromagnetic heating mechanism disposed above the cooling tank, with the electromagnetic heating mechanism located between the first conductive wheel and the conductive wheel assembly; wherein, when the solder strip annealing device operates, the first conductive wheel and the conductive wheel assembly rotate, the solder strip moves to the electromagnetic heating mechanism through the conductive wheel assembly, the electromagnetic heating mechanism heats the solder strip, and the heated solder strip moves to the first conductive wheel.

[0006] According to the solder strip annealing device of the embodiment of the utility model, by arranging an electromagnetic heating mechanism between the first conductive wheel and the conductive wheel assembly, the solder strip is heated by electromagnetic induction. Thus, compared with the traditional short-circuit annealing method, the electromagnetic annealing method can greatly improve the heating efficiency, thereby improving the cooling efficiency, and further improving the production efficiency of the solder strips. At the same time, the electromagnetic annealing method can reduce the emission of harmful gases and reduce environmental pollution.

[0007] According to some embodiments of the present utility model, the solder ribbon annealing device further includes: a protective tube, the protective tube is arranged above the first conductive wheel, the protective tube is located between the first conductive wheel and the conductive wheel assembly, and the electromagnetic heating mechanism is sleeved on the protective tube.

[0008] According to some embodiments of the present utility model, the solder ribbon annealing device further includes: a first air knife member, the first air knife member is arranged outside the cooling tank, and the first air knife member is located above the side of the first conductive wheel away from the conductive wheel assembly.

[0009] According to some embodiments of the present utility model, the conductive wheel assembly includes: a second conductive wheel, the second conductive wheel is arranged outside the cooling tank and above the first conductive wheel; a first traction wheel, the first traction wheel is arranged between the electromagnetic heating mechanism and the first conductive wheel, and the first traction wheel is located above the first conductive wheel; a tension wheel, the tension wheel is arranged between the second conductive wheel and the first traction wheel, the tension wheel is located below the second conductive wheel, and the tension wheel is located above the first conductive wheel.

[0010] According to some embodiments of the present utility model, the conductive wheel assembly includes: a first traction wheel, the first traction wheel is arranged outside the cooling tank, and the first traction wheel is located above the first conductive wheel; a tension wheel, the tension wheel is arranged on the side of the first traction wheel away from the first conductive wheel, and the tension wheel is located above the first traction wheel.

[0011] According to some embodiments of the present utility model, the solder ribbon annealing device further includes: a second traction wheel and a third traction wheel, the second traction wheel and the third traction wheel are arranged side by side on the side of the protective tube away from the first conductive wheel; wherein, when the solder ribbon annealing device works, the solder ribbon sequentially moves through the conductive wheel assembly, the first conductive wheel, the second traction wheel, the third traction wheel and the first conductive wheel to the outside of the cooling tank.

[0012] According to some embodiments of the present utility model, the second traction wheel and the third traction wheel are located above the conductive wheel assembly.

[0013] According to some embodiments of the present utility model, a second air knife member is arranged between the first conductive wheel and the second traction wheel.

[0014] The solder ribbon processing equipment according to the second aspect embodiment of the present utility model includes the solder ribbon annealing device according to the first aspect embodiment of the present utility model above.

[0015] Additional aspects and advantages of the present utility model will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present utility model. Description of the Drawings

[0016] The above and / or additional aspects and advantages of the present utility model will become apparent and be readily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0017] Figure 1 is a schematic diagram of a solder ribbon annealing device according to an embodiment of the present utility model;

[0018] Figure 2 is a schematic diagram of a solder ribbon annealing device according to another embodiment of the present utility model.

[0019] Reference Signs:

[0020] 100: Solder ribbon annealing device;

[0021] 10: Cooling tank; 20: First conductive wheel; 30: Conductive wheel assembly; 40: Electromagnetic heating mechanism; 50: Protection tube; 60: First air knife member; 70: First traction wheel; 80: Tension wheel; 90: Second traction wheel; 110: Third traction wheel; 120: Second air knife member; 130: Second conductive wheel;

[0022] 200: Solder ribbon. Detailed Embodiments

[0023] Reference is made below to Figure 1 - Figure 2 describe a solder ribbon annealing device 100 according to an embodiment of the first aspect of the present utility model.

[0024] As Figure 1 - Figure 2 shown, a solder ribbon annealing device 100 according to an embodiment of the first aspect of the present utility model includes: a cooling tank 10, a first conductive wheel 20, a conductive wheel assembly 30, and an electromagnetic heating mechanism 40.

[0025] Specifically, the cooling tank 10 contains a coolant, the first conductive wheel 20 is disposed in the cooling tank 10, at least a part of the first conductive wheel 20 is located in the coolant, the conductive wheel assembly 30 is disposed outside the cooling tank 10, the conductive wheel assembly 30 is located above the first conductive wheel 20, and the electromagnetic heating mechanism 40 is disposed above the cooling tank 10, and the electromagnetic heating mechanism 40 is located between the first conductive wheel 20 and the conductive wheel assembly 30.

[0026] Wherein, when the solder ribbon annealing device 100 operates, the first conductive wheel 20 and the conductive wheel assembly 30 rotate, the solder ribbon 200 moves to the electromagnetic heating mechanism 40 through the conductive wheel assembly 30, the electromagnetic heating mechanism 40 heats the solder ribbon 200, and the heated solder ribbon 200 moves to the first conductive wheel 20.

[0027] For example, in the examples of Figure 1 and Figure 2 the cooling tank 10 can be filled with a coolant. The entire first conductive wheel 20 is immersed in the coolant. The conductive wheel assembly 30, the electromagnetic heating mechanism 40, and the first conductive wheel 20 are arranged in sequence along the moving direction of the solder tape 200. That is, the solder tape 200 is wound around the upper part of the conductive wheel assembly 30, and the solder tape 200 passes through the electromagnetic heating mechanism 40 and is wound around the lower part of the first conductive wheel 20. When the solder tape annealing device 100 works, both the first conductive wheel 20 and the conductive wheel assembly 30 are electrified, so that the solder tape 200 in contact with the first conductive wheel 20 and the conductive wheel assembly 30 is also charged. At the same time, the electromagnetic heating mechanism 40 can generate a magnetic field. When the charged solder tape 200 passes through the magnetic field, electromagnetic induction heating can be carried out. By heating the solder tape 200, the crystal structure of the solder tape 200 can be changed, the stress of the solder tape 200 can be eliminated. After that, the heated solder tape 200 can be cooled by the coolant to reduce the temperature, so that the solder tape 200 can return to room temperature and solidify its crystal structure, avoiding excessive temperature during the annealing process, reducing the deformation and damage of the solder tape 200, and thus improving the performance and quality of the solder tape 200.

[0028] In the prior art, in the short-circuit annealing method, due to the low heating efficiency, the feeding and unwinding equipment uses a 1.5KW motor, but the motor utilization rate reaches 179%. The ratio of the reducer is also as high as 1:10, and the maximum linear speed can only reach 220r / min. The unwinding length of the solder tape 200 with a minimum coil of 50Hz is 123m / min, and the unwinding length of the solder tape 200 with a minimum coil of 900Hz is 221m / min.

[0029] However, in this application, the electromagnetic annealing method is adopted. Compared with the short-circuit annealing, the electromagnetic annealing greatly improves the heating efficiency and reduces the energy consumption, so that the motor of the feeding and unwinding equipment can be replaced with a high-power 4KW motor. At this time, the ratio of the reducer is also reduced to 1:3, so that the linear speed can be increased to 300r / min. The unwinding length of the solder tape 200 with a minimum coil of 50Hz is increased to 246m / min, and the unwinding length of the solder tape 200 with a minimum coil of 900Hz is 442m / min. In addition, the utilization rate of the motor is between 67% and 121%. Thus, the feeding speed is increased, thereby improving the production efficiency. Moreover, electromagnetic induction heating reduces the emission of harmful gases and reduces environmental pollution, meeting the development trend of green environmental protection.

[0030] Similarly, in the short-circuit annealing method, due to the low heating efficiency, a 0.4KW motor is used, the reduction gear ratio is 1:10, the utilization rate of the motor is 167%, the cooling length of the solder strip 200 with a minimum coil of 50Hz is 132m / min, and the cooling length of the solder strip 200 with a minimum coil of 90Hz is 237m / min. In this application, the electromagnetic annealing method is adopted. Since the electromagnetic annealing method greatly improves the heating efficiency, when cooling the heated solder strip 200, a 0.4KW motor is used, and the reduction gear ratio can be reduced to 1:3. At this time, the utilization rate of the motor is 68%, the cooling length of the solder strip 200 with a minimum coil of 50Hz is 440m / min, and the cooling length of the solder strip 200 with a minimum coil of 90Hz is 790m / min, improving the cooling efficiency.

[0031] In addition, after the annealing of the solder strip 200 is completed, the conveying device needs to convey the solder strip 200 to the winding equipment for winding. Among them, the rotation speed of the dual-speed torque motor used in the winding equipment can be increased from 670r / min to 1200r / min, and the motor utilization rate is reduced from 116% to 89%.

[0032] Optionally, the electromagnetic heating mechanism 40 can be an electromagnetic induction coil. However, it is not limited thereto.

[0033] According to the solder strip annealing device 100 of the embodiment of the present utility model, by arranging the electromagnetic heating mechanism 40 between the first conductive wheel 20 and the conductive wheel assembly 30, the solder strip 200 is heated by electromagnetic induction. Thus, compared with the traditional short-circuit annealing method, the electromagnetic annealing method can greatly improve the heating efficiency, thereby improving the cooling efficiency, further improving the production efficiency of the solder strip 200, and at the same time, the electromagnetic annealing method can reduce the emission of harmful gases and reduce environmental pollution.

[0034] According to some embodiments of the present utility model, as Figure 1 and Figure 2 shown, the solder strip annealing device 100 further includes a protection tube 50. The protection tube 50 is arranged above the first conductive wheel 20. The protection tube 50 is located between the first conductive wheel 20 and the conductive wheel assembly 30, and the electromagnetic heating mechanism 40 is sleeved on the protection tube 50. That is to say, the energized solder strip 200 is located in the protection tube 50 and is heated by electromagnetic induction. One end of the protection tube 50 extends into the coolant in the cooling tank 10, and one end of the protection tube 50 can be flush with the side of the conductive wheel assembly 30 away from the first conductive wheel 20. Thus, the heated solder strip 200 can enter the coolant in time for cooling, and the protection tube 50 can protect the solder strip 200 from being polluted and damaged by the external environment, while controlling the annealing atmosphere to ensure the stability and consistency of the annealing effect of each part of the solder strip 200, which is beneficial to further improving the performance and quality of the solder strip 200.

[0035] Optionally, the protective tube 50 may be a glass tube, but is not limited thereto.

[0036] Furthermore, the solder strip annealing device 100 further includes a first air knife member 60. The first air knife member 60 is provided outside the cooling tank 10, and the first air knife member 60 is located above the side of the first conductive wheel 20 away from the conductive wheel assembly 30. In this way, the first air knife member 60 is located downstream in the conveying direction of the solder strip 200. When the solder strip 200 cooled by the coolant passes through the first air knife member 60, the first air knife member 60 can generate strong wind and blow it onto the cooled solder strip 200. The strong wind can play a role in removing water, cleaning, and accelerating cooling, so that the solder strip 200 conveyed to the winding device is at room temperature, which is beneficial to the winding process of the solder strip 200.

[0037] Still further, the conductive wheel assembly 30 includes a second conductive wheel 130, a first traction wheel 70, and a tension wheel 80. The second conductive wheel 130 is provided outside the cooling tank 10 and above the first conductive wheel 20. The first traction wheel 70 is provided between the electromagnetic heating mechanism 40 and the first conductive wheel 20, and the first traction wheel 70 is located above the first conductive wheel 20. The tension wheel 80 is provided between the second conductive wheel 30 and the first traction wheel 70, and the tension wheel 80 is located below the second conductive wheel 30. Refer to Figure 1 , the second conductive wheel 30, the tension wheel 80, the first traction wheel 70, and the first conductive wheel 20 are arranged in sequence along the conveying direction of the solder strip 200. The second conductive wheel 30 is substantially flush with the first traction wheel 70, and the tension wheel 80 is located between the second conductive wheel 30 and the first conductive wheel 20.

[0038] Specifically, when the first traction wheel 70 rotates, it can pull the solder strip 200 from the second conductive wheel 30 to the first conductive wheel 20. That is, when the solder strip 200 enters the annealing process, the first traction wheel 70 starts to rotate and generates frictional force. Through the cooperation of the first traction wheel 70 and the tension wheel 80, the solder strip 200 can firmly contact the second conductive wheel 30 and the first conductive wheel 20, avoiding the detachment of the solder strip 200, which is beneficial to the annealing process of the solder strip 200. In addition, by controlling the rotation speed and force of the first traction wheel 70, the yield strength of the copper wire can also be changed to meet different process requirements.

[0039] In some alternative embodiments, the tension wheel 80 is located above the first conductive wheel 20. With such a setting, when the solder strip 200 is annealed, the solder strip 200 is conveyed in a wavy shape, which can better tension the solder strip 200, so that the solder strip 200 can always contact the first conductive wheel 20 and the second conductive wheel 30, which is beneficial to the electromagnetic induction heating and cooling of the solder strip 200, and thus can ensure that the solder strip 200 has good performance and quality.

[0040] According to some other embodiments of the present utility model, the conductive wheel assembly 30 includes a first traction wheel 70 and a tension wheel 80. The first traction wheel 70 is arranged outside the cooling tank 10 and is located above the first conductive wheel 20. The tension wheel 80 is arranged on the side of the first traction wheel 70 away from the first conductive wheel 20, and the tension wheel 80 is located above the first traction wheel 20. As Figure 2 shown, the tension wheel 80, the first traction wheel 70, and the first conductive wheel 20 are arranged in sequence along the conveying direction of the welding tape 200. The first traction wheel 70 is located between the tension wheel 80 and the first conductive wheel 20, and the welding tape is wound around the tension wheel 80 and the first traction wheel 70.

[0041] Specifically, when the first traction wheel 70 rotates, it can traction the welding tape 200 from the tension wheel 80 to the first traction wheel 70, and then traction it to the first conductive wheel 20 by the first traction wheel 70. That is, when the welding tape 200 enters the annealing process, the first traction wheel 70 starts to rotate and generates frictional force. Through the cooperation of the first traction wheel 70 and the tension wheel 80, the welding tape 200 can be firmly in contact with the first conductive wheel 20, avoiding the welding tape 200 from falling off, which is beneficial to the annealing treatment of the welding tape 200. In addition, by controlling the rotation speed and force of the first traction wheel 70, the yield strength of the copper wire can also be changed to meet different process requirements.

[0042] According to some specific embodiments of the present utility model, as Figure 1 and Figure 2 shown, the welding tape annealing device 100 further includes a second traction wheel 90 and a third traction wheel 110. The second traction wheel 90 and the third traction wheel 110 are arranged side by side on the side of the protective tube 50 away from the first conductive wheel 20. Among them, when the welding tape annealing device 100 works, the welding tape 200 moves out of the cooling tank 10 through the conductive wheel assembly 30, the first conductive wheel 20, the second traction wheel 90, the third traction wheel 110, and the first conductive wheel 20 in sequence.

[0043] Specifically, both the second traction wheel 90 and the third traction wheel 110 are located on the side of the first traction wheel 70 away from the conductive wheel assembly 30, and the second traction wheel 90 and the third traction wheel 110 are spaced apart along the conveying direction of the solder tape 200. When the solder tape annealing device 100 is working, the first traction wheel 70 rotates and generates frictional force to make the solder tape 200 pass through the coolant and be conveyed to the first conductive wheel 20. At this time, the coolant preliminarily cools the solder tape 200. The solder tape 200 after preliminary cooling is conveyed to the electromagnetic heating mechanism 40 under the action of the frictional force of the second traction wheel 90 and the third traction wheel 110 to heat the solder tape 200. The heated solder tape 200 passes through the coolant and is conveyed to the first conductive wheel 20 under the action of the frictional force of the second traction wheel 90 and the third traction wheel 110, and finally is conveyed to the winding device through the first air knife member 60 from the first conductive wheel 20. Thus, the coolant can cool the solder tape 200 twice. The preliminary cooling can avoid too high temperature of the solder tape 200 during annealing, thereby reducing the deformation and damage of the solder tape 200. The re-cooling anneals the heated solder tape 200 to ensure that the solder tape 200 can have better performance and quality.

[0044] In addition, the annealed solder tape 200 needs to enter the water tank again for secondary cooling to further avoid the deformation and damage of the solder tape 200.

[0045] Furthermore, the second traction wheel 90 and the third traction wheel 110 are located above the conductive wheel assembly 30. With such a setting, it can ensure that the solder tape 200 is conveyed to the electromagnetic heating mechanism 40, which is beneficial to electromagnetic induction heating of the solder tape 200.

[0046] In some alternative embodiments, a second air knife member 120 is provided between the first conductive wheel 20 and the second traction wheel 90. Referring to Figure 1 and Figure 2 , the second air knife member 120 is located between the second traction wheel 90 and the first air knife member 60 to remove water and clean the solder tape 200 conveyed to the electromagnetic heating mechanism 40, ensuring the cleanliness of the solder tape 200 during electromagnetic heating, so as to be able to better heat the solder tape 200 and further improve the heating efficiency of the solder tape 200.

[0047] The solder tape processing equipment (not shown in the figure) according to the second aspect embodiment of the present invention includes the solder tape annealing device 100 according to the first aspect embodiment of the present invention above.

[0048] According to the solder tape processing equipment of the embodiment of the present invention, by adopting the above solder tape annealing device 100, the production efficiency of the solder tape 200 can be greatly improved, and the energy consumption is low, reducing the production cost.

[0049] Other components and operations of the solder tape processing equipment according to the embodiments of the present utility model are known to those of ordinary skill in the art and will not be described in detail herein.

[0050] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "center", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the present utility model.

[0051] In the description of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0052] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example.

[0053] Although the embodiments of the present utility model have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and purposes of the present utility model, and the scope of the present utility model is defined by the claims and their equivalents.

Claims

1. A welding strip annealing device, characterized in that: include: A cooling tank, wherein a coolant is contained in the cooling tank; a first conductive wheel, the first conductive wheel being disposed in the cooling tank, and at least a portion of the first conductive wheel being located in the coolant; A conductive wheel assembly, wherein the conductive wheel assembly is arranged outside the cooling groove and is located above the first conductive wheel; An electromagnetic heating mechanism, wherein the electromagnetic heating mechanism is disposed above the cooling tank and between the first conductive wheel and the conductive wheel assembly; Wherein, when the solder strip annealing device is working, the first conductive wheel and the conductive wheel assembly rotate, the solder strip moves to the electromagnetic heating mechanism through the conductive wheel assembly, the electromagnetic heating mechanism heats the solder strip, and the heated solder strip moves to the first conductive wheel.

2. The welding strip annealing device according to claim 1, characterized in that: Also includes: A protection tube is provided above the first conductive wheel, the protection tube is located between the first conductive wheel and the conductive wheel assembly, and the electromagnetic heating mechanism is sleeved on the protection tube.

3. The welding strip annealing device according to claim 2, characterized in that: Also includes: The first wind blade is arranged on the outside of the cooling groove, and the first wind blade is located above a side of the first conductive wheel away from the conductive wheel assembly.

4. The welding strip annealing device according to claim 3, characterized in that: The conductive wheel assembly comprises: a second conductive wheel, the second conductive wheel being arranged outside the cooling groove and above the first conductive wheel; a first traction wheel, wherein the first traction wheel is disposed between the electromagnetic heating mechanism and the first conductive wheel, and the first traction wheel is located above the first conductive wheel; A tension wheel is arranged between the second conductive wheel and the first traction wheel, the tension wheel is located below the second conductive wheel, and the tension wheel is located above the first conductive wheel.

5. The welding strip annealing device according to claim 3, characterized in that: The conductive wheel assembly comprises: A first traction wheel, wherein the first traction wheel is arranged outside the cooling groove and is located above the first conductive wheel; A tension wheel, wherein the tension wheel is arranged on a side of the first traction wheel away from the first conductive wheel, and the tension wheel is located above the first traction wheel.

6. The welding strip annealing device according to claim 4 or 5, characterized in that: Also includes: a second traction wheel and a third traction wheel, wherein the second traction wheel and the third traction wheel are arranged side by side on a side of the protection tube away from the first conductive wheel; Wherein, when the welding ribbon annealing device is working, the welding ribbon moves to the outside of the cooling tank through the conductive wheel assembly, the first conductive wheel, the second traction wheel, the third traction wheel and the first conductive wheel in sequence.

7. The welding strip annealing device according to claim 6, characterized in that: The second traction wheel and the third traction wheel are located above the conductive wheel assembly.

8. The welding strip annealing device according to claim 6, characterized in that: A second wind blade is provided between the first conductive wheel and the second traction wheel.

9. A welding strip processing device, characterized in that: It comprises the welding strip annealing device as described in any one of claims 1-8.

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