Copper ion concentration control device, recovery system and chemical plating liquid medicine circulation equipment

Abstract

The utility model discloses a copper ion concentration control device which is used for controlling the copper ion content of liquid medicine in a chemical plating container and comprises a cooling mechanism and a separating mechanism, the cooling mechanism, the separating mechanism and the chemical plating container are sequentially communicated to form a loop, and the cooling mechanism and / or the separating mechanism are / is arranged on a machine base corresponding to the chemical plating container. The cooling mechanism is used for cooling the liquid medicine and separating out copper salt, and the separating mechanism is used for separating the separated copper salt from the liquid medicine. Preferably, the cooling mechanism and the separating mechanism are both arranged above the chemical plating container. According to the copper ion concentration control device disclosed by the utility model, the liquid medicine is cooled through the cooling device and copper salt is separated out, so that secondary cooling is not needed; meanwhile, the cooling mechanism and / or the separating mechanism are / is arranged on the machine base corresponding to the chemical plating container, the whole structure of the device is more compact, and the occupied area is small.

Description

Technical Field

[0001] The utility model belongs to the technical field of solar cell preparation and copper ion recovery, and specifically relates to a control device for controlling the copper ion concentration in a liquid medicine, a copper ion recovery system including the control device, and a chemical plating liquid circulation device. Background Art

[0002] In the preparation of solar cells, there is a technical solution for preparing grid lines of solar cells through copper interconnection technology, using electroplated copper and chemically tinned grid lines to replace traditional screen-printed silver grid lines. Specifically, through the copper interconnection technology, PVD sputtering is first performed on the ITO (TCO) conductive film to deposit a seed layer of copper for conduction, and then a pattern transfer is performed on this conductive layer to electroplate copper grid lines, and then a protective tin layer is plated on the surface of the electroplated copper grid lines using a chemical tin plating method.

[0003] However, in this scheme, the chemical plating solution will replace the copper on the grid line of the cell when tinning the cell. The tin ions will become tin and deposit on the copper surface. The metallic copper will be replaced by copper ions and merge into the chemical plating solution. The concentration of copper ions in the chemical plating solution will gradually increase with the operation of production. The concentration of copper ions in the chemical plating solution directly affects the service life of the chemical plating solution and the deposition rate of tin plating. When the concentration of copper ions in the solution reaches a certain amount, it will have a series of negative effects on the cell, thereby affecting the quality of the cell.

[0004] The copper ion recovery device in the prior art, such as the cooling crystallization system with high efficiency in extracting copper ions disclosed in application number 202121991188.2, requires secondary cooling in its recovery process, and the copper sulfate crystals in the refluxed copper sulfate suspension provide the initial crystal seeds for the solution in the crystallizer. The crystallization effect is not good enough in the initial use or when the copper ion content in the liquid is low. At the same time, its heat exchanger and crystallizer are independently arranged outside the micro-etching cylinder, occupying a large area and the structure is not compact enough. Utility Model Content

[0005] In view of this, in order to solve the problems of the prior art, the utility model provides an improved copper ion recovery device with better effect and more compact overall structure.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A copper ion concentration control device is used to control the copper ion content of a chemical plating container, comprising a cooling mechanism and a separation mechanism, wherein the cooling mechanism, the separation mechanism and the chemical plating container are sequentially connected to form a loop, and the cooling mechanism and / or the separation mechanism are arranged on a machine base corresponding to the chemical plating container; the cooling mechanism is used to cool the chemical liquid and precipitate copper salt, and the separation mechanism is used to separate the precipitated copper salt from the chemical liquid. Preferably, the cooling mechanism and the separation mechanism are both arranged above the chemical plating container.

[0008] According to some preferred implementation aspects of the utility model, the cooling mechanism includes a shell assembly and a stirring assembly, the shell assembly has a receiving cavity, the stirring assembly includes a stirring rod, the stirring rod extends into the receiving cavity, a cavity and a connecting hole connecting the receiving cavity and the cavity are provided in the stirring rod, and the cavity and the connecting hole are used to release copper salt into the receiving cavity. By providing a cavity and a connecting hole on the stirring rod, it is possible to release copper salt to the liquid contained in the shell assembly while stirring, and the copper salt released is preferably the same as the copper salt in the liquid, so as to further increase the copper ion concentration in the chemical plating liquid and accelerate precipitation. The stirring assembly also includes a driver for driving the stirring rod to rotate along its axis and a stirring paddle arranged on the stirring rod.

[0009] According to some preferred implementation aspects of the utility model, the shell assembly includes an inner cylinder and an outer cylinder sleeved outside the inner cylinder, a cooling space is formed between the inner cylinder and the outer cylinder, and a cooling medium is contained in the cooling space. The cooling medium is used to cool the liquid medicine contained in the shell assembly.

[0010] According to some preferred implementation aspects of the utility model, the cooling mechanism includes a temperature control component, which is connected to the cooling space and is used to control the temperature of the cooling medium. Preferably, the temperature control component is a cooling machine.

[0011] According to some preferred implementation aspects of the utility model, a temperature sensor is provided in the accommodating chamber, and the temperature sensor is connected to the temperature control component by signal; and / or a liquid level sensor is provided in the accommodating chamber. The temperature sensor is used to monitor the temperature of the liquid medicine contained in the shell component, and when the liquid medicine does not reach the set temperature, the temperature control component is controlled to continuously circulate and cool the cooling medium. Multiple liquid level sensors are provided in the accommodating chamber to avoid too much or too little liquid medicine in the accommodating chamber.

[0012] According to some preferred implementation aspects of the utility model, a recovery container is included, the recovery container is connected between the separation mechanism and the chemical plating container, and the recovery container is used to recover the liquid separated by the separation mechanism. The recovery container is preferably arranged on the machine base and located above the chemical plating container.

[0013] According to some preferred implementation aspects of the utility model, the separation mechanism includes a filter component or a centrifugal component for solid-liquid separation, which is used to separate the copper salt from the liquid medicine, and the liquid after separation enters a recovery container, and the solid copper salt is recovered and utilized.

[0014] According to some preferred implementation aspects of the utility model, it includes any of the following structures or a combination of two or more of them:

[0015] (1) A first pipeline is provided between the chemical plating container and the cooling mechanism, and a first pump body is provided on the first pipeline;

[0016] (2) A second pipeline is provided between the cooling mechanism and the separation mechanism, and a second pump body is provided on the second pipeline;

[0017] (3) A third pipeline is provided between the separation mechanism and the recovery container, and a third pump body is provided on the third pipeline;

[0018] (4) A fourth pipeline is provided between the recovery container and the chemical plating container. Preferably, a valve is provided on the fourth pipeline.

[0019] The utility model also provides a copper ion recovery system comprising the copper ion concentration control device as described above, which is used for recovering copper ions in a chemical plating solution.

[0020] The utility model also provides a chemical plating solution circulation device including the copper ion recovery system as described above, which realizes the reduction of copper ions in the chemical plating solution and the recovery of copper salts, so that the chemical plating solution can be recycled and the use effect is guaranteed.

[0021] According to some preferred implementation aspects of the utility model, it includes a copper ion online monitoring mechanism, which is used to monitor the copper ion concentration of the chemical plating solution in the chemical plating container, and when the copper ion concentration exceeds a set threshold, controls the chemical plating solution in the chemical plating container to be transported to the cooling mechanism.

[0022] According to some preferred implementation aspects of the utility model, a liquid level sensor is provided in the chemical plating container, and the liquid level sensor is used to control the delivery of the liquid in the recovery container to the chemical plating container when the liquid in the chemical plating container is lower than the minimum limit.

[0023] Compared with the prior art, the utility model is advantageous in that: the copper ion concentration control device of the utility model cools the chemical solution and precipitates copper salt through a cooling device, without the need for secondary cooling; at the same time, the cooling mechanism and / or the separation mechanism are arranged on the machine base corresponding to the chemical plating container, and the overall structure of the device is more compact and occupies a small area. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0025] Figure 1 This is a schematic diagram of the structure of the copper ion concentration control device in the preferred embodiment of the utility model;

[0026] Figure 2 This is a schematic diagram of the structure of the stirring assembly and the shell assembly in the preferred embodiment of the utility model;

[0027] Among them: base -1, chemical plating container -2, cooling mechanism -3, separation mechanism -4, recovery container -5, stirring component -6, stirring rod -61, connecting hole -611, driver -62, stirring paddle -63, inner cylinder -71, outer cylinder -72, cooling medium -73, temperature control component -8, first pipeline -91, second pipeline -92, third pipeline -93, fourth pipeline -94, temperature sensor -10, liquid level sensor -11. DETAILED DESCRIPTION

[0028] In order to enable those skilled in the art to better understand the technical solution of the present invention, the following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solution in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0029] like Figure 1-2 As shown, the copper ion concentration control device of this embodiment is used to control the copper ion content of the liquid in the chemical plating container 2, and includes a cooling mechanism 3, a separation mechanism 4 and a recovery container 5 in sequence, and the cooling mechanism 3, the separation mechanism 4, the recovery container 5 and the chemical plating container 2 are connected in sequence to form a loop. The cooling mechanism 3, the separation mechanism 4, and the recovery container 5 are arranged on the base 1 corresponding to the chemical plating container 2, and preferably the cooling mechanism 3, the separation mechanism 4, and the recovery container 5 are all arranged above the chemical plating container 2. The cooling mechanism 3 is used to cool the liquid and precipitate copper salts, the separation mechanism 4 is used to separate the precipitated copper salts from the liquid, and the recovery container 5 is used to recover the liquid obtained after separation by the separation mechanism 4.

[0030] The cooling mechanism 3 includes a shell component, a stirring component 6 and a temperature control component 8. The shell component has a receiving chamber for receiving the liquid medicine delivered by the chemical plating container 2. A temperature sensor 10 and a liquid level sensor 11 are arranged in the receiving chamber. The temperature sensor 10 is connected to the temperature control component 8 for signaling, and is used to monitor the temperature of the liquid medicine contained in the shell component, and when the liquid medicine does not reach the set temperature, the temperature control component 8 is controlled to continuously circulate and cool the cooling medium 73, so as to continuously cool the liquid medicine in the receiving chamber to reach the set temperature. In this embodiment, a plurality of liquid level sensors 11 are arranged in the receiving chamber to avoid too much or too little liquid medicine in the receiving chamber.

[0031] The shell assembly includes an inner cylinder 71 and an outer cylinder 72 sleeved outside the inner cylinder 71. A cooling space is formed between the inner cylinder 71 and the outer cylinder 72. The cooling space contains a cooling medium 73. The cooling medium 73 is used to cool the liquid medicine contained in the shell assembly. The temperature control assembly 8 is connected to the cooling space and is used to control the temperature of the cooling medium 73. Preferably, the temperature control assembly 8 is a cooling machine.

[0032] The stirring assembly 6 includes a stirring rod 61, a driver 62 for driving the stirring rod 61 to rotate around its own axis, and a stirring paddle 63 arranged on the stirring rod 61, and the stirring rod 61 extends into the accommodating chamber. A cavity and a connecting hole 611 connecting the accommodating chamber and the cavity are provided in the stirring rod 61, and the cavity and the connecting hole 611 are used to release copper salt into the accommodating chamber. By providing the cavity and the connecting hole 611 on the stirring rod 61, it is possible to release copper salt to the liquid contained in the shell assembly while stirring, and preferably the released copper salt is the same as the copper salt in the liquid, so as to further increase the copper ion concentration in the chemical plating liquid and accelerate the precipitation.

[0033] The separation mechanism 4 includes a filtering component or a centrifugal component for solid-liquid separation, which is used to separate the copper salt from the liquid medicine. The liquid after separation enters the recovery container 5, and the solid copper salt is recovered and utilized.

[0034] In the present embodiment, the chemical plating container 2 is communicated with the top of the housing component receiving chamber through a first pipeline 91, and a first pump body is provided on the first pipeline 91, which is used to transport the liquid in the chemical plating container 2 to the receiving chamber through the first pump body, and monitor the liquid level of the liquid through the liquid level sensor 11 in the receiving chamber. The bottom of the housing component receiving chamber is communicated with the top of the separation mechanism 4 through a second pipeline 92, and a second pump body is provided on the second pipeline 92. The liquid containing the precipitated copper salt in the receiving chamber is transported to the separation mechanism 4 through the second pipeline 92 and the second pump body for solid-liquid separation. The separation mechanism 4 is communicated with the top of the recovery container 5 through a third pipeline 93, and a third pump body is provided on the third pipeline 93. The liquid obtained after the solid-liquid separation is transported to the recovery container 5 through the third pipeline 93 and the third pump body for storage, and the solid copper salt obtained by separation is recycled. The recovery container 5 is communicated with the chemical plating container 2 through a fourth pipeline 94, and a valve or a pump body is provided on the fourth pipeline 94 to control the liquid in the recovery container 5 to be transported to the chemical plating container 2.

[0035] The chemical plating container 2 in this embodiment is provided with a copper ion online monitoring mechanism and a liquid level sensor 11. The copper ion online monitoring mechanism is used to monitor the copper ion concentration of the liquid in the chemical plating container 2, and when the copper ion concentration exceeds a set threshold, the liquid in the chemical plating container 2 is transported to the cooling mechanism 3 through the first pipeline 91 and the first pump body. The liquid level sensor 11 is used to control the liquid in the recovery container 5 to be transported to the chemical plating container 2 when the liquid in the chemical plating container 2 is lower than the minimum limit.

[0036] The working process of the copper ion concentration control device in this embodiment is briefly described below:

[0037] When the copper ion online monitoring mechanism on the chemical plating container 2 detects that the copper ion concentration of the chemical solution in the chemical plating container 2 reaches or exceeds the set threshold, the first pump body starts to transport the chemical solution in the chemical plating container 2 to the shell component accommodating cavity of the cooling mechanism 3 through the first pipeline 91 and the first pump body.

[0038] The temperature control component 8 is started, and the temperature of the liquid in the receiving chamber is reduced by controlling the temperature of the cooling medium 73 to precipitate the copper salt. At the same time, according to the concentration and precipitation of the copper salt, the copper salt of the same component as that in the liquid can be released into the receiving chamber through the cavity of the stirring rod 61 and the connecting hole 611 to increase the copper ion concentration in the chemical plating liquid and accelerate the precipitation of the copper salt. At this time, the copper ion concentration in the liquid gradually decreases with the precipitation of the copper salt.

[0039] After the precipitation is completed, the liquid containing the precipitated copper salt in the containing chamber is transported to the separation mechanism 4 through the second pipe 92 and the second pump body for solid-liquid separation. The liquid obtained after the solid-liquid separation is transported to the recovery container 5 through the third pipe 93 and the third pump body for storage, and the separated solid copper salt is recycled.

[0040] When the liquid level sensor 11 in the chemical plating container 2 detects that the liquid in the chemical plating container 2 is lower than the minimum limit, the liquid in the recovery container 5 is transported to the chemical plating container 2 through the fourth pipeline 94 and the valve or pump body thereon.

[0041] Repeat the above steps to achieve the reduction of the copper ion concentration in the chemical plating solution and the recycling of the chemical plating solution.

[0042] This embodiment also provides a copper ion recovery system including the copper ion concentration control device as described above, which is used to recover the copper ions in the chemical plating solution, that is, the precipitated copper salts.

[0043] Furthermore, this embodiment also provides a chemical plating solution circulation device including the copper ion recovery system as described above, which can reduce the copper ions in the chemical plating solution and recover the copper salt, so that the chemical plating solution can be recycled and the use effect can be guaranteed.

[0044] The copper ion concentration control device of the present embodiment, when the copper ion concentration of the chemical plating liquid in the chemical plating container 2 exceeds the threshold value, the liquid in the chemical plating container 2 is quantitatively extracted into the accommodating chamber of the shell assembly above the chemical plating container 2 by the first pump body, and the temperature control assembly 8 cools the liquid in the accommodating chamber by the cooling medium 73. A cavity is provided in the stirring rod 61 of the stirring assembly 6, and the copper salt with the same component as that in the chemical plating liquid is released through the cavity and the connecting hole 611, so as to further improve the copper ion concentration in the chemical plating liquid and accelerate the precipitation of the copper salt. The solid-liquid mixture containing the copper salt is introduced into the separation mechanism 4 through the second pipeline 92 and the second pump body for solid-liquid separation, and the liquid obtained by separation is transported to the recovery container 5 through the third pipeline 93 and the third pump body, and the recovery container 5 is communicated with the chemical plating container 2, and when the liquid level sensor 11 in the chemical plating container 2 monitors that the chemical plating liquid is less than the set threshold value, the liquid in the recovery container 5 is introduced into the chemical plating container 2 through the fourth pipeline 94 and the valve for cooling and precipitation.

[0045] Reducing the copper ion concentration in the chemical plating solution can effectively extend the service life of the chemical plating solution, reduce the amount of waste liquid discharged in the chemical plating solution because the copper ions exceed the control range, stabilize the tin plating quality, and save production costs. The copper ion concentration control device of the present embodiment cools the solution and precipitates copper salts through a cooling mechanism, separates them from the liquid, and effectively removes the copper ions in the chemical plating solution without secondary cooling; at the same time, the cooling mechanism 3, the separation mechanism 4, the recovery container 5 and other components are all arranged on the base 1 corresponding to the chemical plating container 2 and are located above the chemical plating container 2, and the overall structure of the device is more compact and occupies a small area.

[0046] The above embodiments are only for illustrating the technical concept and features of the utility model, and their purpose is to enable people familiar with this technology to understand the content of the utility model and implement it accordingly. They cannot be used to limit the protection scope of the utility model. All equivalent changes or modifications made according to the spirit of the utility model should be included in the protection scope of the utility model.

Claims

1. A copper ion concentration control device for controlling the copper ion content of a liquid in a chemical plating container, characterized in that: It comprises a cooling mechanism and a separation mechanism, wherein the cooling mechanism, the separation mechanism and the chemical plating container are sequentially connected to form a loop, and the cooling mechanism and / or the separation mechanism are arranged on a machine base corresponding to the chemical plating container; the cooling mechanism is used to cool the chemical solution and precipitate copper salt, and the separation mechanism is used to separate the precipitated copper salt from the chemical solution; The cooling mechanism comprises a shell component and a stirring component, wherein the shell component has a receiving cavity, and the stirring component comprises a stirring rod, wherein the stirring rod extends into the receiving cavity, wherein a cavity and a connecting hole connecting the receiving cavity and the cavity are provided in the stirring rod, and the cavity and the connecting hole are used to release copper salt into the receiving cavity; The shell assembly comprises an inner cylinder and an outer cylinder sleeved outside the inner cylinder, a cooling space is formed between the inner cylinder and the outer cylinder, and a cooling medium is contained in the cooling space.

2. The copper ion concentration control device according to claim 1, characterized in that: The cooling mechanism comprises a temperature control component, which is communicated with the cooling space and is used to control the temperature of the cooling medium.

3. The copper ion concentration control device according to claim 2, characterized in that: A temperature sensor is arranged in the accommodating cavity, and the temperature sensor is connected to the temperature control component by signal; and / or a liquid level sensor is arranged in the accommodating cavity.

4. The copper ion concentration control device according to claim 1, characterized in that: It comprises a recovery container, which is connected between the separation mechanism and the chemical plating container, and is used for recovering the liquid obtained after separation by the separation mechanism.

5. The copper ion concentration control device according to claim 4, characterized in that: Includes any of the following structures or a combination of two or more: (1) A first pipeline is provided between the chemical plating container and the cooling mechanism, and a first pump body is provided on the first pipeline; (2) A second pipeline is provided between the cooling mechanism and the separation mechanism, and a second pump body is provided on the second pipeline; (3) A third pipeline is provided between the separation mechanism and the recovery container, and a third pump body is provided on the third pipeline; (4) A fourth pipeline is provided between the recovery container and the chemical plating container.

6. A copper ion recovery system, characterized in that: It comprises the copper ion concentration control device as described in any one of claims 1 to 5.

7. A chemical plating solution circulation device, characterized in that: Comprising the copper ion recovery system as described in claim 6.

8. The chemical plating solution circulation equipment according to claim 7, characterized in that: It comprises a copper ion online monitoring mechanism, which is used to monitor the copper ion concentration of the chemical plating solution in the chemical plating container, and when the copper ion concentration exceeds a set threshold, controls the chemical plating solution in the chemical plating container to be transported to the cooling mechanism.

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