Electroplating testing device

Abstract

The utility model provides an electroplating testing device. The electroplating testing device comprises a testing tank body for bearing electroplating liquid, an electroplating clamp, an insoluble anode and a moving mechanism, wherein the electroplating clamp, the insoluble anode and the moving mechanism are arranged in the testing tank body; the moving mechanism is used for achieving relative movement between the insoluble electroplating clamp and the electroplating clamp so as to change the distance between the cathode and the anode in the electroplating process and achieve testing of the electroplating effect under different electroplating parameters, the earlier-stage debugging cost of actual electroplating production can be greatly reduced, the electroplating effect can be improved, and actual application of the horizontal electroplating technology is facilitated.

Description

Technical Field

[0001] This application belongs to the technical field of semiconductor manufacturing, relates to an electroplating technology, and particularly relates to an electroplating test device. Background Art

[0002] The silicon wafer coating process is a crucial technology for manufacturing solar cells. By coating the silicon wafer surface, the performance of solar cells can be improved. Currently, horizontal electroplating process is generally used for silicon wafer electroplating. Horizontal electroplating is an electroplating method developed based on vertical electroplating. The silicon wafer to be electroplated is placed horizontally on the surface of the electroplating solution in contact with it, connected to the negative pole of the power supply as the cathode, and the insoluble anode is placed in the electroplating solution to form a circuit. The silicon wafer is conveyed by rollers arranged below the silicon wafer to be electroplated, and thus a coating can be electroplated on the entire surface of the silicon wafer. Horizontal electroplating is suitable for a relatively wide range of silicon wafer sizes, causes no damage to the silicon wafer surface during the electroplating process, can fully realize automated operation, and is extremely beneficial for realizing large-scale mass production.

[0003] During the horizontal electroplating process, the distance between the silicon wafer and the anode will affect the electric field distribution on the silicon wafer surface, thereby affecting the electroplating quality of the silicon wafer. At the same time, the formulation, concentration, etc. of the electroplating solution will also affect the finished product quality of the silicon wafer electroplating. However, the existing horizontal electroplating process has not formed a unified standard for electroplating parameters, so the actual production application of the horizontal electroplating process may require multiple tests to determine the electroplating parameters and effects, resulting in a large cost and it is difficult to achieve a better electroplating effect.

[0004] Therefore, how to determine the electroplating parameters of horizontal electroplating to improve the electroplating effect of horizontal electroplating is an urgent problem to be solved by those skilled in the art. Summary of the Utility Model

[0005] The purpose of this application is to provide an electroplating test device for determining the electroplating parameters of horizontal electroplating, so as to solve the problems that the actual production application of the existing horizontal electroplating process requires prior testing to determine the parameters, resulting in a large upfront cost and it is difficult to improve the electroplating effect.

[0006] In a first aspect, this application provides an electroplating test device, including a test tank body for carrying the electroplating solution, and an electroplating fixture, an insoluble anode, and a moving mechanism arranged in the test tank body. A cathode connection end is arranged on the electroplating fixture.

[0007] The moving mechanism includes a support member and a moving component fixedly connected to the support member. The electroplating fixture or the insoluble anode is arranged on the support member, and the moving component realizes the relative movement between the insoluble anode and the electroplating fixture.

[0008] In this application, the relative movement between the insoluble anode and the electroplating fixture is achieved through a moving component, that is, the distance between the anode and the cathode during electroplating is changed, which facilitates electroplating tests. This enables users to conduct tests under conditions close to actual electroplating production processes, facilitating parameter modulation and equipment design for actual horizontal electroplating production applications, helping to reduce production costs, and enabling determination of the optimal electroplating parameters to improve electroplating effects.

[0009] In an embodiment of the present utility model, the insoluble anode is disposed on the support member, and the electroplating fixture is detachably fixed to the test tank body; or the electroplating fixture is disposed on the support member, and the insoluble anode is detachably fixed to the test tank body. The above settings can make one of the anode and the cathode fixed and the other move during electroplating, which is beneficial to accurately control the distance between the anode and the cathode.

[0010] In an embodiment of the present utility model, the moving component includes at least one guiding column and a moving connection portion disposed on the test tank body. The moving connection portion includes a fixed platform and a clamping control member disposed on the fixed platform. The guiding column is fixedly connected to the support member, and the clamping control member fixes the guiding column at different heights of the test tank body by fixing different heights of the guiding column.

[0011] In an embodiment of the present utility model, the moving component includes three guiding columns, and the moving connection portion includes at least three clamping control members, and the guiding columns correspond to at least the clamping control members one by one. The above settings can prevent the support member from shaking during movement, improve the stability of the support member, ensure that the electroplating fixture and the insoluble anode move only in the vertical direction, and improve the accuracy of the test.

[0012] In an embodiment of the present utility model, the clamping control member includes a setscrew and a setscrew hole. The guiding column passes through the setscrew hole, and the top of the setscrew is locked to clamp and fix the guiding column.

[0013] In an embodiment of the present utility model, at least one of the guiding columns is provided with a scale to facilitate directly reading the distance between the electroplating fixture and the insoluble anode. The above settings can facilitate the recording of electroplating tests and improve the convenience and operability of electroplating tests for workpieces to be electroplated.

[0014] In an embodiment of the present utility model, the electroplating test device further includes a shielding plate located between the electroplating fixture and the insoluble anode. Due to the edge effect existing in the electric field between the workpiece to be electroplated and the insoluble anode, the electric field intensity at the edge of the workpiece to be electroplated is greater than that in the central region, resulting in uneven thickness of the electroplated coating. The shielding plate can improve the uniformity of the electric field and thus improve the uniformity of the electroplated coating.

[0015] In an embodiment of the present utility model, the electroplating test device further includes a valve located at the bottom of the test tank body. The electroplating solution is discharged through the valve to realize the replacement of the electroplating solution, so as to test and obtain the appropriate formula and concentration of horizontal electroplating.

[0016] In an embodiment of the present utility model, the moving assembly further includes a lifting unit fixedly connected to at least one of the guiding columns to facilitate the moving operation of the guiding columns; the lifting unit is a handle, or a rope connected to a motor-driven rope winding device.

[0017] In an embodiment of the present utility model, the insoluble anode is a titanium mesh.

[0018] As described above, the present application provides an electroplating test device for testing the horizontal electroplating effect under different parameters, with a simple structure and low cost. The present application moves the insoluble anode through a moving mechanism to change the distance between the anode and the cathode during electroplating. The operation is simple, and the electroplating effect of the workpiece to be electroplated can be qualitatively and quantitatively tested to determine the optimal value of the horizontal electroplating parameters of the workpiece to be electroplated. Since the electroplating test device provided by the present application uses the same working principle as the electroplating tank in actual horizontal electroplating production and is in a similar working environment, the electroplating parameters obtained by testing can be directly used for the design of the electroplating tank in actual production, which is beneficial to reducing the production cost of the horizontal electroplating process. Moreover, designing the electroplating tank for actual production according to the electroplating parameters obtained by electroplating tests is beneficial to improving the electroplating effect of the workpiece to be electroplated and the finished product quality of the electroplated workpiece to be electroplated. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It shows a schematic structural diagram of an electroplating test device according to an embodiment of the present application.

[0020] Figure 2 It shows an exploded view of an electroplating test device according to an embodiment of the present application.

[0021] Figure 3 It shows a schematic structural diagram of a moving mechanism of an electroplating test device according to an embodiment of the present application.

[0022] Figure 4 It shows a top view of an electroplating test device according to an embodiment of the present application.

[0023] Figure 5 It shows a cross-sectional view of an electroplating test device according to an embodiment of the present application.

[0024] Description of Component Symbols

[0025] 100 Electroplating Test Device

[0026] 110 Test Tank Body

[0027] 120 Electroplating Fixture

[0028] 130 Baffle

[0029] 140 Moving Mechanism

[0030] 141 Guide Post

[0031] 142 Handle

[0032] 143 Support

[0033] 150 Moving Connection Part

[0034] 151 Set Screw Hole

[0035] 152 Fixed Table

[0036] 160 Valve Detailed Implementation Manner

[0037] The following uses specific specific examples to illustrate the implementation manners of the present application. Those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in this specification. The present application can also be implemented or applied through other different specific implementation manners. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that, without conflict, the following embodiments and the features in the embodiments can be combined with each other.

[0038] It should be noted that the diagrams provided in the following embodiments only illustrate the basic concept of the present application in a schematic manner. Therefore, only the components related to the present application are shown in the diagrams, rather than being drawn according to the number, shape, and size of the components in actual implementation. The type, quantity, and ratio of each component in actual implementation can be arbitrarily changed, and the component layout type may also be more complex.

[0039] The following embodiments of the present application provide an electroplating test device, which changes the distance between the workpiece to be electroplated and the anode through a moving mechanism, tests the electroplating effect of the workpiece to be electroplated at different distances, so as to determine the appropriate cathode-anode distance during horizontal electroplating of the workpiece to be electroplated. Since there is no unified electroplating parameter standard for the existing horizontal electroplating process, when horizontal electroplating is used in actual production applications, it is necessary to spend a large cost to debug the electroplating tank, and it is also very difficult to obtain an optimal electroplating parameter. The electroplating test device for the workpiece to be electroplated provided by the present application is used to test the electroplating effect of the workpiece to be electroplated, obtain an optimal electroplating scheme before actual production, can greatly reduce the cost required for actual application of horizontal electroplating, and is beneficial to achieving a better electroplating effect.

[0040] The principle and implementation manner of an electroplating test device for a workpiece to be electroplated in this embodiment will be described in detail below with reference to the accompanying drawings, so that those skilled in the art can understand the electroplating test device for the workpiece to be electroplated in this embodiment without creative labor.

[0041] As Figures 1-3 shown, an electroplating test device 100 provided in an embodiment of the present application includes a test tank body 110 for holding electroplating solution, an electroplating fixture 120, an insoluble anode (not shown in the figure), and a moving mechanism 140 disposed in the test tank body 110. Among them, the test tank body 110 is filled with electroplating solution during testing, and the electroplating test of the workpiece to be electroplated occurs in the test tank body. The electroplating fixture 120 is used to place the workpiece to be electroplated, and a cathode connection end is provided thereon. Preferably, the electroplating fixture 120 and the insoluble anode are arranged in a corresponding up-and-down position relationship. The moving mechanism 140 is used to change the distance between the workpiece to be electroplated and the insoluble anode; specifically, the moving mechanism 140 includes a support member 143 and a moving component fixedly connected to the support member 143, and the electroplating fixture 120 or the insoluble anode is disposed on the support member 143; the moving component includes at least one guide post 141, the support member 143 is fixedly connected to the lower end of the guide post 141, and when the guide post 141 moves up and down, it drives the support member 143 to move up and down, thereby changing the distance between the insoluble anode and the workpiece to be electroplated. Moreover, since the support member 143 only moves in the vertical direction, the workpiece to be electroplated and the insoluble anode can be kept in a corresponding up-and-down position relationship continuously, avoiding affecting the electroplating effect due to misalignment before and after movement, and further affecting the accuracy of the electroplating test.

[0042] It should be noted that when the insoluble anode is disposed on the support member 143, the electroplating fixture 120 is detachably fixed to the test tank body 110, and the moving component drives the insoluble anode to move up and down to change the distance between the electroplating fixture 120 and the insoluble anode; when the electroplating fixture 120 is disposed on the support member 143 or the moving component is connected to the electroplating fixture 120, the insoluble anode is detachably fixed to the test tank body 110, and the moving component drives the workpiece to be electroplated to move up and down to change the distance between the electroplating fixture 120 and the insoluble anode. Since during the horizontal electroplating process, the workpiece to be electroplated is generally placed at the liquid level position of the electroplating solution and contacts the electroplating solution, in this embodiment, the moving mechanism 140 preferably drives the insoluble anode to move to realize the change in the distance between the electroplating fixture 120 and the insoluble anode, avoiding the need to synchronously change the liquid level height of the electroplating solution when the moving component 140 drives the moving electroplating fixture 120. The method of driving the insoluble anode by the moving mechanism 140 can improve the test efficiency.

[0043] It should be noted that in order to make the movement of the support member 143 smoother and reduce shaking, the moving component can be provided with multiple guide posts 141, preferably including at least 3 guide posts, to keep the support member 143 stable. Exemplarily, asFigure 1 As shown, in this embodiment, a square test tank body 110 is adopted. The moving assembly includes 4 guide posts, which are arranged at positions close to the four edges inside the test tank body 110 to stably drive the insoluble anode to move. Further, each guide post 141 also passes through a plurality of limit holes (not shown in the figure) provided in the test tank body 110 to realize the vertical movement of the guide post 141, and then drive the insoluble anode to move smoothly.

[0044] It should be noted that the moving assembly further includes a moving connection part 150 provided on the test tank body 110. The moving connection part 150 includes a fixed platform 152 and a clamping control part provided on the fixed platform 152. The height of the guide post 141 is fixed through the clamping control part. Exemplarily, as Figure 2 shown, the moving mechanism 110 includes 4 clamping control parts, which correspond to the guide posts 141 one by one.

[0045] Specifically, the clamping control part includes a setscrew hole 151 and a setscrew (not shown in the figure). The guide post 141 passes through the setscrew hole 151, and drives the movement of the insoluble anode by sliding up and down in the setscrew hole 151. When moving to the position where measurement is required, tighten the setscrew. After the setscrew is locked, its top end catches the guide post 141 to fix the position of the insoluble anode; or, the moving connection part 150 includes a clamping mechanical structure (such as a clip), and slides the guide post 141 by loosening the clamping mechanical structure to drive the insoluble anode to translate. When moving to the position where measurement is required, clamp the clamping mechanical structure to fix the guide post 141, and then fix the position of the insoluble anode; or, the moving connection part 150 can also be other locking and fixing mechanisms. Loosen the locking and fixing mechanism to make the guide post 141 slide up and down to drive the insoluble anode to translate. When moving to the position where measurement is required, lock it to fix the guide post 141, and then fix the position of the insoluble anode.

[0046] Further, at least one guide post 141 is provided with a scale, which is convenient for directly reading the distance between the insoluble anode and the workpiece to be electroplated, is beneficial to the recording of test results, enables the optimal settings obtained from the electroplating test to directly obtain parameter values for actual production, and improves the convenience and operability of the electroplating test of the workpiece to be electroplated.

[0047] Further, the moving mechanism 140 in this embodiment further includes a handle 142. The handle 142 is fixedly connected to at least one guide post 141 as a lifting mechanism, so as to facilitate the user to operate the lifting of the guide post 141, and then control the change of the distance between the electroplating fixture 120 and the insoluble anode. Preferably, the handle 142 is fixedly connected to two guide posts 141 located on the diagonal to ensure that the guide posts 141 will not tilt during the lifting process, remain stable, and avoid affecting the electroplating effect of the workpiece to be electroplated.

[0048] It should be noted that the rise or fall of the guiding column can also be controlled by a rope connected to the motor-driven rope winding mechanism. Specifically, one end of the rope is connected to the guiding column 141, and the other end is connected to the motor-driven rope winding mechanism. The motor drives the rotating shaft to wind and tighten the rope, further driving the guiding column 141 to rise, or driving the rotating shaft to rotate reversely to release the rope, so that the guiding column 141 falls under the action of gravity. Preferably, at least two guiding columns 141 located on the diagonal are connected to the rope at their upper ends and are synchronously lifted by the motor-driven rope winding mechanism to ensure the stability of the insoluble anode during the lifting process.

[0049] Furthermore, the electroplating test device 100 provided in this embodiment further includes a shielding plate 130 located between the insoluble anode and the electroplating fixture 120. As Figure 4 shown, the shielding plate 130 includes a hole structure. It should be noted that during electroplating, the workpiece to be electroplated acts as a cathode. Due to the edge effect in the electric field formed between it and the insoluble anode, the electric field lines at the edge of the workpiece to be electroplated are more concentrated, that is, the electric field strength is greater, resulting in poor uniformity of the finally electroplated coating. In this embodiment, by setting a hole structure on the shielding plate 130, the electric field lines penetrate through the holes, and the electric field lines at the positions without holes cannot pass through, that is, part of the electric field is shielded, thereby realizing the regulation of the electric field to reduce the edge effect caused by the edge effect. Furthermore, the holes in the middle of the hole structure of the shielding plate 130 are large and the holes at the edge are small, or the holes in the middle are dense and the holes at the edge are relatively sparse, so that the electric field strength at each part of the workpiece to be electroplated is more uniform, improving the uniformity of the electroplated coating. It should be noted that the shielding plate 130 can make the electric field strength uniform at any position between the insoluble anode and the workpiece to be electroplated. Preferably, the shielding plate 130 is placed on the insoluble anode, without additionally setting a structure for fixing the shielding plate 130 to the test tank body 110, saving the internal space of the test device, saving costs, and not hindering the up and down translation of the insoluble anode.

[0050] Preferably, the insoluble anode in this embodiment is a titanium mesh.

[0051] Preferably, the electroplating test device 100 provided in this embodiment further includes a valve 160 located at the bottom of the test tank 110. Since the formula and concentration of the electroplating solution have a great influence on the electroplated coating, the electroplating test device provided in this embodiment is also used to test the electroplating effects of different electroplating solutions. Specifically, the valve 160 is used to drain the electroplating solution in the test tank 110 to replace the electroplating solution, so as to test the electroplating effects of different electroplating solutions. It should be noted that the electroplating solution can enter the electroplating test device from the upper notch or enter the electroplating test device through a pressure pump via the valve 160 and is discharged through the valve 160, avoiding the need to pour the test tank 110 to drain the electroplating solution, which is more convenient and helps to improve the operability and test efficiency of the electroplating test of the workpiece to be electroplated.

[0052] The electroplating test device 100 provided in this embodiment has a simple structure and low cost, and can qualitatively and quantitatively test the electroplating effect of the workpiece to be electroplated to determine the optimal value of the horizontal electroplating parameters of the workpiece to be electroplated and achieve a better electroplating effect. In this embodiment, the moving mechanism 140 moves the insoluble anode to change the distance between the electroplating fixture 120 and the insoluble anode, and a scale is provided on the guide post 141 of the moving mechanism 140, which can directly read the distance between the electroplating fixture 120 and the insoluble anode, facilitating the recording of test results. In addition, this embodiment further includes a valve 160 located at the bottom of the test tank 110, which is used to drain the electroplating solution in the test tank 110 to realize the electroplating test of different electroplating solution formulas and concentrations, further improving the electroplating test effect of the workpiece to be electroplated.

[0053] The electroplating test method of the workpiece to be electroplated will be specifically described below.

[0054] As Figure 5 shown, the electroplating test device 100 is filled with an electroplating solution, and the formula and concentration of the electroplating solution are known. The workpiece to be electroplated is fixed in the test tank 110 through the electroplating fixture 120 and contacts the liquid level of the electroplating solution. The insoluble anode is placed on the support member 143, the support member 143 is fixedly connected to the lower end of the guide post 141, and the handle 142 is fixedly connected to the upper end of the guide post 141.

[0055] Loosen the set screw of the movable connecting part 150 to make the guide post 141 slide in the set screw hole 151 to drive the insoluble anode placed on the support member 143 to move up and down horizontally. Specifically, by lifting or lowering the handle 142, the guide post 141 is made to slide in the set screw hole 151. It should be noted that this embodiment includes 4 guide posts 141, which can make the process of driving the insoluble anode to move up and down horizontally by the guide post 141 relatively stable and ensure that the insoluble anode is in a horizontal state.

[0056] Read the scale on the guiding column 141. The distance between the insoluble anode and the workpiece to be electroplated can be directly obtained through the scale on the guiding column 141. Specifically, since the workpiece to be electroplated is connected to a fixed position of the test tank body 110 through the electroplating fixture 120, and the insoluble anode is placed on the support member 143, that is, at the fixed lower end position of the guiding column 141. Based on this, the scale on the guiding column 141 actually shows the distance from the fixed lower end position of the guiding column 141 to the electroplating fixture 120, which is also the distance between the workpiece to be electroplated and the insoluble anode.

[0057] When the distance shown by the scale on the guiding column 141 is the value to be tested, tighten the set screw in the set screw hole 151 to fix the guiding column 141, so that the distance between the insoluble anode and the workpiece to be electroplated is fixed.

[0058] Connect the power supply. The workpiece to be electroplated serves as the cathode and is placed at the liquid level of the electroplating solution. The insoluble anode is placed in the electroplating solution inside the test tank body 110 to form a circuit to achieve electroplating of the workpiece to be electroplated. Preferably, the power supply used for electroplating in this embodiment is a constant current source to provide a stable current.

[0059] After completing the electroplating of the workpiece to be electroplated, test the quality of the coating on the surface of the workpiece to be electroplated. Specifically, quantitatively evaluate the quality of the coating through whether the coating on the surface of the workpiece to be electroplated is charred, oxidized, the thickness and uniformity of the coating, etc. It should be noted that in order to improve the accuracy of the experiment, the coating conditions of the workpiece to be electroplated under the electroplating conditions with the same position of the insoluble anode can be measured multiple times to exclude the influence of accidental situations.

[0060] After completing the electroplating test at this position of the insoluble anode, record the electroplating effect of the workpiece to be electroplated and change the distance for testing.

[0061] Loosen the set screw of the movable connection part 150 to make the guiding column 141 movable again. Change the position of the insoluble anode to change the distance between the workpiece to be electroplated and the insoluble anode, repeat the above steps of electroplating the workpiece to be electroplated, and record the quality of the coating on the surface of the workpiece to be electroplated again. By comparing the electroplating effects when the insoluble anode is at multiple different positions, the most suitable cathode - anode distance for electroplating the workpiece to be electroplated can be determined.

[0062] Furthermore, during the electroplating process of the workpiece to be electroplated, the formula or concentration of the electroplating solution will affect the coating quality of the workpiece to be electroplated. Based on this, after determining the appropriate position of the insoluble anode, that is, the appropriate anode-cathode distance, open valve 160 to drain the electroplating solution in the test tank 110, and then fill it with a new electroplating solution to conduct the electroplating test again to determine the most suitable electroplating solution formula and concentration. Specifically, the electroplating effects of electroplating solutions with different concentrations of the same formula can be tested first, and then the electroplating solution formula can be changed to re-test the electroplating effects at different concentrations to obtain the appropriate electroplating solution formula and concentration; alternatively, the electroplating effects of different electroplating solutions with the same concentration can be tested first, and then the concentration of the electroplating solution can be changed to re-test the electroplating effects to obtain the appropriate electroplating solution formula and concentration. Preferably, the electroplating effects of different electroplating solutions can be tested at the optimal anode-cathode distance obtained through testing.

[0063] Preferably, after completing the electroplating test of the same electroplating solution, open valve 160 to drain the electroplating solution in the test tank 110, and then fill the test tank 110 with pure water for cleaning, and then drain the water and fill it with a new electroplating solution to avoid the residue of the previous test liquid from affecting the concentration of the electroplating solution in the subsequent test or causing reactions, thereby improving the accuracy of the electroplating test results.

[0064] It should be noted that there is no specific order for testing the effects of the position of the insoluble anode and the electroplating solution formula and concentration on the electroplating effect. The appropriate position of the insoluble anode can be tested first, and then the appropriate electroplating solution formula and concentration can be tested. Alternatively, the appropriate electroplating solution formula and concentration can be tested first, and then the appropriate position of the insoluble anode can be tested. This embodiment does not make specific limitations here.

[0065] Since the electroplating test device 100 provided in this embodiment uses the same working principle as the electroplating tank in the actual production of electroplating the workpiece to be electroplated and is in a similar working environment, the electroplating parameters obtained through the electroplating test device 100 can be directly used for the design of the electroplating tank in actual production, which is beneficial to reducing the production cost of the horizontal electroplating process. Moreover, designing the electroplating tank used in actual production according to the electroplating parameters obtained through the electroplating test is beneficial to improving the electroplating effect and the finished product quality of the horizontal electroplating coating.

[0066] In summary, for the electroplating test device 100 provided in this application, the insoluble anode is moved by the moving mechanism 140 to conveniently and accurately change the distance between the electroplating anode and cathode, and the formula and concentration of the electroplating solution are changed by the valve 160. The structure is simple, the manufacturing cost is low, it is easy to realize the test of the electroplating effect under different electroplating parameters, and the electroplating test device 100 uses the same working principle as the electroplating tank in actual production and is in a similar working environment. Designing the electroplating tank for actual production based on the electroplating parameters obtained from the test can greatly reduce the debugging cost in the early stage of actual electroplating production of the workpiece to be electroplated and improve the electroplating effect of the workpiece to be electroplated, which is beneficial to the practical application of the horizontal electroplating process.

[0067] The descriptions of the processes or structures corresponding to the above-mentioned respective drawings each have their own focuses. For parts not detailed in a certain process or structure, reference can be made to the relevant descriptions of other processes or structures.

[0068] The above embodiments are only illustrative of the principles and effects of this application and are not used to limit this application. Any person familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of this application. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical ideas disclosed in this application should still be covered by the claims of this application.

Claims

1. An electroplating test device, characterized in that: It comprises a test tank body for carrying electroplating solution, and an electroplating fixture, an insoluble anode and a moving mechanism arranged in the test tank body, wherein the electroplating fixture is provided with a cathode connecting terminal; The moving mechanism includes a support and a moving component fixedly connected to the support. The electroplating fixture or the insoluble anode is arranged on the support. The moving component realizes relative movement between the insoluble anode and the electroplating fixture.

2. The electroplating test device according to claim 1, characterized in that: The insoluble anode is arranged on the support, and the electroplating fixture is detachably fixed on the test slot body; or the electroplating fixture is arranged on the support, and the insoluble anode is detachably fixed on the test slot body.

3. The electroplating test device according to claim 1, characterized in that: The movable assembly includes at least one guide column and a movable connection portion arranged on the test slot body, the movable connection portion includes a fixed platform and a card control portion arranged on the fixed platform, the guide column is fixedly connected to the support member, and the card control portion fixes the guide column at different heights to achieve fixing the guide column at different heights of the test slot body.

4. The electroplating test device according to claim 3, characterized in that: The moving assembly includes at least three guide posts, the moving connection portion includes at least three card controls, and the guide posts correspond to the card controls one by one.

5. The electroplating test device according to claim 3, characterized in that: The card control comprises a top screw and a top screw hole, the guide column passes through the top screw hole, and the top end of the top screw is locked and fixed to the guide column after being locked.

6. The electroplating test device according to claim 3, characterized in that: At least one of the guide posts is provided with a scale.

7. The electroplating testing device according to claim 1, characterized in that: Also included is a shielding plate located between the electroplating fixture and the insoluble anode.

8. The electroplating testing device according to claim 1, characterized in that: Also included is a valve located at the bottom of the test tank.

9. The electroplating test device according to claim 3, characterized in that: The moving assembly also includes a lifting unit fixedly connected to at least one guide column; The lifting unit is a handle, or a rope connected to a motor-driven rope winder.

10. The electroplating testing device according to claim 1, characterized in that: The insoluble anode is a titanium mesh.

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