Electroplating conductive device for rotor

By setting up cathode rods No. 1 and No. 2 in the electroplating device and using support seats and rollers to support the rotation of cathode rods No. 2, the problem of uneven electroplating of long workpiece rotors is solved and the plating quality is improved.

CN222908126UActive Publication Date: 2025-05-27ZHOUSHAN JINQIU MACHINERY
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Patent Information

Application Number
CN202421983563.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-08-16
Publication Date
2025-05-27
Estimated Expiration
2034-08-16

AI Technical Summary

Technical Problem

During the electroplating process, the rotor of the long workpiece is far away from the cathode rod, resulting in uneven current distribution, resulting in uneven electroplating layer, affecting the plating quality.

Method used

A rotor electroplating conductive device is designed, using cathode rods No. 1 and No. 2 respectively arranged on both sides of the plating tank, and the rotation of the cathode rod No. 2 is supported by the support seat and the support roller to ensure uniform electroplating at both ends.

Benefits of technology

By uniform electroplating at both ends of the rotor, the problem of uneven electroplating is solved and the plating quality is improved.

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Abstract

The utility model provides a rotor electroplating conductive device which solves the problem that electroplating is not uniform in the electroplating process of an existing long workpiece. The second cathode bar is arranged on the other side of the plating bath; the mounting head II is arranged at the front end of the cathode bar II; the supporting seat is arranged below the second cathode bar; and the supporting roller is arranged on the supporting seat and is in contact with the second cathode bar. The first installation head and the second installation head are matched with the two ends of the rotor respectively and then installed on the first cathode bar and the second cathode bar respectively, the second cathode bar is supported through the supporting rollers on the supporting base, rotation of the second cathode bar is facilitated, the first cathode bar and the second cathode bar are powered on at the same time during electroplating, and therefore it is guaranteed that the rotor can be electroplated evenly, and the electroplating efficiency is improved. The electroplating quality is improved.
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Description

Technical Field

[0001] The utility model relates to the technical field of electroplating equipment, and particularly relates to a rotor electroplating conductive device. Background Art

[0002] Chinese Patent Authorization Publication No. CN210657208U discloses an electroplating device. By connecting one end of a workpiece to a cathode rod and placing the other end on a support part, during electroplating, the motor drives the cathode rod to rotate so that the workpiece rotates, which can improve the quality of the electroplating layer. However, during the electroplating process of a rotor with a relatively large electroplating length, since one end of the rotor is far from the cathode rod, it will cause uneven current distribution, resulting in uneven electroplating layers at both ends of the rotor, thereby affecting the electroplating quality. Summary of the Utility Model

[0003] To overcome the deficiencies of the background art, the utility model provides a rotor electroplating conductive device, which solves the problem of uneven electroplating of existing long workpieces during electroplating.

[0004] The technical scheme adopted by the utility model is as follows:

[0005] A rotor electroplating conductive device includes a plating tank. An anode plate is arranged in the plating tank. One side of the plating tank is provided with a first cathode rod. One end of the first cathode rod is provided with a first mounting head. The first cathode rod is equipped with a power device. The device further includes:

[0006] A second cathode rod, which is arranged on the other side of the plating tank;

[0007] A second mounting head, which is arranged at the front end of the second cathode rod;

[0008] A support seat, which is arranged below the second cathode rod;

[0009] Support rollers, which are arranged on the support seat and are in contact with the second cathode rod.

[0010] The support seat includes a first support seat arranged on the outer wall of the plating tank and a second support seat arranged in the plating tank. The second support seat is equipped with a lifting mechanism.

[0011] The lifting mechanism includes a mounting seat cooperating with the second support seat. A rotating shaft is arranged in the mounting seat. An eccentric wheel for supporting the second support seat is installed on the rotating shaft. The rotating shaft is equipped with a handle.

[0012] There are two support rollers, which are respectively arranged on the left and right sides of the second cathode rod.

[0013] The second mounting head is provided with a conical part. One end of the second cathode rod is provided with a conical hole for cooperating with the conical part. A threaded rod for cooperating with the second mounting head is installed on the second cathode rod.

[0014] The second cathode rod is installed with an insulating sleeve.

[0015] A roller shaft for contacting the second cathode rod is installed in the plating tank, and the height of the roller shaft is adjustable.

[0016] The beneficial effects of the present utility model are:

[0017] The first mounting head and the second mounting head are respectively fitted with the two ends of the rotor, and then are respectively mounted on the first cathode rod and the second cathode rod. The supporting rollers on the supporting seat support the second cathode rod to facilitate the rotation of the second cathode rod. During electroplating, the first cathode rod and the second cathode rod are simultaneously energized, thereby ensuring that the rotor can be evenly electroplated and improving the electroplating quality. Description of the Drawings

[0018] Figure 1 is a schematic diagram of the present utility model.

[0019] Figure 2 is the present utility model Figure 1 The enlarged schematic diagram at A in.

[0020] Figure 3 is a schematic diagram of the lifting mechanism of the present utility model.

[0021] Figure 4 is a side schematic diagram of the first support seat of the present utility model.

[0022] Plating tank 1, first cathode rod 2, power device 3, second cathode rod 4, second mounting head 5, support seat 6, first support seat 61, second support seat 62, support roller 7, lifting mechanism 8, mounting seat 81, rotating shaft 82, eccentric wheel 83, handle 84, tapered hole 9, threaded rod 10, insulating sleeve 11, roller shaft 12. Detailed Embodiment

[0023] The present utility model will be further described below in conjunction with the drawings and embodiments:

[0024] In the embodiment, as Figure 1 , Figure 2 shown, the rotor electroplating conductive device includes a plating tank 1, an anode plate is provided in the plating tank 1, a first cathode rod 2 is provided on one side of the plating tank 1, a first mounting head is provided at one end of the first cathode rod 2, the first cathode rod 2 is equipped with a power device 3, and further includes:

[0025] A second cathode rod 4, which is arranged on the other side of the plating tank 1;

[0026] A second mounting head 5, which is arranged at the front end of the second cathode rod 4;

[0027] A support seat 6, which is arranged below the second cathode rod 4;

[0028] The supporting roller 7 is arranged on the supporting seat 6 and contacts with the second cathode rod 4.

[0029] The first mounting head and the second mounting head 5 are respectively fitted with the two ends of the rotor, and then are respectively mounted on the first cathode rod 2 and the second cathode rod 4. The supporting roller 7 on the supporting seat 6 supports the second cathode rod 4, facilitating the rotation of the second cathode rod 4. During electroplating, electricity is simultaneously applied to the first cathode rod 2 and the second cathode rod 4, thereby ensuring uniform electroplating of the rotor and improving the electroplating quality.

[0030] In the embodiment, as Figure 1 、 Figure 3 shown, the supporting seat 6 includes a first supporting seat 61 arranged on the outer wall of the plating tank 1 and a second supporting seat 62 arranged inside the plating tank 1. The second supporting seat 62 is equipped with a lifting mechanism 8. The first supporting seat 61 and the second supporting seat 62 respectively support the second cathode rod 4, facilitating the stable rotation of the second cathode rod 4. When it is necessary to install the rotor and move the second cathode rod 4, the second supporting seat 62 can be lowered to facilitate the forward and backward movement of the second cathode rod 4. A sealing member is provided between the second cathode rod 4 and the plating tank 1.

[0031] In the embodiment, as Figure 1 、 Figure 3 shown, the lifting mechanism 8 includes a mounting seat 81 that cooperates with the second supporting seat 62. A rotating shaft 82 is arranged inside the mounting seat. An eccentric wheel 83 for supporting the second supporting seat 62 is installed on the rotating shaft 82, and a handle 84 is equipped on the rotating shaft 82. By rotating the eccentric wheel 83, the second supporting seat 62 can be lifted and lowered, with a simple structure and convenient operation.

[0032] In the embodiment, as Figure 1 、 Figure 4 shown, there are two supporting rollers 7, which are respectively arranged on the left and right sides of the second cathode rod 4. Ensure the stability and balance when the second cathode rod 4 rotates.

[0033] In the embodiment, as Figure 1 、 Figure 2 shown, the second mounting head 5 is provided with a conical portion, one end of the second cathode rod 4 is provided with a conical hole 9 for cooperating with the conical portion, and a threaded rod 10 for cooperating with the second mounting head is installed on the second cathode rod 4. By rotating the threaded rod 10 to drive the second mounting head 5 to move, the conical portion of the second mounting head 5 is made to cooperate with the conical hole 9, so that the second mounting head 5 fits with the second cathode rod 4, and the electrical conductivity effect is good; of course, the mechanisms of the first cathode rod 2, the first mounting head and the second cathode rod 4, the second mounting head 5 are the same.

[0034] In the embodiment, as Figure 1 、 Figure 4As shown, an insulating sleeve 11 is installed on the second cathode rod 4. Insulation is provided around the second cathode rod 4 to prevent the second cathode rod 4 from conducting with the plating bath 1.

[0035] In the embodiment, as Figure 1 shown, a roller shaft 12 for contacting the second cathode rod 4 is installed in the plating bath 1, and the height of the roller shaft 12 is adjustable. A bearing seat for the roller shaft 12 is provided in the plating bath 1, and an adjusting bolt cooperating with the bearing seat is installed below the bearing seat. The height of the roller shaft 12 can be adjusted by the adjusting bolt. When electroplating, the roller shaft 12 is separated from the second cathode rod 4 to facilitate the circumferential rotation of the second cathode rod 4; when installing the rotor, the roller shaft 12 contacts the second cathode rod 4 to facilitate the forward and backward movement of the second cathode rod 4.

[0036] Obviously, the above embodiments of the present invention are merely examples for explaining the present invention, rather than limiting the implementation manners of the present invention. For those of ordinary skill in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation manners here. And these obvious changes or modifications derived from the essential spirit of the present invention still fall within the protection scope of the present invention.

Claims

1. A rotor electroplating conductive device, comprising a plating tank (1), wherein an anode plate is arranged in the plating tank (1), a cathode rod (2) is arranged on one side of the plating tank (1), a mounting head is arranged at one end of the cathode rod (2), and the cathode rod (2) is equipped with a power device (3), characterized in that: Also includes: A second cathode rod (4) is arranged at the other side of the plating tank (1); A second mounting head (5) is arranged at the front end of the second cathode rod (4); A support seat (6) is arranged below the second cathode rod (4); A supporting roller (7) is arranged on the supporting seat (6) and is in contact with the second cathode rod (4).

2. The rotor electroplating conductive device according to claim 1, characterized in that: The support seat (6) comprises a first support seat (61) arranged on the outer wall of the plating tank (1) and a second support seat (62) arranged in the plating tank (1), wherein the second support seat (62) is equipped with a lifting mechanism (8).

3. The rotor electroplating conductive device according to claim 2, characterized in that: The lifting mechanism (8) comprises a mounting seat (81) matched with the second supporting seat (62), a rotating shaft (82) being arranged in the mounting seat, an eccentric wheel (83) being installed on the rotating shaft (82) for supporting the second supporting seat (62), and the rotating shaft (82) is provided with a handle (84).

4. The rotor electroplating conductive device according to claim 1, characterized in that: There are two supporting rollers (7), which are respectively arranged on the left and right sides of the No. 2 cathode rod (4).

5. The rotor electroplating conductive device according to claim 1, characterized in that: The No. 2 mounting head (5) is provided with a conical portion, one end of the No. 2 cathode rod (4) is provided with a conical hole (9) for cooperating with the conical portion, and the No. 2 cathode rod (4) is provided with a threaded rod (10) for cooperating with the No. 2 mounting head.

6. The rotor electroplating conductive device according to claim 1, characterized in that: The second cathode rod (4) is provided with an insulating sleeve (11).

7. The rotor electroplating conductive device according to claim 1, characterized in that: A roller shaft (12) for contacting the second cathode rod (4) is installed in the plating tank (1), and the height of the roller shaft (12) is adjustable.