Chip BGA testing device

Abstract

The utility model relates to the field of chip packaging testing devices, in particular to a chip BGA (Ball Grid Array) testing device, an elastic sheet terminal comprises a clamping end and a welding end, and the clamping end comprises a first connecting sheet and a second connecting sheet; the first connecting piece and the second connecting piece are connected with one end of the welding end, and each of the first connecting piece and the second connecting piece is provided with a semicircular end part; the welding end is assembled on the fixing base, the first connecting piece and the second connecting piece are located on the two sides of the same first spacer block respectively, and the end of the first connecting piece and the end of the second connecting piece penetrate out of the first fixing hole, so that compared with a traditional transverse placing mode, the space can be more effectively utilized, and the space utilization rate is improved. Especially, when small-spacing chips are tested, interference between the first connecting sheet and the second connecting sheet can be avoided, and it is ensured that enough space is reserved between the first connecting sheet and the second connecting sheet to open the first connecting sheet and the second connecting sheet.

Description

Technical Field

[0001] The utility model relates to the field of chip packaging and testing devices, especially a chip BGA testing device. Background Art

[0002] When installing and testing a chip with the existing test socket, it is necessary to first press down the test socket to drive the slot wall to move downward, so that the two test feet of the elastic piece open. When the opening space is larger than the ball diameter, the chip is placed and the pressure is removed. The test socket resets and moves upward, and the elastic piece pins contract and move inward to clamp the solder ball to complete the pin fixing action.

[0003] In the existing chip test socket, elastic piece test holes are opened on the test socket and the contact surface. The elastic piece passes through the test socket through the test holes and then contacts the test chip to complete the transmission of the test current. For the ball-clamping type chip test socket, the number of test elastic pieces at a single test point is two. During the test operation, the straight edges at the heads of the two elastic pieces contact the round solder balls on the test chip. However, in actual application, poor contact is likely to occur during the contact process between the parallel edges of the elastic piece and the chip solder ball, resulting in a low test yield.

[0004] Refer to Figure 14 , in the prior art, two adjacent elastic pieces are placed horizontally with respect to each other. When the two test feet are opened, if the chips have different specifications (for example, the distance between the centers of two adjacent solder balls is 0.5 mm), the corresponding elastic pieces of the two adjacent test feet will interfere with each other, and it cannot be ensured that they are fully opened, so that it is impossible to grasp the solder balls of the chip. The method of the prior art may only further reduce the width of the two elastic pieces, but reducing the width will cause adverse effects such as unstable contact with the solder ball and impaired test accuracy. At the same time, the compatibility with multi-pin chips is very poor. Summary of the Invention

[0005] To solve the above problems, the utility model provides a chip BGA testing device. By placing the fixed slot holes obliquely (preferably at a 45-degree angle), each elastic piece terminal of the present application is placed obliquely (preferably at a 45-degree angle). Compared with the traditional horizontal placement method, it can make more effective use of space. Especially when testing small-pitch chips, it can avoid interference between the first connecting piece and the second connecting piece and ensure that there is enough space between them to open.

[0006] To achieve the above object, the technical solution adopted by the utility model is: a chip BGA testing device, including a fixed base, a moving positioning plate, and a pushing device. A plurality of obliquely arranged first fixed slot holes are opened on the moving positioning plate, and the first fixed slot holes located on the same straight line are separated into a plurality of first fixed holes by a first spacer block;

[0007] Further, the first fixed slot holes are arranged on the surface of the moving positioning plate at a 45-degree angle.

[0008] Furthermore, the elastic sheet terminal includes a clamping end and a welding end. The clamping end includes a first connecting piece and a second connecting piece; the first connecting piece and the second connecting piece are connected to one end of the welding end, and both the first connecting piece and the second connecting piece have semi-circular ends; the welding end is assembled on the fixed base, the first connecting piece and the second connecting piece are respectively located on both sides of the same first spacer block, and the ends of the first connecting piece and the second connecting piece extend out of the first fixing hole; the moving positioning plate is driven by a pushing device to move along the direction of the first fixing slot hole, so that the first connecting piece and the second connecting piece move away from each other.

[0009] Furthermore, the fixed base includes a fixed frame, a fixed bottom plate, and a fixed auxiliary positioning frame. The fixed auxiliary positioning frame is assembled on the surface of the fixed bottom plate, and the fixed bottom plate is assembled at the bottom of the fixed frame; a plurality of first assembly holes are provided on the surface of the fixed bottom plate, and a plurality of second assembly holes for positioning the welding end are provided on the fixed auxiliary positioning frame. A pin end is integrally provided at the tail end of the welding end, and the pin end passes through the second assembly hole and is assembled on the first assembly hole, and the welding end is assembled in the second assembly hole.

[0010] Furthermore, a first buckle is assembled on the side of the fixed bottom plate, and a first buckle position is provided on the side surface of the fixed frame. The fixed bottom plate is buckled to the first buckle position through the first buckle.

[0011] Furthermore, a slider slot is provided on the surface of the fixed frame. The moving positioning plate is arranged in the slider slot, and first pushing inclined surfaces are arranged at the corners of the moving positioning plate. The pushing device is provided with a plurality of pushing claws, and a second pushing inclined surface corresponding to the first pushing inclined surface is arranged on each pushing claw. Pressing down the pushing device makes the second pushing inclined surface push the first pushing inclined surface, so that the moving positioning plate moves along the direction of the first fixing slot hole. At the same time, the moving positioning plate is reset through the first return spring.

[0012] Furthermore, a spring assembly groove is provided at the corner of the fixed frame, and a spring assembly post is provided at the corner of the pushing device. One end of the second return spring is sleeved on the spring assembly post, and the other end is assembled in the spring assembly groove.

[0013] Furthermore, a limiting sliding groove is provided on the side surface of the fixed frame. A first limiting protrusion protrudes from the surface of the limiting sliding groove. A plurality of limiting claws are provided at the bottom of the pushing device. A second limiting protrusion is arranged at the end of the inner side of the limiting claw. The limiting claws are slidably assembled in the limiting sliding groove, and the limiting claws are limited by contacting the first limiting protrusion through the second limiting protrusion.

[0014] Further, several second fixing slot holes are arranged on the surface of the fixing frame at a 45-degree angle, and the second fixing slot holes located on the same straight line are separated by second spacer blocks into several second fixing holes arranged at a 45-degree angle. The first connecting piece and the second connecting piece pass through the second fixing holes and extend outside the first fixing holes.

[0015] Further, each second fixing hole is separated by a third spacer block into two independent cavities.

[0016] Further, the longitudinal section of the first spacer block is triangular.

[0017] Further, the second connecting piece extends vertically upward, and the first connecting piece includes a first vertical section, an inclined section, and a second vertical section from bottom to top; a relief inclined surface is further provided at the top of one side of the second spacer block close to the inclined section.

[0018] The beneficial effects of the present utility model are as follows:

[0019] 1. By arranging the fixing slot holes obliquely, compared with the traditional horizontal placement method, the space can be utilized more effectively. Especially when testing small-pitch chips (such as 0.5 mm specification), the interference between the first connecting piece and the second connecting piece can be avoided, ensuring sufficient space for them to open.

[0020] 2. In the traditional method, it may be necessary to reduce the thickness of the first connecting piece and the second connecting piece to avoid interference, but this will reduce the stability of the fixed solder balls and affect the test accuracy. However, the present technical solution avoids this problem by changing the direction of the fixing slot holes, ensuring the test accuracy and stability. Description of the Drawings

[0021] Figure 1 is a schematic structural diagram of the testing device.

[0022] Figure 2 is a schematic structural diagram of the testing device from another perspective.

[0023] Figure 3 is a schematic structural diagram of the fixing frame.

[0024] Figure 4 is a schematic longitudinal section diagram of the fixing frame.

[0025] Figure 5 is a schematic structural diagram after the fixing base plate, the fixing auxiliary positioning frame, and the elastic piece terminals are assembled.

[0026] Figure 6 is a schematic structural diagram of the fixing base plate, the fixing auxiliary positioning frame, and the elastic piece terminals assembled from another perspective.

[0027] Figure 7It is a schematic diagram of the structure of the elastic sheet terminal.

[0028] Figure 8 It is an enlarged schematic diagram of the end structure of the elastic sheet terminal.

[0029] Figure 9 It is a schematic diagram of the structure of the moving positioning block.

[0030] Figure 10 It is a bottom view of the moving positioning block.

[0031] Figure 11 It is Figure 10 A cross-sectional view along the section line A-A on the basis.

[0032] Figure 12 It is a schematic diagram of the structure of the pushing device.

[0033] Figure 13 It is a schematic diagram of the positional relationship between the solder ball and the elastic sheet terminal in a specific embodiment.

[0034] Figure 14 It is a schematic diagram of the positional relationship between the solder ball and the elastic sheet terminal in the prior art.

[0035] Explanation of the reference numerals in the drawings: Pushing device 1, fixed frame 2, slider slot 21, limiting chute 23, first limiting protrusion 231, first buckle 24, spring fitting groove 25, third partition block 261, second partition block 262, chamfered surface 2621, second fixing hole 263, fixed bottom plate 3, first fitting hole 31, first buckle 32, elastic sheet terminal 4, first connecting piece 41, second connecting piece 42, welding end 43, pin end 44, end 45, first vertical section 411, inclined section 412, second vertical section 413, moving positioning plate 5, first fixing slot hole 51, first spacer block 52, first fixing hole 53, first pushing inclined surface 54, pushing claw 11, second pushing inclined surface 111, limiting claw 12, spring fitting column 13, second return spring 14, second limiting protrusion 121, fixed auxiliary positioning frame 6, second fitting hole 61, solder ball 40. Detailed implementation manners

[0036] Please refer to Figures 1-14 As shown, the present invention provides a chip BGA testing device, including a fixed base, a moving positioning plate 5, and a pushing device 1. A plurality of first fixing slot holes 51 arranged at a 45-degree angle are formed on the moving positioning plate 5, and the first fixing slot holes 51 located on the same straight line are separated into a plurality of first fixing holes 53 arranged at a 45-degree angle by a first spacer block 52;

[0037] The elastic sheet terminal 4 includes a clamping end and a welding end 43. The clamping end includes a first connecting piece 41 and a second connecting piece 42. One end of the first connecting piece 41 and the second connecting piece 42 is connected to the welding end 43. Both the first connecting piece 41 and the second connecting piece 42 have an end 45 in the shape of a 1 / 4 sphere. The welding end 43 is fitted on the fixed base. The first connecting piece 41 and the second connecting piece 42 are respectively located on both sides of the same first spacer block 52, and the ends 45 of the first connecting piece 41 and the second connecting piece 42 extend out of the first fixing hole 53. By driving the moving positioning plate 5 to move along the direction of the first fixing slot hole 51 by the driving device 1, the first connecting piece 41 and the second connecting piece 42 are moved away from each other.

[0038] In this specific embodiment, the main improvement is that a number of fixing slot holes are provided on the moving positioning plate 5 and are placed at a 45-degree angle. The first fixing slot holes 51 on the same straight line are separated into a number of first fixing holes 53 placed at a 45-degree angle by the first spacer block 52.

[0039] Compared with the fixing slot holes placed horizontally in the traditional technology, if the moving positioning plate 5 can be displaced in the horizontal direction, it will push the first connecting piece 41 and the second connecting piece 42 to open. If the moving positioning plate 5 is designed for a 0.5-mm specification chip (the distance between the centers of two adjacent solder balls 40 is 0.5 mm), the corresponding first connecting piece 41 will interfere with the second connecting piece 42, and it cannot be guaranteed to be fully opened, making it impossible to grasp the solder balls 40 of the chip. The method of the prior art may only further reduce the thickness of the first connecting piece 41 and the second connecting piece 42, but reducing the thickness will cause adverse effects such as unstable fixing of the solder balls 40 and impaired test accuracy.

[0040] In this specific embodiment, the fixing slot holes are placed at a 45-degree angle. For the same 0.5-mm specification chip, multiple elastic sheet terminals 4 grasp several solder balls 40 in the 0.5-mm specification chip in an oblique manner. Because in the 0.5-mm specification chip, the distance between two obliquely opposite solder balls 40 is about 0.7 mm (see Figure 12 ), the problem of interference between the first connecting piece 41 and the second connecting piece 42 can be avoided. Therefore, it can be guaranteed that the first connecting piece 41 and the second connecting piece 42 are opened by a sufficient distance. When the moving positioning plate 5 is reset, the corresponding solder balls 40 can be clamped.

[0041] Therefore, the overall effect is:

[0042] 1. Improve space utilization: By placing the fixed slots at a 45-degree angle, compared with the traditional horizontal placement method, space can be utilized more effectively. Especially when testing small-pitch chips (such as 0.5 mm specifications), interference between the first connecting piece 41 and the second connecting piece 42 can be avoided, ensuring sufficient space for them to open.

[0043] At the same time, it should be particularly noted that on the moving positioning plate 5 of the same size, the traditional horizontal hole design limits the number of holes, and at most only 153 holes can be accommodated, which restricts the compatibility of the test device and makes it only applicable to testing fixed chip types. However, by introducing an innovative oblique hole design, the key of the oblique hole design lies in breaking the limitation of the traditional horizontal placement. By changing the arrangement direction and angle of the holes, the maximization of the number of holes in a limited space is achieved. This design not only makes full use of the area of the moving positioning plate, but also makes the spacing between the holes more reasonable, which is beneficial to stably fixing chips of different sizes and shapes.

[0044] We have successfully increased the number of holes on the same moving positioning plate 5 by more than three times, greatly improving the compatibility and flexibility of the test device. Due to the significant increase in the number of holes, the test device can now be compatible with more chip types. Whether it is common standard chips or chips with special pin layouts or sizes, they can be adapted by adjusting the position and angle of the oblique holes. This flexibility enables the test device to meet a wider range of market demands, improving the utilization rate and test efficiency of the equipment.

[0045] 2. Improve test accuracy and stability: In the traditional method, it may be necessary to reduce the thickness of the first connecting piece 41 and the second connecting piece 42 to avoid interference, but this will reduce the stability of the fixed solder balls 40 and affect the test accuracy. However, this technical solution avoids this problem by changing the direction of the fixed slots, ensuring the accuracy and stability of the test.

[0046] 3. In addition, it should be particularly noted that in the traditional design, the clamping end consists of two simple clips, with bilateral line contact with the solder balls. In this specific embodiment, the ends of the first connecting piece 41 and the second connecting piece 42 of the clamping end are both designed as the ends 45 of a 1 / 4 sphere, thus forming a hemispherical slot to clamp the solder balls, and the contact area has been significantly increased. By designing the ends of the 1 / 4 sphere, the contact between the clamping end and the solder balls changes from bilateral line contact to multi-point contact, which greatly increases the contact area. A larger contact area means better stability and conductivity, which is beneficial to signal transmission and test accuracy. The design of the hemispherical slot can better adapt to the shape of the solder balls, thus achieving more stable and firm clamping. This helps to reduce movement or shaking during the test, improving the reliability and repeatability of the test.

[0047] Specific assembly working principle:

[0048] Refer to Figures 1-13 As shown in, the driving device 1 drives the moving positioning plate 5 to move along a 45-degree angle, so that the first spacer block 52 exerts a force on the first connecting piece 41 in the 45-degree angle direction, causing the first connecting piece 41 to move away from the second connecting piece 42, thereby opening the first connecting piece 41. When the distance between the end 45 of the first connecting piece 41 and the end 45 of the second connecting piece 42 is greater than the diameter of the solder ball 40, the solder ball 40 can fall into the space between the end 45 of the first connecting piece 41 and the end 45 of the second connecting piece 42; subsequently, the force on the driving device 1 is cancelled, so that the moving positioning is reset in the 45-degree angle direction, thereby enabling the elastic terminal 4 to stably fix the solder ball 40.

[0049] Refer to Figures 3-6 As shown in, further, the fixed base includes a fixed frame 2, a fixed bottom plate 3, and a fixed auxiliary positioning frame 6. The fixed auxiliary positioning frame 6 is assembled on the surface of the fixed bottom plate 3, and the fixed bottom plate 3 is assembled at the bottom of the fixed frame 2; wherein a plurality of first assembly holes 31 are formed on the surface of the fixed bottom plate 3, and a plurality of second assembly holes 61 for positioning the welding end 43 are formed on the fixed auxiliary positioning frame 6. A pin end 44 is integrally provided at the tail end of the welding end 43. The pin end 44 passes through the second assembly hole 61 and is assembled on the first assembly hole 31, and the welding end 43 is assembled in the second assembly hole 61.

[0050] Through the precise cooperation of the first assembly hole 31 and the second assembly hole 61, the precise positioning of the welding end 43 and the elastic terminal 4 can be ensured, thereby improving the assembly accuracy and consistency. The split fixed base design and the double-hole assembly method jointly enhance the stability of the overall structure and reduce the shaking and deviation during use. If a certain part fails or is damaged, it can be replaced or repaired separately without replacing the entire fixed base, reducing the maintenance cost.

[0051] The design of the pin end 44 not only enhances the stability of the welding end 43, but also optimizes the signal transmission path, reducing signal loss and interference. The precise assembly hole design and the stable assembly method make the assembly process more efficient and accurate, improving the production efficiency.

[0052] Refer to Figures 5-6, Further, a first buckle 32 is assembled on the side of the fixed base plate 3, and a first buckle position 24 is provided on the side surface of the fixed frame 2. The fixed base plate 3 is buckled to the first buckle position 24 through the first buckle 32. The assembly method using the buckle and the buckle position makes the assembly process of the fixed base plate 3 and the fixed frame 2 simple and fast, reduces the assembly complexity and time cost, and improves the assembly efficiency. When it is necessary to repair or replace the fixed base plate 3, simply disconnect the connection between the first buckle 32 and the first buckle position 24, without disassembling the entire device, which is convenient and fast.

[0053] Refer to Figure 3 , Further, a slider slot 21 is formed on the surface of the fixed frame 2. The moving positioning plate 5 is arranged in the slider slot 21, and first pushing inclined surfaces 54 are arranged at the corners of the moving positioning plate 5. The pushing device 1 is provided with a plurality of pushing claws 11, and a second pushing inclined surface 111 corresponding to the first pushing inclined surface 54 is arranged on each pushing claw 11. Pressing down the pushing device 1 makes the second pushing inclined surface 111 push the first pushing inclined surface 54, so that the moving positioning plate 5 moves along the direction of the first fixing slot hole 51. At the same time, the moving positioning plate 5 is reset by the first return spring.

[0054] Pushing process: When the pushing device 1 is pressed down, the second pushing inclined surface 111 on the pushing claw 11 contacts and interacts with the first pushing inclined surface 54 on the moving positioning plate 5. Due to the design of the inclined surface, this contact will be converted into a thrust force along the direction of the first fixing slot hole 51, thereby pushing the moving positioning plate 5 to move. Reset process: When the pressing down of the pushing device 1 stops, the first return spring starts to play a role. Due to the elastic force of the spring, the moving positioning plate 5 will be pulled back to the initial position, that is, the starting point in the slider slot 21.

[0055] Beneficial effects: The slider slot 21 provides stable guidance for the moving positioning plate 5, ensuring the accuracy and stability of its movement during the movement. Through the design of the pushing inclined surface, the moving direction and distance of the moving positioning plate 5 can be accurately controlled to ensure that the elastic terminal 4 can accurately grasp the solder balls 40 on the chip. The introduction of the first return spring realizes the automatic reset function of the moving positioning plate 5 without manual intervention, improving the automation degree and efficiency of the test.

[0056] Further, a spring fitting groove 25 is arranged at the corner of the fixed frame 2, a spring fitting column 13 is arranged at the corner of the pushing device 1, one end of the second return spring 14 is sleeved on the spring fitting column 13, and the other end is fitted in the spring fitting groove 25.

[0057] Pushing process: When it is necessary to push the moving positioning plate 5, an external force acts on the pushing device 1, and the pushing device 1 moves downward while compressing the second return spring 14. During this process, the spring mounting column 13 of the pushing device 1 slides in the spring mounting groove 25 to ensure the smooth progress of the pushing process. Return process: When the external force disappears, the second return spring 14 begins to take effect. Due to the elastic force of the spring, the pushing device 1 will be pushed upward until the spring mounting column 13 returns to the initial position of the spring mounting groove 25, realizing the automatic return of the pushing device 1.

[0058] Beneficial effects: The design of the second return spring 14 ensures that the pushing device 1 can be stably returned to the initial position after each use, preparing for the next test. By introducing the second return spring 14, the automatic return function of the pushing device 1 is realized, without manual intervention, improving the automation level and efficiency of the test. The design of the spring mounting groove 25 and the spring mounting column 13 provides a stable installation environment for the second return spring 14, reducing the wear and damage of the spring, thereby extending the service life of the device.

[0059] Furthermore, a limit sliding groove 23 is provided on the side surface of the fixed frame 2, and a first limit protrusion 231 protrudes from the surface of the limit sliding groove 23. A plurality of limit claws 12 are provided at the bottom of the pushing device 1, and a second limit protrusion 121 is provided at the end of the inner side of the limit claw 12. The limit claw 12 is slidably fitted in the limit sliding groove 23, and the limit claw 12 is limited by the contact of the second limit protrusion 121 with the first limit protrusion 231.

[0060] When the pushing device 1 completes its pushing task, due to the elastic force of the second return spring 14, it will start to move upward to return to the initial position. During the return process, the limit claws 12 at the bottom of the pushing device 1 will move upward together. The second limit protrusions 121 are provided at the ends of the inner sides of these limit claws 12, and they will contact the first limit protrusions 231 in the limit sliding groove 23 on the side surface of the fixed frame 2. When the second limit protrusion 121 abuts against the first limit protrusion 231, due to the blocking effect of the first limit protrusion 231, the pushing device 1 cannot continue to move upward, thus realizing the limit. This design ensures that the pushing device 1 can accurately stay at the predetermined position after returning and will not exceed its working range due to excessive return.

[0061] Beneficial effects: Through the cooperation of the second limiting protrusion 121 and the first limiting protrusion 231, the pushing device 1 can achieve precise reset, ensuring that it can return to the initial position after each reset, improving the accuracy and reliability of the test. The limiting design can prevent the pushing device 1 from being damaged or affecting the normal operation of the device due to excessive movement during the reset process. Since the pushing device 1 can automatically reset and stay in the correct position, the operator does not need to manually adjust its position, improving the convenience and efficiency of the operation.

[0062] Further, there are several second fixing slot holes on the surface of the fixed frame 2 placed at a 45-degree angle, and the second fixing slot holes located on the same straight line are separated by a second spacer 262 into several second fixing holes 263 placed at a 45-degree angle. The first connecting piece 41 and the second connecting piece 42 pass through the second fixing holes 263 and extend outside the first fixing hole 53. When it is necessary to fix the test chip or other components, first pass the first connecting piece 41 and the second connecting piece 42 through the second fixing holes 263, and then connect them to the test chip or other components. Since the second fixing holes 263 are placed at a 45-degree angle, this design can provide better support and stability.

[0063] Refer to Figure 4 , further, each second fixing hole 263 is separated by a third spacer 261 into two independent cavities, and the first connecting piece 41 and the second connecting piece 42 respectively pass through the two independent cavities and extend to the first fixing hole 53.

[0064] Refer to Figure 11 , further, the longitudinal section of the first spacer 52 is triangular; thus, when the spacer acts on the first connecting piece 41, it will not damage the side wall of the first connecting piece 41.

[0065] The first spacer 52 with a triangular inclined design can provide an oblique thrust when pushing the first connecting piece 41. This oblique thrust can not only help the first connecting piece 41 move along a predetermined path, but also reduce the lateral friction generated during the pushing process, thereby improving the efficiency and stability of the pushing. The contact surface between the inclined spacer and the first connecting piece 41 is an inclined plane. This design makes the contact area gradually increase during the pushing process, thereby dispersing the pressure at the contact point. This can reduce the increase in resistance caused by excessive local pressure and make the pushing process smoother.

[0066] Refer to Figures 7-8, Further, the second connecting piece 42 extends vertically upward, and the first connecting piece 41 includes a first vertical section 411, an inclined section 412, and a second vertical section 413 from bottom to top; a relief inclined surface 2621 is further provided at the top of one side of the second spacer 262 close to the inclined section 412. Still because the inclined section 412 will incline towards the relief inclined surface 2621 during the movement process, it is necessary to ensure that the angle and size of the relief inclined surface 2621 are large enough to accommodate the deformation of the inclined section 412.

[0067] The above embodiments are only descriptions of the preferred embodiments of the present invention, and do not limit the scope of the present invention. Without departing from the design spirit of the present invention, various deformations and improvements made by those of ordinary skill in the art to the technical solutions of the present invention shall fall within the protection scope determined by the claims of the present invention.

Claims

1. A chip BGA test device, comprising a fixed base, a movable positioning plate, a pushing device, and a spring terminal, characterized in that: The movable positioning plate is provided with a plurality of first fixing slots arranged obliquely, and the first fixing slots located on the same straight line are divided into a plurality of first fixing holes by first spacer blocks; The spring terminal includes a clamping end and a welding end, and the clamping end includes a first connecting piece and a second connecting piece; the first connecting piece and the second connecting piece are connected to one end of the welding end, and the first connecting piece and the second connecting piece both have an end for clamping a solder ball; the welding end is mounted on a fixed base, and the first connecting piece and the second connecting piece are respectively located on both sides of the same first spacer block, and the ends of the first connecting piece and the second connecting piece pass through the first fixing hole; the movable positioning plate is driven to move along the direction of the first fixing slot hole by a pushing device, so that the first connecting piece and the second connecting piece are moved away from each other.

2. A chip BGA testing device according to claim 1, characterized in that: The first fixing slot hole is arranged at an angle of 45 degrees on the surface of the movable positioning plate.

3. A chip BGA testing device according to claim 1, characterized in that: The fixed base includes a fixed frame, a fixed base plate, and a fixed auxiliary positioning frame. The fixed auxiliary positioning frame is mounted on the surface of the fixed base plate, and the fixed base plate is mounted on the bottom of the fixed frame. The surface of the fixed base plate is provided with a plurality of first mounting holes, and the fixed auxiliary positioning frame is provided with a plurality of second mounting holes for positioning the welding end, wherein the tail end of the welding end is also integrally provided with a pin end, wherein the pin end passes through the second mounting hole and is mounted on the first mounting hole, and the welding end is mounted in the second mounting hole.

4. A chip BGA testing device according to claim 3, characterized in that: The side edge of the fixed bottom plate is equipped with a first buckle, and the side surface of the fixed frame is provided with a first buckle position, wherein the fixed bottom plate is buckled with the first buckle position through the first buckle.

5. A chip BGA testing device according to claim 4, characterized in that: A slider slot is provided on the surface of the fixed frame, wherein a movable positioning plate is arranged in the slider slot, and corners of the movable positioning plate are provided with a first pushing inclined surface, the pushing device is provided with a plurality of pushing claws, and each pushing claw is provided with a second pushing inclined surface corresponding to the first pushing inclined surface, and the pushing device is pressed downward so that the second pushing inclined surface pushes the first pushing inclined surface, thereby causing the movable positioning plate to move along the direction of the first fixed slot hole, and at the same time, the movable positioning plate is reset by the first reset spring.

6. A chip BGA testing device according to claim 5, characterized in that: A spring fitting groove is arranged at a corner of the fixed frame, a spring fitting column is arranged at a corner of the pushing device, one end of the second return spring is sleeved on the spring fitting column, and the other end is fitted in the spring fitting groove.

7. A chip BGA testing device according to claim 6, characterized in that: A limiting groove is arranged on the side of the fixed frame, a first limiting protrusion is convexly arranged on the surface of the limiting groove, a plurality of limiting claws are arranged at the bottom of the pushing device, a second limiting protrusion is arranged at the inner end of the limiting claw, wherein the limiting claw is slidably mounted in the limiting groove, and the limiting claw realizes limitation by contacting the first limiting protrusion through the second limiting protrusion.

8. A chip BGA testing device according to claim 7, characterized in that: The surface of the fixed frame has several second fixing slots placed at an angle of 45 degrees, and the second fixing slots located on the same straight line are separated into several second fixing holes placed at an angle of 45 degrees by second spacers, and the first connecting piece and the second connecting piece pass through the second fixing hole and extend outside the first fixing hole.

9. A chip BGA testing device according to claim 8, characterized in that: The longitudinal section of the first spacer block is triangular.

10. A chip BGA testing device according to claim 9, characterized in that: The second connecting piece is vertically extended upwards, and the first connecting piece comprises a first vertical section, an inclined section and a second vertical section from bottom to top; a yielding inclined surface is also arranged on the top of one side of the second spacer close to the inclined section.

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