Heat dissipation device and electronic equipment
By designing a heat dissipation device including a flow guide structure, heat dissipation parts and movable components, the problem of abnormal heat generation of electronic equipment power supply chips when the load is high is solved, and effective cooling of processors, graphics cards and power supply chips is achieved, and the stability of electronic equipment is improved.
Patent Information
- Application Number
- CN202421741038.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-22
- Publication Date
- 2025-05-27
- Estimated Expiration
- 2034-07-22
AI Technical Summary
The power supply chips in electronic devices are prone to abnormal heat when the load is high, resulting in problems such as crashing the electronic device.
A heat dissipation device is designed, including a flow guide structure, a heat dissipation member and a moving assembly. Through the attitude adjustment of the movable component, the air flow generated by the heat sink can flow to the second opening of the flow guide structure, and through the design of the flow guide structure, the cooling of the processor core, the graphics card core and the power supply chip can be achieved.
It effectively reduces the chance of abnormal heating of power supply chips, reduces the risk of electronic equipment crashes, and improves the stability and reliability of electronic equipment.
Smart Images
Figure CN222914147U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the technical field of electronic devices, and particularly to a heat dissipation device and an electronic device. Background Art
[0002] A power supply chip in an electronic device (such as a laptop computer) can supply power to a processor core and a graphics card core so that the processor core and the graphics card core can operate.
[0003] During operation, the power supply chip generates heat, and currently it is usually allowed to dissipate heat naturally. However, when the load is high, the power supply chip is prone to abnormal heating, which may even cause problems such as the electronic device crashing. Summary of the Utility Model
[0004] The present disclosure provides a heat dissipation device and an electronic device, and the technical solutions are as follows:
[0005] In a first aspect, the present disclosure provides a heat dissipation device, which may include: a diversion structure, a heat dissipation member, and a movable assembly. The diversion structure has a first opening and a second opening; the heat dissipation member is used to generate an air flow flowing to the second opening; the movable assembly is disposed at the second opening and can move relative to the second opening to have a first posture and a second posture; the first posture indicates that at least a part of the movable assembly is located at a first position where the first opening and the second opening are disconnected; the second posture indicates that at least a part of the movable assembly is located at a second position where the first opening and the second opening are connected.
[0006] In some embodiments, the movable assembly is disposed inside the diversion structure and includes: a connection structure and a blocking structure; the connection structure is disposed adjacent to the second opening; the blocking structure is rotatably connected to the connection structure so as to be able to switch between the first position and the second position.
[0007] In some embodiments, one end of the diversion structure corresponding to the second opening includes: a first section of diversion channel, and the first section of diversion channel includes: a first guiding wall, the first guiding wall is arc-shaped, and the center of the first guiding wall corresponds to the inside of the first section of diversion channel; the connection structure is disposed at the center position of the first guiding wall, and the blocking structure can rotate along the first guiding wall between the first position and the second position.
[0008] In some embodiments, the barrier structure includes: a baffle and a partition plate. The baffle is rotatably connected to the connection structure and abuts against the inner wall of the diversion structure. The partition plate is disposed on one side of the baffle corresponding to the second opening, and the partition plate and the baffle enclose a barrier space with a notch. In the first position, the baffle is located on the side of the second opening close to the first opening. In the second position, the baffle faces at least a part of the second opening, and the barrier space communicates with the first opening through the notch.
[0009] In some embodiments, one end of the diversion structure corresponding to the first opening includes: a plurality of second-stage diversion channels, the plurality of second-stage diversion channels are respectively communicated with the first-stage diversion channel, and an assembly space is provided in the second-stage diversion channel.
[0010] In some embodiments, heat dissipation fins are provided in the second-stage diversion channel, and the heat dissipation fins are opposite to the assembly space.
[0011] In some embodiments, a heat conduction sheet is provided on one side of the heat dissipation fin corresponding to the assembly space.
[0012] In some embodiments, the diversion structure further has a third opening disposed opposite to the second opening.
[0013] In a second aspect, the present disclosure provides an electronic device, which may include: a box body and the heat dissipation device in any one of the embodiments of the first aspect. The box body has an accommodation space, and a fourth opening and a fifth opening communicating with the accommodation space are provided on the box body. The heat dissipation device is disposed in the accommodation space, and the second opening of the heat dissipation device is disposed adjacent to the fifth opening.
[0014] In some embodiments, a first electronic device is provided in the accommodation space; a second electronic device is provided in the diversion structure of the heat dissipation device.
[0015] The above description is only an overview of the technical solutions of the present disclosure. In order to be able to understand the technical means of the present disclosure more clearly and implement them according to the content of the specification, the following describes the preferred embodiments of the present disclosure in detail in conjunction with the drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present disclosure. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.
[0017] Figure 1It is a schematic structural diagram of the heat dissipation device (the movable component is in the first posture) disclosed in the embodiments of the present disclosure;
[0018] Figure 2 It is a schematic structural diagram of the heat dissipation device (the movable component is in the second posture) disclosed in the embodiments of the present disclosure;
[0019] Figure 3 It is a schematic partial structural diagram of the electronic device disclosed in the embodiments of the present disclosure.
[0020] Explanation of reference numerals:
[0021] 10. Heat dissipation device; 11. Flow guiding structure; 111. First opening; 112. Second opening; A. First position; B. Second position; 113. Flow guiding space; 114. Second plate body; 115. Fourth plate body; 116. First section of flow guiding channel; 1161. First guiding wall; 117. Second section of flow guiding channel; 1171. Assembly space; 118. Heat sink; 1181. Recess; 119. Heat conducting sheet; 120. Third opening; 12. Heat dissipating member; 13. Movable component; 131. Connection structure; 1311. Driving motor; 1312. Driving gear; 1313. Rotating gear; 132. Blocking structure; 1321. Baffle; 1322. Partition plate; 1323. Notch; 20. Second electronic device; 30. Circuit board. Detailed implementation manners
[0022] The following further describes in detail the implementation manners of the present disclosure in conjunction with the drawings and embodiments. The detailed descriptions and drawings of the following embodiments are used to exemplarily illustrate the principles of the present disclosure, but cannot be used to limit the scope of the present disclosure. The present disclosure can be implemented in many different forms, not limited to the specific embodiments disclosed herein, but including all technical solutions falling within the scope of the claims.
[0023] These embodiments of the present disclosure are provided to make the present disclosure thorough and complete, and to fully convey the scope of the present disclosure to those skilled in the art. It should be noted that: unless otherwise specifically stated, the relative arrangements of the components and steps, the components of the materials, the numerical expressions and values described in these embodiments should be construed as merely exemplary, rather than as limitations.
[0024] It should be noted that in the description of the present disclosure, unless otherwise stated, the meaning of "a plurality" is greater than or equal to two; the orientation or positional relationships indicated by the terms "upper", "lower", "left", "right", "inner", "outer", etc. are only for the convenience of describing the present disclosure and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation of the present disclosure. When the absolute position of the object being described changes, the relative position relationship may also change accordingly.
[0025] In addition, the "first", "second" and similar terms used in this disclosure do not denote any order, quantity or importance, but are merely used to distinguish different parts. "Vertical" does not mean strictly vertical, but within the allowable error range. "Parallel" does not mean strictly parallel, but within the allowable error range. Words such as "including" or "comprising" mean that the elements before this word cover the elements listed after this word, and do not exclude the possibility of also covering other elements.
[0026] It should also be noted that in the description of this disclosure, unless otherwise clearly specified and limited, the terms "installed", "connected" and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected, or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in this disclosure can be understood according to specific circumstances. When it is described that a specific device is located between a first device and a second device, there may or may not be an intermediate device between the specific device and the first device or the second device.
[0027] All terms used in this disclosure have the same meanings as understood by those of ordinary skill in the art to which this disclosure pertains, unless otherwise specifically defined. It should also be understood that terms defined in a general dictionary, such as those, should be interpreted as having meanings consistent with their meanings in the context of the relevant art, and should not be interpreted in an idealized or overly formal sense, unless specifically defined as such here.
[0028] Technologies, methods and devices known to those of ordinary skill in the relevant fields may not be discussed in detail, but where appropriate, the technologies, methods and devices should be regarded as part of the specification.
[0029] A power supply chip in an electronic device (such as a laptop computer) can supply power to a processor core and a graphics core so that the processor core and the graphics core can operate.
[0030] During operation, the power supply chip generates heat, and currently it is usually allowed to dissipate heat naturally. However, when the load is high, it is easy for the power supply chip to overheat abnormally, which may even cause problems such as the electronic device crashing.
[0031] In this disclosure, by arranging a second electronic device 20 such as a power supply chip within a diversion structure 11, and adjusting the attitude of a movable component 13 so that the airflow generated by a heat dissipation component 12 can cool a first electronic device such as a processor core and a graphics core outside the diversion structure 11 or cool the second electronic device 20 within the diversion structure 11, thus, the probability of the power supply chip overheating abnormally and even causing the electronic device to crash can be reduced.
[0032] First of all, it should be noted that Figure 1 is a schematic structural diagram of the heat dissipation device 10 (the movable component 13 is in the first posture) disclosed in the embodiment of the present disclosure; Figure 2 is a schematic structural diagram of the heat dissipation device 10 (the movable component 13 is in the second posture) disclosed in the embodiment of the present disclosure, Figure 2 the dotted line in which is the air flow direction; Figure 3 is a partial structural schematic diagram of the electronic device disclosed in the embodiment of the present disclosure.
[0033] In a first aspect
[0034] The present disclosure provides a heat dissipation device 10. Referring to Figures 1 to 3 as shown, the heat dissipation device 10 may include: a diversion structure 11, a heat dissipation member 12, and a movable component 13. The diversion structure 11 has a first opening 111 and a second opening 112; the heat dissipation member 12 is used to generate an air flow flowing to the second opening 112; the movable component 13 is disposed at the second opening 112 and can move relative to the second opening 112 to have a first posture and a second posture; the first posture represents that at least a part of the movable component 13 is located at a first position A where the first opening 111 and the second opening 112 are disconnected; the second posture represents that at least a part of the movable component 13 is located at a second position B where the first opening 111 and the second opening 112 are connected.
[0035] That is to say, at least part of the movable component 13 can move so that the movable component 13 can switch from the first posture to the second posture and can also switch from the second posture to the first posture; in the first posture, a part of the movable component 13 is located at the first position A between the first opening 111 and the second opening 112 to disconnect the space between the first opening 111 and the second opening 112. In this way, after the airflow generated by the heat dissipation component 12 flows to the second opening 112, the gas at the second opening 112 accelerates, but due to the blocking effect of the movable component 13 at the first position A, the accelerated gas cannot drive the gas at the first opening 111 to flow through the first position A to the second opening 112, so that the internal space (hereinafter referred to as the diversion space 113) in the diversion structure 11 cannot be cooled; in the second posture, the movable component 13 removes the block between the first opening 111 and the second opening 112 to connect the space between the first opening 111 and the second opening 112. In this way, after the airflow generated by the heat dissipation component 12 flows to the second opening 112, the gas at the second opening 112 accelerates, and then drives the gas in the diversion space 113 between the first opening 111 and the second opening 112 to accelerate, so that the diversion space 113 can be cooled. In this way, a first electronic device can be arranged at the second opening 112 or in a space in communication with the space of the second opening 112, so that when the movable component 13 is in the first posture, the first electronic device can be cooled; and a second electronic device 20 can be arranged in the diversion space 113 between the first opening 111 and the first position A, so that when the movable component 13 is in the second posture, the second electronic device 20 in the diversion space 113 can be cooled.
[0036] Among them, the diversion structure 11 can be a pipe fitting, the inside of the pipe fitting is the diversion space 113, and the openings at both ends of the pipe fitting are the first opening 111 and the second opening 112 respectively; it can also be a structure formed by connecting multiple plates end to end to form the diversion space 113 and the openings at both ends are the first opening 111 and the second opening 112; it can also be other setting methods. The heat dissipation component 12 can include fan blades to generate airflow by rotation; it can also include vibration structures such as a vibrating diaphragm like a horn to generate airflow during vibration; it can also be other setting methods. The part of the movable component 13 that can move between the first position A and the second position B can be moved by manual sliding, rotation, flipping and other operations, or can be moved by the drive of the second drive structure through sliding, rotation, flipping and other operations. For example, a temperature sensor electrically connected to the second drive structure is arranged in the diversion structure 11. When the temperature detected by the temperature sensor is greater than the threshold value, the second drive structure drives the movable component 13 to switch from the first posture to the second posture.
[0037] In one example, a heat dissipation device 10 and a first electronic device are provided inside a laptop computer. The first electronic device may include: a circuit board 30, a memory card, etc.; see Figures 1 to 3 As shown, the heat dissipation device 10 may include: a diversion structure 11, a heat dissipation member 12, and a movable component 13. The diversion structure 11 is a diversion pipe with two open ends being a first opening 111 and a second opening 112, and a second electronic device 20 such as a power supply chip is provided inside the diversion pipe; a heat dissipation member 12 such as a fan is used to generate an air flow flowing to the second opening 112; the movable component 13 is arranged at the second opening 112 and can move relative to the second opening 112 to have a first posture and a second posture; the first posture represents that at least part of the movable component 13 is located at a first position A where the first opening 111 and the second opening 112 are disconnected; the second posture represents that at least part of the movable component 13 is located at a second position B where the first opening 111 and the second opening 112 are connected. When the movable component 13 is in the first posture, the first electronic devices such as the circuit board 30 and the memory card can be cooled; when the movable component 13 is in the second posture, the second electronic device 20 such as the power supply chip can be cooled. In this way, when the load inside the laptop computer is relatively high and the heat of the second electronic device 20 such as the power supply chip is relatively high, the movable component 13 can be switched to the second posture to reduce the temperature of the second electronic device 20 such as the power supply chip. In addition, the movable setting of the movable component 13 can switch to cool the first electronic device or the second electronic device 20, so that the setting of the heat dissipation member 12 can be reduced and the manufacturing cost of the heat dissipation device 10 can be lowered.
[0038] In some embodiments, see Figure 1 and Figure 2 As shown, the movable component 13 is arranged inside the diversion structure 11. The movable component 13 may include: a connection structure 131 and a blocking structure 132; the connection structure 131 is arranged adjacent to the second opening 112; the blocking structure 132 is rotatably connected to the connection structure 131 to be able to switch between the first position A and the second position B. That is to say, the blocking structure 132 switches between the first position A and the second position B through the rotational connection with the connection structure 131, thereby realizing the switching of the movable component 13 between the first posture and the second posture. Here, the moving mode of the movable component 13 is rotation, and the structural setting mode of rotation is already mature. In this way, the manufacturing of the movable component 13 can be made simpler.
[0039] In one example, see Figure 1 and Figure 2As shown, the guide structure 11 may include: a first plate body, a second plate body 114, a third plate body, a fourth plate body 115 and a plug. The first plate body, the second plate body 114, the third plate body and the fourth plate body 115 are connected end to end to form and define a guide space 113. One end opening of the four plates is a first opening 111, and the opening of the other end is closed by a plug (a first guide wall 1161 shown in the figure), and the first plate body is provided with a second opening 112 near the plug; the connecting structure 131 is arranged in the guide space 113. The connection structure 131 may include: a driving motor 1311, a driving gear 1312 and a rotating gear 1313. The driving gear 1312 is disposed near the inner wall of the second plate 114 and connected to the motor shaft of the driving motor 1311 so as to rotate when the motor shaft rotates. The rotating gear 1313 is meshed with the driving gear 1312 and can also rotate with the rotation of the driving gear 1312. The blocking structure 132 is connected to the rotating gear 1313 so as to be able to rotate to a first position A or a second position B relative to the driving motor 1311. The driving gear 1312 drives the rotating gear 1313 to rotate, so that the rotating gear 1313 and the blocking structure 132 switch between the first position A staggered from the second opening 112 and the second position B opposite to the second opening 112, so as to realize that the airflow is not transported or transported in the guide space 113 of the guide structure 11. Here, two, three or even all of the first plate body, the second plate body 114, the third plate body and the fourth plate body 115 can be integrally formed, and / or one or more plates are parts of other structures to reuse other structures, thereby reducing manufacturing costs and reducing space occupancy.
[0040] In some embodiments, see Figure 1 and Figure 2 As shown, the end of the guide structure 11 corresponding to the second opening 112 may include: a first section of the guide channel 116, and the first section of the guide channel 116 may include: a first guide wall 1161, the first guide wall 1161 is arc-shaped, and the center of the first guide wall 1161 corresponds to the first section of the guide channel 116; the connecting structure 131 is arranged at the center of the first guide wall 1161, and the blocking structure 132 can rotate along the first guide wall 1161 between the first position A and the second position B. For example: the fourth plate 115 is connected to the first guide wall 1161, the driving gear 1312 is arranged at the center of the circle, and the blocking structure 132 can rotate along the first guide wall 1161, so that the rotation process of the blocking structure 132 is smoother.
[0041] In some embodiments, see Figure 1 and Figure 2As shown, the barrier structure 132 may include: a baffle 1321 and a partition plate 1322. The baffle 1321 is rotatably connected to the connection structure 131 and abuts against the inner wall of the diversion structure 11. The partition plate 1322 is disposed on one side of the baffle 1321 corresponding to the second opening 112, and the partition plate 1322 and the baffle 1321 enclose a barrier space with a notch 1323. At the first position A, the baffle 1321 is located on the side of the second opening 112 close to the first opening 111. At the second position B, the baffle 1321 is opposite to at least a part of the second opening 112, and the barrier space communicates with the first opening 111 through the notch 1323. Here, when the movable assembly 13 is in the first posture, the baffle 1321 is staggered from the second opening 112, and the partition plate 1322 abuts against the inner wall of the second opening 112 on the side close to the first opening 111, so as to disconnect the first opening 111 and the second opening 112. When the movable assembly 13 is in the second posture, the baffle 1321 is at least partially opposite to the second opening 112, and the partition plate 1322 abuts against the inner wall of the second opening 112 on the side away from the first opening 111, so as to connect the first opening 111 and the second opening 112. The baffle 1321 and the partition plate 1322 are plate-like structures, so that the manufacturing procedures of the two are simple and fast, thereby making the barrier structure 132 easy to manufacture and having high manufacturing efficiency.
[0042] Wherein, the surface size of the baffle 1321 on the side close to the second opening 112 may be greater than or equal to the radial size of the second opening 112, so that when the baffle 1321 is opposite to the second opening 112, the positive projection of the second opening 112 on the baffle 1321 covers part or all of the baffle 1321.
[0043] In one example, refer to Figure 1 and Figure 2As shown, the second opening 112 is circular, and the blocking structure 132 may include: a baffle 1321 and a partition plate 1322, the baffle 1321 is a circular plate and abuts against the inner walls of the second plate body 114, the third plate body and the fourth plate body 115, and the partition plate 1322 is arranged around a portion of the edge of the baffle 1321 corresponding to the second opening 112, so that the baffle 1321 and the partition plate 1322 define a gap 1323; when the driving gear 1312 rotates to make the blocking structure 132 located at the first position A, the baffle 1321 and the second opening 112 are staggered, and the partition plate 1322 abuts against the second opening 112 close to the second opening The inner wall on one side of the first opening 111 is used to separate the guide space 113 between the first opening 111 and the second opening 112; when the driving gear 1312 rotates to make the blocking structure 132 located at the second position B, the baffle 1321 and the second opening 112 are at least partially opposite, and the blocking space defined by the first opening 111, the notch 1323, the baffle 1321 and the partition plate 1322 and the second opening 112 form a channel for gas flow, so that the airflow at the second opening 112 can drive the gas flow in the channel to cool down the second electronic device 20 such as the power supply chip in the guide space 113.
[0044] In some embodiments, see Figure 1 and Figure 2 As shown, the end of the guide structure 11 corresponding to the first opening 111 may include: a plurality of second-section guide channels 117, the plurality of second-section guide channels 117 are respectively connected to the first-section guide channel 116, and an assembly space 1171 is provided in the second-section guide channel 117. In this way, the assembly space 1171 in each second-section guide channel 117 can be assembled with one or more second electronic devices 20, so that the plurality of second electronic devices 20 in the plurality of second-section guide channels 117 can be cooled down respectively at the same time.
[0045] The structural settings, dimensions, etc. of the plurality of second-section guide channels 117 may be consistent or inconsistent; the contours, dimensions, etc. of the assembly spaces 1171 of different second-section guide channels 117 may be consistent or inconsistent.
[0046] In some embodiments, see Figures 1 to 3 As shown, a heat sink 118 is disposed in the second section of the guide channel 117, and the heat sink 118 is opposite to the assembly space 1171. In this way, the heat generated by the second electronic device 20 assembled in the assembly space 1171 can be dissipated to the heat sink 118, and the multiple surfaces of the heat sink 118 that are not opposite to the assembly space 1171 can dissipate the heat respectively, and then can be sent out from the second opening 112 at the same time when the movable component 13 is in the second posture, so as to improve the heat dissipation efficiency of the second electronic device 20 in the assembly space 1171.
[0047] Here, on the side of the heat sink 118 facing away from the assembly space 1171, a plurality of circular, rectangular or strip-shaped recesses 1181 may be recessed to increase the heat dissipation area of the heat sink 118 and further improve the heat dissipation efficiency of the second electronic device 20 in the assembly space 1171.
[0048] In some embodiments, as shown in Figures 1 to 3 shown, a heat conducting sheet 119 is provided on the side of the heat sink 118 corresponding to the assembly space 1171. The heat conducting sheet 119 has a high heat conduction efficiency so as to quickly conduct the heat generated by the second electronic device 20 in the assembly space 1171 to the heat sink 118, and then dissipate the heat through the heat sink 118. Thus, the heat dissipation efficiency of the second electronic device 20 in the assembly space 1171 can be further improved. The heat conducting sheet 119 may be configured as a heat conducting silicone grease sheet, a heat conducting copper sheet, etc.
[0049] Here, the part of the second diversion channel 117 where the assembly space 1171 is provided may be a circuit board 30. Thus, the second electronic device 20 may be disposed on the circuit board 30, and the circuit board 30 may be reused to reduce the material used for the diversion structure 11; or, the second diversion channel 117 is provided with through holes corresponding to the bottom wall of the assembly space 1171, so that the circuit board 30 outside the second diversion channel 117 can be connected to the second electronic device 20 through the through holes.
[0050] In some embodiments, as shown in Figures 1 to 3 shown, the diversion structure 11 further has a third opening 120 disposed opposite to the second opening 112. Thus, when the movable component 13 is in the first posture, the heat dissipation device 10 can cool the first electronic device in the space communicated with the third opening 120 through the second opening 112 and the third opening 120; when the movable component 13 is in the second posture, the heat dissipation device 10 can cool the second electronic device 20.
[0051] Second aspect
[0052] The present disclosure provides an electronic device, which may include: a box body and the heat dissipation device 10 in any one of the embodiments of the first aspect. The box body has an accommodation space, and a fourth opening and a fifth opening communicating with the accommodation space are formed on the box body; the heat dissipation device 10 is disposed in the accommodation space, and the second opening 112 of the heat dissipation device 10 is disposed adjacent to the fifth opening. The electronic device may be a notebook computer, a mainframe of a desktop computer, a server, etc.; the fourth opening enables the cold air flow outside the box body to enter the box body interior, and then the heat dissipation member 12 conveys the incoming cold air flow to the second opening 112; the fifth opening can send the hot air flow at the second opening 112 out of the box body.
[0053] In some embodiments, a first electronic device is disposed in the accommodation space; a second electronic device 20 is disposed in the diversion structure 11 of the heat dissipation device 10. Thus, when the movable component 13 is in the first posture, the heat dissipation device 10 can cool the first electronic device; when the movable component 13 is in the second posture, the heat dissipation device 10 can cool the second electronic device 20.
[0054] In one example, the electronic device is a laptop computer, which includes a display end with a display screen and a system end with keys and a touchpad. The electronic device may include:
[0055] A box body, which is the outer shell of the system end of the laptop computer and has an accommodation space. A first electronic device is disposed in the accommodation space. The first electronic device includes: a circuit board 30, etc. A fourth opening and a fifth opening communicating with the accommodation space are formed in the box body. The fourth opening is an air inlet, and the fifth opening is an air outlet.
[0056] The heat dissipation device 10 is disposed in the accommodation space. Refer to Figures 1 to 3 As shown, the heat dissipation device 10 may include: a diversion structure 11, a heat dissipation member 12, and a movable component 13; the diversion structure 11 has a first opening 111 and a second opening 112, and the second opening 112 is disposed adjacent to the fifth opening. One end of the diversion structure 11 corresponding to the second opening 112 may include: a first section of diversion channel 116, and the first section of diversion channel 116 may include: a first guiding wall 1161, the first guiding wall 1161 is arc-shaped, and the center of the first guiding wall 1161 corresponds to the inside of the first section of diversion channel 116; one end of the diversion structure 11 corresponding to the first opening 111 may include: a plurality of second section of diversion channels 117, the plurality of second section of diversion channels 117 communicate with the first section of diversion channel 116 respectively, and an assembly space 1171 for assembling a second electronic device 20 such as a power supply chip is disposed in the second section of diversion channel 117. A heat dissipation fin 118 is disposed in the second section of diversion channel 117, the heat dissipation fin 118 is opposite to the assembly space 1171, and a heat conducting sheet 119 is disposed on the side of the heat dissipation fin 118 corresponding to the assembly space 1171. The diversion structure 11 further has a third opening 120 disposed opposite to the second opening 112.
[0057] The heat dissipation member 12 may include fan blades, which are disposed adjacent to the second opening 112 and are used to generate an air flow flowing to the second opening 112.
[0058] The movable component 13 may include: a connection structure 131 and a blocking structure 132. The connection structure 131 is disposed at the center position of the first guiding wall 1161. The connection structure 131 may include: a driving motor 1311, a driving gear 1312, and a rotating gear 1313. The driving gear 1312 is connected to the motor shaft of the driving motor 1311 to rotate when the motor shaft rotates. The rotating gear 1313 meshes with the driving gear 1312 and can also rotate with the rotation of the driving gear 1312. The blocking structure 132 is connected to the rotating gear 1313 to be able to rotate relative to the driving motor 1311 along the first guiding wall 1161 between a first position A and a second position B, so that the movable component 13 can switch between a first posture and a second posture. The blocking structure 132 may include: a baffle 1321 and a partition plate 1322. The baffle 1321 is connected to the rotating gear 1313 and abuts against the inner wall of the flow guiding structure 11. The partition plate 1322 is disposed on one side of the baffle 1321 corresponding to the second opening 112, and the partition plate 1322 and the baffle 1321 enclose a blocking space having a notch 1323. At the second position B, the baffle 1321 is opposite to at least a part of the second opening 112, and the blocking space communicates with the first opening 111 through the notch 1323.
[0059] Wherein, when the temperature of the second electronic device 20 such as a power supply chip is relatively low, the baffle 1321 is misaligned with the second opening 112 and the partition plate 1322 abuts against the inner wall of the second opening 112 on the side close to the first opening 111. The airflow generated by the heat dissipation member 12 sends the heat outside the second opening 112 (for example, the heat pipe located between the first electronic device and the second opening 112 guides the heat generated by the first electronic device to the second opening 112 to accumulate at the second opening 112) to the fifth opening, thereby realizing heat dissipation for the first electronic device. When the temperature of the second electronic device 20 such as a power supply chip is relatively high, the motor shaft of the driving motor 1311 outputs a driving force to drive the driving gear 1312 to drive the rotating gear 1313 and the baffle 1321 to rotate. After rotation, the baffle 1321 is opposite to the second opening 112, and the partition plate 1322 abuts against the inner wall of the second opening 112 on the side far from the first opening 111. In this way, the first opening 111 and the second opening 112 are communicated, and the airflow of the heat dissipation member 12 at the second opening 112 drives the airflow of the first opening 111 to flow towards the second opening 112 and be sent out to the fifth opening, so as to take away the heat of the second electronic device 20 between the first opening 111 and the second opening 112, thereby realizing heat dissipation for the second electronic device 20.
[0060] It should be noted that the heat dissipation device in the electronic device provided in the embodiments of the present disclosure is similar to the description of the heat dissipation device in the above embodiments, and has beneficial effects similar to those of the heat dissipation device in the above embodiments. For the technical details not disclosed in the embodiments of the electronic device of the present disclosure, please refer to the description of the heat dissipation device in the present disclosure and will not be elaborated here.
[0061] So far, the embodiments of the present disclosure have been described in detail. To avoid obscuring the concept of the present disclosure, some details well known in the art are not described. Those skilled in the art can fully understand how to implement the technical solutions disclosed here based on the above description.
[0062] Although some specific embodiments of the present disclosure have been described in detail by way of examples, those skilled in the art should understand that the above examples are only for illustration and not for limiting the scope of the present disclosure. Those skilled in the art should understand that the above embodiments can be modified or some technical features can be equivalently replaced without departing from the scope and spirit of the present disclosure. In particular, as long as there is no structural conflict, the technical features mentioned in each embodiment can be combined in any way.
Claims
1. A heat dissipation device, characterized in that: include: A flow guiding structure having a first opening and a second opening; a heat sink, used to generate airflow to flow to the second opening; A movable component is disposed at the second opening and is movable relative to the second opening to have a first posture and a second posture; The first posture indicates that at least part of the movable component is in a first position that disconnects the first opening and the second opening; The second posture indicates that at least a portion of the movable component is in a second position that enables communication between the first opening and the second opening.
2. The heat dissipation device according to claim 1, characterized in that: The movable component is arranged in the diversion structure, and includes: a connecting structure and a blocking structure; The connecting structure is disposed adjacent to the second opening; The blocking structure is rotatably connected to the connecting structure so as to be switchable between the first position and the second position.
3. The heat dissipation device according to claim 2, characterized in that: The end of the guide structure corresponding to the second opening includes: a first section of the guide channel, the first section of the guide channel includes: a first guide wall, the first guide wall is arc-shaped, and the center of the first guide wall corresponds to the first section of the guide channel; The connecting structure is arranged at the center of the first guide wall, and the blocking structure can rotate along the first guide wall between the first position and the second position.
4. The heat dissipation device according to claim 3, characterized in that: The barrier structure includes: a baffle and a partition plate, the baffle is rotatably connected to the connecting structure and abuts against the inner wall of the guide structure, the partition plate is arranged on a side of the baffle corresponding to the second opening, and the partition plate and the baffle are arranged to form a barrier space with a gap; when in the first position, the baffle is located on a side of the second opening close to the first opening; when in the second position, the baffle is opposite to at least a part of the second opening, and the barrier space is connected to the first opening through the gap.
5. The heat dissipation device according to claim 3, characterized in that: The end of the flow guiding structure corresponding to the first opening includes: a plurality of second flow guiding channels, the plurality of second flow guiding channels are respectively connected to the first flow guiding channels, and an assembly space is provided in the second flow guiding channels.
6. The heat dissipation device according to claim 5, characterized in that: A heat sink is disposed in the second section of the flow guiding channel, and the heat sink is opposite to the assembly space.
7. The heat dissipation device according to claim 6, characterized in that: A heat conducting sheet is arranged on one side of the heat sink corresponding to the assembly space.
8. The heat dissipation device according to claim 1, characterized in that: The flow guiding structure further has a third opening arranged opposite to the second opening.
9. An electronic device, characterized in that: include: A box body having an accommodating space, and the box body is provided with a fourth opening and a fifth opening communicating with the accommodating space; The heat dissipation device according to any one of claims 1 to 8, wherein the heat dissipation device is arranged in the accommodating space, and the second opening of the heat dissipation device is arranged adjacent to the fifth opening.
10. The electronic device according to claim 9, characterized in that: The accommodating space is provided with a first electronic device; A second electronic device is arranged in the flow guiding structure of the heat dissipation device.