Infrared remote control circuit

By designing infrared remote control circuits, using infrared receiving modules and MCU modules to decode signals and control the X86 motherboard, the limitations of traditional control methods in long-distance operation and flexibility are solved, and remote control of the PC system is achieved and more convenient.

CN222914299UActive Publication Date: 2025-05-27SHENYANG UZEL INFORMATION TECH
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Patent Information

Application Number
CN202421924201.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-08-08
Publication Date
2025-05-27
Estimated Expiration
2034-08-08

AI Technical Summary

Technical Problem

Traditional keyboard and mouse control methods have limitations in certain specific application scenarios, such as inconvenient long-distance operation and insufficient flexibility.

Method used

An infrared remote control circuit is designed, including a power supply module, an infrared receiving module, an MCU module and an X86 motherboard. The remote control signal is collected through the infrared receiving module, and the MCU module decodes and outputs it to the X86 motherboard to realize remote control of the PC system.

Benefits of technology

Remote control of X86 architecture PC system is realized, providing higher flexibility and convenience, and users can turn on, shut down, move the mouse position without touching the computer, expanding the usage scenarios.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

The utility model provides an infrared remote control circuit, which belongs to the technical field of infrared remote control equipment and comprises a power supply module, an infrared receiving module, a microprogrammed control unit (MCU) module and an X86 mainboard. The power supply module is respectively connected with the infrared receiving module and the MCU module, and is used for converting voltage and supplying power to the infrared receiving module and the MCU module; the infrared receiving module is connected with the MCU module and is used for collecting infrared signals, converting the infrared signals and outputting the converted infrared signals to the MCU module; the MCU module is connected with the X86 mainboard and used for decoding signals converted by the infrared receiving module and outputting the decoded signals to the X86 mainboard, and through cooperative work of the modules, remote control over a PC system of the X86 architecture can be achieved, and higher flexibility and convenience can be provided in a specific environment.
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Description

Technical Field

[0001] The utility model relates to the technical field of infrared remote control devices, and specifically relates to an infrared remote control circuit. Background Art

[0002] As an indispensable information processing tool in modern society, computers are widely used in various fields, including home use, office work, industrial control, education, and entertainment. The X86 architecture-based PC system, as a typical computer system architecture, is widely used in various computing devices, including desktop computers, laptops, servers, etc. The PC system under this architecture usually relies on peripherals such as keyboards and mice to achieve the interaction between humans and computers. Users input instructions through the keyboard or perform clicks and drags through the mouse to control the computer system. Although this interaction method is very mature and popular, in some specific application scenarios, the traditional keyboard and mouse control methods have certain limitations, such as inconvenient long-distance operation and insufficient flexibility. Content of the Utility Model

[0003] In view of the above problems, on the one hand, the embodiment of the utility model provides an infrared remote control circuit, and the infrared remote control circuit includes: a power supply module, an infrared receiving module, an MCU module, and an X86 main board;

[0004] The power supply module is respectively connected to the infrared receiving module and the MCU module, and is used for converting voltage and supplying power to the infrared receiving module and the MCU module;

[0005] The infrared receiving module is connected to the MCU module, and is used for collecting infrared signals and converting and outputting them to the MCU module;

[0006] The MCU module is connected to the X86 main board, and is used for decoding the signals converted by the infrared receiving module and outputting them to the X86 main board.

[0007] In one embodiment, the power supply module includes: a power supply chip PU3, an inductor PL2 is connected to the inductor pin of the power supply chip PU3, and the inductor PL2 is connected in parallel with a capacitor PC38, a capacitor PC47, a resistor PR40, and a resistor PR43.

[0008] In one embodiment, the enable pin of the power supply chip PU3 is connected to an RC circuit composed of a resistor PR41, a resistor PR42, and a capacitor PC46.

[0009] In one embodiment, the MCU module includes an MCU chip U21.

[0010] In one embodiment, a CPU module is provided on the X86 motherboard, and the MCU module is connected to the CPU module.

[0011] In one embodiment, an isolation circuit is provided between the MCU module and the CPU module.

[0012] In one embodiment, the isolation circuit includes a first isolation circuit and a second isolation circuit. The first isolation circuit is connected to the transmission signal pins of the MCU module and the CPU module, and the second isolation circuit is connected to the reception signal pins of the MCU module and the CPU module.

[0013] In one embodiment, the first isolation circuit includes a resistor R33, a MOS transistor Q20, and a resistor R1075. Both ends of the resistor R33 are connected to the gate and source of the MOS transistor Q20, and the resistor R1075 is connected to the drain of the MOS transistor Q20. The second isolation circuit includes a resistor R22, a MOS transistor Q66, and a resistor R1077. Both ends of the resistor R22 are connected to the gate and source of the MOS transistor Q66, and the resistor R1077 is connected to the drain of the MOS transistor Q66.

[0014] In one embodiment, a TVS diode D81 is further connected to the drain of the MOS transistor Q20.

[0015] In one embodiment, a TVS diode D82 is further connected to the drain of the MOS transistor Q66.

[0016] One or more of the above technical solutions in the embodiments of the present application have at least one or more of the following technical effects:

[0017] In an infrared remote control circuit provided in an embodiment of the present utility model, it includes: a power supply module, an infrared reception module, an MCU module, and an X86 motherboard. Among them, the infrared reception module collects infrared signals emitted by an infrared remote control, converts them into encoded pulse signals and transmits them to the MCU module. The MCU module decodes the received pulse signals and converts them into UART TTL level signals, and outputs two TX and RX signals to the X86 motherboard. The X86 motherboard performs corresponding operations according to the received signals to change the system state. Through the collaborative work of these modules, not only can remote control of the PC system with an X86 architecture be realized, but also higher flexibility and convenience can be provided in a specific environment. For example, users can turn on, turn off, move the mouse position, switch desktop icons or windows through the infrared remote control without touching the computer, greatly expanding the usage scenarios and convenience of the PC system with an X86 architecture.

[0018] The above description is only an overview of the technical solution of the present utility model. In order to understand the technical means of the present utility model more clearly, it can be implemented according to the content of the description. And in order to make the above and other purposes, features and advantages of the present utility model more obvious and understandable, the specific embodiments of the present utility model are specifically exemplified below. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following briefly introduces the drawings required to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0020] Figure 1 Schematic diagram of the circuit module in the embodiment of the present utility model;

[0021] Figure 2 Schematic diagram of the circuit module in the embodiment of the present utility model;

[0022] Figure 3 Schematic circuit diagram of the power supply module in the embodiment of the present utility model;

[0023] Figure 4 Schematic circuit diagram of the MCU module in the embodiment of the present utility model;

[0024] Figure 5 Schematic circuit diagram of the isolation circuit in the embodiment of the present utility model.

[0025] Description of the reference numerals in the drawings: 100, power supply module; 200, infrared receiving module; 300, MCU module; 400, X86 main board; 500, CPU module; 600, isolation circuit; 610, first isolation circuit; 620, second isolation circuit. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0026] The general idea of the technical solution provided by the present utility model is as follows:

[0027] Please refer to Figures 1 to 2 , the infrared remote control circuit includes: a power supply module 100, an infrared receiving module 200, an MCU module 300, and an X86 main board 400;

[0028] The power supply module 100 is respectively connected to the infrared receiving module 200 and the MCU module 300, and is used to convert the voltage and supply power to the infrared receiving module 200 and the MCU module 300. Specifically, the power supply module 100 is mainly responsible for providing the required stable power supply for the infrared receiving module 200 and the MCU module 300. This module converts the input voltage into a voltage suitable for the infrared receiving module 200 and the MCU module 300 to ensure the stable operation of the system;

[0029] The infrared receiving module 200 is connected to the MCU module 300 and is used to collect infrared signals and convert and output them to the MCU module 300. Specifically, the infrared receiving head in the infrared receiving module 200 receives the remote control signal, converts it into a coded pulse signal with an internal circuit, and transmits the signal to the MCU module 300 through the connection with the MCU module 300;

[0030] The MCU module 300 is connected to the X86 main board 400 and is used to decode the signal converted by the infrared receiving module 200 and output it to the X86 main board 400. Specifically, the MCU module 300 receives the coded pulse signal sent by the infrared receiving module 200, decodes it and outputs two TX and RX signals to the X86 main board 400;

[0031] The X86 main board 400 receives the two TX and RX signals from the MCU module 300 and performs corresponding operations according to these signals to change the system state.

[0032] In actual use, the infrared receiving module 200 collects the infrared signals emitted by the infrared remote control, converts them into coded pulse signals and transmits them to the MCU module 300. The MCU module 300 decodes the received pulse signals and converts them into UART TTL level signals, and outputs two TX and RX signals to the X86 main board 400. The X86 main board 400 performs corresponding operations according to the received signals to change the system state. Through the coordinated work of these modules, not only can the remote control of the PC system with the X86 architecture be realized, but also higher flexibility and convenience can be provided in a specific environment. For example, users can turn on and off the computer, move the mouse position, switch desktop icons or windows through the infrared remote control without touching the computer, which greatly expands the usage scenarios and convenience of the PC system with the X86 architecture

[0033] To make the objectives, technical solutions, and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Apparently, the described embodiments are some, but not all, of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0034] Please refer to Figure 3 , the power supply module 100 includes: a power supply chip PU3. The inductance pin of the power supply chip PU3 is connected to an inductor PL2. The inductor PL2 is connected in parallel with a capacitor PC38, a capacitor PC47, a resistor PR40, and a resistor PR43. Specifically, the inductor PL2 is connected to the inductance pin of the power supply chip PU3, which helps to smooth the voltage fluctuations and noise in the circuit and ensure that the power supply module 100 stably outputs the required voltage. This helps to ensure the stability and reliability of the system operation. The capacitors PC38 and PC47 play a role in voltage compensation and filtering in the circuit to help stabilize the output voltage. The resistors PR40 and PR43 are used to adjust the output voltage or limit current for protection to ensure that the output voltage meets the set requirements.

[0035] Further, please refer to Figure 3 , the enable pin of the power supply chip PU3 is connected to an RC circuit composed of a resistor PR41, a resistor PR42, and a capacitor PC46. Specifically, the RC circuit is composed of the resistor PR41, the resistor PR42, and the capacitor PC46, which can control the rising speed of the enable signal pin. By reasonably selecting the parameters of the RC circuit, the rising speed of the enable signal can be limited to ensure the smooth switching of the power supply chip PU3 and avoid the negative impact on the system caused by too fast switching actions. When loads such as the MCU module 300 are powered on, it may cause a sudden change in current and interfere with the normal operation of the power supply chip PU3. By controlling the enable pin of the power supply chip PU3 through the RC circuit, the power-on process can be smoothed, the sudden change of current can be prevented, the impact on the power supply chip can be reduced, and the stability and reliability of the system can be improved.

[0036] Please refer to Figure 4 , the MCU module 300 includes an MCU chip U21. The MCU chip U21, as the core of the MCU module 300, can implement the intelligent control function of the system. Through preset algorithms and programs, the MCU chip U21 can monitor the system status and signals in real time, make intelligent decisions, and control the operation of other components.

[0037] Further, please refer to Figure 4, in the figure, the model of the MCU chip U21 is SN8F8701P. PIN1 of the MCU chip U21 is the power supply PIN, and the power supply is controlled by the power supply chip PU3. PIN2 of the MCU chip U21 is responsible for receiving the signals coming in from the infrared receiving module 200. The MCU chip U21 controls the X86 motherboard 400 through pin7 via the resistor R70 to achieve functions such as power on, power off, and hibernation. The X86 motherboard 400 sends an RST signal through the resistor R133 to tell pin3 of the MCU chip U21 that the X86 motherboard 400 is working properly. The MCU chip U21 controls the X86 motherboard 400 under the Windows operating system through the serial port signals of pin4 and pin5 via the resistors R74 and R75.

[0038] Please refer to Figure 2 , a CPU module 500 is provided on the X86 motherboard 400. The MCU module 300 is connected to the CPU module 500. It can be understood that the CPU module 500 is usually equipped with a powerful processor and computing power and can process complex algorithms and tasks. By connecting the MCU module 300 to the CPU module 500, data exchange and communication between the two can be achieved.

[0039] Please refer to Figure 2 , an isolation circuit 600 is provided between the MCU module 300 and the CPU module 500. The isolation circuit 600 can achieve electrical isolation between the MCU module 300 and the CPU module 500, prevent the propagation of electrical noise, interference, and overvoltage, and protect the circuits and components between the two modules.

[0040] Further, please refer to Figure 2 , the isolation circuit 600 includes a first isolation circuit 610 and a second isolation circuit 620. The first isolation circuit 610 is connected to the transmission signal pins of the MCU module 300 and the CPU module 500, and the second isolation circuit 620 is connected to the receiving signal pins of the MCU module 300 and the CPU module 500. Specifically, the first isolation circuit is used to isolate the transmission signal to prevent signal feedback, electrical noise, and interference from interfering with the transmission of the transmission signal. The second isolation circuit is used to isolate the receiving signal to prevent the influence of signal errors, interference, and noise on the receiving signal, and ensure the accurate transmission of data. By setting the first isolation circuit 610 and the second isolation circuit 620, signal isolation and electrical isolation can be achieved during the process of transmitting and receiving signals, ensuring the security and stability of data transmission. This isolation design helps to improve the anti-interference ability of the system, ensure the accurate transmission of data, and protect the MCU module 300 and the CPU module 500 from the influence of electrical problems.

[0041] Please refer to Figure 5, the first isolation circuit 610 includes a resistor R33, a MOS transistor Q20, and a resistor R1075. The two ends of the resistor R33 are connected to the gate and source of the MOS transistor Q20. The resistor R1075 is connected to the drain of the MOS transistor Q20. The second isolation circuit 620 includes a resistor R22, a MOS transistor Q66, and a resistor R1077. The two ends of the resistor R22 are connected to the gate and source of the MOS transistor Q66. The resistor R1077 is connected to the drain of the MOS transistor Q66. Specifically, the two ends of the resistor R33 are connected to the gate and source of the MOS transistor Q20, and the two ends of the resistor R22 are connected to the gate and source of the MOS transistor Q66. The resistors R33 and R22 play a role in current limiting. The MOS transistors Q20 and Q66 serve as electronic switches in the circuit to control the transmission and isolation of signals. The resistor R1075 is connected to the drain of the MOS transistor Q20, and the resistor R1077 is connected to the drain of the MOS transistor Q66, which are used to adjust the current and impedance matching.

[0042] Further, please refer to Figure 5 , a TVS diode D81 is also connected to the drain of the MOS transistor Q20, and a TVS diode D82 is also connected to the drain of the MOS transistor Q66. The TVS diodes D81 and D82 can conduct quickly when detecting a transient voltage exceeding the set value, leading the excess voltage to the ground to protect the MOS transistor and other components from overvoltage. By connecting the TVS diode D81 to the drain of the MOS transistor Q20 and connecting the TVS diode D82 to the drain of the MOS transistor Q66, protection can be provided for the MOS transistor and other components in the circuit to prevent sudden voltage fluctuations and high-voltage impacts from damaging the circuit, improving the stability and reliability of the entire system.

[0043] Although the preferred embodiments of the present invention have been described, those skilled in the art can make additional changes and modifications to these embodiments once they know the basic creative concept. Therefore, the appended claims are intended to be construed as including the preferred embodiments and all changes and modifications falling within the scope of the present invention.

[0044] Obviously, those skilled in the art can make various changes and modifications to the embodiments of the present invention without departing from the spirit and scope of the embodiments of the present invention. Thus, if these modifications and variations of the embodiments of the present invention fall within the scope of the claims of the present invention and their equivalent technologies, the present invention also intends to include these changes and modifications.

Claims

1. An infrared remote control circuit, characterized in that: include: Power module, infrared receiving module, MCU module and X86 mainboard; The power supply module is connected to the infrared receiving module and the MCU module respectively, and is used for converting voltage and supplying power to the infrared receiving module and the MCU module; The infrared receiving module is connected to the MCU module and is used to collect infrared signals and convert and output them to the MCU module; The MCU module is connected to the X86 mainboard and is used for decoding the signal converted by the infrared receiving module and outputting it to the X86 mainboard.

2. An infrared remote control circuit according to claim 1, characterized in that: The power module includes: a power chip PU3, an inductor pin of the power chip PU3 is connected to an inductor PL2, and the inductor PL2 is connected in parallel to a capacitor PC38, a capacitor PC47, a resistor PR40 and a resistor PR43.

3. An infrared remote control circuit according to claim 2, characterized in that: The enable pin of the power chip PU3 is connected to an RC circuit consisting of a resistor PR41, a resistor PR42 and a capacitor PC46.

4. An infrared remote control circuit according to claim 1, characterized in that: The MCU module includes an MCU chip U21.

5. An infrared remote control circuit according to claim 1, characterized in that: The X86 mainboard is provided with a CPU module, and the MCU module is connected to the CPU module.

6. An infrared remote control circuit according to claim 5, characterized in that: An isolation circuit is provided between the MCU module and the CPU module.

7. An infrared remote control circuit according to claim 6, characterized in that: The isolation circuit includes a first isolation circuit and a second isolation circuit, the first isolation circuit is connected to the sending signal pins of the MCU module and the CPU module, and the second isolation circuit is connected to the receiving signal pins of the MCU module and the CPU module.

8. An infrared remote control circuit according to claim 7, characterized in that: The first isolation circuit includes a resistor R33, a MOS tube Q20 and a resistor R1075, wherein two ends of the resistor R33 are connected to the gate and source of the MOS tube Q20, and the resistor R1075 is connected to the drain of the MOS tube Q20. The second isolation circuit includes a resistor R22, a MOS tube Q66 and a resistor R1077, wherein two ends of the resistor R22 are connected to the gate and source of the MOS tube Q66, and the resistor R1077 is connected to the drain of the MOS tube Q66.

9. An infrared remote control circuit according to claim 8, characterized in that: The drain of the MOS tube Q20 is also connected to a TVS tube D81.

10. An infrared remote control circuit according to claim 8, characterized in that: The drain of the MOS tube Q66 is also connected to a TVS tube D82.