Zero-ohm resistor and high-speed circuit

Abstract

The utility model relates to the technical field of zero-ohm resistors, and discloses a zero-ohm resistor and a high-speed circuit, the zero-ohm resistor comprises a first terminal, a second terminal, a ceramic substrate, a transmission line and a power connection piece, the second terminal and the first terminal are arranged at an interval, two ends of the ceramic substrate are respectively connected with the first terminal and the second terminal, and the transmission line is connected with the power connection piece. The ceramic substrate, the first terminal and the second terminal define a containing groove, the containing groove is filled with a semi-solidified layer, the two ends of the transmission line are electrically connected to the first terminal and the second terminal respectively, and the transmission line is located in the semi-solidified layer. The power connection part is located between the first terminal and the second terminal, and the power connection part is electrically connected with the semi-solidified layer. According to the zero-ohm resistor and the high-speed circuit, the value of the characteristic impedance of the zero-ohm resistor can be flexibly designed, so that the zero-ohm resistor can be matched with high-speed circuits with different requirements, and the zero-ohm resistor can have large characteristic impedance.

Description

Technical Field

[0001] The utility model relates to the technical field of zero-ohm resistors, in particular to a zero-ohm resistor and a high-speed circuit. Background Art

[0002] In the related technology, zero-ohm resistors are widely used in circuit design. When zero-ohm resistors are used in low-speed, low-frequency signal circuits, the parasitic parameters of zero-ohm resistors have little effect on the signal, and there is no need to consider issues such as characteristic impedance, loss, and electromagnetic compatibility. However, when zero-ohm resistors are used in high-speed, high-frequency signal circuits, issues such as characteristic impedance, loss, eye closure, noise jitter, and radiation need to be considered.

[0003] However, the characteristic impedance of the existing zero-ohm resistor is relatively fixed, and cannot be flexibly matched to high-speed circuits with different requirements, and the characteristic impedance is relatively small. Utility Model Content

[0004] The embodiment of the utility model discloses a zero-ohm resistor and a high-speed circuit. The value of the characteristic impedance of the zero-ohm resistor can be flexibly designed to match high-speed circuits with different requirements, and can have a larger characteristic impedance.

[0005] In the first aspect, an embodiment of the utility model discloses a zero-ohm resistor, comprising a first terminal, a second terminal, a ceramic substrate, a transmission line and an electrical connection piece, wherein the second terminal is spaced apart from the first terminal, two ends of the ceramic substrate are respectively connected to the first terminal and the second terminal, the ceramic substrate and the first terminal and the second terminal are enclosed to form a receiving groove, the receiving groove is filled with a semi-cured layer, the transmission line is buried in the semi-cured layer, and the two ends of the transmission line are respectively electrically connected to the first terminal and the second terminal, the electrical connection piece is located between the first terminal and the second terminal, and the electrical connection piece is electrically connected to the semi-cured layer.

[0006] As an optional implementation, in an embodiment of the utility model, the ceramic substrate is provided with a through hole connected to the receiving groove, the electrical connection piece extends from the receiving groove through the through hole and protrudes out of the side of the ceramic substrate away from the receiving groove, and the portion of the electrical connection piece located in the receiving groove is electrically connected to the semi-cured layer.

[0007] As an optional implementation, in an embodiment of the utility model, the power connection component includes a main body and an extension portion, the main body is arranged on the side of the ceramic substrate facing the receiving groove and is electrically connected to the semi-cured layer, the extension portion is arranged on the side of the main body facing the ceramic substrate, and the extension portion extends through the through hole and protrudes from the side of the ceramic substrate away from the receiving groove.

[0008] As an optional implementation, in the embodiment of the utility model, the dielectric constant of the semi-cured layer is ε r , the thickness of the transmission line along the thickness direction of the zero-ohm resistor is t, the width of the transmission line along the width direction of the zero-ohm resistor is w, along the thickness direction, the distance from the transmission line to the power connection is h, and the characteristic impedance of the zero-ohm resistor is Z 0 ,

[0009] As an optional implementation, in an embodiment of the utility model, the thickness of the transmission line along the thickness direction of the zero-ohm resistor is t, and 0.03mm≤t≤0.06mm.

[0010] As an optional implementation, in an embodiment of the present utility model, the width of the transmission line along the width direction of the zero-ohm resistor is w, and 0.08mm≤w≤0.12mm.

[0011] As an optional implementation, in an embodiment of the present utility model, along the thickness direction of the zero-ohm resistor, the distance from the transmission line to the power connection piece is h, and 0.1 mm≤h≤0.3 mm.

[0012] As an optional implementation, in an embodiment of the utility model, the zero-ohm resistor also includes a shielding layer, which is arranged between the first terminal and the second terminal, and the shielding layer is located on the side of the semi-cured layer away from the ceramic substrate, and closes the opening of the receiving groove.

[0013] As an optional implementation, in an embodiment of the utility model, the first terminal includes a first inner terminal and a first outer terminal sleeved on the first inner terminal, the second terminal includes a second inner terminal and a second outer terminal sleeved on the second inner terminal, the second inner terminal is spaced apart from the first inner terminal, the two ends of the ceramic substrate are respectively connected to the first inner terminal and the second inner terminal, and the ceramic substrate and the first inner terminal and the second inner terminal are enclosed to form the accommodating groove.

[0014] In a second aspect, an embodiment of the utility model discloses a high-speed circuit, comprising a circuit board and a zero-ohm resistor of the second aspect, wherein the zero-ohm resistor is arranged on the circuit board, and the first terminal, the second terminal and the electrical connection piece are all electrically connected to the circuit board.

[0015] Compared with the prior art, the embodiments of the present invention have at least the following beneficial effects:

[0016] In the embodiment of the utility model, the first terminal and the second terminal are arranged at intervals, and the two ends of the ceramic substrate are respectively connected to the first terminal and the second terminal, so as to enclose the first terminal and the second terminal together to form a receiving groove, and the receiving groove is used to fill the semi-cured layer, and the transmission line is buried in the semi-cured layer, so that the two ends of the transmission line are connected to the first terminal and the second terminal. Then the first terminal and the second terminal are used as the two pins of the zero-ohm resistor to conduct with the circuit, and the transmission line can be used to transmit signals. At the same time, the connection piece is electrically connected to the semi-cured layer, and the connection piece is used as the ground pin of the zero-ohm resistor to conduct with the circuit to be grounded, that is, the zero-ohm resistor has three pins, which can provide reflux for the signal, thereby maintaining good signal integrity, realizing high-speed signal transmission, and maintaining impedance consistency. Based on this, the structure of the zero-ohm resistor is designed using high-speed signal design theory and transmission line theory, and the characteristic impedance value of the zero-ohm resistor can be flexibly designed by changing the size of the transmission line, the distance between the transmission line and the connection piece, the dielectric constant of the semi-cured layer, etc., so as to match high-speed circuits with different requirements, and have a larger characteristic impedance. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this technical field, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 It is a schematic diagram of the cross-sectional structure of a zero-ohm resistor disclosed in the first embodiment of the utility model;

[0019] Figure 2 It is a schematic diagram of the structure of the zero-ohm resistor (hiding the semi-cured layer) disclosed in the first embodiment of the utility model from a top view perspective;

[0020] Figure 3 It is a structural schematic diagram of a high-speed circuit disclosed in Embodiment 2 of the present utility model.

[0021] Description of main reference numerals

[0022] 100, zero-ohm resistor; 10, first terminal; 10a, first inner terminal; 10b, first outer terminal; 11, second terminal; 11a, second inner terminal; 11b, second outer terminal; 12, ceramic substrate; 12a, through hole; 13, transmission line; 14, semi-cured layer; 15, power connection piece; 151, main body; 152, extension part; 16, shielding layer; 200, high-speed circuit; 20, circuit board; x, thickness direction; y, width direction. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] In the present invention, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inside", "outside", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings. These terms are mainly used to better describe the present invention and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0025] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those skilled in the art, the specific meanings of these terms in this utility model can be understood according to specific circumstances.

[0026] In addition, the terms "installed", "set", "provided with", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0027] In addition, the terms "first", "second", etc. are mainly used to distinguish different devices, elements or components (the specific types and structures may be the same or different), and are not used to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise specified, "plurality" means two or more.

[0028] The utility model discloses a zero-ohm resistor and a high-speed circuit. The value of the characteristic impedance of the zero-ohm resistor can be flexibly designed to match high-speed circuits with different requirements, and the zero-ohm resistor can have a larger characteristic impedance.

[0029] Embodiment 1

[0030] See also Figure 1, is a structural schematic diagram of a zero-ohm resistor 100 provided in Example 1 of the utility model, the zero-ohm resistor 100 includes a first terminal 10, a second terminal 11, a ceramic substrate 12, a transmission line 13 and an electrical connection piece 15, the second terminal 11 is spaced apart from the first terminal 10, two ends of the ceramic substrate 12 are respectively connected to the first terminal 10 and the second terminal 11, the ceramic substrate 12 and the first terminal 10 and the second terminal 11 are enclosed to form a receiving groove (not shown), the receiving groove is filled with a semi-cured layer 14, the transmission line 13 is buried in the semi-cured layer 14, and two ends of the transmission line 13 are respectively electrically connected to the first terminal 10 and the second terminal 11, the electrical connection piece 15 is located between the first terminal 10 and the second terminal 11, and the electrical connection piece 15 is electrically connected to the semi-cured layer 14.

[0031] In this embodiment, the first terminal 10 and the second terminal 11 are arranged at intervals, and the two ends of the ceramic substrate 12 are connected to the first terminal 10 and the second terminal 11 respectively, so as to enclose the first terminal 10 and the second terminal 11 together to form a receiving groove, and the semi-cured layer 14 is filled with the receiving groove, and the transmission line 13 is buried in the semi-cured layer 14, so that the two ends of the transmission line 13 are connected to the first terminal 10 and the second terminal 11. The first terminal 10 and the second terminal 11 are used as the two pins of the zero-ohm resistor 100 to conduct with the circuit, and the transmission line 13 can be used to transmit signals. At the same time, the zero-ohm resistor 100 is electrically connected to the semi-cured layer 14 through the electrical connection 15, and the electrical connection 15 is used as the ground pin of the zero-ohm resistor 100 to conduct with the circuit and ground, that is, the zero-ohm resistor 100 has three pins, which can provide reflux for the signal, thereby maintaining good signal integrity, realizing high-speed signal transmission, and maintaining impedance consistency. Based on this, the structure of the zero-ohm resistor 100 is designed using high-speed signal design theory and transmission line 13 theory. By changing the size of the transmission line 13, the distance between the transmission line 13 and the electrical connector 15, the dielectric constant of the semi-cured layer 14, etc., the value of the characteristic impedance of the zero-ohm resistor 100 can be flexibly designed, thereby matching high-speed circuits 200 with different requirements and having a larger characteristic impedance.

[0032] Furthermore, the insertion loss, return loss, noise and jitter of the zero-ohm resistor 100 can be reduced.

[0033] In some embodiments, the dielectric constant of the semi-cured layer 14 is εr, the thickness of the transmission line 13 along the thickness direction x of the zero-ohm resistor 100 is t, the width of the transmission line 13 along the width direction y of the zero-ohm resistor 100 is w, the distance from the transmission line 13 to the electrical connection member 15 along the thickness direction x is h, and the characteristic impedance Z of the zero-ohm resistor 100 is 0 for In this way, by changing the thickness t and width w of the transmission line 13, the distance between the transmission line 13 and the electrical connection part 15, and the dielectric constant of the semi-cured layer 14, the characteristic impedance of the zero-ohm resistor 100 can be changed, and the value of the characteristic impedance of the zero-ohm resistor 100 can be flexibly designed, thereby matching high-speed circuits 200 with different requirements and having a larger characteristic impedance.

[0034] Optionally, the thickness of the transmission line 13 along the thickness direction x of the zero ohm resistor 100 is t, 0.03mm≤t≤0.06mm. If the thickness t of the transmission line 13 is less than 0.03mm, the thickness t of the transmission line 13 is small, the processing and production difficulty is greater, the cost of the zero ohm resistor 100 is high, and the preparation yield is low. If the thickness t of the transmission line 13 is greater than 0.06mm, the thickness t of the transmission line 13 is large. According to the characteristic impedance Z of the zero ohm resistor 100, 0 for It is difficult to design a larger characteristic impedance for the zero-ohm resistor 100. Therefore, the thickness t of the transmission line 13 along the thickness direction x of the zero-ohm resistor 100 can be 0.03mm≤t≤0.06mm, the processing and production difficulty is relatively low, the cost of the zero-ohm resistor 100 is relatively low, the preparation yield is relatively high, and the zero-ohm resistor 100 can be designed with a larger characteristic impedance. The thickness t of the transmission line 13 can be 0.03mm, 0.035mm, 0.04mm, 0.045mm, 0.05mm, 0.055mm, 0.06mm, etc., which is not specifically limited in this embodiment.

[0035] For example, Figure 2 As shown, the width of the transmission line 13 along the width direction y of the zero ohm resistor 100 is w, 0.08mm≤w≤0.12mm. If the width w of the transmission line 13 is less than 0.08mm, the width w of the transmission line 13 is smaller, the processing and production difficulty is greater, the cost of the zero ohm resistor 100 is higher, and the preparation yield is lower. If the width w of the transmission line 13 is greater than 0.12mm, the width w of the transmission line 13 is larger. According to the characteristic impedance Z of the zero ohm resistor 100, 0 for It is difficult to design a larger characteristic impedance for the zero-ohm resistor 100. Therefore, the width w of the transmission line 13 along the thickness direction x of the zero-ohm resistor 100 can be 0.08mm≤w≤0.12mm, the processing and production difficulty is relatively low, the cost of the zero-ohm resistor 100 is relatively low, the preparation yield is relatively high, and the zero-ohm resistor 100 can be designed with a larger characteristic impedance. The width w of the transmission line 13 can be 0.08mm, 0.085mm, 0.09mm, 0.095mm, 0.1mm, 0.105mm, 0.11mm, 0.115mm, 0.12mm, etc., which is not specifically limited in this embodiment.

[0036] Optionally, along the thickness direction x, the distance from the transmission line 13 to the power connection 15 is h, 0.1 mm ≤ h ≤ 0.3 mm. If the distance h from the transmission line 13 to the power connection 15 is less than 0.1 mm, the distance h from the transmission line 13 to the power connection 15 is small. According to the characteristic impedance Z of the zero-ohm resistor 100 0 for It is difficult to design a larger characteristic impedance for the zero-ohm resistor 100. If the distance h from the transmission line 13 to the electrical connection 15 is greater than 0.3 mm, the distance h from the transmission line 13 to the electrical connection 15 is larger, occupying a larger space, and the overall size of the zero-ohm resistor 100 is larger. Therefore, the distance h from the transmission line 13 to the electrical connection 15 can be 0.1 mm ≤ h ≤ 0.3 mm, and the zero-ohm resistor 100 can be designed with a larger characteristic impedance, and the overall size of the zero-ohm resistor 100 is smaller. The distance h from the transmission line 13 to the electrical connection 15 can be 0.1 mm, 0.15 mm, 0.2 mm, 0.25 mm, 0.3 mm, etc., which is not specifically limited in this embodiment.

[0037] In some embodiments, such as Figure 1 As shown, the ceramic substrate 12 is provided with a through hole 12a connected to the receiving groove, and the electrical connection member 15 extends from the receiving groove through the through hole 12a to protrude from the side of the ceramic substrate 12 away from the receiving groove, and the portion of the electrical connection member 15 located in the receiving groove is electrically connected to the semi-cured layer 14. In this way, by providing the through hole 12a in the ceramic substrate 12, the electrical connection member 15 can be electrically connected to the semi-cured layer 14 in the receiving groove by using the through hole 12a, and the portion of the electrical connection member 15 protruding from the side of the ceramic substrate 12 away from the receiving groove can be used for conducting and grounding with the circuit, while avoiding the electrical connection member 15 from contacting the first terminal 10 and the second terminal 11, resulting in a short circuit between the grounding of the electrical connection member 15 and the transmission signal of the transmission line 13.

[0038] Exemplarily, the electrical connector 15 includes a main body 151 and an extension 152. The main body 151 is disposed on the side of the ceramic substrate 12 facing the receiving groove and is electrically connected to the semi-cured layer 14. The extension 152 is disposed on the side of the main body 151 facing the ceramic substrate 12, and the extension 152 extends through the through hole 12a and protrudes from the side of the ceramic substrate 12 away from the receiving groove. In this way, by virtue of the main body 151 being disposed on the side of the ceramic substrate 12 facing the receiving groove, the main body 151 can be electrically connected to the semi-cured layer 14, and the extension 152 extends from the main body 151 through the through hole 12a and protrudes from the ceramic substrate 12, so that the extension 152 is connected to the circuit and the electrical connector 15 is grounded.

[0039] In some embodiments, the zero-ohm resistor 100 further includes a shielding layer 16, which is disposed between the first terminal 10 and the second terminal 11. The shielding layer 16 is located on the side of the semi-cured layer 14 away from the ceramic substrate 12, and closes the opening of the receiving groove. In this way, by providing the shielding layer 16, the shielding layer 16 can shield electromagnetic radiation, and the electromagnetic radiation of the zero-ohm resistor 100 is small.

[0040] Optionally, the thickness of the shielding layer 16 along the thickness direction x of the zero ohm resistor 100 is d, 0.02≤d≤0.1mm. If the thickness d of the shielding layer 16 is less than 0.02mm, the thickness d of the shielding layer 16 is small, the shielding effect of the shielding layer 16 on electromagnetic radiation is poor, and the electromagnetic radiation of the zero ohm resistor 100 is large. If the thickness d of the shielding layer 16 is greater than 0.1mm, the thickness d of the shielding layer 16 is large, and the shielding layer 16 occupies a large space while satisfying the electromagnetic radiation shielding effect, and the overall size of the zero ohm resistor 100 is large. Therefore, the thickness d of the shielding layer 16 can be 0.02≤d≤0.1mm, the shielding effect of the shielding layer 16 on electromagnetic radiation is better, the electromagnetic radiation of the zero ohm resistor 100 is small, and the shielding layer 16 occupies a small space, and the overall size of the zero ohm resistor 100 is small. The thickness d of the shielding layer 16 may be 0.02 mm, 0.03 mm, 0.04 mm, 0.05 mm, 0.06 mm, 0.07 mm, 0.08 mm, 0.09 mm, 0.1 mm, etc., which is not specifically limited in this embodiment.

[0041] Exemplarily, the dielectric constant of the shielding layer 16 is less than or equal to 3.8, and the dielectric loss angle is less than or equal to 0.02. Thus, by using the shielding layer 16 with a small dielectric constant and dielectric loss angle, the loss can be reduced.

[0042] In some embodiments, the first terminal 10 includes a first inner terminal 10a and a first outer terminal 10b sleeved on the first inner terminal 10a, the second terminal 11 includes a second inner terminal 11a and a second outer terminal sleeved on the second inner terminal 11a, the second inner terminal 11a is spaced apart from the first inner terminal 10a, the two ends of the ceramic substrate 12 are respectively connected to the first inner terminal 10a and the second inner terminal 11a, and the ceramic substrate 12 and the first inner terminal 10a and the second inner terminal 11a are enclosed to form a receiving groove. In this way, a good supporting structure is formed by the first inner terminal 10a and the second inner terminal 11a, and the ceramic substrate 12 with good hardness, thermal conductivity, corrosion resistance and reliability is used to achieve better support for the semi-cured layer 14, the transmission line 13 and the power connection part 15. At the same time, the first outer terminal 10b and the second outer terminal are respectively in contact and conduction with the first inner terminal 10a and the second inner terminal 11a, so as to form an electrical connection with the transmission line 13, which is convenient for welding with the circuit to realize signal transmission.

[0043] The first outer terminal 10b and the second outer terminal may be made of a lead-tin alloy, and the first inner terminal 10a and the second inner terminal 11a may be made of a nickel-chromium alloy.

[0044] The first embodiment of the utility model provides a zero-ohm resistor 100, in which a first terminal 10 and a second terminal 11 are arranged at intervals, and two ends of a ceramic substrate 12 are respectively connected to the first terminal 10 and the second terminal 11, so as to enclose a receiving groove together with the first terminal 10 and the second terminal 11, and the receiving groove is filled with a semi-cured layer 14, and a transmission line 13 is buried in the semi-cured layer 14, so that the two ends of the transmission line 13 are connected to the first terminal 10 and the second terminal 11. The first terminal 10 and the second terminal 11 are used as two pins of the zero-ohm resistor 100 to conduct with the circuit, and the transmission line 13 can be used to transmit signals. At the same time, the zero-ohm resistor 100 is electrically connected to the semi-cured layer 14 through the electrical connection 15, and the electrical connection 15 is used as the ground pin of the zero-ohm resistor 100 to conduct with the circuit and to be grounded, that is, the zero-ohm resistor 100 has three pins, which can provide reflux for the signal, thereby maintaining good signal integrity, realizing high-speed signal transmission, and maintaining impedance consistency. Based on this, the structure of the zero-ohm resistor 100 is designed using high-speed signal design theory and transmission line 13 theory. By changing the size of the transmission line 13, the distance between the transmission line 13 and the electrical connector 15, the dielectric constant of the semi-cured layer 14, etc., the value of the characteristic impedance of the zero-ohm resistor 100 can be flexibly designed, thereby matching high-speed circuits 200 with different requirements and having a larger characteristic impedance.

[0045] Embodiment 2

[0046] See also Figure 3 , is a structural schematic diagram of a high-speed circuit 200 provided in Embodiment 2 of the present utility model, the high-speed circuit 200 includes a circuit board 20 and the zero-ohm resistor 100 of Embodiment 1, the zero-ohm resistor 100 is arranged on the circuit board 20, and the first terminal 10, the second terminal 11 and the electrical connection member 15 are all electrically connected to the circuit board 20.

[0047] The second embodiment of the present invention provides a high-speed circuit 200, in which the value of the characteristic impedance of the zero-ohm resistor 100 can be flexibly designed to match the high-speed circuit 200 with different requirements and can have a larger characteristic impedance.

[0048] The above is a detailed introduction to a zero-ohm resistor and a high-speed circuit disclosed in the embodiment of the present invention. This article uses individual examples to illustrate the principle and implementation method of the present invention. The description of the above embodiments is only used to help understand the zero-ohm resistor and the high-speed circuit of the present invention and its core idea; at the same time, for general technical personnel in this field, according to the idea of ​​the present invention, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A zero ohm resistor, characterized in that: include: First terminal; a second terminal, the second terminal being spaced apart from the first terminal; A ceramic substrate, two ends of which are respectively connected to the first terminal and the second terminal, the ceramic substrate and the first terminal and the second terminal are surrounded by a receiving groove, and the receiving groove is filled with a semi-cured layer; a transmission line, wherein the transmission line is buried in the semi-cured layer, and two ends of the transmission line are electrically connected to the first terminal and the second terminal respectively; and A connection piece is located between the first terminal and the second terminal, and the connection piece is electrically connected to the semi-cured layer.

2. The zero-ohm resistor according to claim 1, characterized in that: The ceramic substrate is provided with a through hole connected to the receiving groove, the electrical connection piece extends from the receiving groove through the through hole and protrudes out of the side of the ceramic substrate away from the receiving groove, and the portion of the electrical connection piece located in the receiving groove is electrically connected to the semi-cured layer.

3. The zero-ohm resistor according to claim 2, characterized in that: The electrical connection member includes a main body and an extension portion, wherein the main body is disposed on a side of the ceramic substrate facing the receiving groove and is electrically connected to the semi-cured layer, and the extension portion is disposed on a side of the main body facing the ceramic substrate, and the extension portion extends through the through hole and protrudes out of a side of the ceramic substrate away from the receiving groove.

4. The zero-ohm resistor according to claim 1, characterized in that: The dielectric constant of the semi-cured layer is ε r , the thickness of the transmission line along the thickness direction of the zero-ohm resistor is t, the width of the transmission line along the width direction of the zero-ohm resistor is w, along the thickness direction, the distance from the transmission line to the power connection piece is h, the characteristic impedance of the zero-ohm resistor is Z0, 5. The zero-ohm resistor according to any one of claims 1 to 4, characterized in that: The thickness of the transmission line along the thickness direction of the zero-ohm resistor is t, and 0.03mm≤t≤0.06mm.

6. The zero-ohm resistor according to any one of claims 1 to 4, characterized in that: The width of the transmission line along the width direction of the zero-ohm resistor is w, and 0.08mm≤w≤0.12mm.

7. The zero-ohm resistor according to any one of claims 1 to 4, characterized in that: Along the thickness direction of the zero-ohm resistor, the distance from the transmission line to the power connection piece is h, and 0.1 mm≤h≤0.3 mm.

8. The zero-ohm resistor according to any one of claims 1 to 4, characterized in that: The zero-ohm resistor further includes a shielding layer, which is disposed between the first terminal and the second terminal. The shielding layer is located on a side of the semi-cured layer away from the ceramic substrate and closes an opening of the receiving groove.

9. The zero-ohm resistor according to any one of claims 1 to 4, characterized in that: The first terminal includes a first inner terminal and a first outer terminal sleeved on the first inner terminal, the second terminal includes a second inner terminal and a second outer terminal sleeved on the second inner terminal, the second inner terminal is spaced apart from the first inner terminal, the two ends of the ceramic substrate are respectively connected to the first inner terminal and the second inner terminal, and the ceramic substrate, the first inner terminal and the second inner terminal are surrounded to form the accommodating groove.

10. A high-speed circuit, characterized in that: It comprises a circuit board and the zero-ohm resistor according to any one of claims 1 to 9, wherein the zero-ohm resistor is arranged on the circuit board, and the first terminal, the second terminal and the power connection member are all electrically connected to the circuit board.

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