Wafer positioning device

Abstract

The utility model provides a wafer positioning device. The wafer positioning device comprises a body, a carrying table, a support, an optical module and a control module. The carrying platform is movably arranged on the body. The support is vertically arranged on the body and partially suspended above the body, so that a detection space is formed by the support and the body. The wafer is carried on the carrying table and driven by the carrying table to rotate relative to the body, the edge of the wafer passes through the detection space, and at least one surface, forming the detection space, of the support and the body is a light absorption surface. The optical module comprises a light source and an image acquirer, the light source is arranged in the body, and the image acquirer is arranged in the support. The control module is electrically connected with the carrying table and the optical module, the control module drives the light source to project a light beam, and the light beam sequentially penetrates through the body and the detection space, penetrates into the support and is received by the image acquisition device so as to detect the edge of the wafer. According to the wafer positioning device provided by the utility model, wafer positioning can be effectively completed, and the subsequent wafer processing process can be facilitated.

Description

Technical Field

[0001] The utility model relates to a semiconductor device, in particular to a wafer positioning device. Background Art

[0002] With the progress of technology and the improvement of people's living standards, semiconductor electronic products have been widely applied to various fields of society and life and have become an indispensable part of modern life. Before a semiconductor wafer enters a processing device, it is necessary to position the wafer first so that a notch preset on the wafer faces a specific position, facilitating subsequent processing of the wafer after positioning.

[0003] Specifically, the existing wafer positioning method is to place the wafer on a tray. The controller controls the rotation of the tray and detects the notch of the wafer through a sensor for rapid positioning and eccentricity correction of the wafer. Generally, during the detection process, a light source is used to irradiate the edge of the wafer, and then the sensor senses the image of the edge to determine whether the notch exists. However, because the sensor is used to sense the image of the wafer edge, it will inevitably be affected by external environmental light sources, which may lead to misjudgment of the sensing result. Summary of the Utility Model

[0004] The utility model provides a wafer positioning device to efficiently complete wafer positioning, which is beneficial to the subsequent wafer processing process.

[0005] A wafer positioning device of the utility model includes a main body, a stage, a bracket, an optical module, and a control module. The stage is movably arranged on the main body. The bracket is erected on the main body and partially hangs above the main body, so that a detection space is formed between the bracket and the main body. The wafer is carried on the stage and driven by the stage to rotate relative to the main body, and the edge of the wafer passes through the detection space, wherein at least one surface of the detection space formed by the bracket and the main body is a light absorption surface. The optical module includes a light source and an image acquirer. The light source is arranged in the main body, and the image acquirer is arranged in the bracket. The control module is electrically connected to the stage and the optical module. The control module drives the light source to project a light beam, and the light beam sequentially passes through the main body and the detection space and enters the bracket to be received by the image acquirer to detect the edge of the wafer.

[0006] In an embodiment of the utility model, the above-mentioned bracket has a connection structure and a detection structure. The connection structure is connected between the detection structure and the main body. The detection structure hangs above the main body. The image acquirer is located in the detection structure. The above-mentioned at least one surface includes the surface of the connection structure facing the detection space.

[0007] In an embodiment of the present utility model, the above detection structure has a detection surface, which is exposed to the detection space and faces the body, and the surface of the connection structure facing the detection space is adjacent between the detection surface and the body.

[0008] In an embodiment of the present utility model, the above bracket has a connection structure and a detection structure. The connection structure is connected between the detection structure and the body. The detection structure is suspended above the body, and the image acquirer is located inside the detection structure. The above at least one surface includes a partial top surface of the body adjacent to the connection structure.

[0009] In an embodiment of the present utility model, the above partial top surface is the orthographic projection surface of the detection structure corresponding to the body.

[0010] In an embodiment of the present utility model, the above body has an opening, which is within the range of the partial top surface, and the light beam projected by the light source enters the detection space through the opening.

[0011] In an embodiment of the present utility model, the above detection structure has a detection surface, which is exposed to the detection space and faces the partial top surface, and the connection structure is adjacent between the partial top surface and the detection surface.

[0012] In an embodiment of the present utility model, the above bracket has a connection structure and a detection structure. The connection structure is connected between the detection structure and the body. The detection structure is suspended above the body, and the image acquirer is located inside the detection structure. The above at least one surface includes the surface of the connection structure exposed to the detection space and the partial top surface of the body.

[0013] In an embodiment of the present utility model, the above detection structure has a detection surface, which is exposed to the detection space and faces the partial top surface, and the surface of the connection structure exposed to the detection space is adjacent between the partial top surface and the detection surface.

[0014] In an embodiment of the present utility model, the above light absorption surface is an anodized black matte surface.

[0015] In an embodiment of the present utility model, the above stage includes a planar moving platform and a rotating platform, which are respectively electrically connected to the control module. The rotating platform is arranged on the planar moving platform. The planar moving platform performs planar movement on the body, and the rotating platform rotates around the normal line of the plane.

[0016] In an embodiment of the present utility model, the above stage further includes an adsorption unit, which is electrically connected to the control module and structurally communicates with the rotating platform. The control module drives the adsorption unit to adsorb and fix the wafer on the rotating platform.

[0017] Based on the above, the wafer positioning device forms a detection space with a bracket and a body. When the wafer is driven to rotate by a loading stage, its edge can pass through the detection space, enabling the optical module to detect the wafer passing through the detection space, so that the control module can determine the location of the notch on the wafer, and then rotate the wafer to a specific position to achieve the positioning effect, which is beneficial to subsequent wafer processing processes.

[0018] More importantly, at least one surface of the body and the bracket forming the detection space is a light-absorbing surface. Therefore, when the light generated by the light source of the optical module passes through the detection space, it can be free from the interference of the light in the external environment, enabling the image acquirer of the optical module to smoothly acquire the image of the wafer at its edge, thereby improving the discrimination accuracy.

[0019] To make the above features and advantages of the present utility model more obvious and understandable, specific embodiments are hereinafter given and described in detail in conjunction with the accompanying drawings as follows. Description of the Drawings

[0020] Figure 1 is a schematic diagram of a wafer positioning device and a wafer according to an embodiment of the present utility model;

[0021] Figure 2 is Figure 1 a schematic diagram of the wafer positioning device;

[0022] Figure 3 is Figure 1 a side view of the wafer positioning device. Detailed Embodiment

[0023] Figure 1 is a schematic diagram of a wafer positioning device and a wafer according to an embodiment of the present utility model. Figure 2 is Figure 1 a schematic diagram of the wafer positioning device. Figure 3 is Figure 1 a side view of the wafer positioning device. Cartesian coordinates X - Y - Z are provided here for facilitating the description of components. Please refer to Figures 1 to 3, in this embodiment, the wafer positioning device 100 includes a main body 110, a stage 130, a bracket 120, an optical module 140, and a control module CM. The stage 130 is movably disposed on the main body 110. The bracket 120 is erected on the main body 110 and partially suspended above the main body 110, so that a detection space IS is formed between the bracket 120 and the main body 110. The wafer 200 is carried on the stage 130 and driven by the stage 130 to rotate relative to the main body 110, and the edge of the wafer 200 passes through the detection space IS. At least one surface of the detection space IS formed by the bracket 120 and the main body 110 is a light-absorbing surface. The optical module 140 includes a light source 142 and an image acquirer 141. The light source 142 is disposed in the main body 110, and the image acquirer 141 is disposed in the bracket 120. The control module CM is electrically connected to the stage 130 and the optical module 140. The control module CM drives the light source 142 to project a light beam. The light beam sequentially passes through the main body 110 and the detection space IS and is projected into the bracket 120 and received by the image acquirer 141 to detect the edge of the wafer 200.

[0024] Specifically, as Figure 2 shown in Figure 3 , the stage 130 includes a planar moving platform 131 and a rotating platform 132, which are respectively electrically connected to the control module CM. The rotating platform 132 is disposed on the planar moving platform 131. The planar moving platform 131 performs planar movement (moves along the X-Y plane) on the main body 110, and the rotating platform 132 rotates about the normal of the X-Y plane (i.e., the Z axis). Here, the rotation axis C1 followed by the rotating platform 132 is substantially parallel to the Z axis. Furthermore, the stage 130 further includes an adsorption unit 133, such as a vacuum pump, which is electrically connected to the control module CM and structurally communicated with the rotating platform 132. As Figure 3 shown, a plurality of adsorption holes are formed on the upper surface of the rotating platform 132. Therefore, the control module CM can drive the adsorption unit 133 to adsorb and fix the wafer 200 carried on the rotating platform 132.

[0025] On the other hand, as Figure 2 shown in Figure 3As shown, the bracket 120 has a connection structure ST1 and a detection structure ST2. The connection structure ST1 is connected between the detection structure ST2 and the body 110. The detection structure ST2 is suspended above the body 110, and the image acquirer 141 is located within the detection structure ST2. Furthermore, the detection structure ST2 has a detection surface 122 that is exposed to the detection space IS and faces the partial top surface 112 of the body 110. The surface 121 of the connection structure ST1 facing the detection space IS is adjacent between the detection surface 122 and the partial top surface 112 of the body 110. Particularly, at least one surface of the aforementioned detection space IS is a light-absorbing surface, which in this case includes the surface 121 of the connection structure ST1 facing the detection space IS and the partial top surface 112 of the body 110 adjacent to the connection structure ST1. The light-absorbing surface is, for example, an anodized black matte surface, which enables the light beam generated by the light source 142 to effectively avoid interference from external environmental light when passing through the detection space IS.

[0026] As Figure 2 , Figure 3 shown, the body 110 has an opening 111 within the range of the partial top surface 112. The light beam generated by the light source 142 enters the detection space IS through the opening 111 and travels along the edge of the wafer 200 as Figure 3 shown. In this way, as the wafer 200 is driven by the stage 130 to rotate about the rotation axis C1, the edge of the wafer 200 will continuously pass through the detection space IS, and the image acquirer 141 can continuously acquire images of the wafer 200 at its edge until the notch 210 of the wafer 200 is detected (as Figure 3 shown, the light flux passing through the notch 210 is significantly different from that at non-notch locations). After that, the control module CM can further drive the stage 130 to rotate and move the wafer 200 to a specific position to facilitate subsequent wafer processing operations.

[0027] Precisely because Figure 2 , Figure 3 shown, the surface 121 and the partial top surface 112 are both light-absorbing surfaces, so external environmental light can be effectively blocked outside the Figure 3 shown optical path to ensure that the light beam projected from the opening 111 can smoothly pass through the wafer 200 and then enter the detection structure ST2 and be received by the image acquirer 141. Additionally, as Figure 2 shown, the partial top surface 112 of the body 110 is substantially the orthographic projection surface of the detection structure ST2 corresponding to the body 110, enabling it to smoothly surround the opening 111 through which the light beam passes.

[0028] In summary, in the above embodiments of the present utility model, the wafer positioning device forms a detection space with the bracket and the body. When the wafer is driven to rotate by the loading platform, its edge can pass through the detection space, so that the optical module continuously detects the wafer passing through the detection space, for the control module to determine the location of the notch of the wafer and complete the required positioning. After that, the control module rotates and moves the wafer to a specific position through the platform to facilitate subsequent wafer processing processes.

[0029] More importantly, at least one surface of the body and the bracket forming the detection space is a light absorption surface, and includes the surface of the connection structure facing the detection space and a partial top surface of the body. The body further has an opening for the beam to pass through, and the opening is substantially surrounded by the light absorption surface. In other words, the light absorption surface substantially exists in the peripheral structure of the detection space to prevent the external environmental light from being reflected or refracted through the detection space after being projected onto the peripheral structure and affecting the propagation of the beam generated by the light source. Therefore, when the light generated by the light source of the optical module passes through the detection space, it can be free from the interference of the external environmental light, so that the image acquirer of the optical module can smoothly acquire the image of the wafer at its edge, thereby improving the discrimination accuracy.

[0030] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present utility model and are not intended to limit them. Although the present utility model has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present utility model.

Claims

1. A wafer positioning device, characterized in that: include: ontology; A carrier, movably disposed on the body; A support, erected on the body and partially suspended above the body, so that the support and the body form a detection space, a wafer is carried on the stage and driven by the stage to rotate relative to the body, and an edge of the wafer passes through the detection space, wherein at least one surface of the detection space formed by the support and the body is a light absorbing surface; An optical module, comprising a light source and an image acquirer, wherein the light source is disposed in the body, and the image acquirer is disposed in the bracket; as well as A control module is electrically connected to the carrier and the optical module, wherein the control module drives the light source to project a light beam, and the light beam sequentially passes through the body and the detection space and is projected into the bracket and received by the image acquirer to detect the edge of the wafer.

2. The wafer positioning device according to claim 1, characterized in that: The bracket has a connecting structure and a detection structure, the connecting structure is connected between the detection structure and the body, the detection structure is suspended above the body, the image acquirer is located in the detection structure, and the at least one surface includes a surface of the connecting structure facing the detection space.

3. The wafer positioning device according to claim 2, characterized in that: The detection structure has a detection surface exposed to the detection space and facing the body, and the surface of the connection structure facing the detection space is adjacent to the detection surface and the body.

4. The wafer positioning device according to claim 1, characterized in that: The bracket has a connecting structure and a detection structure, the connecting structure is connected between the detection structure and the body, the detection structure is suspended above the body, the image acquirer is located in the detection structure, and the at least one surface includes a partial top surface of the body adjacent to the connecting structure.

5. The wafer positioning device according to claim 4, characterized in that: The local top surface is the orthographic projection surface of the detection structure corresponding to the main body.

6. The wafer positioning device according to claim 4, characterized in that: The main body has an opening located within the range of the local top surface, and the light beam projected by the light source enters the detection space through the opening.

7. The wafer positioning device according to claim 6, characterized in that: The detection structure has a detection surface exposed in the detection space and facing the partial top surface, and the connection structure is adjacent to the partial top surface and the detection surface.

8. The wafer positioning device according to claim 1, characterized in that: The bracket has a connecting structure and a detection structure, the connecting structure is connected between the detection structure and the main body, the detection structure is suspended above the main body, the image acquirer is located in the detection structure, and the at least one surface includes a surface of the connecting structure exposed to the detection space and a partial top surface of the main body.

9. The wafer positioning device according to claim 8, characterized in that: The detection structure has a detection surface exposed in the detection space and facing the partial top surface, and the surface of the connection structure exposed in the detection space is adjacent to the partial top surface and the detection surface.

10. The wafer positioning device according to claim 1, characterized in that: The light absorbing surface is a black matte surface treated with anodizing.

11. The wafer positioning device according to claim 1, characterized in that: The carrier includes a planar moving platform and a rotating platform, which are electrically connected to the control module respectively. The rotating platform is arranged on the planar moving platform. The planar moving platform moves in a planar manner on the body, and the rotating platform rotates along the normal of the plane.

12. The wafer positioning device according to claim 11, characterized in that: The carrier also includes an adsorption unit electrically connected to the control module and structurally connected to the rotating platform. The control module drives the adsorption unit to adsorb and fix the wafer on the rotating platform.

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