Three-dimensional multilayer ceramic carrier plate

Abstract

The utility model relates to a three-dimensional multilayer ceramic carrier plate, which relates to the technical field of semiconductors and comprises a substrate plate, an adapter plate is arranged above the substrate plate, shielding plates are arranged on two sides of the adapter plate, conducting hole channels are arranged on the adapter plate and the shielding plates, positioning columns are arranged between the adapter plate and the shielding plates, and the positioning columns are arranged on the substrate plate. One end of the positioning column is fixedly connected with the adapter plate, the other end of the positioning column is provided with an identification layer, a positioning sleeve penetrates through the center of the shielding plate, and the positioning column is inserted into the positioning sleeve. The production cost of the ceramic carrier plate is reduced, and the mounting quality of the adapter plate and the shielding plate is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a three-dimensional multi-layer ceramic carrier. Background Art

[0002] 3D packaging is the most mature integration category in the industry. It mainly stacks bare chips or individually packaged chips together through packaging. Glass through-hole technology is mainly filled through metallization, and copper is used as the filling material.

[0003] In the related art, a Chinese patent with authorization announcement number CN115332222A provides a TGV adapter board 3D packaging structure, which includes a substrate layer, two TGV adapter boards stacked on the substrate layer and spaced apart, conductive layers on both sides of the TGV adapter board, a shielding plate is provided on the side of the conductive layer away from the TGV adapter board, the shielding plate includes a ceramic base layer, an EBG structure layer and a transfer conductive layer, a matrix support body is provided on the side of the ceramic base layer facing the TGV adapter board, the EBG structure layer is provided on the side of the ceramic base layer away from the TGV adapter board, the transfer conductive layer is provided on the side of the EBG structure layer away from the ceramic base layer, and the TGV adapter board and the ceramic base layer are respectively provided with conductive channels filled with copper. The ceramic base layer is used to achieve stable combination with the TGV adapter board, and has the characteristics of reliable structural reinforcement and stable composite conduction, and is easy to realize 3D packaging stacking construction, and the structure is also relatively compact.

[0004] In the process of implementing the present application, the inventors found that there are at least the following problems in this technology: the TGV adapter board and the ceramic base layer are filled and packaged together by insulating glue, etc. When the TGV adapter board and the ceramic base layer are packaged together, the conductive channels on the TGV adapter board and the ceramic base layer should correspond to each other, but in the process of packaging the TGV adapter board and the ceramic base layer, the conductive channels on the TGV adapter board and the ceramic base layer are easily misaligned, resulting in difficulty in improving the installation quality of the TGV adapter board and the ceramic base layer, and increasing the packaging cost of the TGV adapter board and the ceramic base layer. Utility Model Content

[0005] In order to reduce the production cost of ceramic carrier boards and improve the installation quality of adapter boards and shielding boards, the present application provides a three-dimensional multi-layer ceramic carrier board.

[0006] The present application provides a three-dimensional multi-layer ceramic carrier adopts the following technical solution:

[0007] A three-dimensional multi-layer ceramic carrier board, comprising a base board, a transfer board is arranged above the base board, shielding boards are arranged on both sides of the transfer board, via holes are formed on both the transfer board and the shielding boards, positioning columns are arranged between the transfer board and the shielding boards, one end of the positioning column is fixedly connected to the transfer board, an identification layer is arranged at the other end of the positioning column, a positioning sleeve is arranged through the center of the shielding board, and the positioning column is inserted into the positioning sleeve.

[0008] By adopting the above technical solution, when the transfer board and the shielding board are stacked together for encapsulation, if the via holes on the transfer board and the shielding board correspond to each other, the positioning column is inserted into the positioning sleeve. At this time, the operator can detect the identification layer on the shielding board, proving that the transfer board and the shielding board are installed in alignment. Then, the transfer board and the shielding board are encapsulated into one body. When the transfer board and the shielding board are stacked together in a misaligned manner, the positioning column is not inserted into the positioning sleeve. At this time, the operator cannot detect the identification layer on the shielding board, thus proving that the via holes on the transfer board and the shielding board do not correspond to each other. Then, the operator corrects the misaligned stacked transfer board and shielding board, reducing the situation of misaligned encapsulation of the transfer board and the shielding board, improving the installation quality of the transfer board and the shielding board, and reducing the production cost of the ceramic carrier board.

[0009] Preferably, the positioning column includes a guiding column and a supporting column, the identification layer is arranged at one end of the guiding column, the other end of the guiding column is fixedly connected to one end of the supporting column, the other end of the supporting column is fixedly connected to the transfer board, the positioning sleeve includes an upper sleeve and a lower sleeve, one end of the upper sleeve penetrates through the shielding board, the other end of the upper sleeve communicates with the lower sleeve, the guiding column is inserted into the upper sleeve, and the guiding column and the supporting column are inserted into the lower sleeve.

[0010] By adopting the above technical solution, if the guiding column is first inserted into the upper sleeve, the guiding column and the supporting column are restricted by the upper sleeve, making the transfer board and the shielding board unable to approach each other continuously. At this time, the shielding board and the transfer board are incorrectly installed. If the guiding column is first inserted into the lower sleeve, the transfer board and the shielding board continue to approach each other, and then the guiding column continues to be inserted into the upper sleeve, making the supporting column inserted into the lower sleeve until the lower sleeve abuts against the transfer board. At this time, the shielding board and the transfer board are correctly installed together, thus reducing the situation of the shielding board and the transfer board being installed in the reverse direction and improving the installation quality of the transfer board and the shielding board.

[0011] Preferably, the guiding column is frustum-shaped, and the inner wall of the upper sleeve is used to fit with the outer wall of the guiding column.

[0012] By adopting the above technical solution, after the lower sleeve abuts against the transfer board, the inner wall of the upper sleeve fits with the outer wall of the guiding column, reducing the situation of horizontal shaking between the transfer board and the shielding board and improving the installation quality of the transfer board and the shielding board.

[0013] Preferably, the end diameter of the guiding column near the identification layer is smaller than the end diameter of the guiding column near the supporting column.

[0014] By adopting the above technical solution, when the adapter plate and the shielding plate approach each other, since the end diameter of the guiding column near the shielding plate is smaller than the end diameter of the guiding column near the adapter plate, it is convenient for the guiding column to be inserted into the upper sleeve and the lower sleeve, thus facilitating the installation of the adapter plate and the shielding plate.

[0015] Preferably, the supporting column is in the shape of a triangular prism, and the inner wall of the lower sleeve is used to fit with the outer wall of the supporting column.

[0016] By adopting the above technical solution, after the lower sleeve is attached to the adapter plate, the inner wall of the lower sleeve fits with the outer wall of the supporting column, reducing the relative rotation between the adapter plate and the shielding plate and improving the installation quality of the adapter plate and the shielding plate.

[0017] Preferably, a clamping rubber sleeve is fixedly arranged in the lower sleeve, a clamping ring groove is formed on the side wall of the supporting column, the clamping ring groove penetrates through the end of the supporting column far from the adapter plate, the clamping ring groove is for the clamping rubber sleeve to be inserted, and the end of the guiding column near the supporting column is used to abut against the clamping rubber sleeve in the clamping ring groove.

[0018] By adopting the above technical solution, when the adapter plate and the shielding plate approach each other, the guiding column first squeezes the clamping rubber sleeve to deform. When the guiding column is completely inserted into the upper sleeve, the clamping rubber sleeve returns to its original shape and is clamped in the clamping ring groove. At this time, both the inner wall of the clamping ring groove and the end wall of the guiding column near the supporting column are in contact with the outer wall of the clamping rubber sleeve, thereby making it difficult for the adapter plate and the shielding plate to move relative to each other in the height direction and improving the installation quality of the adapter plate and the shielding plate.

[0019] Preferably, a plurality of auxiliary columns are fixedly arranged on both sides of the adapter plate, a plurality of auxiliary grooves are formed on the side of the shielding plate facing the adapter plate, and the end of the auxiliary column far from the adapter plate is inserted into the auxiliary groove.

[0020] By adopting the above technical solution, when the positioning column is inserted into the positioning sleeve, the auxiliary column is inserted into the auxiliary groove, and the auxiliary column forms a filling gap between the adapter plate and the shielding plate, facilitating the filling and encapsulation of the adapter plate and the shielding plate with insulating glue.

[0021] Preferably, a support block is sleeved on the auxiliary column, the support block is fixedly connected to the auxiliary column, one side of the support block is used to abut against the adapter plate, and the other side of the support block is used to abut against the shielding plate.

[0022] By adopting the above technical solution, the support block increases the contact area between the adapter plate and the shielding plate, thereby improving the connection stability between the adapter plate and the shielding plate.

[0023] In summary, the present application includes at least one of the following beneficial technical effects:

[0024] 1. By providing a lining plate, an adapter plate, a shielding plate, a via channel, positioning posts, an identification layer, and a positioning sleeve, the situation of misaligned encapsulation between the adapter plate and the shielding plate is reduced, the installation quality of the adapter plate and the shielding plate is improved, and the production cost of the ceramic carrier board is reduced;

[0025] 2. By providing guide posts, support posts, an upper sleeve, a lower sleeve, a clamping rubber sleeve, and a clamping ring groove, the installation quality of the adapter plate and the shielding plate is improved;

[0026] 3. By providing auxiliary posts, auxiliary grooves, and support blocks, it is convenient for the adapter plate and the shielding plate to be filled and encapsulated with insulating glue. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 FIG. is a schematic structural diagram of a three-dimensional multi-layer ceramic carrier board in an embodiment of the present application.

[0028] Figure 2 FIG. is a cross-sectional view showing the connection relationship between the adapter plate and the shielding plate in an embodiment of the present application.

[0029] Figure 3 FIG. is Figure 2 an enlarged view of part A in FIG.

[0030] Figure 4 FIG. is a schematic diagram showing the positional relationship between the guide post and the support post in an embodiment of the present application.

[0031] Figure 5 FIG. is a schematic diagram showing the positional relationship between the upper sleeve and the lower sleeve in an embodiment of the present application.

[0032] Description of the reference numerals: 1, lining plate; 2, adapter plate; 21, glass substrate; 22, first conductive layer; 3, shielding plate; 31, ceramic base layer; 32, second conductive layer; 4, via channel; 5, positioning post; 51, guide post; 52, support post; 6, positioning sleeve; 61, upper sleeve; 62, lower sleeve; 7, clamping rubber sleeve; 71, clamping ring groove; 8, auxiliary post; 81, auxiliary groove; 82, support block; 9, identification layer. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0033] The following further describes the present application in detail with reference to the Figures 1-5 accompanying drawings.

[0034] An embodiment of the present application discloses a three-dimensional multi-layer ceramic carrier board. Refer to Figures 1 to 5, including a lining board 1, and a plurality of adapter boards 2 are installed above the lining board 1. The adapter board 2 includes a glass substrate 21 and a first conductive layer 22 provided on both sides of the glass substrate 21. Shielding plates 3 are provided on both sides of the adapter board 2. The shielding plate 3 includes a ceramic base layer 31 and a second conductive layer 32. One side of the ceramic base layer 31 faces one side of the adapter board 2, and the second conductive layer 32 is provided on the other side of the ceramic base layer 31. A plurality of via channels 4 are opened on both the glass substrate 21 and the ceramic base layer 31, and copper is filled inside the via channels 4. A positioning post 5 is installed between the adapter board 2 and the shielding plate 3. One end of the positioning post 5 is fixedly installed on the side surface of the adapter board 2, and a dye is sprayed on the other end of the positioning post 5 to form an identification layer 9. A positioning sleeve 6 is installed through the center of the shielding plate 3, and the positioning post 5 is inserted into the positioning sleeve 6. When the adapter board 2 and the shielding plate 3 are stacked together for encapsulation, if the via channels 4 on the adapter board 2 and the shielding plate 3 correspond to each other, the positioning post 5 is inserted into the positioning sleeve 6. At this time, the operator can detect the identification layer 9 on the shielding plate 3, proving that the adapter board 2 and the shielding plate 3 are installed in alignment, and then the adapter board 2 and the shielding plate 3 are encapsulated into one body. When the adapter board 2 and the shielding plate 3 are stacked together in a misaligned manner, the positioning post 5 is not inserted into the positioning sleeve 6. At this time, the operator cannot detect the identification layer 9 on the shielding plate 3, thus proving that the via channels 4 on the adapter board 2 and the shielding plate 3 do not correspond to each other. Then, the operator corrects the misaligned stacked adapter board 2 and shielding plate 3. The situation of misaligned encapsulation between the adapter board 2 and the shielding plate 3 is reduced, the installation quality of the adapter board 2 and the shielding plate 3 is improved, and the production cost of the ceramic carrier board is reduced.

[0035] In order to improve the installation quality of the adapter board 2 and the shielding plate 3, referring to Figures 1 to 5, the positioning post 5 includes a guiding post 51 and a supporting post 52. The identification layer 9 is located at one end of the guiding post 51. The other end of the guiding post 51 is integrally formed with one end of the supporting post 52. The other end of the supporting post 52 is installed on the side of the adapter plate 2. The positioning sleeve 6 includes an upper sleeve 61 and a lower sleeve 62. One end of the upper sleeve 61 penetrates through the shielding plate 3, and the other end of the upper sleeve 61 communicates with the lower sleeve 62. The upper sleeve 61 is for the guiding post 51 to be inserted, and the lower sleeve 62 is for the guiding post 51 and the supporting post 52 to be inserted. When the adapter plate 2 and the shielding plate 3 approach each other, if the second conductive layer 32 on the shielding plate 3 faces the first conductive layer 22 on the adapter plate 2, the shielding plate 3 and the adapter plate 2 are misinstalled. At this time, the guiding post 51 is first inserted into the upper sleeve 61, and the guiding post 51 and the supporting post 52 are restricted by the upper sleeve 61, so that the adapter plate 2 and the shielding plate 3 cannot continue to approach each other, and thus the adapter plate 2 and the shielding plate 3 cannot be installed together. When the adapter plate 2 and the shielding plate 3 approach each other, if the ceramic base layer 31 on the shielding plate 3 faces the first conductive layer 22 on the adapter plate 2, the shielding plate 3 and the adapter plate 2 are correctly installed. At this time, the guiding post 51 is first inserted into the lower sleeve 62 to make the adapter plate 2 and the shielding plate 3 continue to approach each other, and then the guiding post 51 continues to be inserted into the upper sleeve 61 to make the supporting post 52 inserted into the lower sleeve 62 until the lower sleeve 62 abuts against the adapter plate 2, and thus the adapter plate 2 and the shielding plate 3 are installed together. The situation where the shielding plate 3 is reversely installed on the adapter plate 2 is reduced, and the installation quality of the adapter plate 2 and the shielding plate 3 is improved.

[0036] Refer to Figures 2 to 5 , the guiding post 51 is frustum-shaped, the end diameter of the guiding post 51 near the identification layer 9 is smaller than the end diameter of the guiding post 51 near the supporting post 52, and the inner wall of the lower sleeve 62 is used to fit with the outer wall of the supporting post 52. The supporting post 52 is triangular prism-shaped, and the inner wall of the lower sleeve 62 is used to fit with the outer wall of the supporting post 52. Since the end diameter of the guiding post 51 near the shielding plate 3 is smaller than the end diameter of the guiding post 51 near the adapter plate 2, it is convenient for the guiding post 51 to be inserted into the upper sleeve 61 and the lower sleeve 62, thus facilitating the installation of the adapter plate 2 and the shielding plate 3. After the lower sleeve 62 fits with the adapter plate 2, the inner wall of the upper sleeve 61 fits with the outer wall of the guiding post 51, reducing the situation of horizontal shaking between the adapter plate 2 and the shielding plate 3; the inner wall of the lower sleeve 62 fits with the outer wall of the supporting post 52, reducing the situation of relative rotation between the adapter plate 2 and the shielding plate 3, and improving the installation quality of the adapter plate 2 and the shielding plate 3.

[0037] Refer to Figures 2 to 5, a clamping ring groove 71 is formed in the side wall of the support column 52, and the clamping ring groove 71 penetrates through one end of the support column 52 away from the adapter plate 2. A clamping rubber sleeve 7 is installed in the lower sleeve 62, the clamping ring groove 71 is for the clamping rubber sleeve 7 to be inserted, and one end of the guide post 51 close to the support column 52 is used to abut against the clamping rubber sleeve 7 in the clamping ring groove 71. When the adapter plate 2 and the shielding plate 3 approach each other, the guide post 51 first squeezes the clamping rubber sleeve 7 to deform. When the guide post 51 is completely inserted into the upper sleeve 61, the clamping rubber sleeve 7 returns to its original shape and is clamped in the clamping ring groove 71. At this time, the inner wall of the clamping ring groove 71 and the end wall of one end of the guide post 51 close to the support column 52 are both in contact with the outer wall of the clamping rubber sleeve 7, thereby making it difficult for the adapter plate 2 and the shielding plate 3 to move relative to each other in the height direction, and improving the installation quality of the adapter plate 2 and the shielding plate 3.

[0038] To facilitate the filling and encapsulation of the adapter plate 2 and the shielding plate 3 with insulating glue, referring to Figure 1 and Figure 2 , a number of auxiliary columns 8 are installed on both sides of the adapter plate 2, and a number of auxiliary grooves 81 are formed on the side of the shielding plate 3 facing the adapter plate 2. The auxiliary grooves 81 are for the ends of the auxiliary columns 8 away from the adapter plate 2 to be inserted. A support block 82 is sleeved on the auxiliary column 8, and the support block 82 is fixedly connected to the auxiliary column 8. One side of the support block 82 is used to abut against the adapter plate 2, and the other side of the support block 82 is used to abut against the shielding plate 3. The support block 82 increases the contact area between the adapter plate 2 and the shielding plate 3, thereby improving the connection stability between the adapter plate 2 and the shielding plate 3. When the positioning post 5 is inserted into the positioning sleeve 6, the auxiliary column 8 is inserted into the auxiliary groove 81, and the auxiliary column 8 forms a filling gap between the adapter plate 2 and the shielding plate 3, facilitating the filling and encapsulation of the adapter plate 2 and the shielding plate 3 with insulating glue.

[0039] The implementation principle of a three-dimensional multi-layer ceramic carrier board in an embodiment of this application is as follows: When encapsulating the adapter board 2 and the shielding board 3, the ceramic base layer 31 on the shielding board 3 faces the first conductive layer 22 on the adapter board 2, and then the adapter board 2 and the shielding board 3 are brought closer to each other. The guiding column 51 is inserted into the upper sleeve 61, and the supporting column 52 is inserted into the lower sleeve 62 until the lower sleeve 62 abuts against the adapter board 2. After the lower sleeve 62 fits with the adapter board 2, the inner wall of the upper sleeve 61 fits with the outer wall of the guiding column 51, and the inner wall of the lower sleeve 62 fits with the outer wall of the supporting column 52. The clamping rubber sleeve 7 is clamped between the clamping ring groove 71 and the guiding column 51, so that the adapter board 2 and the shielding board 3 are not prone to relative movement. Before the adapter board 2 and the shielding board 3 are encapsulated, the effect of pre-connecting the adapter board 2 and the shielding board 3 is achieved, reducing the misalignment of the adapter board 2 and the shielding board 3 during the encapsulation process, and improving the installation quality of the adapter board 2 and the shielding board 3. After the adapter board 2 and the shielding board 3 are connected together, if the operator can detect the identification layer 9 on the shielding board 3, it means that the via holes 4 on the adapter board 2 and the shielding board 3 correspond to each other, proving that the adapter board 2 and the shielding board 3 are installed in alignment. Then, the adapter board 2 and the shielding board 3 installed in alignment are encapsulated into one body. If the adapter board 2 and the shielding board 3 are stacked in a misaligned manner, the positioning column 5 is not inserted into the positioning sleeve 6. At this time, the operator cannot detect the identification layer 9 on the shielding board 3, thus proving that the via holes 4 on the adapter board 2 and the shielding board 3 do not correspond to each other. Then, the operator corrects the misaligned stacked adapter board 2 and shielding board 3. Thus, the situation of misaligned encapsulation of the adapter board 2 and the shielding board 3 is reduced, and the production cost of the ceramic carrier board is lowered.

[0040] The above are all the preferred embodiments of this application, and the protection scope of this application is not limited accordingly. Therefore, all equivalent changes made according to the structure, shape, and principle of this application should be covered within the protection scope of this application.

Claims

1. A three-dimensional multilayer ceramic carrier, comprising a substrate plate (1), a transfer plate (2) arranged above the substrate plate (1), shielding plates (3) arranged on both sides of the transfer plate (2), and conductive channels (4) being provided on the transfer plate (2) and the shielding plate (3), characterized in that: A positioning column (5) is arranged between the adapter plate (2) and the shielding plate (3); one end of the positioning column (5) is fixedly connected to the adapter plate (2); the other end of the positioning column (5) is provided with a marking layer (9); a positioning sleeve (6) is arranged through the center of the shielding plate (3); and the positioning sleeve (6) is provided for the positioning column (5) to be inserted.

2. A three-dimensional multi-layer ceramic carrier according to claim 1, characterized in that: The positioning column (5) comprises a guide column (51) and a support column (52); the identification layer (9) is arranged at one end of the guide column (51); the other end of the guide column (51) is fixedly connected to one end of the support column (52); the other end of the support column (52) is fixedly connected to the adapter plate (2); the positioning sleeve (6) comprises an upper sleeve (61) and a lower sleeve (62); one end of the upper sleeve (61) passes through the shielding plate (3); the other end of the upper sleeve (61) is connected to the lower sleeve (62); the upper sleeve (61) is for the guide column (51) to be inserted; the lower sleeve (62) is for the guide column (51) and the support column (52) to be inserted.

3. A three-dimensional multi-layer ceramic carrier according to claim 2, characterized in that: The guide column (51) is of a truncated cone shape, and the inner wall of the upper sleeve (61) is used to fit with the outer wall of the guide column (51).

4. The three-dimensional multi-layer ceramic carrier according to claim 3, characterized in that: The end diameter of the guide column (51) close to the marking layer (9) is smaller than the end diameter of the guide column (51) close to the support column (52).

5. The three-dimensional multi-layer ceramic carrier according to claim 2, characterized in that: The support column (52) is a triangular column shape, and the inner wall of the lower sleeve (62) is used to fit with the outer wall of the support column (52).

6. The three-dimensional multi-layer ceramic carrier according to claim 2, characterized in that: A snap-fit ​​rubber sleeve (7) is fixedly arranged in the lower sleeve (62), and a snap-fit ​​ring groove (71) is provided on the side wall of the support column (52). The snap-fit ​​ring groove (71) passes through the end of the support column (52) away from the adapter plate (2), and the snap-fit ​​ring groove (71) is used for inserting the snap-fit ​​rubber sleeve (7). The end of the guide column (51) close to the support column (52) is used to abut against the snap-fit ​​rubber sleeve (7) in the snap-fit ​​ring groove (71).

7. The three-dimensional multi-layer ceramic carrier according to claim 1, characterized in that: A plurality of auxiliary columns (8) are fixedly arranged on both sides of the adapter plate (2), and a plurality of auxiliary grooves (81) are provided on the shielding plate (3) on the side facing the adapter plate (2), wherein the auxiliary columns (8) are inserted into the auxiliary grooves (81) at one end away from the adapter plate (2).

8. The three-dimensional multi-layer ceramic carrier according to claim 7, characterized in that: A support block (82) is sleeved on the auxiliary column (8), the support block (82) is fixedly connected to the auxiliary column (8), one side of the support block (82) is used to abut against the adapter plate (2), and the other side of the support block (82) is used to abut against the shielding plate (3).

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