Integrated circuit display chip convenient to install and position

Abstract

The utility model discloses an integrated circuit display chip convenient to install and position, which relates to the technical field of integrated circuit chips and comprises an integrated circuit chip and a positioning bolt, and a base is arranged on the outer side of the integrated circuit chip. According to the integrated circuit display chip convenient to install and position, the base can be installed inside a display through the positioning bolt, so that the threaded part is in threaded connection with the display, the positioning bolt is connected with the base into a whole, bolts do not need to be additionally carried, and then the butt joint block of the integrated circuit chip is clamped into the butt joint groove; then the outer sides of the first butt joint rod and the second butt joint rod are sleeved with inserting holes of a baffle, so that the baffle blocks the outer side of the butt joint block, then the outer side of the second butt joint rod is sleeved with a fastening ring, the fastening ring and the second butt joint rod are in threaded connection, and the baffle can limit the position of the butt joint block; the integrated circuit chip can be conveniently and rapidly installed, positioned and disassembled, and the convenience of the integrated circuit display chip is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuit chips, in particular to an integrated circuit display chip convenient for installation and positioning. Background Technique

[0002] A display is an important output device for displaying images and texts in computers and other electronic devices. They come in a wide variety of types, mainly classified according to display technology, uses, and performance characteristics. An integrated circuit display chip is installed in the display. The integrated circuit display chip is a special integrated circuit used to drive and control various types of displays, such as liquid crystal displays, organic light-emitting diode displays, electronic ink displays, etc. They play a crucial role in modern electronic devices, responsible for converting digital signals into electrical signals suitable for the display to display images and texts on the screen.

[0003] However, the existing integrated circuit display chips have the following disadvantages. The integrated circuit display chips are usually installed inside the display through bolts, but the bolts are generally separated from the integrated circuit display chips. Bolts need to be carried during installation, and the bolts are easy to lose. Moreover, when installing, positioning, and disassembling the integrated circuit display chips, multiple bolts need to be disassembled, which is time-consuming. Therefore, the current integrated circuit display chips need to be improved. Content of the Utility Model

[0004] The purpose of the utility model is to provide an integrated circuit display chip convenient for installation and positioning, so as to solve the problems in the above background technique that the existing integrated circuit display chips in the current market are usually installed inside the display through bolts, bolts need to be carried during installation, the bolts are easy to lose, and when installing, positioning, and disassembling the integrated circuit display chips, multiple bolts need to be disassembled.

[0005] To achieve the above purpose, the utility model provides the following technical solution: An integrated circuit display chip convenient for installation and positioning, including an integrated circuit chip and positioning bolts. A base is arranged on the outer side of the integrated circuit chip. The positioning bolts slide through both ends of the base. A sliding groove is opened on the inner side of the base close to the positioning bolts, and the positioning bolts are slidably connected to the sliding groove. Docking blocks are connected to both ends of the integrated circuit chip. An installation mechanism is arranged above the base and the docking blocks. A jack is opened inside the installation mechanism. Clamping blocks are connected to both ends of the installation mechanism. The installation mechanism includes a first docking rod, a baffle, a second docking rod, and a fastening ring. The first docking rod is connected above the docking block.

[0006] Preferably, the second docking rod is connected above the base, and the first docking rod and the second docking rod are sleeved in the jack.

[0007] Preferably, a baffle is provided outside the jack, and the baffle is located above the docking block and the base, and a fastening ring is threadedly sleeved outside the second docking rod.

[0008] Preferably, one end of the positioning bolt is provided with a threaded portion, a docking groove is opened inside the base near the docking block, both ends of the baffle are connected to the clamping blocks, and a clamping groove is opened above the base near the clamping blocks.

[0009] Preferably, a heat dissipation mechanism is installed inside the base near the lower side of the integrated circuit chip. Both ends of the integrated circuit chip away from the docking block are connected with mounting blocks, and mounting grooves are opened above the base near the mounting blocks.

[0010] Preferably, the heat dissipation mechanism includes a heat conduction mesh plate, through holes and heat conduction fins. The heat conduction mesh plate is arranged inside the base near the lower side of the integrated circuit chip.

[0011] Preferably, heat conduction fins are arranged at equal intervals above the heat conduction mesh plate, and through holes are arranged at equal intervals through the bottom end of the base.

[0012] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0013] 1. There are a positioning bolt and an installation mechanism. The base can be installed inside the display through the positioning bolt, so that the threaded portion is threadedly connected with the display. And the positioning bolt slides downward in the sliding groove. The positioning bolt and the base are integrated, without the need to carry bolts additionally. Then, the docking block of the integrated circuit chip is snapped into the docking groove, and at the same time, the mounting block is snapped into the mounting groove. Subsequently, the jack of the baffle is sleeved outside the first docking rod and the second docking rod, so that the baffle blocks outside the docking block. Then, the fastening ring is sleeved outside the second docking rod, and threaded connection is carried out between the fastening ring and the second docking rod, which can limit the position of the docking block by the baffle, install the integrated circuit chip on the base, facilitate the quick installation positioning and disassembly of the integrated circuit chip, and improve the convenience of the integrated circuit display chip.

[0014] 2. There is a heat dissipation mechanism. When the integrated circuit chip is running, the heat can be absorbed by the heat conduction fins arranged at equal intervals, and the heat is guided to the heat conduction mesh plate, and finally the heat is dissipated through the through holes. And the materials of the heat conduction mesh plate and the heat conduction fins are both copper, which improves the heat dissipation efficiency and prolongs the service life of the integrated circuit display chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is the front view structural schematic diagram of the present utility model;

[0016] Figure 2 is the front view sectional structural schematic diagram of the present utility model;

[0017] Figure 3 Schematic top view structure diagram of the docking block of the present utility model;

[0018] Figure 4 Schematic top view structure diagram of the present utility model;

[0019] Figure 5 Schematic top view structure diagram of the heat conducting sheet of the present utility model;

[0020] Figure 6 Schematic three-dimensional structure diagram of the baffle of the present utility model;

[0021] Figure 7 Schematic three-dimensional structure diagram of the fastening ring of the present utility model.

[0022] In the figure: 1, integrated circuit chip; 2, base; 3, positioning bolt; 4, chute; 5, threaded part; 6, heat dissipation mechanism; 601, heat conducting mesh plate; 602, through hole; 603, heat conducting sheet; 7, docking block; 8, installation mechanism; 801, first docking rod; 802, baffle; 803, second docking rod; 804, fastening ring; 9, docking groove; 10, installation groove; 11, installation block; 12, card slot; 13, card block; 14, jack. Specific implementation manner

[0023] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without making creative efforts shall fall within the protection scope of the present utility model.

[0024] Please refer to Figures 1 - 5 , the present utility model provides a technical solution: an integrated circuit display chip that is convenient for installation and positioning, including an integrated circuit chip 1 and a positioning bolt 3. A base 2 is provided outside the integrated circuit chip 1. The positioning bolt 3 slidably penetrates through both ends of the base 2. A heat dissipation mechanism 6 is installed inside the base 2 near the lower side of the integrated circuit chip 1. The heat dissipation mechanism 6 includes a heat conducting mesh plate 601, through holes 602, and a heat conducting sheet 603. A heat conducting mesh plate 601 is provided inside the base 2 near the lower side of the integrated circuit chip 1. Heat conducting sheets 603 are arranged at equal intervals above the heat conducting mesh plate 601. Through holes 602 are arranged at equal intervals through the bottom end of the base 2. One end of the positioning bolt 3 is provided with a threaded part 5. The heat conducting mesh plate 601 and the heat conducting sheet 603 are made of copper.

[0025] In specific implementation, since an integrated circuit display chip is usually directly installed inside the display and there is no heat dissipation structure installed at the bottom of the integrated circuit display chip again, the heat at the bottom of the integrated circuit display chip is relatively high. Heat can be absorbed by heat conduction fins 603 distributed at equal intervals, and the heat is diverted into the heat conduction mesh plate 601. Finally, the heat is dissipated through the through holes 602, improving the heat dissipation efficiency and extending the service life of the integrated circuit display chip.

[0026] Please refer to Figures 1 - 4 , Figure 6 and Figure 7 , a chute 4 is provided inside the base 2 near the positioning bolt 3, and the positioning bolt 3 is slidably connected to the chute 4. Both ends of the integrated circuit chip 1 are connected with docking blocks 7. An installation mechanism 8 is provided above the base 2 and the docking blocks 7. A socket 14 is provided inside the installation mechanism 8. Both ends of the installation mechanism 8 are connected with clamping blocks 13. The installation mechanism 8 includes a first docking rod 801, a baffle 802, a second docking rod 803 and a fastening ring 804. The first docking rod 801 is connected above the docking block 7, and the second docking rod 803 is connected above the base 2. The first docking rod 801 and the second docking rod 803 are sleeved in the socket 14. A baffle 802 is provided outside the socket 14, and the baffle 802 is located above the docking block 7 and the base 2. The fastening ring 804 is threadedly sleeved outside the second docking rod 803. A docking groove 9 is provided inside the base 2 near the docking block 7. Both ends of the baffle 802 are connected with the clamping blocks 13. A clamping groove 12 is provided above the base 2 near the clamping blocks 13. Both ends of the integrated circuit chip 1 away from the docking block 7 are connected with installation blocks 11. An installation groove 10 is provided above the base 2 near the installation blocks 11. The cross-sectional shapes of the docking block 7 and the docking groove 9 are both "T" shaped.

[0027] In specific implementation, an integrated circuit display chip is usually installed inside the display through bolts. However, the bolts are generally separated from the integrated circuit display chip, and bolts need to be carried during installation, which are prone to loss. Moreover, when installing, positioning, and disassembling the integrated circuit display chip, multiple bolts need to be disassembled, which is time-consuming. When installing the integrated circuit display chip, the base 2 can be installed inside the display through the positioning bolt 3, so that the threaded portion 5 is threadedly connected to the display. And the positioning bolt 3 slides downward in the chute 4. The positioning bolt 3 and the base 2 are integrated, without the need to carry bolts additionally. Then, the docking block 7 of the integrated circuit chip 1 is snapped into the docking groove 9, and at the same time, the mounting block 11 is snapped into the mounting groove 10. Subsequently, the insertion hole 14 of the baffle 802 is sleeved outside the first docking rod 801 and the second docking rod 803, so that the baffle 802 blocks outside the docking block 7. Then, the fastening ring 804 is sleeved outside the second docking rod 803, and a threaded connection is made between the fastening ring 804 and the second docking rod 803, which can limit the position of the docking block 7 by the baffle 802, and install the integrated circuit chip 1 on the base 2, facilitating the quick installation, positioning, and disassembly of the integrated circuit chip 1, and improving the convenience of the integrated circuit display chip.

[0028] Working principle: When using the integrated circuit display chip that is convenient for installation and positioning, first, the base 2 can be installed inside the display through the positioning bolt 3. Subsequently, the integrated circuit chip 1 is installed on the base 2 through the installation mechanism 8, the mounting block 11, and the mounting groove 10. During the operation of the integrated circuit chip 1, heat is quickly dissipated through the heat dissipation mechanism 6. The settings of the installation mechanism 8 and the heat dissipation mechanism 6 improve the installation convenience of the integrated circuit display chip and extend the service life at the same time. The content not described in detail in this specification belongs to the prior art well-known to those skilled in the art.

[0029] Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. An integrated circuit display chip that is easy to install and position, comprising an integrated circuit chip (1) and a positioning bolt (3), characterized in that: A base (2) is provided on the outer side of the integrated circuit chip (1), the positioning bolt (3) slides through the two ends of the base (2), a slide groove (4) is provided on the inner side of the base (2) close to the positioning bolt (3), and the positioning bolt (3) and the slide groove (4) are slidably connected, the two ends of the integrated circuit chip (1) are connected with docking blocks (7), a mounting mechanism (8) is provided above the base (2) and the docking block (7), a plug hole (14) is provided on the inner side of the mounting mechanism (8), and a clamping block (13) is connected at both ends of the mounting mechanism (8), and the mounting mechanism (8) comprises a No. 1 docking rod (801), a baffle (802), a No. 2 docking rod (803) and a fastening ring (804), and the No. 1 docking rod (801) is connected above the docking block (7).

2. The integrated circuit display chip that is easy to install and position according to claim 1, characterized in that: A second docking rod (803) is connected to the top of the base (2), and the first docking rod (801) and the second docking rod (803) are sleeved with the socket (14).

3. The integrated circuit display chip that is easy to install and position according to claim 2, characterized in that: A baffle (802) is provided on the outer side of the insertion hole (14), and the baffle (802) is located above the docking block (7) and the base (2). A fastening ring (804) is threadedly sleeved on the outer side of the No. 2 docking rod (803).

4. The integrated circuit display chip that is easy to install and position according to claim 3, characterized in that: One end of the positioning bolt (3) is provided with a threaded portion (5), the inner side of the base (2) close to the docking block (7) is provided with a docking groove (9), the two ends of the baffle (802) are connected to the clamping block (13), and the base (2) is provided with a clamping groove (12) above the clamping block (13).

5. The integrated circuit display chip that is easy to install and position according to claim 4, characterized in that: A heat dissipation mechanism (6) is installed on the inner side of the base (2) near the bottom of the integrated circuit chip (1), two ends of the integrated circuit chip (1) away from the docking block (7) are connected to mounting blocks (11), and a mounting groove (10) is provided on the upper side of the base (2) near the mounting block (11).

6. The integrated circuit display chip that is easy to install and position according to claim 5, characterized in that: The heat dissipation mechanism (6) comprises a heat-conducting mesh plate (601), a through hole (602) and a heat-conducting sheet (603); the heat-conducting mesh plate (601) is provided inside the base (2) close to the bottom of the integrated circuit chip (1).

7. The integrated circuit display chip that is easy to install and position according to claim 6, characterized in that: The heat-conducting mesh plate (601) is provided with heat-conducting sheets (603) distributed at equal intervals above the heat-conducting mesh plate (601), and the bottom end of the base (2) is penetrated by through holes (602) distributed at equal intervals.

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