Marking device for chip processing

Abstract

The utility model discloses a marking device for chip processing, and relates to the field of marking devices. The device comprises an operation table, a main conveying belt is arranged at the top of the operation table, a supporting frame is arranged on one side of the main conveying belt, a marking mechanism and a visual detection mechanism are arranged below the inner side of the supporting frame, a removing mechanism is arranged on one side of the supporting frame, and the removing mechanism comprises an installation frame. According to the utility model, through the material distribution mechanism, chips which are stacked or placed with wrong surfaces can slide onto the conveying belt through the second flow distribution groove, the conveying belt stably conveys the chips to the lifting belt, the lifting belt lifts the chips to the head end of the main conveying belt again, and the chips are conveyed to the main conveying belt through the second flow distribution groove. According to the utility model, the chip can be marked again, so that the convenience of the marking operation is remarkably improved, the labor cost is effectively reduced, and efficient and accurate chip processing is realized.

Description

Technical Field

[0001] The utility model relates to the field of marking devices, and specifically to a marking device for chip processing. Background Technique

[0002] A chip marking device is an advanced equipment using laser technology. It performs high-precision marking on chips through laser beams. The device consists of components such as a laser, an adjustment mechanism, and a marking seat, which can ensure the stability and accuracy of marking. It has a wide range of applications in fields such as the electronics manufacturing industry. It can quickly and accurately mark identification, traceability, and anti-counterfeiting information on chips. Compared with traditional marking methods, the chip laser marking device has advantages such as high precision, high efficiency, high flexibility, and strong durability. Therefore, it has become an indispensable important tool in modern production, providing strong support for product quality tracking, management, and anti-counterfeiting, and showing broad application prospects.

[0003] In the current chip marking process, in order to improve marking efficiency and accuracy, a machine vision system is equipped beside the marking device. This system is responsible for detecting the position and surface structure of the chips to be marked, and working in coordination with the rejection mechanism to promptly exclude chips that do not meet the processing standards. However, a problem is faced in actual operation: the rejected defective chips need to be re-collected and processed to meet the marking standards. Especially when the chips are stacked, or the non-marking surface of the chips faces the marking mechanism incorrectly, these chips will also be rejected. Subsequently, the operator needs to manually carry and re-adjust these chips for re-marking, which significantly reduces the convenience of using the marking device. Content of the Utility Model

[0004] Based on this, the purpose of the utility model is to provide a marking device for chip processing to solve the technical problem of the inconvenient reprocessing of chips that do not meet the processing standards during the chip marking process.

[0005] To achieve the above purpose, the utility model provides the following technical solution: A marking device for chip processing, including an operating table. A main conveyor belt is arranged on the top of the operating table. A support frame is arranged on one side of the main conveyor belt. A marking mechanism and a vision detection mechanism are arranged below the inner side of the support frame. A rejection mechanism is arranged on one side of the support frame. The rejection mechanism includes a mounting frame, and a high-pressure nozzle is arranged below the inner side of the mounting frame.

[0006] A material dividing mechanism is provided at the end of the main conveyor belt, and the material dividing mechanism includes a receiving plate, a diverter plate is provided on the surface of the receiving plate, a first diverter groove and a second diverter groove are formed on the left and right sides of the diverter plate respectively, a movable door is provided on the surface of the second diverter groove, a motor is provided on one side of the movable door, a first receiving frame is provided below the first diverter groove, a second receiving frame is provided below the movable door, a transport belt is provided at the end of the second diverter groove, and a lifting belt is provided at the other end of the transport belt.

[0007] By adopting the above technical solution, according to the detection information, the motor will control the opening and closing of the movable door, so that the chips with impurities on the surface fall into the second receiving frame, thereby realizing the automatic classification and collection of defective products.

[0008] Furthermore, a plurality of high-pressure nozzles are provided, and the plurality of high-pressure nozzles are linearly arranged at equal intervals along the width line of the main conveyor belt.

[0009] By adopting the above technical solution, setting up multiple high-pressure nozzles can ensure wide coverage and efficient execution of the rejection operation. Since these nozzles are arranged equidistantly along the width line of the main conveyor belt, they can evenly spray high-pressure gas, thereby effectively and quickly removing chips that do not meet processing standards or are non-conforming products from the main conveyor belt.

[0010] Furthermore, the first receiving frame is used to receive good chips, the second receiving frame is used to receive chips with impurities on the surface, and the transport belt is used to receive chips that are stacked during transportation by the main conveyor belt.

[0011] By adopting the above technical solution, the first receiving frame is specifically used to receive good chips, which can ensure that these qualified chips are collected separately to avoid confusion with defective products, thereby ensuring the purity and quality of the product, which helps the smooth progress of subsequent processes and improves the reliability of the final product.

[0012] Furthermore, the end of the lifting belt is connected to the head end of the main conveyor belt.

[0013] By adopting the above technical solution, a closed-loop circulation system is formed, so that chips that have not been successfully marked for various reasons can automatically return to the starting point of the main conveyor belt for re-marking. This not only improves the success rate of marking, but also avoids the tedious process of manually re-placing the chip, saving time and labor costs.

[0014] Furthermore, hangers are provided on both sides of the support frame, and a polishing ring is provided at the bottom end of the hanger.

[0015] By adopting the above technical solution, the light-emitting ring provides a stable and sufficient light source for the vision detection mechanism. The light-emitting ring can evenly illuminate the chips on the main conveyor belt, ensuring that the vision detection mechanism can accurately capture the surface structure and position status of the chips under various ambient light conditions.

[0016] Furthermore, the motor, high-pressure nozzle, light-emitting ring, marking mechanism, and vision detection mechanism are all electrically connected to an external power source.

[0017] By adopting the above technical solution, this ensures the stable power supply and continuous operation of the equipment. A stable power supply is the basis for the normal operation of these devices, which can avoid production stagnation caused by insufficient power or power interruption.

[0018] In summary, the main beneficial effects of the present utility model are as follows:

[0019] With the continuous operation of the main conveyor belt through the material distribution mechanism of the present utility model, the marked and qualified chips will smoothly pass through the first diversion groove and finally fall into the first receiving frame. Those chips detected with problems will enter the second diversion groove. At the second diversion groove, the motor precisely controls the opening and closing of the movable door according to the detection information. The chips with impurities on the surface will fall into the second receiving frame under the guidance of the movable door, realizing classified collection. At the same time, those chips stacked or placed with the wrong surface will slide down the second diversion groove onto the transport belt. This transport belt smoothly conveys them to the lifting belt, and the lifting belt lifts these chips back to the head end of the main conveyor belt, giving them the opportunity to be marked again. This not only significantly improves the convenience of the marking operation but also effectively reduces the labor cost, achieving efficient and precise chip processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is a three-dimensional structural schematic diagram of the present utility model;

[0021] Figure 2 is a side-view structural schematic diagram of the present utility model;

[0022] Figure 3 is a structural schematic diagram of the rejection mechanism of the present utility model;

[0023] Figure 4 is for the present utility model Figure 2 an enlarged structural schematic diagram of part A in.

[0024] In the figure: 1. Operating table; 2. Main conveyor belt; 3. Support frame; 401. Hanging bracket; 402. Lighting ring; 5. Rejection mechanism; 501. Mounting frame; 502. High-pressure nozzle; 6. Material distribution mechanism; 601. Receiving plate; 602. Shunt plate; 603. First shunt groove; 604. Second shunt groove; 605. Movable door; 606. Motor; 607. First receiving frame; 608. Second receiving frame; 7. Transport belt; 8. Lifting belt. Specific embodiments

[0025] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. The embodiments described below by referring to the accompanying drawings are exemplary and are only used to explain the present invention and should not be construed as a limitation to the present invention.

[0026] Next, the embodiments of the present invention will be described according to the overall structure of the present invention.

[0027] Embodiment 1:

[0028] A marking device for chip processing, as Figures 1-4 shown, includes an operating table 1. A main conveyor belt 2 is arranged on the top of the operating table 1. A support frame 3 is arranged on one side of the main conveyor belt 2. A marking mechanism and a vision detection mechanism are arranged below the inner side of the support frame 3. A rejection mechanism 5 is arranged on one side of the support frame 3. The rejection mechanism 5 includes a mounting frame 501, and a high-pressure nozzle 502 is arranged below the inner side of the mounting frame 501;

[0029] A material distribution mechanism 6 is arranged at the end of the main conveyor belt 2. The material distribution mechanism 6 includes a receiving plate 601. A shunt plate 602 is arranged on the surface of the receiving plate 601. First shunt grooves 603 and second shunt grooves 604 are respectively formed on the left and right sides of the shunt plate 602. A movable door 605 is arranged on the surface of the second shunt groove 604. A motor 606 is arranged on one side of the movable door 605. A first receiving frame 607 is arranged below the first shunt groove 603. A second receiving frame 608 is arranged below the movable door 605. A transport belt 7 is arranged at the end of the second shunt groove 604. The other end of the transport belt 7 is provided with a lifting belt 8. According to the detection information, the motor 606 will control the opening and closing of the movable door 605, so that the chips with impurities on the surface fall into the second receiving frame 608, realizing the automatic classification and collection of defective products. At the same time, the chips stacked or placed with the wrong surface will fall onto the transport belt 7 through the second shunt groove 604, and then be transported to the lifting belt 8. The lifting belt 8 will lift these chips back to the head end of the main conveyor belt 2, enabling them to perform the marking operation again. This process realizes the automatic cyclic processing of chips, improves the convenience of the marking operation, and effectively reduces the labor cost.

[0030] Refer to Figure 1, Figure 2 , Figure 3 There are multiple high-pressure nozzles 502, and the multiple high-pressure nozzles 502 are arranged in an equidistant linear manner along the width line of the main conveyor belt 2. The multiple high-pressure nozzles 502 can ensure wide coverage and efficient execution of the rejection operation. Since these nozzles are arranged in an equidistant linear manner along the width line of the main conveyor belt 2, they can evenly spray high-pressure gas, thereby effectively and quickly removing chips that do not meet the processing standards or are non-conforming products from the main conveyor belt 2. At the same time, this layout also ensures the accuracy and consistency of rejection. No matter where the chip is on the main conveyor belt 2, it will be affected by the high-pressure nozzles at the corresponding position, avoiding incomplete or erroneous rejection due to position deviation. In this way, not only the production efficiency is improved, but also the need for operators to manually handle defective products is reduced, further saving labor costs and improving the automation level of the overall production process.

[0031] See also Figure 1 , Figure 2 , Figure 4 The first receiving frame 607 is used to receive good chips, the second receiving frame 608 is used to receive chips with impurities on the surface, and the conveyor belt 7 is used to receive the chips that are stacked during transportation by the main conveyor belt 2. The first receiving frame 607 is specifically used to receive good chips, which can ensure that these qualified chips are collected separately to avoid confusion with defective products, thereby ensuring the purity and quality of the product, which helps the smooth progress of subsequent processes and improves the reliability of the final product. At the same time, the second receiving frame 608 is specifically used to receive chips with impurities on the surface, realizing the classified collection of defective products. This classification not only helps to further analyze and process the defective products, but also provides important data for quality control in the production process.

[0032] See also Figure 1 , Figure 2 The end of the lifting belt 8 is connected to the head end of the main conveyor belt 2, forming a closed-loop circulation system, so that the chips that failed to be successfully marked due to various reasons can automatically return to the starting point of the main conveyor belt 2 for re-marking. This not only improves the success rate of marking, but also avoids the tedious process of manually re-placing the chip, saving time and labor costs. At the same time, this docking method also optimizes the production process, enhances the continuity and automation of the production line, and the chip can be continuously marked without human intervention until the quality standard is met. This greatly improves production efficiency and product quality, reduces losses and waste in the production process, and brings greater economic benefits to the enterprise.

[0033] Embodiment 2:

[0034] See also Figure 1 , Figure 2, hangers 401 are provided on both sides of the support frame 3, and a lighting ring 402 is provided at the bottom of the hanger 401. The lighting ring 402 provides a stable and sufficient light source for the visual inspection mechanism. The lighting ring 402 can evenly illuminate the chips on the main conveyor belt 2, ensuring that the visual inspection mechanism can accurately capture the surface structure and position status of the chip under various ambient light conditions. At the same time, stable lighting conditions also improve the accuracy and speed of visual inspection, so that the system can more quickly identify and eliminate chips that do not meet the processing standards, thereby improving the overall production efficiency. Good lighting can also help reduce misjudgments and missed judgments, further ensuring product quality and the stability of the production line.

[0035] See also Figure 1 , Figure 2 , Figure 3 , Figure 4 The motor 606, the high-pressure nozzle 502, the light ring 402, the marking mechanism and the visual inspection mechanism are all electrically connected to the external power supply, which ensures the stable power supply and continuous operation of the equipment. The stable power supply is the basis for the normal operation of these devices and can avoid production stagnation caused by power shortage or interruption. At the same time, the electrical connection with the external power supply also facilitates the maintenance and management of the equipment. When the equipment fails or requires maintenance, the corresponding operation can be performed by cutting off or restoring the power supply, which improves the safety and controllability of the equipment. The stable power supply also helps to extend the service life of the equipment and reduce equipment damage caused by power fluctuations.

[0036] The implementation principle of the utility model is as follows: first, the operator places the chip to be processed at the head end of the main conveyor belt 2, and uses the main conveyor belt 2 to transport the chip until it is transported to the bottom of the marking mechanism. At this time, the visual inspection mechanism is used to inspect the chip on the main conveyor belt 2, and then the inspection signal is transmitted to the control center. The marking mechanism marks the surface of the good chip according to the inspection information, and the non-good chip is blown to one side of the main conveyor belt 2 through the high-pressure nozzle 502 for removal. As the main conveyor belt 2 gradually transports the chips, the good and qualified chips slide through the first diversion groove 603 on one side to the first receiving frame 6 07, and non-conforming products fall into the second diverter trough 604. According to the detection information, the motor 606 controls the opening and closing of the movable door 605 for the chips with impurities on the surface, causing these chips to fall into the second receiving frame 608. The remaining chips with incorrect stacking and placement surface fall onto the conveyor belt 7 through the second diverter trough 604. As these chips are transported, they fall onto the lifting belt 8 at the end. The lifting belt 8 is used to drop the chips that can be marked again to the head end of the main conveyor belt 2 and re-mark them, thereby improving the convenience of the marking operation and reducing the output of labor costs.

[0037] Parts not involved in the present utility model are the same as or can be implemented using the prior art, and will not be elaborated herein.

[0038] Although embodiments of the present utility model have been shown and described, the specific embodiments are only explanations of the present utility model and not limitations thereof. The specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. After reading this specification, those skilled in the art can make modifications, substitutions and variations that do not contribute creatively to the embodiments as needed, provided that they are within the scope of the claims of the present utility model and are protected by the patent law.

Claims

1. A marking device for chip processing, characterized in that: The invention comprises an operating table (1), a main conveyor belt (2) is arranged on the top of the operating table (1), a support frame (3) is arranged on one side of the main conveyor belt (2), a marking mechanism and a visual inspection mechanism are arranged on the inner lower side of the support frame (3), a rejection mechanism (5) is arranged on one side of the support frame (3), the rejection mechanism (5) comprises a mounting frame (501), and a high-pressure nozzle (502) is arranged on the inner lower side of the mounting frame (501); A material distribution mechanism (6) is provided at the end of the main conveyor belt (2), and the material distribution mechanism (6) includes a receiving plate (601), and a diverter plate (602) is provided on the surface of the receiving plate (601), and a first diverter groove (603) and a second diverter groove (604) are formed on the left and right sides of the diverter plate (602), respectively, and a movable door (605) is provided on the surface of the second diverter groove (604), and a motor (606) is provided on one side of the movable door (605), a first receiving frame (607) is provided below the first diverter groove (603), and a second receiving frame (608) is provided below the movable door (605), and a transport belt (7) is provided at the end of the second diverter groove (604), and a lifting belt (8) is provided at the other end of the transport belt (7).

2. The chip processing marking device according to claim 1, characterized in that: A plurality of the high-pressure nozzles (502) are provided, and the plurality of the high-pressure nozzles (502) are linearly arranged at equal distances along the width line of the main conveyor belt (2).

3. The chip processing marking device according to claim 1, characterized in that: The first receiving frame (607) is used to receive good chips, the second receiving frame (608) is used to receive chips with impurities on the surface, and the transport belt (7) is used to receive chips that are stacked during transportation by the main conveyor belt (2).

4. The chip processing marking device according to claim 1, characterized in that: The end of the lifting belt (8) is connected to the head end of the main conveyor belt (2).

5. The chip processing marking device according to claim 1, characterized in that: Hangers (401) are provided on both sides of the support frame (3), and a light ring (402) is provided at the bottom end of the hanger (401).

6. The chip processing marking device according to claim 1, characterized in that: The motor (606), the high-pressure nozzle (502), the light ring (402), the marking mechanism and the visual detection mechanism are all electrically connected to an external power source.

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