Polishing pad mounting assembly

Abstract

The embodiment of the utility model discloses a polishing pad mounting assembly which comprises a plurality of annular cavities arranged in a sleeving mode and arranged at intervals. The opening end of the annular cavity is used for facing and making contact with a polishing pad; the plurality of nozzles are correspondingly communicated with the annular cavity; a plurality of pipelines, wherein the plurality of nozzles are communicated through the pipelines; wherein one pipeline corresponds to one annular cavity, and ventilation or air exhaust is carried out on the annular cavity through a plurality of nozzles communicated with the annular cavity.

Description

Technical Field

[0001] Embodiments of the present disclosure relate to the field of semiconductor technology, and particularly to a polishing pad mounting assembly. Background Art

[0002] Chemical Mechanical Polishing (CMP) is one of the key processes for achieving wafer surface planarization during integrated circuit manufacturing. Different from some pure mechanical polishing and grinding processes, the CMP process combines surface chemical action and mechanical grinding techniques to remove micrometer / nanometer-scale material thickness on the wafer surface, thereby achieving less thickness removal on the wafer surface and a topographical performance with a high surface flatness.

[0003] The main working principle of the CMP process is that under a certain pressure and in the presence of a polishing liquid, the wafer to be polished moves relative to the polishing pad. By means of the highly organic combination between the mechanical grinding action of nano-abrasives and the chemical action of various chemical reagents, the surface of the wafer to be polished is made highly planar, meeting the process requirements of low surface roughness and low defects. The polishing pad is fixed on the polishing disk of a polishing machine or a CMP machine. The wafer is driven by a grinding head to rotate and contact the polishing pad for grinding. The fixing method of the polishing pad to the polishing disk can be pasting. As a consumable material in the CMP process, after the polishing machine runs for a certain period of time or polishes a certain number of wafers, the polishing performance of the polishing pad deteriorates and a new polishing pad needs to be replaced. The tight state of the polishing pad against the polishing disk has a great influence on the wafer surface flatness, the wafer surface thickness removal rate, the uniformity of the wafer surface roughness, and the yield. How to make the polishing pad stick more tightly and uniformly to the surface of the polishing disk, and how to improve the replacement rate of the polishing pad have become problems to be solved urgently. Summary of the Utility Model

[0004] According to some aspects of the embodiments of the present disclosure, a polishing pad mounting assembly is provided, including:

[0005] A plurality of nested annular chambers spaced from each other; an open end of the annular chamber is used to face and contact the polishing pad;

[0006] A plurality of nozzles corresponding to and communicating with the annular chambers;

[0007] A plurality of pipelines, and the plurality of nozzles are connected through the pipelines; wherein, one pipeline corresponds to one annular chamber and ventilates or evacuates the annular chamber through a plurality of nozzles communicating with the annular chamber.

[0008] In some embodiments, the polishing pad mounting assembly includes:

[0009] A top plate and side baffles extending in a first direction; the side baffles are in contact with the top plate and enclose the annular chamber, and the open end of the annular chamber is disposed opposite to the top plate in the first direction;

[0010] The nozzle is disposed based on the top plate.

[0011] In some embodiments, the nozzle penetrates the top plate, and the pipeline is located on a side of the top plate away from the annular chamber.

[0012] In some embodiments, two adjacent annular chambers share one side baffle.

[0013] In some embodiments, the polishing pad mounting assembly further includes:

[0014] An intake valve communicated with the pipeline, the intake valve is communicated with a supply pipeline; and a vacuum valve communicated with the pipeline, the vacuum valve is connected to an exhaust pipeline;

[0015] The vacuum valve is opened and the intake valve is closed to enable the annular chamber to adsorb the polishing pad; or,

[0016] The intake valve is opened and the vacuum valve is closed to enable the polishing pad to be pressed against the surface of the polishing disc of the polishing machine.

[0017] In some embodiments, the multiple pipelines are arranged in concentric circles, and each pipeline has independent gas flow;

[0018] Each pipeline is correspondingly communicated with multiple nozzles; each pipeline is correspondingly communicated with one vacuum valve and one intake valve; one supply pipeline is communicated with multiple intake valves, and one exhaust pipeline is communicated with multiple vacuum valves.

[0019] In some embodiments, the polishing pad mounting assembly further includes:

[0020] A bracket, the bracket is fixedly connected to the multiple pipelines, and the bracket intersects with the pipelines; and / or, the bracket is fixedly connected to the top plate.

[0021] In some embodiments, the bracket further includes:

[0022] An alignment portion, the alignment portion is used for aligning with a positioning port on the polishing disc of the polishing machine.

[0023] In some embodiments, the polishing pad mounting assembly further includes:

[0024] A lifting shaft, connected to the bracket; the lifting shaft drives the bracket to move up and down.

[0025] In some embodiments, the side baffle includes:

[0026] A flexible material that undergoes elastic deformation under the action of external pressure.

[0027] Embodiments of the present disclosure provide a polishing pad mounting assembly for mounting a polishing pad on the surface of a polishing platen of a polishing machine. The polishing pad mounting assembly includes a plurality of nested annular chambers spaced apart from each other, and the open ends of the chambers are used to face and contact the polishing pad; a plurality of nozzles provided and communicated on each annular chamber, and a pipeline communicating the plurality of nozzles; wherein, one pipeline corresponds to one annular chamber, and the annular chamber is ventilated or evacuated through the plurality of nozzles communicated with the annular chamber. When the pipeline evacuates the annular chamber through the nozzles, the annular chamber can adsorb the polishing pad. When the pipeline exhausts the annular chamber through the nozzles, the polishing pad can be desorbed from the annular chamber and pressed against the surface of the polishing platen under the action of air pressure. While facilitating the automatic grasping and pressing of the polishing pad, it can also reduce the air bubbles between the polishing pad and the polishing platen, reduce the wrinkles of the polishing pad, facilitate the close fit between the polishing pad and the surface of the polishing platen, thereby improving the flatness of the polished surface of the wafer and the uniformity of the roughness distribution, and improving the polishing yield of the wafer. Brief Description of the Drawings

[0028] Figure 1 is a schematic diagram of an exemplary polishing machine shown according to an exemplary embodiment;

[0029] Figures 2 to 5 is a schematic diagram of an exemplary polishing pad mounting assembly shown according to an embodiment of the present disclosure.

[0030] In the above drawings (which are not necessarily drawn to scale), similar reference numerals may describe similar components in different views. Similar reference numerals with different letter suffixes may represent different examples of similar components. The drawings generally illustrate the various embodiments discussed herein by way of example and not limitation. Detailed Embodiments

[0031] Hereinafter, the exemplary embodiments of the present disclosure will be described in more detail with reference to the drawings. Although the exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the specific embodiments set forth herein. On the contrary, these embodiments are provided so that the present disclosure can be more thoroughly understood and the scope of the present disclosure can be fully conveyed to those skilled in the art.

[0032] In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present disclosure. However, it will be apparent to one of ordinary skill in the art that the present disclosure may be practiced without one or more of these specific details. In other instances, well-known features have not been described in order to avoid obscuring the present disclosure; that is, not all features of actual embodiments are described herein, and well-known functions and structures are not described in detail.

[0033] Spatial relationship terms such as "under", "below", "beneath", "underneath", "above", "upper", etc. are used herein for convenience in describing the relationship of one element or feature shown in the figures to other elements or features. It should be understood that, in addition to the orientation shown in the figures, spatial relationship terms are intended to also encompass different orientations of the device during use and operation. For example, if the device in the figures is flipped, then an element or feature described as "under" or "beneath" or "underneath" another element or feature will be oriented "above" the other element or feature. Thus, the exemplary terms "under" and "beneath" can include both an upper and a lower orientation. The device may be otherwise oriented (rotated 90 degrees or other orientations) and the spatial descriptors used herein are to be interpreted accordingly.

[0034] The terms used herein are for the purpose of describing particular embodiments only and are not intended to be limiting of the present disclosure. As used herein, the singular forms "a", "an" and "the" are also intended to include the plural forms unless the context clearly dictates otherwise. It should also be understood that the terms "comprising" and / or "including", when used in this specification, specify the presence of the stated features, integers, steps, operations, elements and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups. As used herein, the term "and / or" includes any and all combinations of the associated listed items.

[0035] It should be understood that references throughout the specification to "some embodiments" or "an embodiment" mean that a particular feature, structure, or characteristic associated with the embodiment is included in at least one embodiment of the present disclosure. Thus, appearances of the phrases "in some embodiments" or "in an embodiment" throughout the specification are not necessarily referring to the same embodiment. Furthermore, these particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. It should be understood that in various embodiments of the present disclosure, the order numbers of the above processes do not imply the order of execution, and the order of execution of each process should be determined by its function and internal logic, and should not constitute any limitation to the implementation process of the embodiments of the present disclosure.

[0036] According to some aspects of embodiments of the present disclosure, Figure 1An exemplary polishing machine tool 100 is provided. The polishing machine tool 100 can be a CMP machine tool. The polishing machine tool 100 can include: a polishing platen 101, a polishing pad 102, a polishing head 103, a dressing assembly 104, and a liquid supply assembly 105; the polishing pad 102 is a replaceable consumable. The polishing platen 101 can be disposed on a carrier. The polishing head 103 is located above the polishing pad 102 and holds the wafer. The polishing head 103 can have a flexible chamber to hold the wafer. The polishing head 103 can move up and down along the z-direction relative to the polishing pad 102, and can also move horizontally along the x- or y-direction. The polishing head 103 drives the wafer and the polishing pad 102 to perform a relative rotational motion to polish the wafer. The polishing head 103 can apply pressure to the wafer along the z-direction to improve the polishing performance. The polishing platen 101 can be stationary, or rotate in the opposite direction to the polishing head 103. The dressing assembly 104 can include a dressing arm and a dressing head, and can be disposed on one side of the polishing platen 101. The dressing arm can drive the rotating dressing head to swing to dress and clean the surface of the polishing pad 102, making the polishing pad 102 smooth and wrinkle-free, and can also sweep away the abrasive slurry and polishing by-products on the polishing pad 102. The liquid supply assembly 105 supplies the abrasive slurry to the surface of the polishing pad 102. The abrasive slurry can include components such as alumina, silica, polyurethane, water, surfactant, etc., or various small-sized microspheres formed by the above alumina, silica, polyurethane and other materials. The liquid supply assembly 105 can be connected to the liquid storage tank or the liquid mixing system of the machine tool through a pipeline to obtain the abrasive slurry and supply it to the surface of the polishing pad 102.

[0037] During the CMP process, the chemical components in the abrasive slurry can chemically react with the material to be removed on the wafer surface, softening or converting these materials into soluble substances. This step helps to reduce the hardness of the material surface, making it easier to be removed mechanically. Through the relative motion between the polishing pad 102 and the wafer, and the applied pressure, the abrasive in the abrasive slurry and the polishing pad 102 physically remove the surface of the wafer. This mechanical action effectively removes the softened material, thus achieving the planarization of the material surface. The combined use of chemical action and mechanical action can avoid the processing damage caused by relying solely on mechanical polishing, as well as the problems of low polishing efficiency and poor surface flatness caused by solely using chemical polishing.

[0038] In some embodiments, the adhesion state between the polishing pad 102 and the polishing platen 101 has a significant impact on the flatness, surface roughness uniformity, and yield of the wafer. The polishing platen 101 is used to fix and carry the polishing pad 102, and the fixing methods can include but are not limited to pasting, electrostatic adsorption, etc. The polishing platen 101 can drive the polishing pad 102 to rotate, or the polishing platen 101 can be stationary. The polishing pad 102 can also be called a grinding pad, and the polishing platen 101 can also be called a grinding disk.

[0039] The surface of the polishing pad 102 may have grooves, which can increase the roughness of the surface of the polishing pad 102, make the abrasive liquid more evenly distributed on the surface of the polishing pad 102, and also discharge the by-products ground from the wafer. As the usage time of the polishing pad 102 increases, the polishing pad 102 will be consumed, and the groove depth on the surface of the polishing pad 102 will decrease, affecting the progress of the CMP process. When the polishing time of the polishing pad 102 or the number of wafers ground reaches a certain set value, the polishing pad 102 needs to be replaced.

[0040] In some embodiments, the method for replacing the polishing pad 102 is as follows: Remove the old polishing pad, and through the cooperation between operators, paste the side of the polishing pad 102 with adhesive on the surface of the polishing platen 101, and then use a smooth roller unit to gradually roll and press the polishing pad 102 to make it closely adhered to the polishing platen 101. This method is more convenient for pasting polishing pads made of materials with a relatively hard texture, such as polyurethane polishing pads, on small polishing machines (machines with a relatively small size of the polishing platen 101). However, on large polishing equipment, when pasting some soft polishing pads, many problems will occur, such as: the bonding state of each part of the polishing pad and the polishing platen is uneven, there are gaps in the middle to generate air bubbles, and the polishing pad has wrinkles during pasting; for some polishing pads with a relatively soft and thin texture, the surface structure of the polishing pad will be irreparably damaged when pressing the polishing pad by rolling the roller unit. As the wafers develop towards larger sizes and the manufacturing process has higher and higher requirements for the quality of the wafers, if defects such as air bubbles, wrinkles, and surface damage occur during the pasting of the polishing pad, the yield will be reduced and the cost will be increased. Moreover, the method for pasting the polishing pad in this embodiment requires a lot of manpower and time.

[0041] In view of this, the embodiments of the present disclosure provide a polishing pad mounting assembly 110 for mounting the polishing pad 102, which is used to mount the polishing pad 102 on the surface of the polishing platen 101, and can realize the automatic installation of the polishing pad 102, improve the installation efficiency and flatness of the polishing pad 102, and improve the CMP yield.

[0042] According to some aspects of the embodiments of the present disclosure, Figures 2 to 5 An exemplary polishing pad mounting assembly 110 is provided, including:

[0043] A plurality of nested annular chambers 111, with the annular chambers 111 spaced apart from each other; the open ends of the annular chambers 111 are used to face and contact the polishing pad 102;

[0044] A plurality of nozzles 112, corresponding to and communicating with the annular chambers 111;

[0045] A plurality of pipelines 113, with the plurality of nozzles 112 communicating through the pipelines 113; among them, one pipeline 113 corresponds to one annular chamber 111, and ventilates or evacuates the annular chamber 111 through the plurality of nozzles 112 communicating with the annular chamber 111.

[0046] Specifically, Figure 2 and Figure 3 FIG. 113 shows a schematic diagram of five concentrically arranged pipelines 113. Each pipeline 113 can be correspondingly connected to an annular chamber 111. The corresponding five annular chambers 111 can be concentrically sleeved. The outer contour of the cross-section of the annular chamber 111 in the horizontal plane xoy is a closed figure connected end to end. The shapes of the annular chamber 111 and the pipeline 113 can be adapted to the shape of the polishing pad 102. The concentrically arranged annular chambers 111 can be adapted to a circular polishing pad 102. The shape of a single annular chamber 111 can be circular, elliptical, or approximately circular within a certain error range. According to the size of the polishing platen 101 or the size of the polishing pad 102, the number of annular chambers 111 can be increased or decreased. The embodiments of the present disclosure do not limit this. The annular chambers 111 are isolated from each other and spaced apart. Each annular chamber 111 can flow gas independently, that is, each annular chamber 111 can independently conduct ventilation or exhaust, and each annular chamber 111 can independently conduct ventilation and exhaust successively. The ventilation and exhaust sequence and time can be set according to actual needs. In some embodiments, the annular chamber 111 can be rectangular or other polygons. The z direction in the figure can be the direction perpendicular to the polishing pad 102, which can be the thickness direction of the wafer or the vertical direction, and can be the first direction mentioned in the present disclosure.

[0047] For an annular chamber 111, a plurality of nozzles 112 can be provided and connected to the annular chamber 111 to increase the gas flow rate and balance the gas pressure. The plurality of nozzles 112 can be arranged in a circular pattern. There is no specific limitation on the spacing and number of the nozzles 112. Each annular chamber 111 can be configured with a corresponding pipeline 113 connected. One pipeline 113 is connected to a plurality of nozzles 112 and correspondingly connected to the target annular chamber 111 through the plurality of nozzles 112. The pipeline 113 ventilates or evacuates the corresponding annular chamber 111 through the nozzles 112. Exemplarily, the pipeline 113 can be a stainless steel pipe or a polymer material pipe; for example, a stainless steel pipe with a polytetrafluoroethylene lining.

[0048] In the embodiments of the present disclosure, when the pipeline 113 evacuates the annular chamber 111 through the nozzles 112, the annular chamber 111 can adsorb the polishing pad 102. When the pipeline 113 exhausts the annular chamber 111 through the nozzles 112, the polishing pad 102 can be desorbed from the annular chamber 111 and pressed against the surface of the polishing platen 101 under the action of air pressure. While facilitating the automatic grasping and pressing of the polishing pad 102, it can also reduce the bubbles between the polishing pad 102 and the polishing platen 101, reduce the wrinkles of the polishing pad 102, facilitate the tight fit between the polishing pad 102 and the surface of the polishing platen 101, thereby improving the flatness of the polished surface of the wafer and the uniformity of the roughness distribution, and improving the polishing yield of the wafer.

[0049] Figure 2 and Figure 3 An enlarged schematic view of the annular chamber 111 is also shown. The open end of the annular chamber 111 faces the polishing pad 102 in the z direction and contacts the polishing pad 102. The space inside the annular chamber 111 is a hollow chamber, and a plurality of nozzles 112 can be arranged anywhere on the inner wall of the hollow chamber to communicate with the annular chamber 111. As an example, Figure 2 A schematic cross-section of two adjacent annular chambers 111 in the xoz plane is also shown, Figure 3 and a schematic cross-section of two adjacent annular chambers 111 in the yoz plane is also shown. Figure 2

[0050] In some embodiments, as shown in reference to Figure 2 the polishing pad mounting assembly 110 includes:

[0051] a top plate 114 and side baffles 115 extending in the first direction (z direction); the side baffles 115 contact the top plate 114 and enclose the annular chamber 111. The open end of the annular chamber 111 is oppositely arranged with the top plate 114 in the z direction; the nozzles 112 can be arranged based on the top plate 114. A plurality of side baffles 115 arranged in concentric circles contact and connect with the top plate 114 to enclose a plurality of annular chambers 111 arranged in concentric circles.

[0052] As shown in reference to Figure 2 the top plate 114 can be used to carry components such as the nozzles 112 and the side baffles 115. The size of the top plate 114 in the xoy plane can be adapted to the size of the polishing disc 101, can be equal to the size of the polishing disc 101, or slightly larger or slightly smaller than the size of the polishing disc 101. The nozzles 112 can penetrate the top plate 114 in the z direction. One side of the nozzles 112 in the z direction communicates with the annular chamber 111, and the other side communicates with the pipeline 113. The pipeline 113 is arranged on the side of the top plate 114 away from the annular chamber 111 and is located above the top plate 114. The side baffles 115 are end-to-end rings or circles and have a certain thickness in the z direction, for example, 5 - 20 mm. Two side baffles 115 contact and connect with the top plate 114 to enclose an annular chamber 111 with an opening facing the polishing pad 102 in the z direction. The side baffles 115 and a part of the top plate 114 serve as the inner wall of the annular chamber 111. The annular chamber 111 can achieve independent control of the gas flow due to the isolation of the side baffles 115. The side of the side baffles 115 away from the top plate 114 in the z direction contacts the polishing pad 102. The side baffles 115 can serve as a sealing baffle, a sealing ring, or a sealing ring to form a sealed air-containing space after the annular chamber 111 contacts the polishing pad 102, improving the adsorption effect on the polishing pad 102 and preventing the polishing pad 102 from falling off.

[0053] ​In some embodiments, the side baffle 115 includes a flexible material that undergoes elastic deformation under the action of external force. The side baffle 115 may include flexible materials such as rubber, polyurethane, and silicone rubber, which can provide deformation buffering when contacting the polishing pad 102, reducing damage to the polishing pad 102; it can also improve the airtightness when contacting the polishing pad 102, reducing air leakage from the annular chamber 111. In some specific examples, the entire side baffle 115 may be made of a flexible material, or the end of the side baffle 115 in contact with the polishing pad 102 is a flexible material, and the end in contact with the top plate 114 is a rigid material to facilitate providing mechanical stability. In some other specific examples, a cap or film layer made of a flexible material is sleeved on the end of the side baffle 115 in contact with the polishing pad 102.

[0054] In some embodiments, referring to Figure 2 and Figure 3 as shown, the nozzle 112 penetrates the top plate 114, and the pipeline 113 is located on the side of the top plate 114 away from the annular chamber 111. In some other embodiments, referring to Figure 4 as shown, the pipeline 113 may be embedded in the top plate 114, or a part of the pipeline 113 is embedded in the top plate 114, and the nozzle 112 is arranged below the pipeline 113 and communicates with the pipeline 113 and the annular chamber 111. In some other embodiments, the pipeline 113 may be arranged below the top plate 114 and within the annular chamber 111.

[0055] In some embodiments, referring to Figure 2 and Figure 3 as shown, two adjacent annular chambers 111 share a side baffle 115. Taking two adjacent annular chambers 111 as an example, by setting 3 nested annular side baffles 115 in contact with or connected to the top plate 114, two annular chambers 111 can be formed, and the two annular chambers 111 share a side baffle 115. Thus, the number of annular chambers 111 can be increased, and the number of side baffles 115 can be reduced. In some other embodiments, two annular chambers 111 can be formed by setting 4 annular side baffles 115. The two annular chambers 111 do not share a side baffle 115, and a certain distance is provided between the two annular chambers 111 as a buffer area.

[0056] In some embodiments, referring to Figure 2 and Figure 3 as shown, the polishing pad mounting assembly 110 further includes:

[0057] An intake valve 119 communicating with the pipeline 113, the intake valve 119 communicating with the air supply pipeline 118; and a vacuum valve 117 communicating with the pipeline 113, the vacuum valve 117 connected to the air extraction pipeline 116;

[0058] The vacuum valve 117 is opened and the intake valve 119 is closed to cause the annular chamber 111 to adsorb the polishing pad 102; or,

[0059] The intake valve 119 is opened and the vacuum valve 117 is closed to cause the polishing pad 102 to adhere tightly to the surface of the polishing disc 101 of the polishing machine.

[0060] In some embodiments, the plurality of pipelines 113 are arranged in concentric circles, and each pipeline 113 has independent gas flow;

[0061] Each pipeline 113 is correspondingly communicated with a plurality of nozzles 112; each pipeline 113 is correspondingly communicated with a vacuum valve 117 and an intake valve 119; a gas supply pipeline 118 is communicated with a plurality of intake valves 119, and an air extraction pipeline 116 is communicated with a plurality of vacuum valves 117.

[0062] Referring to Figure 2 As shown, the plurality of pipelines 113 are arranged in concentric circles. The air extraction pipeline 116 can extend along the x direction and is respectively communicated with each pipeline 113 through a vacuum valve 117. The air extraction pipeline 116 can be communicated with a vacuum pump. By switching the vacuum valve 117, the pipeline 113 can be evacuated or the evacuation can be stopped. The opening degree of the vacuum valve 117 can be adjusted to regulate the vacuum degree of the pipeline 113, and then the vacuum degree of the annular chamber 111 can be adjusted to adsorb the polishing pad 102 without deforming the polishing pad 102 due to excessive suction. In Figure 2 In the partial enlarged schematic view of the annular chamber 111 shown, the air extraction pipeline 116 can have one connection point or two connection points with each pipeline 113. A vacuum valve 117 is provided at each connection point to connect the air extraction pipeline 116 and the pipeline 113, and a nozzle 112 can be provided at any one connection point to connect the annular chamber 111. Figure 2 In, the air extraction pipeline 116 has one connection point with the corresponding pipeline 113, and a vacuum valve 117 is provided at this connection point. The vacuum valves 117 can all be on the same side of the center of the top plate 114 with respect to the air extraction pipeline 116; a nozzle 112 can be provided at the position of the pipeline 113 corresponding to the vacuum valve 117 under the vacuum valve 117 to facilitate maintaining the vacuum degree of the annular chamber 111, so as to stably adsorb the polishing pad 102 without damaging the polishing pad 102. At the place where the vacuum valve 117 is not provided, the air extraction pipeline 116 only crosses but is not communicated with the pipeline 113, such as the air extraction pipeline 116 is only fixedly connected to the pipeline 113 without communicating for gas flow.

[0063] Referring to Figure 3As shown, a plurality of pipelines 113 are arranged in concentric circles. The air supply pipeline 118 can extend along the y direction and communicate with each pipeline 113 through an intake valve 119. The air supply pipeline 118 is connected to a gas source, such as being connected to the gas secondary distribution device of the machine tool. The gas secondary distribution device can be connected to the factory-wide air supply system. Gas can be supplied to or stopped from being supplied to the pipeline 113 by switching the intake valve 119. The opening degree of the intake valve 119 can be adjusted to adjust the gas supply volume to regulate the pressure of the pipeline 113, and then the ventilation volume of the annular chamber 111 can be adjusted. In Figure 3 In the partially enlarged schematic view of the annular chamber 111 shown, the air supply pipeline 118 can be arranged above the pipeline 113. The air supply pipeline 118 can have one or two connection points with each pipeline 113. An intake valve 119 is provided at each connection point to connect the air supply pipeline 118 and the pipeline 113. A nozzle 112 can be provided at any one connection point to connect the annular chamber 111. Figure 3 In, the air supply pipeline 118 has one connection point with the corresponding pipeline 113, and an intake valve 119 is provided at this connection point. The intake valves 119 can all be on the same side of the center of the circle of the air supply pipe relative to the top plate 114; a nozzle 112 can be provided below the intake valve 119 at the position of the pipeline 113 corresponding to the intake valve 119, which is convenient for maintaining good stability of the gas flow inside the annular chamber 111. Where the intake valve 119 is not provided, the air supply pipeline 118 and the pipeline 113 only cross but are not connected. The gas introduced into the air supply pipeline 118 can be dry air, nitrogen, argon, helium and other gases.

[0064] In some embodiments, for ease of explanation, Figure 5Schematic diagrams of two pipelines 113, a gas supply pipeline 118, and an air extraction pipeline 116 are shown. The gas supply pipeline 118 can extend along the y direction. The gas supply pipeline 118 is connected to the pipeline 113 through an intake valve 119. The gas supply pipeline 118 has a connection point with one pipeline 113, and an intake valve 119 is provided at each connection point to connect the gas supply pipeline 118 and the pipeline 113. The air extraction pipeline 116 can extend along the x direction. The air extraction pipeline 116 is connected to the pipeline 113 through a vacuum valve 117. The air extraction pipeline 116 has a connection point with one pipeline 113, and a vacuum valve 117 is provided at each connection point to connect the air extraction pipeline 116 and the pipeline 113. The intake valve 119 can include various intake valves, and can include an intake valve with electronically controlled opening to achieve automatic control. The vacuum valve 117 can include various valves suitable for air extraction under vacuum, and can include a valve with electronically controlled opening. The vacuum valve 117 and a vacuum pump are opened to extract air, so that a certain vacuum degree is formed inside the annular chamber 111 to adsorb the polishing pad 102. At this time, the intake valve 119 is closed to prevent the gas supply pipeline 118 from supplying gas to the annular chamber 111 and destroying the vacuum degree, which may cause the polishing pad 102 to fall off. The intake valve 119 is opened and the vacuum valve 117 is closed. Gas is introduced into the annular chamber 111 through the gas supply pipeline 118, so that the polishing pad 102 is detached from the annular chamber 111 and is pressed against the surface of the polishing disc 101 under the pressure of the gas to complete the installation of the polishing pad 102.

[0065] In some embodiments, referring to Figure 2 , Figure 3 and Figure 5 as shown, the polishing pad mounting assembly 110 further includes:

[0066] A bracket 121, the bracket 121 is fixedly connected to a plurality of pipelines 113, and the bracket 121 intersects with the pipelines 113; and / or, the bracket 121 is fixedly connected to the top plate 114.

[0067] The bracket 121 can be fixedly connected to the concentrically arranged pipelines 113 as a reinforcing member. The bracket 121 can extend along the diameter direction of the top plate 114. The bracket 121 intersects with the concentrically arranged pipelines 113, and each pipeline 113 is fixedly connected to reinforce the pipeline 113 to prevent the pipeline 113 from deforming. The bracket 121 can be fixedly connected to the top plate 114 to support and reinforce the top plate 114 to prevent the top plate 114 from deforming.

[0068] In some embodiments, referring to Figure 5 as shown, the bracket 121 further includes:

[0069] An alignment portion 1211, the alignment portion 1211 is used to align with a positioning port on the polishing disc 101 of the polishing machine table 100.

[0070] The bracket 121 includes a portion extending along the diameter of the top plate 114 or along the diameter of the pipeline 113 for fixedly connecting the pipeline 113 and the top plate 114 to prevent deformation; the bracket 121 further includes Figure 5 an alignment portion 1211 extending in the negative z-direction and a fixing portion 1212 extending in the positive z-direction. One side of the polishing pad mounting assembly 110 that adsorbs the polishing pad 102 is the negative z-direction surface, and the open end of the annular chamber 111 faces the negative z-direction. After the polishing pad mounting assembly 110 adsorbs the polishing pad 102, the alignment portion 1211 is inserted into the positioning opening of the polishing disc 101 to complete alignment and positioning. At this time, the distance between the back surface of the polishing pad 102 and the surface of the polishing disc 101 is 3-10 mm; the vacuum valve 117 is closed and the intake valve 119 is opened to ventilate the annular chamber 111, and the air pressure is used to tightly attach the polishing pad 102 to the surface of the polishing disc 101. The fixing portion 1212 of the bracket 121 in the positive z-direction can be used for holding by hand to facilitate the displacement of the polishing pad mounting assembly 110. The fixing portion 1212 and the alignment portion 1211 are detachable and can be threadedly connected to other parts of the bracket 121.

[0071] In some embodiments, the polishing pad mounting assembly 110 further includes:

[0072] a lifting shaft fixedly connected or detachably fixedly connected to the bracket 121; the lifting shaft drives the bracket 121 to move up and down. The lifting shaft can be connected to Figure 5 the fixing portion 1212 therein, or connected to the central position of the bracket 121. The lifting shaft drives the bracket 121 to move up and down to adjust the distance between the polishing pad mounting assembly 110 and the surface of the polishing disc 101. The lifting shaft can be provided by a moving workbench. The workbench hoists the polishing pad mounting assembly 110 above the polishing disc 101 through the lifting shaft and aligns it with the polishing disc 101, controls the lifting shaft to descend or ascend to adjust the distance between the polishing pad 102 and the polishing disc 101 to the target installation height, closes the vacuum valve 117, opens the intake valve 119 to ventilate the annular chamber 111, and uses the air pressure to tightly attach the polishing pad 102 to the surface of the polishing disc 101. After the polishing pad 102 is installed, the lifting shaft is controlled to rise so that the polishing pad mounting assembly 110 is away from the polishing disc 101 by a certain height and then removed from the working area.

[0073] In some embodiments, the method of installing the polishing pad 102 may be as follows: lay the polishing pad 102 flat on the tabletop with the back surface of the polishing pad 102 where the adhesive is provided facing downwards; align the polishing pad mounting assembly 110 with the polishing pad 102 and place it on top of the polishing pad 102, such that the open end of the annular chamber 111 contacts the front surface of the polishing pad 102 where no adhesive is provided, and the side of the polishing pad 102 where no adhesive is provided is the grinding surface for contacting the wafer; connect the air supply pipeline 118 to the air source and the air extraction pipeline 116 to the vacuum pump, and close the vacuum valve 117 and the intake valve 119; open the vacuum valve 117 and close the intake valve 119, and extract air through the air extraction pipeline 116 to create a certain degree of vacuum inside the annular chamber 111 to adsorb the polishing pad 102; tear off the adhesive sticker on the back surface of the polishing pad 102 to expose the adhesive, or apply adhesive to the back surface of the polishing pad 102, or apply adhesive to the surface of the polishing platen 101; align the polishing pad mounting assembly 110 with the polishing platen 101 and place it above the polishing platen 101, and the polishing pad 102 may contact the polishing platen 101 or have a distance of 3 - 10 mm; close the vacuum valve 117, open the intake valve 119 to introduce air into the annular chamber 111 to disengage the polishing pad 102 from the annular chamber 111, and use air pressure to press the polishing pad 102 tightly against the surface of the polishing platen 101.

[0074] In some embodiments, the control of the vacuum valve 117 and the intake valve 119 may be electrically controlled. The polishing pad mounting assembly 110 may include a control unit, and the control unit may execute relevant operation programs to control the opening and closing of the vacuum valve 117 and the intake valve 119. Figure 2 The five concentrically arranged pipelines 113 shown correspond to five individually controllable intake valves 119 and individually controllable vacuum valves 117, and the intake valves 119 and the vacuum valves 117 are controlled by the control unit. When the polishing pad mounting assembly 110 executes the adsorption mode, all intake valves 119 may be closed, and at the same time, all vacuum valves 117 may be opened, or the vacuum valves 117 may be opened sequentially from the inside to the outside or from the outside to the inside to adsorb the polishing pad 102. When the polishing pad mounting assembly 110 aligns the polishing pad 102 with the polishing platen 101, the polishing pad mounting assembly 110 executes the pasting mode, closes all vacuum valves 117, and at the same time, opens all intake valves 119 or opens the intake valves 119 sequentially from the inside to the outside or from the outside to the inside.

[0075] In some embodiments, for ease of explanation, Figure 2The pipeline 113 arranged with 5 concentric circles is sequentially denoted as the first - circle pipeline 113, the second - circle pipeline 113, until the fifth - circle pipeline 113 of the outermost circle from the inside to the outside. The polishing - pad installation assembly 110 executes the pasting mode. First, close the vacuum valve 117 corresponding to the innermost first - circle pipeline 113. After a 1 - s interval, open the intake valve 119 corresponding to the first - circle pipeline 113 for 5 s of air intake. At this time, the part of the polishing pad 102 closest to the center of the circle will be pressed against the polishing platen 101 and adhered to the surface of the polishing platen 101; close the vacuum valve 117 corresponding to the second - circle pipeline 113. After a 1 - s interval, open the intake valve 119 corresponding to the second - circle pipeline 113 for 5 s of air intake; close the vacuum valve 117 corresponding to the third - circle pipeline 113. After a 1 - s interval, open the intake valve 119 corresponding to the third - circle pipeline 113 for 5 s of air intake; close the vacuum valve 117 corresponding to the fourth - circle pipeline 113. After a 1 - s interval, open the intake valve 119 corresponding to the fourth - circle pipeline 113 for 5 s of air intake; close the vacuum valve 117 corresponding to the fifth - circle pipeline 113. After a 1 - s interval, open the intake valve 119 corresponding to the fifth - circle pipeline 113 for 5 s of air intake. At this time, the outermost - circle pipeline 113 has completed air intake, and all intake valves 119 can be closed; remove the polishing - pad installation assembly 110 from the surface of the polishing platen 101, check the pasting situation of the polishing pad 102, roll - press and trim the polishing pad 102 to reduce bubbles and wrinkles, and complete the pasting of the polishing pad 102. For the multi - circle annular chamber 111, the desorption and ventilation operations are sequentially performed from the inner circle to the outer circle, which can realize the pasting of the polishing pad 102 in areas from the inner circle to the outer circle in sequence, and can drive out the bubbles or wrinkles generated by pasting from the inner circle to the outer circle, which can improve the pasting flatness of the polishing pad 102.

[0076] The polishing - pad installation assembly 110 provided by the embodiments of the present disclosure can be used as a part of the polishing machine tool or separately as a fitting adapted to some polishing machine tools; while realizing the automatic grasping and automatic pressing of the polishing pad 102, it can also reduce the bubbles between the polishing pad 102 and the polishing platen 101, reduce the wrinkles of the polishing pad 102, facilitate the close fitting of the polishing pad 102 to the surface of the polishing platen 101, thereby improving the flatness of the polished surface of the wafer and the uniformity of the roughness distribution, and improving the polishing yield of the wafer.

[0077] The above - mentioned are only specific embodiments of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present disclosure can easily think of changes or substitutions, which should all be covered within the protection scope of the present disclosure.

Claims

1. A polishing pad mounting assembly, characterized in that: include: A plurality of annular chambers are arranged in a nested manner, wherein the annular chambers are spaced apart from each other; the open ends of the annular chambers are used to face and contact the polishing pad; A plurality of nozzles are connected to the annular chambers respectively; A plurality of pipelines, and a plurality of nozzles are connected through the pipelines; wherein one pipeline corresponds to one annular chamber, and the annular chamber is ventilated or exhausted through a plurality of nozzles connected with the annular chamber.

2. The polishing pad mounting assembly according to claim 1, wherein: The polishing pad mounting assembly comprises: A top plate, and a side baffle extending along a first direction; the side baffle contacts the top plate and encloses the annular chamber, and an opening end of the annular chamber is arranged opposite to the top plate in the first direction; The nozzle is disposed based on the top plate.

3. The polishing pad mounting assembly according to claim 2, characterized in that: The nozzle passes through the top plate, and the pipeline is located at a side of the top plate away from the annular chamber.

4. The polishing pad mounting assembly according to claim 2, wherein: Two adjacent annular chambers share one side baffle.

5. The polishing pad mounting assembly according to claim 2, wherein: The polishing pad mounting assembly further comprises: an air intake valve in communication with the pipeline, the air intake valve being in communication with the air supply pipeline; and a vacuum valve in communication with the pipeline, the vacuum valve being connected with the air extraction pipeline; The vacuum valve is opened and the air inlet valve is closed so that the annular chamber absorbs the polishing pad; or, The air inlet valve is opened and the vacuum valve is closed so that the polishing pad is closely attached to the polishing disc surface of the polishing machine.

6. The polishing pad mounting assembly according to claim 5, characterized in that: The multiple pipelines are arranged in concentric circles, and each pipeline flows gas independently; Each of the pipelines is connected to a plurality of the nozzles; each of the pipelines is connected to a vacuum valve and an intake valve; an air supply pipeline is connected to a plurality of the intake valves, and an air exhaust pipeline is connected to a plurality of the vacuum valves.

7. The polishing pad mounting assembly according to claim 5, characterized in that: The polishing pad mounting assembly further comprises: A bracket, wherein the bracket is fixedly connected to the plurality of pipelines, the bracket intersects with the pipelines; and / or the bracket is fixedly connected to the top plate.

8. The polishing pad mounting assembly according to claim 7, wherein: The support also includes: An alignment portion is used to align with a positioning opening on a polishing disc of a polishing machine.

9. The polishing pad mounting assembly according to claim 7, wherein: The polishing pad mounting assembly further comprises: A lifting shaft is connected to the bracket; the lifting shaft drives the bracket to move up and down.

10. The polishing pad mounting assembly according to claim 2, wherein: The side baffle comprises: A flexible material that undergoes elastic deformation under external pressure.

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