Testing pressure head and testing machine

Abstract

The utility model provides a test pressure head and a test machine, and relates to the technical field of chips. The test pressure head comprises a pressure head body and a temperature detection piece, the pressure head body is provided with a heat conduction end, the heat conduction end is used for abutting against a packaging surface of a chip, and the heat conduction end is provided with an accommodating cavity; the temperature detection piece is installed in the containing cavity and provided with a detection end, and the detection end can abut against the packaging face. According to the test pressure head provided by the utility model, the heat conduction end of the pressure head body is provided with the accommodating cavity for installing the temperature detection piece, so that the temperature detection piece can be separated from the external environment when the heat conduction end is attached to and abuts against the packaging surface of the chip, and the influence of the external environment on the temperature detection piece is reduced; as the detection end of the temperature detection piece can be attached to the packaging surface, the accurate temperature of the chip can be obtained in time; the detection end can detect the position of the middle part of the chip, so that the condition that the temperature at the edge of the chip is not accurately measured can be avoided; the highest temperature of the chip can be limited by detecting the temperature in the middle of the chip.

Description

Technical Field

[0001] The utility model relates to the field of chips, and particularly to a test probe and a tester. Background Art

[0002] The test probe is used in a chip tester and contacts the chip when detecting the chip. During use, different chip tests require different environments, such as high temperature, normal temperature, and low temperature environments.

[0003] Currently, generally, the temperature of the chip is indirectly obtained by acquiring the temperature of the chip test probe. This method cannot accurately detect the temperature of the chip, and the detected temperature of the chip has hysteresis and cannot control the temperature in a timely manner. Summary of the Utility Model

[0004] In view of this, the purpose of the utility model is to overcome the deficiencies in the prior art and provide a test probe that can accurately and timely detect the temperature of the packaging surface of the chip and reduce the influence of the external environment on the temperature detection result;

[0005] In addition, a tester applying the above test probe is provided.

[0006] The utility model provides the following technical solutions:

[0007] According to one aspect disclosed by the utility model, a test probe is provided. The test probe includes:

[0008] A probe body having a heat-conducting end for abutting against the packaging surface of the chip, and the heat-conducting end has a receiving cavity; and

[0009] A temperature detection component installed in the receiving cavity, and the temperature detection component has a detection end that can abut against the packaging surface.

[0010] Further, the probe body further has a wire passing hole communicating with the receiving cavity, and the cable of the temperature detection component passes through the wire passing hole; wherein, the wire passing hole communicates with the outside of the probe body.

[0011] Further, an end portion of the heat-conducting end for abutting against the packaging surface is provided with a hole groove structure that communicates with the outside of the probe body.

[0012] Further, the temperature detection component includes:

[0013] A temperature sensor installed in the receiving cavity.

[0014] Further, the test indenter further includes an elastic member, and the temperature detection member is connected to the inner wall of the accommodation cavity through the elastic member; wherein, the elastic member is configured to be elastically deformable so that the detection end remains in contact with the encapsulation surface.

[0015] Further, the elastic member includes:

[0016] An elastic adhesive layer, and the temperature detection member is bonded to the inner wall of the accommodation cavity through the elastic adhesive layer.

[0017] Further, the indenter body includes:

[0018] A housing, and the housing is formed with a heat insulation layer; and

[0019] A heat conduction part, the heat conduction part is installed in the housing, and the heat conduction part has an extending end extending out of the housing, and the extending end forms the heat conduction end; and

[0020] A temperature adjustment part, the temperature adjustment part is installed in the housing, and the temperature adjustment part can adjust the temperature of the heat conduction end.

[0021] Further, the temperature adjustment part includes:

[0022] A semiconductor cooler and a radiator, the semiconductor cooler has two working ends, wherein, one of the working ends is in contact with the heat conduction part, and the other working end is connected to the radiator.

[0023] Further, the indenter body further includes:

[0024] A power conversion part, the power conversion part is electrically connected to the semiconductor cooler, and the power conversion part is configured to: at least be able to provide a first current flowing forward and a second current flowing backward to the semiconductor cooler.

[0025] Further, the power conversion part includes:

[0026] A DC power supply, the DC power supply is used to provide DC current; and

[0027] A commutator, and the DC power supply is electrically connected to the semiconductor cooler through the commutator.

[0028] Further, one end of the heat conduction part opposite to the heat conduction end is in contact with the temperature adjustment part; wherein

[0029] A limiting part is arranged in the housing, and the limiting part can at least limit the movement of the heat conduction part in the direction close to the temperature adjustment part, so that the limiting part can bear the extrusion force transmitted from the heat conduction part.

[0030] Further, the limiting part includes:

[0031] a limiting projection, the limiting projection is connected to the heat conducting part, the housing has a limiting groove, and the limiting projection is inserted into the limiting groove; wherein, the limiting projection can at least abut against the side wall of the limiting groove far away from the heat conducting end.

[0032] Furthermore, when the cooling medium of the radiator is liquid, a heat conducting partition is arranged in the housing, and the heat conducting partition is used for dividing the inner cavity of the housing into two chambers, and the radiator and the semiconductor refrigerator are respectively located in different chambers.

[0033] Furthermore, an annular clamping groove is arranged in the housing, the base of the radiator has an annular flange, and the annular flange is inserted into the annular clamping groove; wherein, an elastic sealing ring is arranged between at least one side of the opposite sides of the annular flange and the corresponding side wall on the annular clamping groove, and the elastic sealing ring, the annular flange and the annular clamping groove form the heat conducting partition.

[0034] Furthermore, the housing is at least formed by enclosing an outer shell, a positioning frame and an end cover which are arranged in sequence; wherein

[0035] the end cover is provided with a process hole, the heat conducting end penetrates through the process hole, and a sunken area is arranged at one end of the end cover in contact with the heat conducting part;

[0036] and / or, the annular clamping groove is formed between the outer shell and the positioning frame;

[0037] and / or, the limiting groove is formed between the positioning frame and the end cover.

[0038] Furthermore, the temperature adjusting part further includes a temperature controller, the temperature controller is respectively electrically connected to the temperature detecting part and the commutator, and the temperature controller can send an instruction to the commutator according to the temperature signal sent by the temperature detecting part to switch the current direction of the semiconductor refrigerator.

[0039] According to another aspect disclosed by the present utility model, a testing machine is provided, and the testing machine includes the testing indenter described in any one of the above.

[0040] The embodiments of the present utility model have the following advantages:

[0041] By adopting the test indenter provided by the present utility model, a receiving cavity for installing a temperature detector is arranged at the heat-conducting end of the indenter body, so that when the heat-conducting end is in contact with the packaging surface of the chip, the temperature detector can be separated from the external environment, thereby reducing the influence of the external environment on the temperature detector; in addition, since the detection end of the temperature detector can keep in contact with the packaging surface, the accurate temperature of the chip can be obtained in a timely manner; of course, since the detection end can detect the position in the middle of the chip, the situation of inaccurate temperature measurement at the edge of the chip can be avoided, which is caused by the heat exchange between the edge of the chip and the external environment; obviously, due to the temperature difference between the middle and the edge of the chip, the temperature in the middle of the chip is higher than the temperature at the edge of the chip, so by detecting the temperature in the middle of the chip, the maximum temperature of the chip can be limited to avoid burning the chip due to exceeding the temperature limit.

[0042] In addition, the present utility model also relates to a testing machine. Since the above-mentioned test indenter has the above-mentioned technical effects, the testing machine including the test indenter should have the same technical effects, which will not be elaborated here.

[0043] In order to make the above-mentioned objects, features and advantages of the present utility model more obvious and understandable, the following specifically gives preferred embodiments and, in conjunction with the accompanying drawings, the detailed description is as follows. Description of the Drawings

[0044] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required to be used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present utility model, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

[0045] Figure 1 Shows a structural schematic diagram of a perspective view of the test indenter provided by the embodiment of the present utility model;

[0046] Figure 2 Shows an exploded view of the test indenter provided by the embodiment of the present utility model;

[0047] Figure 3 Shows an internal structural schematic diagram of the test indenter provided by the embodiment of the present utility model;

[0048] Figure 4 Shows Figure 3 The partial enlarged view at A in

[0049] Figure 5 Shows an internal structural schematic diagram of the radiator of the test indenter provided by the embodiment of the present utility model.

[0050] Main Component Symbol Description:

[0051] 100 - Heat conduction part; 110 - Heat conduction end; 111 - Hole and groove structure; 200 - Housing; 210 - Outer shell; 220 - Positioning frame; 230 - End cover; 231 - Concave area; 240 - Annular clamping groove; 250 - Limiting projection; 300 - Radiator; 310 - Water inlet end; 320 - Water outlet end; 330 - Annular flange; 400 - Elastic sealing ring; 500 - Locking part; 600 - First thermal grease layer; 700 - Temperature adjustment part; 800 - Second thermal grease layer; 900 - Temperature sensor; 910 - Cable; 920 - Detection end. Detailed implementation mode

[0052] The embodiments of the present invention will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present invention and should not be construed as a limitation to the present invention.

[0053] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there can also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. On the contrary, when an element is referred to as being "directly on" another element, there is no intermediate element. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for the purpose of illustration.

[0054] In the present invention, unless otherwise clearly specified and defined, the terms "installed", "connected", "connected", "fixed" and other terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. It can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0055] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, the meaning of "a plurality" is two or more unless otherwise clearly and specifically defined.

[0056] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terms used in the specification of the template herein are for the purpose of describing specific embodiments only and are not intended to limit the present utility model. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0057] In the related art, in order to master the real situation and data of the chip in the simulated actual application environment or extreme environment, it is necessary to test the chip in various temperature environments. Generally, the chip is usually tested for high and low temperatures through a chip tester.

[0058] During the performance test or aging test of the chip, the test head of the tester contacts the chip package surface to conduct heat transfer, so as to perform performance tests or life stability tests on the chip at different temperature set values within the temperature range of -55°C to 125°C. During the test process, it is necessary to monitor the temperature of the chip in real time. Generally, the temperature of the test head in contact with the chip is obtained to indirectly obtain the temperature of the chip. This method cannot accurately detect the temperature of the chip, and there is a heat transfer process between the test head and the chip, resulting in a lag in the detected temperature of the chip, making it impossible to control the temperature in a timely manner and unable to meet the increasingly strict actual requirements of the application side.

[0059] As Figure 1 and Figure 2 shown, in order to solve the above technical problems, according to one aspect disclosed by the present utility model, a test head is provided. The test head includes a head body and a temperature detection member. The head body has a heat conduction end 110, and the heat conduction end 110 is used to abut against the package surface of the chip, and the heat conduction end 110 has a receiving cavity; the temperature detection member is installed in the receiving cavity, and the temperature detection member has a detection end 920, and the detection end 920 can abut against the package surface.

[0060] To ensure that the heat conduction end 110 can efficiently transfer heat to the chip, the heat conduction end 110 is set as a planar structure, and the heat conduction end 110 and the package surface of the chip can be completely attached, and the heat conduction end 110 can cover the package surface, then it can be achieved.

[0061] Optionally, the receiving cavity can be opened at the edge of the heat conduction end 110 or set in the middle of the heat conduction end 110. There is no specific limitation here, and both can improve the accuracy of detecting the temperature of the chip; the difference is that since the edge of the chip is in an exposed state and has a high heat exchange efficiency with the environment, the middle of the chip can be completely covered and blocked by the heat conduction end 110 and has a low heat exchange efficiency with the environment. Obviously, relatively speaking, by installing the temperature detection member in the middle of the heat conduction end 110, the temperature of the middle of the chip can be measured more accurately.

[0062] Of course, setting the heat conduction end 110 to be able to cover the packaging surface of the chip can enable the chip to be evenly heated everywhere, which is beneficial to improving the accuracy of the detection result. For example, the heat conduction end 110 can be set in a square, circular, or polygonal shape, etc., and no specific limitation is made here.

[0063] Among them, the detection end 920 of the temperature detection component is kept in contact with the packaging surface of the chip, so as to ensure that the temperature of the chip can be directly obtained. Exemplarily, the detection end 920 can be set to be flush with the heat conduction end 110, so that the detection end 920 and the heat conduction end 110 can contact the chip synchronously.

[0064] It should be noted that the temperature detection component is required to have high temperature and low temperature resistance characteristics to adapt to the high temperature and low temperature tests of the chip. Or, only the detection end 920 can be set in the accommodation groove, so as to avoid the influence of high temperature or low temperature on the body of the temperature detection component.

[0065] It is easy to understand that the indenter body exchanges heat with the chip through the heat conduction end 110, so as to achieve the purpose of reducing or increasing the temperature of the chip. For example, during high temperature tests, the temperature of the heat conduction end 110 can be increased to heat the chip; during low temperature tests, the temperature of the heat conduction end 110 can be reduced to absorb the temperature of the chip and synchronously reduce the temperature of the chip. Generally, the temperature range of the chip is regulated to be in the interval of -55°C to 125°C.

[0066] Applying the test indenter provided by the present utility model, by providing an accommodation cavity for installing a temperature detection component on the heat conduction end 110 of the indenter body, when the heat conduction end 110 fits and abuts against the packaging surface of the chip, the temperature detection component can be separated from the external environment to reduce the influence of the external environment on the temperature detection component; in addition, since the detection end 920 of the temperature detection component can be kept in contact with the packaging surface, the accurate temperature of the chip can be obtained in a timely manner, and the temperature value deviation range of the chip is within ±1°C; of course, since the detection end 920 can detect the position in the middle of the chip, the situation of inaccurate temperature measurement at the edge of the chip can be avoided, which is caused by the heat exchange between the edge of the chip and the external environment; obviously, due to the temperature difference between the middle and the edge of the chip, the temperature in the middle of the chip is relatively higher than the temperature at the edge of the chip, so by detecting the temperature in the middle of the chip, the maximum temperature of the chip can be limited to avoid burning the chip due to exceeding the temperature limit.

[0067] As Figure 3 shown, on the basis of the above embodiments, the indenter body further has a wire passing hole communicating with the accommodation cavity, and the cable 910 of the temperature detection component is passed through the wire passing hole; wherein, the wire passing hole communicates with the outside of the indenter body.

[0068] That is to say, by setting a wire threading hole, the cable 910 connecting the temperature detection component and the external device can be installed. The external device can be a control terminal, such as a controller, a computer, etc. In addition, since the wire threading hole communicates with the accommodation groove, the accommodation groove and the wire threading hole form an air passage, so that the accommodation groove can be connected to the external environment to realize gas circulation, thereby reducing the influence of the high-temperature environment formed by the gas in the accommodation groove on the detection end 920.

[0069] Obviously, since the accommodation groove can communicate with the outside, it can avoid the formation of a vacuum environment between the heat conduction end 110 and the chip packaging surface after the heat conduction end 110 contacts the chip packaging surface, which is similar to an adhesion effect and is not conducive to the separation between the heat conduction end 110 and the chip when the detection is completed.

[0070] It should be noted that when the temperature detection component is installed in the accommodation groove, an air passage is formed between the gap between the temperature detection component and the accommodation groove and the wire threading hole.

[0071] Of course, in other embodiments, a hole can be provided to communicate the outside with the middle part of the heat conduction end 110.

[0072] On the basis of the above embodiments, a hole groove structure 111 is provided at the end of the heat conduction end 110 for abutting against the packaging surface, and the hole groove structure 111 communicates with the outside of the pressing head body.

[0073] Exemplarily, the hole groove structure 111 provided at the end of the heat conduction end 110 can be in the shape of a straight line, a T shape, a cross shape, etc., without specific limitation, as long as it can communicate the middle part of the heat conduction end 110 with the outside, so as to avoid the formation of a vacuum between the heat conduction end 110 and the chip.

[0074] On the basis of the above embodiments, the temperature detection component includes a temperature sensor 900, and the temperature sensor 900 is installed in the accommodation cavity. However, it is not limited to the temperature sensor 900, and other devices capable of realizing temperature detection can also be used, such as a contact thermometer, etc. Among them, the installation and principle of the temperature sensor 900 are common knowledge in the field and will not be elaborated here.

[0075] As Figure 4 shown, on the basis of the above embodiments, the test pressing head further includes an elastic member, and the temperature detection component is connected to the inner wall of the accommodation cavity through the elastic member; wherein, the elastic member is configured to be elastically deformed so that the detection end 920 remains in contact with the packaging surface.

[0076] That is to say, the elastic member can keep the detection end 920 in close contact with the packaging surface of the chip, thereby ensuring the detection accuracy. Generally, due to installation errors, it is easy to cause the detection end 920 to not be accurately flush with the end of the heat conduction end 110, and a great deal of workload and time are required to adjust the position of the detection member. However, after long-term use, there are still usage errors, resulting in the detection end 920 being unable to maintain close contact with the chip.

[0077] Furthermore, this problem can be eliminated by the elastic member. By utilizing the elastic deformation characteristic of the elastic member, the installation position of the temperature sensor 900 can be adjusted. In the initial state, the detection end 920 (i.e., the probe of the temperature sensor 900) slightly protrudes from the end face of the heat conduction end 110. Then, when the heat conduction end 110 contacts the packaging surface of the chip, the detection end 920 will be squeezed, and the squeezing force will be transmitted to the elastic member, causing the elastic member to undergo elastic deformation, so that the detection end 920 and the heat conduction end 110 are flush and maintain close contact with the packaging surface of the chip. Thus, problems such as installation errors do not need to be considered, and the situation where the detection end 920 is damaged due to extrusion can be effectively avoided. In addition, the difficulty of assembling the temperature sensor 900 in the later stage can be reduced.

[0078] As Figure 4 shown, on the basis of the above embodiment, the elastic member includes an elastic glue layer, and the temperature detection member is bonded to the inner wall of the accommodation cavity through the elastic glue layer.

[0079] That is to say, the temperature detection member is fixed in the accommodation cavity by gluing. Among them, the applied glue forms an elastic glue layer after drying and solidifying. The advantage of this method is that it can not only facilitate the quick installation and fixation of the temperature detection member, but also form an elastic member, reducing the space occupied by installing the elastic member. In other embodiments, the elastic member can also be formed by setting an elastic pad to enable the temperature detection member to move in the depth direction of the accommodation groove, such as a rubber elastic pad or a silicone pad, etc.; of course, the elastic member can also be set as a spring, etc.

[0080] Exemplarily, the temperature sensor 900 is cured in the accommodation groove through thermal conductive silica gel, and the detection end 920 of the temperature sensor 900 protrudes 0.05 mm from the end face of the heat conduction end 110. Of course, it can also be set to protrude 0.04 mm, 0.06 mm, 0.07 mm, 0.08 mm, etc. from the end face of the heat conduction end 110.

[0081] As Figure 2As shown, on the basis of the above embodiments, the indenter body includes a housing 200, a heat conduction part 100, and a temperature adjustment part 700. The housing 200 is formed with a heat insulation layer; the heat conduction part 100 is installed inside the housing 200, and the heat conduction part 100 has an extending end extending out of the housing 200, and the extending end forms the heat conduction end 110; the temperature adjustment part 700 is installed inside the housing 200, and the temperature adjustment part 700 can adjust the temperature of the heat conduction end 110.

[0082] Among them, the housing 200 has an inner cavity, and both the heat conduction part 100 and the temperature adjustment part 700 are installed in the inner cavity; by contacting the heat conduction part 100 and the temperature adjustment part 700, the temperature of the heat conduction part 100 can be adjusted through the temperature adjustment part 700. Obviously, to ensure that the heat conduction part 100 has excellent heat conduction performance, the heat conduction part 100 can be made of heat-conducting metal, that is, a low thermal resistance medium material, such as iron, aluminum, copper, etc. Optionally, a coating layer, such as a nickel plating layer, is provided on the surface of the heat conduction part 100 to avoid oxidation. Exemplarily, the heat conduction part 100 can be made of nickel-plated red copper material.

[0083] Exemplarily, the heat conduction part 100 can be provided with a protruding end to form the heat conduction end 110, and the heat conduction end 110 is used to contact the chip to enable heat exchange with the chip. It should be noted that for those skilled in the art, a hole can be opened in the housing 200 so that the heat conduction end 110 can extend out of the housing 200 from the hole. The hole can be set to be circular, square, diamond-shaped or polygonal, etc. Obviously, setting the shape of the hole to match the shape of the heat conduction end 110 can reduce the gap between the heat conduction end 110 and the hole, so as to reduce the heat dissipation from the inside of the housing 200 to the air and cause heat loss.

[0084] Of course, through the heat insulation layer formed by the housing 200, the heat exchange efficiency between the housing 200 and the outside can be further blocked, heat loss can be reduced, and the temperature can be accurately controlled. Exemplarily, the housing 200 is made of a low thermal resistance material; or, a heat insulation layer is provided inside the housing 200, and the heat insulation layer has high temperature resistance and flame retardant properties to be able to adapt to high temperature environments.

[0085] It should be noted that the temperature adjustment part 700 can be a radiator, such as a small plate radiator, etc., and heat exchange is carried out using a gas medium or a liquid medium. But it is not limited to this one kind.

[0086] As Figure 1 shown, on the basis of the above embodiments, the temperature adjustment part 700 includes a semiconductor refrigerator and a radiator 300. The semiconductor refrigerator has two working ends. Among them, one working end abuts against the heat conduction part 100, and the other working end is connected to the radiator 300.

[0087] That is, by energizing the thermoelectric cooler, electric energy is utilized for refrigeration or heating, thereby adjusting the temperature of the heat conduction part 100 in thermal contact with the thermoelectric cooler. Among them, to ensure the heat conduction efficiency between the heat conduction part 100 and the thermoelectric cooler, a surface contact can be set between the heat conduction part 100 and the thermoelectric cooler, and the area size of the end of the heat conduction part 100 in contact with the thermoelectric cooler is set to be not less than the area size of the end of the thermoelectric cooler in contact with the heat conduction part 100, so as to ensure that the heat conduction part 100 can cover the thermoelectric cooler and improve the heat conduction efficiency. In addition, to ensure the fitting degree between the thermoelectric cooler and the heat conduction part 100, a second thermal grease layer 800 can be set between the two to increase the contact area, further improve the heat conduction performance, and the second thermal grease can avoid the hard contact between the thermoelectric cooler and the heat conduction part 100 and can protect the thermoelectric cooler.

[0088] Of course, a first thermal grease layer 600 can also be set between the radiator 300 and the thermoelectric cooler. The specific reason is the same as above and will not be elaborated here.

[0089] On the basis of the above embodiments, the indenter body further includes a power conversion part, which is electrically connected to the thermoelectric cooler. The power conversion part is configured to: be able to provide at least a first current flowing in the forward direction and a second current flowing in the reverse direction to the thermoelectric cooler.

[0090] It is easy to understand that a thermoelectric cooler is a device that utilizes the thermoelectric effect of semiconductors to produce cooling capacity, also known as a thermoelectric refrigerator. Connect two different metals with a conductor and connect to direct current, then the temperature at one end decreases and the temperature at the other end increases.

[0091] That is to say, by changing the direction of the direct current flowing through the thermoelectric cooler, it can be selectively made that one end of the thermoelectric cooler in contact with the heat conduction part 100 refrigerates or heats, so as to adapt to low-temperature, normal-temperature or high-temperature tests of the chip. It can be understood that if the power supply is reversely connected, the temperature of the end of the thermoelectric cooler in contact with the heat conduction part 100 changes in the opposite direction. This phenomenon is called the Peltier effect, also known as the thermoelectric effect.

[0092] Different from traditional low-temperature refrigeration technologies, when the indenter is set at a temperature below zero, there is no need to circulate any low-temperature refrigerant or compressor inside it. Only normal-temperature liquid water needs to be provided to supply heat exchange to the radiator 300 built in the indenter. By performing heat and cold exchange on the working-state TEC, the indenter can reach any temperature value in the range of 0 to -55°C. That is to say, during refrigeration, one end of the thermoelectric cooler in contact with the heat conduction part 100 refrigerates, and the other end of the thermoelectric cooler far from the heat conduction part 100 heats, and then the heated end of the thermoelectric cooler is cooled by the radiator 300.

[0093] Based on the above embodiments, the power conversion unit includes a DC power supply and a commutator. The DC power supply is used to provide a direct current; the DC power supply is electrically connected to the semiconductor cooler through the commutator.

[0094] That is to say, the direction of the direct current flowing into the semiconductor cooler from the DC power supply is changed through the commutator. For example, when the direct current flows forward, one end of the semiconductor cooler in contact with the heat conduction part 100 cools; when the direct current flows reversely, one end of the semiconductor cooler in contact with the heat conduction part 100 heats. Among them, the DC power supply can be set to be formed by converting alternating current into direct current, and the details will not be elaborated here.

[0095] Based on the above embodiments, one end of the heat conduction part 100 opposite to the heat conduction end 110 abuts against the temperature adjustment part 700; wherein, a limiting part is arranged in the housing 200, and the limiting part can at least limit the movement of the heat conduction part 100 in the direction close to the temperature adjustment part 700, so that the limiting part can bear the extrusion force transmitted from the heat conduction part 100.

[0096] That is to say, by arranging a limiting part in the inner cavity of the housing 200 to limit the heat conduction part 100, a rigid contact is formed among the heat conduction part 100, the housing 200 and the limiting part, so that the limiting part can bear the reverse force generated by the chip on the heat conduction end 110 during the process of the heat conduction end 110 being pressed and contacting the chip. Most of this reverse force is transmitted to the housing 200, avoiding the concentration of the reverse force on the TEC and causing damage to the TEC.

[0097] As Figure 3 shown, based on the above embodiments, the limiting part includes a limiting protrusion 250. The limiting protrusion 250 is connected to the heat conduction part 100, and the housing 200 has a limiting groove. The limiting protrusion 250 is inserted into the limiting groove; wherein, the limiting protrusion 250 can at least abut against the side wall of the limiting groove far from the heat conduction end 110.

[0098] Optionally, the limiting groove is arranged on the side wall of the housing 200, and the limiting protrusion 250 fixed to the heat conduction part 100 is inserted into the limiting groove to realize the limitation of the heat conduction part 100 in the approaching or departing direction. Among them, the limiting groove can be set as a blind hole to reduce the heat loss in the housing 200.

[0099] Exemplarily, the limiting groove is set as a conical blind hole. Correspondingly, the limiting protrusion 250 is set as a cone, and the two are matched through a conical surface to enable precise limitation.

[0100] Of course, a limiting groove can also be formed by arranging an annular groove in the housing 200; the heat conduction part 100 is provided with an annular skirt to form the limiting protrusion 250, thereby increasing the contact area between the heat conduction part 100 and the limiting part and being able to withstand a greater reverse force.

[0101] As Figure 3 shown, on the basis of the above embodiments, a heat-conducting partition is provided inside the housing 200. The heat-conducting partition is used to divide the inner cavity of the housing 200 into two chambers, and the radiator 300 and the semiconductor cooler are respectively located in different chambers.

[0102] It is easy to understand that if the cooling medium of the radiator 300 is liquid, the housing 200 is separated by the heat-conducting partition to respectively install the radiator 300 and the semiconductor cooler, so that the two can be isolated to avoid short-circuit damage of the semiconductor cooler caused by water leakage of the radiator 300.

[0103] As Figure 3 shown, on the basis of the above embodiments, an annular clamping groove 240 is provided inside the housing 200. The base of the radiator has an annular flange 330, and the annular flange 330 is inserted into the annular clamping groove 240; wherein, an elastic sealing ring 400 is provided between at least one side of the opposite sides of the annular flange 330 and the corresponding side wall on the annular clamping groove 240, and the elastic sealing ring, the annular flange and the annular clamping groove form a heat-conducting partition.

[0104] The annular flange 330 can increase the contact area between the radiator 300 and the heat-conducting part 100, improve the heat dissipation efficiency, and the annular flange 330 can be integrally provided with the radiator 300.

[0105] Exemplarily, a groove for installing the elastic sealing ring 400 is provided on the upper side wall of the annular clamping groove 240. The elastic sealing ring 400 is pre-installed in the groove, and then the annular flange 330 is inserted into the annular clamping groove 240, and the elastic sealing ring 400 is kept in contact with the annular flange 330, thereby realizing sealing.

[0106] Of course, it is not limited to this sealing method only, and sealant can also be used for sealing. The difference is that the method of using the elastic sealing ring 400 for sealing is convenient for disassembly and assembly.

[0107] As Figure 2 and Figure 3 shown, on the basis of the above embodiments, the housing 200 is at least formed by enclosing an outer shell 210, a positioning frame 220 and an end cover 230; wherein, the end cover 230 is provided with a process hole, the heat-conducting end 110 passes through the process hole, and a concave area 231 is provided at one end of the end cover 230 in contact with the heat-conducting part 100.

[0108] It can be understood that by providing the concave area 231, the contact area between the heat-conducting part 100 and the end cover 230 can be reduced to reduce the heat transferred from the heat-conducting part 100 to the end cover 230. Of course, a plurality of protrusions can also be provided at one end of the heat-conducting part 100 in contact with the end cover 230, which can also reduce the contact area between the two.

[0109] Based on the above embodiments, an annular clamping groove 240 is formed between the outer shell 210 and the positioning frame 220; and / or, a limiting groove is formed between the positioning frame 220 and the end cover.

[0110] By setting the housing 200 as a split type, it is convenient to install internal components; in addition, an annular clamping groove 240 can be set between the outer shell 210 and the positioning frame 220. Furthermore, the radiator can be pre-placed on the first annular sunken platform at the upper end of the positioning frame 220, and then the elastic sealing ring 400 can be installed in the groove on the second annular sunken platform at the lower end of the outer shell 210. Then, by installing the outer shell 210 at the upper end of the positioning frame 220, an annular clamping groove 240 is formed between the first annular sunken platform and the second annular sunken platform, which is convenient for assembly.

[0111] In addition, the same principle as that of the annular clamping groove 240 can be adopted to form a limiting groove between the lower end of the positioning frame 220 and the upper end of the end cover, which is also beneficial to pre-processing and post-assembly. Of course, the annular clamping groove 240 and the limiting groove can also be formed in other ways, which are not specifically limited herein.

[0112] Based on the above embodiments, the temperature adjustment part 700 further includes a thermostat, which is electrically connected to the temperature detection part and the commutator respectively. The thermostat can send an instruction to the commutator according to the temperature signal sent by the temperature detection part to switch the current direction of the semiconductor refrigerator.

[0113] This thermostat is electrically connected to the temperature detection part and is different from the traditional temperature controller. This thermostat is connected to the commutator by adopting a PID algorithm to realize the high and low temperature control of one end of the TEC contact heat conduction part 100 by changing the current direction. That is to say, if the temperature of one end of the TEC contact heat conduction part 100 is too high, the current direction is changed to make one end of the TEC contact heat conduction part 100 refrigerate and then cool down; if the temperature of one end of the TEC contact heat conduction part 100 is too low, the current direction is changed to make one end of the TEC contact heat conduction part 100 heat and then heat up. The test head realizes the temperature control accuracy of the test head within ±0.5 °C through the detection and control of the cooperation between the thermostat and the radiator 300.

[0114] As Figure 5 shown, based on the above embodiments, the radiator 300 has a cooling channel for the cooling medium to flow through. The water inlet end 310 and the water outlet end 320 of the radiator 300 are respectively connected to the water inlet pipe and the water outlet pipe for conveying the cooling medium. The cooling medium can be a liquid, such as cooling water. A number of flow disturbing protrusions are provided in the cooling channel, and the number of flow disturbing protrusions are arranged at intervals along the extension direction of the cooling channel, so that a turbulent flow can be formed in the cooling channel, the flow rate can be reduced, and sufficient heat exchange can be carried out to avoid the formation of a boundary layer on the inner wall of the cooling channel and improve the heat dissipation efficiency.

[0115] Based on the above embodiments, a locking part 500 may be provided at the upper end of the outer shell 210 to facilitate connection with the power component. The test indenter is driven to move by the power component to perform pressing and releasing actions. Among them, the setting of the locking part 500 facilitates later disassembly, installation and maintenance. Exemplarily, the locking part 500 may be a locking bolt or the like.

[0116] According to another aspect disclosed by the present utility model, a testing machine is provided, and the testing machine includes the test indenter of any one of the above.

[0117] Since the above test indenter has the above technical effects, the testing machine including this test indenter should have the same technical effects, which will not be elaborated here.

[0118] In all the examples shown and described here, any specific value should be construed as merely exemplary, rather than as a limitation. Therefore, other examples of the exemplary embodiments may have different values.

[0119] It should be noted that: like reference numerals and letters denote like items in the following figures. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0120] The above-described embodiments merely represent several implementation manners of the present utility model. The description thereof is relatively specific and detailed, but should not be construed as a limitation on the scope of the present utility model. It should be pointed out that for those of ordinary skill in the art, without departing from the concept of the present utility model, several modifications and improvements can still be made, and these all belong to the protection scope of the present utility model.

Claims

1. A test pressure head, characterized in that: The test pressure head comprises: A pressure head body, wherein the pressure head body has a heat-conducting end, the heat-conducting end is used to abut against the packaging surface of the chip, and the heat-conducting end has a receiving cavity; and A temperature detection component is installed in the accommodating cavity, and the temperature detection component has a detection end, and the detection end can abut against the packaging surface.

2. The test indenter according to claim 1, characterized in that: The pressure head body also has a threading hole connected to the accommodating cavity, and the cable of the temperature detection component is passed through the threading hole; wherein the threading hole is connected to the outside of the pressure head body.

3. The test indenter according to claim 1 or 2, characterized in that: The end of one end of the heat-conducting end that is used to abut against the packaging surface is provided with a hole groove structure, and the hole groove structure is communicated with the outside of the pressure head body.

4. The test indenter according to claim 1, characterized in that: The temperature detection element comprises: A temperature sensor is installed in the accommodating cavity.

5. The test indenter according to claim 1 or 4, characterized in that: The test pressure head also includes an elastic member, and the temperature detection member is connected to the inner wall of the accommodating cavity through the elastic member; wherein the elastic member is configured to be elastically deformable so that the detection end remains in contact with the packaging surface.

6. The test indenter according to claim 5, characterized in that: The elastic member comprises: An elastic adhesive layer, through which the temperature detection element is bonded to the inner wall of the accommodating cavity.

7. The test indenter according to claim 1, characterized in that: The pressure head body comprises: a housing formed with a heat-insulating layer; and a heat conducting portion, the heat conducting portion being installed in the housing and having an extended end extending out of the housing, the extended end forming the heat conducting end; and A temperature regulating part is installed in the shell and can regulate the temperature of the heat conducting end.

8. The test indenter according to claim 7, characterized in that: The temperature regulating unit comprises: A semiconductor refrigerator and a radiator, wherein the semiconductor refrigerator has two working ends, wherein one of the working ends abuts against the heat conducting part, and the other working end is connected to the radiator.

9. The test indenter according to claim 8, characterized in that: The pressure head body also includes: A power conversion unit is electrically connected to the semiconductor refrigerator, and the power conversion unit is configured to at least provide the semiconductor refrigerator with a first current flowing in a forward direction and a second current flowing in a reverse direction.

10. The test indenter according to claim 9, characterized in that: The power conversion unit includes: a DC power supply for providing a DC current; and A commutator, wherein the DC power supply is electrically connected to the semiconductor refrigerator via the commutator.

11. The test indenter according to claim 10, characterized in that: The temperature regulating unit also includes a temperature controller, which is electrically connected to the temperature detection element and the commutator respectively. The temperature controller can send instructions to the commutator according to the temperature signal sent by the temperature detection element to switch the current direction of the semiconductor refrigerator.

12. The test indenter according to claim 8, characterized in that: An end of the heat-conducting portion opposite to the heat-conducting end is in contact with the temperature regulating portion; in A limiting portion is provided in the shell, and the limiting portion can at least limit the heat conducting portion from moving in a direction close to the temperature regulating portion, so that the limiting portion can bear the extrusion force transmitted from the heat conducting portion.

13. The test indenter according to claim 12, characterized in that: The limiting part comprises: A limiting protrusion is connected to the heat conducting part, the shell has a limiting groove, and the limiting protrusion is inserted into the limiting groove; wherein the limiting protrusion can at least abut against the side wall of the limiting groove away from the heat conducting end.

14. The test indenter according to claim 13, characterized in that: When the cooling medium of the radiator is liquid, a heat-conducting partition is provided in the shell, and the heat-conducting partition is used to divide the inner cavity of the shell into two chambers. The radiator and the semiconductor refrigerator are respectively located in different chambers.

15. The test indenter according to claim 14, characterized in that: An annular groove is provided in the shell, and the base of the radiator has an annular flange, which is inserted into the annular groove; wherein, an elastic sealing ring is provided between at least one of the two opposite sides of the annular flange and the corresponding side wall of the annular groove, and the elastic sealing ring, the annular flange and the annular groove form the heat-conducting partition part.

16. The test indenter according to claim 15, characterized in that: The housing is at least formed by a casing, a positioning frame and an end cover arranged in sequence; wherein The end cover is provided with a process hole, the heat conducting end is passed through the process hole, and one end of the end cover in contact with the heat conducting part is provided with a recessed area; And / or, the annular groove is formed between the housing and the positioning frame; And / or, the limiting groove is formed between the positioning frame and the end cover.

17. A testing machine, characterized in that: The testing machine comprises a testing indenter as claimed in any one of claims 1 to 16.

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