Display panel and display device

Abstract

The utility model provides a display panel and a display device, and belongs to the technical field of display. The display panel of the present disclosure includes: a display substrate including a plurality of signal lines; the functional film layer is arranged on one side of the display substrate; the supporting structure is arranged on the side, away from the functional film layer, of the display substrate; an adapter member; the connecting circuit board is arranged on one side, far away from the display substrate, of the supporting structure; wherein the supporting structure shrinks inwards relative to the display substrate to form a first space, the switching component is arranged in the first space, and the signal lines are connected with the connecting circuit board through the switching component in the first space.

Description

Technical Field

[0001] The present disclosure belongs to the field of display technology, and particularly relates to a display panel and a display device. Background Art

[0002] With the development of active matrix organic light-emitting diode (AMOLED) display technology, the borders of flexible AMOLED products are gradually reduced, the screen-to-body ratio is gradually increased, and the product thickness is gradually reduced. In order to further improve the user experience, how to make the borders of display products narrower is a technical problem that needs to be solved urgently. Utility Model Content

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art and provides a display panel and a display device.

[0004] The present disclosure provides a display panel, including:

[0005] A display substrate including a plurality of signal lines;

[0006] The functional film layer is arranged on one side of the display substrate;

[0007] A supporting structure, arranged on a side of the display substrate away from the functional film layer;

[0008] Transition components; and

[0009] A connecting circuit board is arranged on a side of the supporting structure away from the display substrate; wherein,

[0010] The support structure is retracted relative to the display substrate to form a first space,

[0011] The transfer component is arranged in the first space,

[0012] The plurality of signal lines are connected to the connection circuit board through the adapter component in the first space.

[0013] In some embodiments, the display substrate includes a display area and a peripheral area located on at least one side of the display area, and the display substrate is not provided with a bending area and a pad area.

[0014] In some embodiments, the connection circuit board does not contact the display substrate.

[0015] In some embodiments, the support structure includes a back film and a support layer which are sequentially arranged away from the display substrate, and at least one of the back film and the support layer is retracted to form the first space.

[0016] In some embodiments, the backing film and the support layer are recessed to form substantially flush edges.

[0017] In some embodiments, the connecting circuit board is directly disposed on the supporting layer to form a pad area, and the pad area is located on the supporting layer.

[0018] In some embodiments, the functional film layer includes a polarizer, and an edge of at least one side of the polarizer is substantially flush with an edge of at least one side of the display substrate.

[0019] In some embodiments, the display substrate includes a display area and a peripheral area located on at least one side of the display area, and an edge of the support structure is closer to the display area than an edge of the polarizer.

[0020] In some embodiments, the transfer component is located in a peripheral area of ​​the display substrate.

[0021] In some embodiments, a sealing structure is filled in the first space; the adapter component is wrapped by the sealing structure, and two ends thereof are oppositely arranged along the thickness direction of the display substrate and are respectively connected to the signal line and the connection circuit board.

[0022] In some embodiments, the connecting circuit board includes at least a first connecting pad connected to the transfer component and a second connecting pad boundly connected to the driving circuit board; the driving circuit board is configured to provide a driving signal to the signal line.

[0023] In some embodiments, the connection circuit board further includes a third connection pad, the third connection pad is bound and connected to the driving chip, and the driving chip is configured to provide a driving signal to the signal line under the control of the driving circuit board.

[0024] In some embodiments, the number of the first connecting pads is multiple, and the multiple first connecting pads are arranged side by side; the connecting circuit board also includes a first alignment pad and a second alignment pad, and the multiple first connecting pads are arranged between the first alignment pad and the second alignment pad.

[0025] In some embodiments, the connection circuit board is bonded to a side of the support structure away from the display substrate through a first bonding layer.

[0026] In some embodiments, the display substrate includes a display area and a peripheral area located on at least one side of the display area; the display panel further includes:

[0027] A cover plate is arranged on a side of the functional film layer away from the display substrate; an edge of the cover plate is farther away from the display area than an edge of the display substrate;

[0028] The edge sealant is disposed on the side of the cover plate close to the display substrate and at least partially surrounds the display area, and the edge sealant is at least used to seal the edge of the display substrate.

[0029] In some embodiments, the edge sealant includes a first edge-sealing component and a second edge-sealing component; wherein,

[0030] The first edge-sealing component is disposed on the side of the edge of the display substrate away from the display area;

[0031] The second edge-sealing component is connected to the first edge-sealing component and is disposed on the side of the layer where the connection circuit board is located away from the support structure.

[0032] In some embodiments, the first edge-sealing component includes multiple layers of auxiliary film layers stacked in sequence in a direction away from the cover plate; the second edge-sealing component and the auxiliary film layer farthest from the cover plate are of an integral structure.

[0033] In some embodiments, both the first edge-sealing component and the second edge-sealing component are made of acrylate materials.

[0034] In some embodiments, it further includes an ink layer disposed on the side of the cover plate close to the functional film layer, the ink layer is located in the peripheral area and is disposed around the display area.

[0035] An embodiment of the present disclosure provides a display device, which includes the display panel described in any one of the above. Description of the Drawings

[0036] Figure 1 It is a schematic diagram of an exemplary display panel.

[0037] Figure 2 It is Figure 1 a pixel circuit diagram in a pixel area in

[0038] Figure 3 It is a cross-sectional view of an exemplary display panel.

[0039] Figure 4 It is a front schematic view of the display panel according to the embodiment of the present disclosure.

[0040] Figure 5 It is a back schematic view of the display panel according to the embodiment of the present disclosure.

[0041] Figure 6 It is a cross-sectional view of the display panel according to the embodiment of the present disclosure.

[0042] Figure 7 It is a partial schematic view of an exemplary display panel.

[0043] Figure 8 A partial schematic diagram of the display panel according to an embodiment of the present disclosure.

[0044] Figure 9 A partial schematic diagram of an exemplary display panel.

[0045] Figure 10 A partial schematic diagram of the display panel according to an embodiment of the present disclosure.

[0046] Figure 11 A schematic diagram of the connection circuit board according to an embodiment of the present disclosure.

[0047] Figure 12 A cross-sectional schematic diagram of the display panel according to an embodiment of the present disclosure.

[0048] Figure 13 A partial structural schematic diagram of the display substrate according to an embodiment of the present disclosure. Detailed implementation manners

[0049] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Apparently, the described embodiments are some but not all of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the described embodiments of the present invention without creative efforts shall fall within the scope of protection of the present invention.

[0050] Unless otherwise defined, the technical terms or scientific terms used herein shall have the ordinary meanings as understood by those of ordinary skill in the art to which the present invention pertains. The "first", "second" and similar terms used in the specification and claims of this patent application of the present invention do not denote any order, quantity or importance, but are only used to distinguish different components. Similarly, the terms such as "a" or "one" do not denote a quantity limitation, but mean that there is at least one. The terms such as "include" or "comprise" mean that the elements or items appearing before "include" or "comprise" cover the elements or items listed after "include" or "comprise" and their equivalents, and do not exclude other elements or items. The terms such as "connect" or "couple" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. The terms such as "upper", "lower", "left" and "right" are only used to represent relative positional relationships, and when the absolute position of the object being described changes, the relative positional relationships may also change accordingly.

[0051] In the following description, when an element or layer is referred to as "on" or "connected to" another element or layer, the element or layer can be directly on the other element or layer, directly connected to the other element or layer, or there can be intermediate elements or intermediate layers. However, when an element or layer is referred to as "directly on" or "directly connected to" another element or layer, there are no intermediate elements or intermediate layers. The term "and / or" includes any and all combinations of one or more of the associated listed items.

[0052] Although terms such as first, second, etc. may be used herein to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are used to distinguish one element, component, region, layer, and / or part from another element, component, region, layer, and / or part. Thus, without departing from the teachings of the present disclosure, the first element, first component, first region, first layer, and / or first part discussed below may be referred to as the second element, second component, second region, second layer, and / or second part.

[0053] For purposes of description, spatial relative terms such as "under", "below", "lower", "above", "upper", etc. may be used herein to describe the relationship of one element or feature to another (other) element or feature as shown in the figures. In addition to the orientation depicted in the figures, the spatial relative terms are intended to encompass different orientations of the device during use, operation, and / or manufacture. For example, if the device in the figures is flipped, an element described as "under" or "below" another element or feature will then be positioned "above" the other element or feature. Thus, the exemplary term "under" can encompass both the upper and lower orientations.

[0054] Figure 1 It is a schematic diagram of an exemplary display panel; Figure 2 is Figure 1 the pixel circuit diagram in a pixel region in Figure 3 It is a cross-sectional view of an exemplary display panel; as Figures 1 - 3 shown, the display panel includes a display substrate 1. In some embodiments, the display substrate is a flexible display substrate and the display panel is a flexible display panel. The display substrate 1 is divided into a display area AA, a peripheral area PA surrounding the display area AA, a pad area WA located on the side of the peripheral area PA away from the display area AA, and a bending area BA located between the peripheral area PA and the pad area WA and configured to bend along a bending axis BX. For the sake of edge description, the part of the peripheral area PA located between the bending area BA and the display area AA is referred to as a connection area TPA.

[0055] Among them, the display substrate 1 includes a substrate, signal lines 11 disposed on the substrate. For example, the signal lines 11 include a plurality of gate lines GL (Gate Line) extending in the x direction and a plurality of data lines DL (Data Line) extending in the y direction. The plurality of gate lines GL and the plurality of data lines DL intersect to define a plurality of pixel regions. A pixel P (Pixel) is disposed in each pixel region, and each pixel P has an organic light-emitting element, such as an organic light-emitting diode OLED (Organic Light-Emitting Diode). Since the light emitted by the organic light-emitting diode can be used for image display, the region where the plurality of pixel regions are located is defined as a display region AA. A peripheral region PA is disposed outside the display region AA, and the peripheral region PA cannot display an image and is a non-display region.

[0056] As Figure 2 shown, each pixel P includes a pixel circuit PC (Pixel Circuit) and an organic light-emitting diode OLED connected to the pixel circuit PC. The pixel circuit PC is connected to the gate line GL and the data line DL corresponding to the pixel P. The pixel circuit PC includes a driving thin-film transistor (Thin-film Transistor, TFT) Td, a switching TFT Ts, and a storage capacitor Cst. The switching TFT Ts is connected to the gate line GL and the data line DL and is configured to transmit the data signal received through the data line DL to the driving TFT Td according to the scan signal received through the gate line GL. The storage capacitor Cst is connected to the switching TFT Ts and the driving voltage line PL and is configured to store a voltage corresponding to the difference between the voltage received from the switching TFT Ts and the driving voltage ELVDD supplied to the driving voltage line PL. The driving TFT Td is connected to the driving voltage line PL and the storage capacitor Cst and can be used to control the driving current flowing from the driving voltage line PL to the organic light-emitting diode OLED according to the voltage value stored in the storage capacitor Cst. The organic light-emitting diode OLED can emit light with a desired brightness through the driving current. The organic light-emitting diode OLED can emit, for example, red light, green light, blue light, or white light. Although Figure 2 the case where the pixel P includes two TFTs and one storage capacitor Cst is shown, exemplary embodiments of the present disclosure may adopt different arrangements of transistors and memories. In other embodiments, the pixel circuit PC of the pixel P may include three or more TFTs or two or more storage capacitors.

[0057] Continue to refer to Figure 3The display substrate 1 also includes a plurality of connecting pads 4 located in the pad area WA, each of which is configured to electrically connect a signal line 11 extending from the display area AA or the peripheral area PA. The connecting pads 4 may be exposed on the surface of the pad area WA, that is, not covered by any layer, so that it is convenient to electrically connect to the flexible printed circuit board FPCB (Flexible Print Circuit Board). The flexible printed circuit board FPCB is electrically connected to an external controller and is configured to transmit signals or power from the external controller. For example, the connecting pads 4 are electrically connected to the common signal line, the connecting pads 4 are electrically connected to the touch signal line, the connecting pads 4 are electrically connected to the drive signal line, and the connecting pads 4 are electrically connected to the data connection line (the data connection line is electrically connected to the data line DL in the display area AA). The connecting pads 4 are electrically connected to each signal line 11, so that the signal line 11 can communicate with the flexible printed circuit board FPCB. There is no specific restriction on the number and arrangement of the connecting pads 4, and they can be set according to actual needs.

[0058] Continue to refer to Figure 3 The display panel also includes a functional film layer and a cover plate 5 arranged on the light-emitting side of the display substrate 1, and a support structure 3 located on the backlight side of the display substrate 1 (the side away from the functional film layer). The cover plate 5 is located on the side of the functional film layer away from the display substrate 1. The present disclosure takes the functional film layer as a polarizer 2 as an example for explanation. The polarizer 2 extends from the display area AA to the peripheral area PA. The polarizer 2 can be a circular polarizer, specifically composed of a polarizer and a 1 / 4 wave plate. The setting of the polarizer 2 can improve the contrast of the display panel and reduce reflected light. The transparent optical adhesive layer 6 is arranged between the cover plate 5 and the polarizer 2 to bond the two together. The support structure 3 is used to provide a certain support force for the display substrate 1. The support structure 3 may include a back film 31 and a support layer 32 arranged in sequence in a direction away from the display substrate 1. Among them, the support layer 32 may be made of metal material and extend from the display area AA of the display substrate 1 to the connection area TPA. In order to facilitate bending, the back film 31 is provided with a groove at the position corresponding to the bending area BA.

[0059] Combination Figure 1 and Figure 3 As shown, after the bending area BA of the display substrate 1 is bent along the bending axis BX, the pad area WA of the display substrate 1 is located on the side of the support structure 3 away from the polarizer 2. Since the connecting pads 4 of the pad area WA will be connected to the flexible printed circuit board (or the driving chip), in order to avoid signal interference, an electromagnetic shielding layer 9 is provided on the side of the support layer 32 away from the back film 31, which can not only prevent electromagnetic interference, but also dissipate heat for the flexible printed circuit board and the display substrate 1.

[0060] Continue to refer to Figure 3, a protective layer 8 is provided on the display substrate 1, and the protective layer 8 covers at least the bending area BA. In some examples, the protective layer 8 can also extend to the position in the connection area TPA that is not blocked by the polarizer 2. The protective layer 8 uses MCL glue, that is, Micro Coating Layer glue, to protect the bending area BA and the exposed part of the connection area TPA, preventing environmental factors such as moisture, oxygen, and temperature changes from damaging the signal line 11.

[0061] Continue to refer to Figure 3 , the display panel further includes an ink layer 7 located in the peripheral area PA. The ink layer 7 is provided on the surface of the cover plate 5 close to the polarizer 2, and there is a certain overlap amount between the ink layer 7 and the polarizer 2, that is, the orthographic projections of the ink layer 7 and the polarizer 2 on the plane where the cover plate 5 is located overlap. The ink layer 7 can play a role in protecting the screen and preventing the screen from being scratched and worn.

[0062] For Figure 3 the shown display panel, its border width is related to factors such as the bending radius of the bending area BA and the bending starting position of the bending area BA. Among them, when manufacturing the protective layer 8, first coat the colloid on the display substrate 1, and then cure the colloid to form the protective layer 8. Before curing, the colloid will flow to a certain extent and climb along the side of the polarizer 2, resulting in the protective layer 8 formed after the colloid is cured not being flat at the position close to the polarizer 2. In order to prevent damage to the signal line on the display substrate 1, the bending starting point of the bending area BA close to the polarizer 2 can be set at the flat position of the protective layer 8, such as Figure 3 the w position in Figure 3As shown, the bending starting point is position w, then the frame width of the display panel is T = A + B + C + D + E + F + G + H, wherein A is the distance from the side edge VA of the ink layer 7 close to the display area AA to the display area AA, which is related to the bonding accuracy of the vacuum bonding device (D-lami), which is used to bond the cover plate 5 to the display substrate 1; B is the overlap width of the polarizer 2 and the ink layer 7; C is the distance between the bending starting point (i.e., position w) and the side edge of the polarizer 2. The distance between the edges; D is the distance between the orthographic projection of the bending starting point on the back film 31 and the edge of the back film 31; E is the bending radius of the bending area BA; F is the thickness of the portion of the display substrate 1 located in the bending area BA; G is the thickness of the protective layer 8; H is the width of the middle frame assembly frame, that is, after the middle frame is set around the display panel, the distance from the cross section of the bending area BA perpendicular to the cover plate 5 to the middle frame; that is, the distance between the outer edge of the orthographic projection of the bending area BA on the cover plate 5 and the edge of the cover plate 5. Usually, A ≥ 150μm, B ≥ 276μm, C ≥ 200μm, D ≥ 80μm, E ≥ 200μm, F + G ≥ 94μm, H ≥ 0.71mm, then T ≥ 1.71mm. The inventors found that for this type of display panel, the pad area WA is folded to the backlight side of the display substrate 1 by bending in the bending area BA, which results in a wider frame width of the display panel.

[0063] In view of the problems existing in the above display panel, the embodiments of the present disclosure provide the following display panel: The display panel may be a flexible display panel as described above, or may be a non-flexible display panel. Figure 4 is a front schematic diagram of a display panel according to an embodiment of the present disclosure; Figure 5 is a schematic diagram of the back side of a display panel according to an embodiment of the present disclosure; Figure 6 is a cross-sectional view of a display panel according to an embodiment of the present disclosure; Figures 4 - 6 As shown, the display panel of the embodiment of the present disclosure includes a display substrate 1, a functional film layer and a support structure 3. Among them, the display substrate 1 includes a plurality of signal lines 11; the functional film layer is arranged on the light-emitting side of the display substrate 1. Exemplarily, the functional film layer is a film layer used to adjust the light. The embodiment of the present disclosure is described by taking the functional film layer as a polarizer 2 as an example. The support structure 3 is arranged on the side of the display substrate 1 away from the polarizer 2. The display panel also includes: a transition component 101 and a connecting circuit board 100. Among them, the support structure 3 is retracted relative to the display substrate 1 to form a first space, and the transition component 101 is arranged in the first space. The connecting circuit board 100 is arranged on the side of the support structure 3 away from the display substrate 1, and the plurality of signal lines 11 are connected to the connecting circuit board 100 through the transition component 101 in the first space.

[0064] It should be noted that the support structure 3 includes a top surface facing the display substrate 1, a bottom surface away from the display substrate 1, and a side surface connected between the top surface and the bottom surface. The support structure 3 is retracted relative to the display substrate 1, which means that the orthographic projection of at least part of the side surface of the support structure 3 on the display substrate 1 is located inside the edge of the display substrate 1. The first space is the space that is arranged opposite to the side surface of the support structure 3 and does not exceed the edge of the display substrate 1. Figure 6 The L indicated in is the width of the first space.

[0065] It should also be noted that the connecting circuit board 100 is used to connect a driving circuit board (such as a flexible printed circuit board), a driving chip, etc., that is, the external driving circuit can provide a corresponding driving signal to the signal line 11 through the connecting circuit board 100.

[0066] In the embodiment of the present disclosure, the connecting circuit board 100 is arranged on the side of the display substrate 1 away from the polarizer 2, and the supporting structure 3 is retracted relative to the display substrate 1 to form a first space; the signal line 11 is connected to the connecting circuit board 100 through the adapter component 101 arranged in the first space. Therefore, compared with Figure 3 For the display panel in the embodiment of the present disclosure, the space around the support structure 3 is fully utilized, so that the adapter component 11 used to transmit the driving signal to the signal line 11 is closer to the support structure 3, which is beneficial to reduce the border width of the display panel.

[0067] In some examples, reference Figure 4 As shown, the display substrate 1 includes a display area AA and a peripheral area PA located at least on one side of the display area AA. The display area AA is used to display images. A plurality of gate lines GL and a plurality of data lines DL are arranged in the display area AA. The plurality of gate lines GL and the plurality of data lines DL intersect to define a plurality of pixel areas, and each pixel area is provided with a pixel P. The structure of the display area AA of the display substrate 1 can be the same as that described above. Figures 1 to 3 The display substrate 1 shown adopts the same structure, so the structure of the display area AA of the display substrate 1 will not be described in detail here.

[0068] and Figure 1 , Figure 3 The display panel shown is different in that Figures 4 to 6 In the display panel shown, the display substrate 1 is not provided with the above-mentioned bending area BA and pad area WA, that is, the display substrate 1 is no longer bent, and there will be no bending radius, thereby reducing the frame width of the display panel.

[0069] In addition, due to the cancellation of the bending area BA, some improvements can be made to the peripheral area PA of the display substrate 1 to further reduce the frame, which will be specifically described below in conjunction with the specific structure.

[0070] ReferenceFigure 6 The support structure 3 in the embodiment of the present disclosure may also include a back film 31 and a support layer 32 arranged in sequence in a direction away from the display substrate 1. At least one of the back film 31 and the support layer 32 is retracted to form the first space. For example, Figure 6 As shown, the back film 31 and the support layer 32 are both retracted relative to the display substrate 1 , so as to facilitate the connection between the adapter component 101 in the first space and the signal line 11 and the connection circuit board 100 .

[0071] In some examples, such as Figure 6 As shown, the back film 31 and the support layer 32 are retracted to form substantially flush edges. Wherein, “substantially flush” means that there may be a small misalignment between the edge of the back film 31 and the edge of the support layer 32, for example, the width of the misalignment is less than the thickness of the back film 31, or less than half the thickness of the back film 31; of course, the edge of the back film 31 and the edge of the support layer 32 may also be completely flush.

[0072] In other examples, both the back film 31 and the support layer 32 shrink relative to the display substrate 1 , and the shrinking edges of the two are not flush.

[0073] The relative position relationship between the edges of some film layers in the display panel of the embodiment of the present disclosure is as follows. Figure 3 The embodiments shown are compared. Figure 7 is a partial schematic diagram of an exemplary display panel, Figure 7 Indicated Figure 3 The display substrate 1 and the back film 31 are flattened; Figure 7 As shown, the pad area WA includes a first pad area WA1 for bonding with the driver chip D-IC and a second pad area WA2 for bonding with the flexible printed circuit board FPCB. Since the bending area BA needs to be bent so that the pad area WA is turned to the side of the display substrate 1 away from the polarizer 2, a groove is dug on the back film 31 to form a groove Q1 to release the stress caused by the bending. At the same time, in order to protect the bent portion of the display substrate 1 after bending, a protective layer 8 (i.e., a protective layer 8) is coated on the portion of the display substrate 1 not covered by the polarizer 2. Figure 7 and, from the above description of the bending starting point, it can be seen that there needs to be a certain distance between the bending starting point and the polarizer 2. Figure 8 is a partial schematic diagram of a display panel according to an embodiment of the present disclosure; Figure 8As shown, the display substrate 1 in the embodiment of the present disclosure eliminates the bending area BA part and the pad area WA part, so there is no need to apply the protective layer 8, so the lateral distance between the edge of the display substrate 1 and the edge of the polarizer 2 can be reduced; the lateral distance refers to the distance between the orthographic projection of the edge of the display substrate 1 on the reference plane and the orthographic projection of the edge of the polarizer 2 on the reference plane, and the reference plane is a plane perpendicular to the thickness direction of the display substrate 1. In one example, the lateral distance between the edge of at least one side of the polarizer 2 and the edge of at least one side of the display substrate 1 is less than 280μm, for example, less than 250μm, or less than 200μm, or less than 150μm, or less than 100μm, or less than 50μm. In a specific example, the edge of at least one side of the polarizer 2 is substantially flush with the edge of at least one side of the display substrate 1, for example, the lateral distance between the edge of at least one side of the polarizer 2 and the edge of at least one side of the display substrate 1 is less than 50μm, or less than 20μm, or the edge of at least one side of the polarizer 2 is completely flush with the edge of at least one side of the display substrate 1.

[0074] In addition, from the above description of the bending starting point, it can be seen that Figure 3 In the display panel shown, the bending starting point is located in the area where the back film 31 is located, and outside the area where the support layer 32 is located. The support layer 32 is shrunk by about 150 μm compared to the back film 31 (as shown in FIG. Figure 9 In one example of the present disclosure, the back film 31 and the support layer 32 are retracted to form a substantially flush edge, and the back film 31 and the support layer 32 are retracted by about 200 μm compared to the display substrate 1 (as shown in FIG. Figure 10 As shown), a certain space can be provided for the adapter component 101, so as to facilitate the connection between the signal line 11 and the connecting circuit board 100. In order to ensure the supporting strength of the product, the thickness of the back film 31 is not less than 75 μm.

[0075] In addition, Figure 3 In the display panel shown, the edge of the polarizer 2 is closer to the display area AA than the edge of the support structure 3. Figure 6 As shown, the edge of the support structure 3 is closer to the display area AA than the edge of the polarizer 2, which is beneficial to reduce the distance between the edge of the display area AA and the edge of the display substrate 1, thereby further reducing the border width of the display panel.

[0076] In some examples of the present disclosure, continue to refer to Figure 6, the adapter component 101 is located in the peripheral area PA of the display substrate 1. The adapter component 101 in the embodiment of the present disclosure can specifically be a connection structure with a pointed end. For example, the adapter component 101 uses a copper needle, and the maximum width of the copper needle is about 125 to 175 μm, and the height of the copper needle is not less than the sum of the thickness of the back film 31 and the support layer 32. In one example, the thickness of the back film 31 is not less than 75 μm, and the thickness of the support layer 32 is not less than 200 μm; when the thickness of the back film 31 is set to 75 μm, and the thickness of the support layer 32 is set to 200 μm, the height of the copper needle is not less than 275 μm, so as to ensure that the two ends of the copper needle can be stably connected to the signal line 11 and the connection circuit board 100 respectively. It should be noted that in the embodiment of the present disclosure, only the adapter component 101 is a copper needle as an example for description.

[0077] For further information, please refer to Figure 6 , a sealing structure 102 for wrapping the copper needle is also provided in the first space, so as to protect the copper needle and prevent the copper needle from being corroded by external water and oxygen. The sealing structure 102 can be specifically a sealant, and the material can be epoxy resin, the viscosity of which is not less than 2000cps, and the hardness after curing is not less than 70A. The width of the sealant is the width of the support structure 3 that is retracted compared to the display substrate 1. For example, the width of the sealant is about 200μm. The thickness of the sealant is slightly smaller than the height of the copper needle to ensure that the two tips of the copper needle are exposed, so as to be stably connected to the signal line 11 and the connecting circuit board 100 respectively. For example, the thickness of the sealant is about 4μm smaller than the height of the copper needle. Among them, when the sealant is UV glue, the curing wavelength is 365nm during curing.

[0078] In some examples, continue to refer to Figure 6 The connecting circuit board 100 is a flexible circuit board, wherein the connecting circuit board 100 is not in contact with the display substrate 1 .

[0079] In some examples, the connection circuit board 100 can be attached to the side of the support layer 32 away from the display substrate 1 through the first adhesive layer. In other examples, the connection circuit board 100 can also be directly prepared on the side of the support layer 32 away from the display substrate 1, and the first adhesive layer is not required. In this case, the connection circuit board 100 is directly arranged on the support layer 32 to form a pad area, and the pad area is located on the support layer 32.

[0080] Figure 11 Schematic diagram of the connection circuit board 100 of the embodiment of the present disclosure; Figure 11As shown, the connection circuit board 100 includes a connection pad. For the convenience of description, the pad used to connect to the copper needle is called the first connection pad 41, the pad used to connect to the driving circuit board 40 is called the second pad, and the pad used to connect to the driving chip D-IC is called the third connection pad 43. Among them, a first connection pad 41 is connected to a copper needle, and the first connection pad 41 can be connected to the third connection pad 43 through a connecting wire, and the third connection pad 43 can be connected to the second connection pad 42 through a connecting wire. After the third connection pad 43 is bound and connected to the driving chip D-IC, and the second connection pad 42 is bound and connected to the driving circuit board 40, the driving circuit board 40 can control the driving chip D-IC to provide a corresponding driving signal for the signal line 11. For example, the driving circuit board 40 is a flexible printed circuit board FPCB. Of course, the third connection pad 43 may not be set in the connection circuit board 100, that is, the driving circuit board 40 bound and connected to the second connection pad 42 directly provides a driving signal to the signal line 11.

[0081] Furthermore, the number of signal lines 11 is multiple, and the number of corresponding first connection pads 41 is also multiple. In the embodiment of the present disclosure, the first connection pads 41 are arranged side by side, for example, the first connection pads 41 are arranged side by side along the row direction. Figure 11 As shown, in the present disclosed embodiment, the connecting circuit board 100 also includes a first alignment pad 45 and a second alignment pad 46, and a plurality of first connection pads 41 are arranged between the first alignment pad 45 and the second alignment pad 46. The first alignment pad 45 and the second alignment pad 46 are only used for alignment and are not connected to signals. They are used to ensure the connection accuracy when the copper needle and the first connection pad 41 are crimped. In the present disclosed embodiment, the connection accuracy of the copper needle is about ±5μm.

[0082] In some examples, such as Figure 8 As shown, the display substrate 1 further includes a base substrate 12 and a light emitting device 13 disposed on the base substrate 12, and the light emitting device 13 is, for example, an OLED device. The light emitting device 13 and the signal line 11 are both located on the side of the base substrate 12 away from the back film 31. In order to realize the connection between the signal line 11 and the adapter component 101, as shown in FIG. Figure 8 As shown, a via hole V1 may be opened on the base substrate 12 , and the signal line 11 is connected to the transfer component 101 through the via hole V1 .

[0083] In some examples, the base substrate 12 is made of a flexible material to facilitate the formation of the via holes V1 on the base substrate 12. For example, the flexible material may include polyimide (PI).

[0084] In some examples, continue to refer to Figure 6The display panel in the embodiment of the present disclosure not only includes the above structure, but also includes a cover plate 5 located on the side of the polarizer 2 away from the display substrate 1, and a transparent optical adhesive layer 6 is provided between the cover plate 5 and the polarizer 2. ， The transparent optical adhesive layer 6 is used to bond the cover plate 5 and the polarizer 2 together. The display panel also includes an ink layer 7 located in the peripheral area PA. The ink layer 7 is arranged on the surface of the cover plate 5 close to the polarizer 2, and the ink layer 7 and the polarizer 2 have a certain overlap, that is, the orthographic projections of the ink layer 7 and the polarizer 2 on the plane where the cover plate 5 is located overlap. The ink layer 7 can protect the screen from scratches and wear.

[0085] In some examples, the orthographic projections of the adapter component 101 and the sealing structure 102 on the cover plate 5 are both located within the orthographic projection range of the ink layer 7 on the cover plate 5. For example, the orthographic projection of the ink layer 7 on the cover plate 5 contacts the edge of the cover plate 5, and the orthographic projections of the adapter component 101 and the sealing structure 102 on the cover plate 5 are both spaced from the edge of the cover plate 5.

[0086] In some embodiments, an edge sealant is formed on the side of the cover plate 5 close to the support structure 3, which at least partially surrounds one side of the side of the display substrate 1. Among them, the edge sealant can be located on one or more sides of the side of the display substrate 1. In some embodiments, the edge sealant is arranged around the display area AA, and is at least used to seal the edge of the display substrate 1. In some embodiments, an edge sealant is formed around the display area AA on the side of the ink layer 7 away from the cover plate 5, and the edge sealant is at least used to seal the edge of the display substrate 1. In the embodiment of the present disclosure, due to the setting of the edge sealant, the width of the middle frame assembly frame can be further reduced, and the width of the whole machine frame can be further reduced. Among them, the existence of the width of the middle frame assembly frame is mainly affected by the product bending tolerance and the middle frame assembly tolerance, and it is also to ensure that the middle frame will not cause the bending area BA line to break Crack after being compressed. In the embodiment of the present disclosure, due to the setting of the edge sealant, after the bending area BA is cancelled, the edge sealant is used to protect the edge of the display panel where the copper needle is located, which can reduce or eliminate the risks of dislocation and short circuit when subjected to external force.

[0087] In some examples, the edge of the edge sealant does not exceed the edge of the cover plate 5, so that the width of the middle frame assembly frame reaches a smaller value. In some examples, at least one side edge of the edge sealant is flush with at least one side edge of the cover plate 5. For example, each edge of the edge sealant is flush with the corresponding edge of the cover plate 5. Among them, the orthographic projection of the edge sealant on the cover plate 5 can be located within the orthographic projection range of the ink layer 7 on the cover plate 5, so as to ensure that the edge sealant can be shielded by the ink layer 7.

[0088] In some examples, continue to refer to Figure 6, the edge-sealing glue specifically includes a first edge-sealing component 103 located on the side of the edge of the display substrate 1 away from the display area AA, and a second edge-sealing component 104 disposed on the side of the layer where the connection circuit board 100 is located away from the support structure 3. The first edge-sealing component 103 and the second edge-sealing component 104 are connected. As Figure 12 shown, since the overall thickness of the first edge-sealing component 103 is relatively thick, the first edge-sealing component 103 is composed of a plurality of stacked auxiliary film layers 1031. Preferably, the second edge-sealing component 104 and the auxiliary film layer 1031 of the layer farthest from the cover plate 5 are of an integral structure. When the first edge-sealing component 103 is composed of a plurality of auxiliary film layers 1031, the auxiliary film layers 1031 can be formed by dispensing, and specifically, UV glue can be used. This structure can reduce the influence of product bending tolerance and middle frame assembly tolerance on the whole machine frame. At the same time, it also ensures that after the middle frame is pressed, the UV glue absorbs pressure according to its own high elastic modulus, high hardness and other characteristics, thereby protecting the stability of the circuit in the product and not affecting the normal lighting and use of the product. Moreover, the UV glue wraps the edges of each film layer of the display panel, synchronously improving the waterproof vapor ability of the product.

[0089] Furthermore, when both the first edge-sealing component 103 and the second edge-sealing component 104 use UV glue, the main component of the UV glue is acrylate, the viscosity is not less than 10000 cps, the storage modulus is not less than 150 Mpa, the hardness after curing is not less than 60A, and the compressive capacity is not less than 70 N. The first edge-sealing component 103 and the second edge-sealing component 104 are formed by dispensing. The dispensing uses an air pressure valve with a diameter of 65 um, the dispensing speed is 30 mm / s, the dispensing air pressure is 40 psi, and the dispensing height is not more than 0.1 mm. The sum of the widths of the second edge-sealing component 104 and the auxiliary film layer 1031 of the layer farthest from the cover plate 5 is a, and a is about 1200 um. The width of the auxiliary film layer 1031 is b, and b is not less than 0.3 mm; the thickness of the first edge-sealing component 103 is d, and d is not less than 1200 um. The thickness c of a single auxiliary film layer 1031 is 200 um, so as to ensure the compressive and impact resistance of the edge-sealing glue.

[0090] As Figure 6 shown, the first edge-sealing component 103 is bonded to the side surface of the polarizer 2 and the side surface of the display substrate 1. In order to improve the adhesion between the first edge-sealing component 103 and the polarizer 2 and the display substrate 1, in some examples, the edge of the polarizer 2 close to the first edge-sealing component 103 and the edge of the display substrate 1 close to the first edge-sealing component 103 can be made not flush. For example, there is a certain misalignment between the two edges. For example, the misalignment width is between 5 and 50 μm. An uneven structure can also be formed on the side surface of the polarizer 3 facing the first edge-sealing component 103 and / or the side surface of the display substrate 1 facing the first edge-sealing component 103, so as to improve the adhesion with the first edge-sealing component 103.

[0091] In one example, as Figure 6 shown, the width N of the first edge-sealing component 103 is not less than 0.3 mm, the distance A from the side edge VA of the ink layer 7 close to the display area AA to the display area AA is not less than 150 μm, and the overlapping width B between the polarizer 2 and the ink layer 7 is not less than 276 μm. Then, the frame width T of the display panel in the embodiment of the present disclosure is T = A + B + N ≥ 0.726 mm. Compared with the display panel with a frame width T = 1.71 mm in Figure 3 , the frame width T of the display panel in the embodiment of the present disclosure is reduced by 0.984 mm.

[0092] In the embodiment of the present disclosure, a method for manufacturing a display panel is further provided. This method can be used to manufacture the above-mentioned display panel. The manufacturing method includes:

[0093] S1. Provide a display substrate 1.

[0094] Figure 13 is a partial structural schematic diagram of the display substrate in the embodiment of the present disclosure. As Figure 13 shown, the display substrate 1 includes a substrate 12, and structures such as signal lines 11, pixel driving circuits 14, and light-emitting devices 13 formed on the substrate 12. Exemplarily, the display substrate 1 is an OLED display substrate, and the light-emitting device 13 is an OLED device. Exemplarily, the substrate 12 can be a flexible substrate, for example, materials such as polyimide (PI), polyethylene terephthalate (PET), or a surface-treated polymer soft film can be used.

[0095] Exemplarily, the pixel driving circuit 14 can include transistors and storage capacitors, Figure 13Only one transistor and one storage capacitor in each pixel driving circuit 14 are shown. The transistor includes an active layer 142, a gate electrode 141, a source electrode 143, and a drain electrode 144. In some possible implementation manners, the pixel driving circuit 14 of each sub-pixel may include: a buffer layer BFL disposed on the substrate 12, an active layer 142 disposed on the buffer layer BFL, a first gate insulating layer GI1 covering the active layer 142, a gate electrode 141 and a first capacitor electrode 145 disposed on the first gate insulating layer GI1, a second gate insulating layer GI2 covering the gate electrode 141 and the first capacitor electrode 145, a second capacitor electrode 146 disposed on the second gate insulating layer GI2, an interlayer insulating layer ILD covering the second capacitor electrode 146, and a via is formed in the interlayer insulating layer ILD, and the via exposes the active layer 142. The source electrode 143 and the drain electrode 144 are disposed on the interlayer insulating layer ILD, and the source electrode 143 and the drain electrode 144 are respectively connected to the active layer 142 through the via. A planarization layer PLN is located on a side of the source electrode 143 and the drain electrode 144 away from the substrate 12. The first capacitor electrode 145 and the second capacitor electrode 146 form a storage capacitor. In some possible implementation manners, the buffer layer BFL, the first gate insulating layer GI1, the second gate insulating layer GI2, and the interlayer insulating layer ILD may be made of any one or more of silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiON), and may be a single layer, a multi-layer, or a composite layer. The gate electrode 141, the source electrode 143, the drain electrode 144, the first capacitor electrode 145, and the second capacitor electrode 146 may be made of a metal material, such as any one or more of silver (Ag), copper (Cu), aluminum (Al), titanium (Ti), and molybdenum (Mo), or an alloy material of the above metals, such as aluminum neodymium alloy (AlNd) or molybdenum niobium alloy (MoNb), and may be a single-layer structure or a multi-layer composite structure, such as Ti / Al / Ti, etc. The active layer 142 may be made of amorphous indium gallium zinc oxide material (a-IGZO), zinc oxide nitride (ZnON), indium zinc tin oxide (IZTO), amorphous silicon (a-Si), polycrystalline silicon (p-Si), hexathiophene, or polythiophene, etc., that is, the present disclosure is applicable to transistors manufactured based on oxide (Oxide) technology, silicon technology, or organic technology. The active layer 142 based on oxide technology may be made of an oxide containing indium and tin, an oxide containing tungsten and indium, an oxide containing tungsten, indium, and zinc, an oxide containing titanium and indium, an oxide containing titanium, indium, and tin, an oxide containing indium and zinc, an oxide containing silicon, indium, and tin, an oxide containing indium, gallium, and zinc, etc.

[0096] Exemplarily, the light-emitting device 13 may include an anode 131, an organic light-emitting layer 133 and a cathode 132, the anode 131 is arranged on the flat layer PLN, and is connected to the drain electrode 144 through a via hole opened in the flat layer PLN, the pixel definition layer PDL is arranged on the anode 131 and the flat layer PLN, and a pixel opening is arranged thereon, the pixel opening exposes the anode 131, the organic light-emitting layer 133 is arranged in the pixel opening, the cathode 132 is arranged on the organic light-emitting layer 133, and the organic light-emitting layer 133 emits light of corresponding color under the action of voltage applied by the anode 131 and the cathode 132.

[0097] Exemplarily, the organic light-emitting layer 133 may include at least a stacked hole injection layer (HIL), a hole transport layer (HTL), an emission layer (EML), an electron transport layer (ETL) and an electron injection layer (EIL), the hole injection layer and the hole transport layer may be collectively referred to as a hole layer, and the electron transport layer and the electron injection layer may be collectively referred to as an electron layer.

[0098] Exemplarily, the encapsulation layer 15 may include a stacked first encapsulation layer 151, a second encapsulation layer 152 and a third encapsulation layer 153. The first encapsulation layer 151 and the third encapsulation layer 153 may be made of inorganic materials, the second encapsulation layer 152 may be made of organic materials, and the second encapsulation layer 152 is arranged between the first encapsulation layer 151 and the third encapsulation layer 153 to ensure that external water vapor cannot enter the light-emitting device 13.

[0099] S2, forming a polarizer 2 on the light-emitting surface side of the display substrate 1, and forming a support structure 3 on the side of the display substrate 1 away from the polarizer 2; wherein, referring to Figure 6 , the supporting structure 3 is retracted relative to the display substrate 1, thereby forming a first space.

[0100] The order of forming the polarizer 2 and the support structure 3 in step S2 is not limited, and the polarizer 2 may be formed first and then the support structure 3; or the support structure 3 may be formed first and then the polarizer 2. The support structure 3 may include a back film 31 and a support layer 32, which are the same as those in the above-mentioned display panel, so they will not be described in detail here.

[0101] At least one of the back film 31 and the support layer 32 is retracted relative to the display substrate 1. In one example, the back film 31 and the support layer 32 are retracted to form substantially flush edges.

[0102] S3. In the first space, a transfer component 101 is arranged to connect the transfer component 101 to the signal line 11 in the display substrate 1; a connecting circuit board 100 is formed on the side of the supporting structure 3 away from the display substrate 1, and the connecting circuit board 100 is connected to the transfer component 101.

[0103] Among them, refer to Figure 8A via V1 may be provided on the base substrate 12 , and the signal line 11 is connected to the transfer component 101 through the via V1 .

[0104] In step S3 , the transfer component 101 may be a copper needle, and a sealing structure 102 that wraps the copper needle may be formed in this step. The sealing structure 102 may be formed by curing an epoxy resin material. The transfer component 101 is located in the peripheral area PA of the display substrate 1 .

[0105] In some examples, the display substrate 1 is not provided with a bending area and a pad area, and the connection circuit board 100 is directly provided on the support layer 32 to form a pad area, and the pad area is located on the support layer 32 .

[0106] In some examples, the preparation method of the embodiment of the present disclosure also includes the steps of sequentially forming a transparent optical glue 6 and a cover plate 5 on the side of the polarizer 2 facing away from the display substrate 1; wherein an ink layer 7 is formed on the surface of the cover plate 5 close to the display substrate 1; the ink layer 7 is located in the peripheral area PA away from the edge of the display area AA, and is arranged around the display area AA.

[0107] The edge position of the polarizer 2 can refer to the above description of the display panel, which will not be repeated here.

[0108] Furthermore, the preparation method in the embodiment of the present disclosure further includes: forming an edge sealing adhesive on a side of the cover plate 5 close to the display substrate 1, the edge sealing adhesive surrounds at least a portion of the display area AA, and the edge sealing adhesive is at least used to seal the edge of the display substrate 1. Specifically, a first edge sealing component 103 can be formed on a side of the edge of the display substrate 1 away from the display area AA, and a second edge sealing component 104 can be formed on a side of the layer where the circuit board 100 is connected away from the support structure 3; the second edge sealing component 104 is connected to the first edge sealing component 103.

[0109] Furthermore, since the overall thickness of the first edge sealing component 103 is relatively thick, the first edge sealing component 103 is composed of a stacked multi-layer auxiliary film layer 1031. Preferably, the second edge sealing component 104 is an integral structure with a layer of auxiliary film layer 1031 farthest from the cover plate 5. When the first edge sealing component 103 is composed of a multi-layer auxiliary film layer 1031, the auxiliary film layer 1031 can be formed by dispensing. In one example, when the first edge sealing component 103 and the second edge sealing component 104 both use UV glue, the main component of the UV glue is acrylate, the viscosity is not less than 10000cps, the storage modulus is not less than 150Mpa, the hardness after curing is not less than 60A, and the compressive strength is not less than 70N. The first edge sealing component 103 and the second edge sealing component 104 are formed by dispensing, and the dispensing uses an air pressure valve with a diameter of 65um, a dispensing speed of 30mm / s, a dispensing air pressure of 40psi, and a dispensing height of not more than 0.1mm.

[0110] An embodiment of the present disclosure further provides a display device, which may include a display panel, and of course, structures such as a middle frame may also be included. Since the display device includes the above-mentioned display panel, the overall border of the display device is relatively narrow and the impact resistance is relatively high.

[0111] The display device may include any device or product with a display function. For example, the display device may be an in-vehicle display device, a smart phone, a mobile phone, an e-book reader, a desktop computer (PC), a laptop PC, a netbook PC, a personal digital assistant (PDA), a portable multimedia player (PMP), a digital audio player, a mobile medical device, a camera, a wearable device (such as a head-mounted device, an electronic bracelet, or a smart watch), and so on.

[0112] It can be understood that the above embodiments are merely exemplary embodiments adopted to illustrate the principle of the present invention, but the present invention is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also regarded as the protection scope of the present invention.

Claims

1. A display panel, characterized in that: include: A display substrate including a plurality of signal lines; The functional film layer is arranged on one side of the display substrate; A supporting structure, arranged on a side of the display substrate away from the functional film layer; Adapter components; and A connecting circuit board is arranged on a side of the supporting structure away from the display substrate; wherein, The support structure is retracted relative to the display substrate to form a first space, The transfer component is arranged in the first space, The plurality of signal lines are connected to the connection circuit board through the adapter component in the first space.

2. The display panel according to claim 1, characterized in that: The display substrate comprises a display area and a peripheral area located at at least one side of the display area, and the display substrate is not provided with a bending area and a pad area.

3. The display panel according to claim 1, characterized in that: The connection circuit board does not contact the display substrate.

4. The display panel according to claim 1, characterized in that: The support structure includes a back film and a support layer which are sequentially arranged away from the display substrate, and at least one of the back film and the support layer is retracted to form the first space.

5. The display panel according to claim 4, characterized in that: The backing film and the support layer are retracted to form substantially flush edges.

6. The display panel according to claim 4, characterized in that: The connecting circuit board is directly arranged on the supporting layer to form a pad area, and the pad area is located on the supporting layer.

7. The display panel according to claim 1, characterized in that: The functional film layer comprises a polarizer, and an edge of at least one side of the polarizer is substantially flush with an edge of at least one side of the display substrate.

8. The display panel according to claim 7, characterized in that: The display substrate comprises a display area and a peripheral area located at least on one side of the display area, and an edge of the support structure is closer to the display area than an edge of the polarizer.

9. The display panel according to claim 8, characterized in that: The transfer component is located in the peripheral area of ​​the display substrate.

10. The display panel according to claim 1, characterized in that: The first space is filled with a sealing structure; the adapter component is wrapped by the sealing structure, and two ends thereof are oppositely arranged along the thickness direction of the display substrate and are respectively connected to the signal line and the connection circuit board.

11. The display panel according to claim 1, characterized in that: The connecting circuit board at least includes a first connecting pad connected to the transfer component and a second connecting pad bound and connected to the driving circuit board; the driving circuit board is configured to provide a driving signal to the signal line.

12. The display panel according to claim 11, characterized in that: The connection circuit board further includes a third connection pad, and the third connection pad is bound and connected to a driving chip, and the driving chip is configured to provide a driving signal to the signal line under the control of the driving circuit board.

13. The display panel according to claim 11, characterized in that: The number of the first connection pads is multiple, and the multiple first connection pads are arranged side by side; the connection circuit board also includes a first alignment pad and a second alignment pad, and the multiple first connection pads are arranged between the first alignment pad and the second alignment pad.

14. The display panel according to claim 1, characterized in that: The connection circuit board is bonded to a side of the support structure away from the display substrate through a first bonding layer.

15. The display panel according to any one of claims 1 to 14, characterized in that: The display substrate includes a display area and a peripheral area located at at least one side of the display area; the display panel also includes: A cover plate is arranged on a side of the functional film layer away from the display substrate; an edge of the cover plate is farther away from the display area than an edge of the display substrate; The edge sealing adhesive is arranged on a side of the cover plate close to the display substrate and at least partially surrounds the display area. The edge sealing adhesive is at least used to seal the edge of the display substrate.

16. The display panel according to claim 15, characterized in that: The edge sealing adhesive comprises a first edge sealing component and a second edge sealing component; wherein, The first edge sealing component is arranged on a side of the edge of the display substrate away from the display area; The second edge sealing component is connected to the first edge sealing component and is arranged on a side of the layer where the connection circuit board is located away from the supporting structure.

17. The display panel according to claim 16, characterized in that: The first edge sealing component comprises a plurality of auxiliary film layers stacked in sequence in a direction away from the cover plate; the second edge sealing component is an integral structure with a layer of the auxiliary film layer farthest from the cover plate.

18. The display panel according to claim 16, characterized in that: The first edge sealing component and the second edge sealing component are both made of acrylic materials.

19. The display panel according to claim 15, characterized in that: It also includes an ink layer arranged on a side of the cover plate close to the functional film layer, wherein the ink layer is located in the peripheral area and surrounds the display area.

20. A display device, characterized in that: A display panel comprising any one of claims 1-19.

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