Chip carrier plate material box and transfer device

Abstract

The utility model relates to the technical field of wafer transfer equipment, and particularly discloses a chip carrier plate material box and a transfer device.The chip carrier plate material box comprises a guide assembly and a plurality of carrier plate bearing frames used for bearing chip carrier plates; the plurality of carrier plate bearing frames are stacked on the guide assembly, and the carrier plate bearing frames are driven to move on the guide assembly in the direction away from the adjacent carrier plate bearing frames, so that the distance between the geometric centers of the two adjacent chip carrier plates is increased. According to the invention, the stacked chip carrier plate can be unfolded during heating, the heating area of the carrier plate is increased, and rapid heating can be realized.

Description

Technical Field

[0001] This application relates to the technical field of wafer transfer equipment, and more particularly, to a chip carrier board material box and a transfer device. Background Art

[0002] In the semiconductor manufacturing and packaging processes, the material box, as a component for transferring chip carrier boards, is an essential part of the automated production line. The material box is crucial for protecting the chip carrier board from physical damage and ensuring the smooth progress of the production process. Since in some processes of chip packaging, a thermosetting glue needs to be set on the chip, and then heat fixation is achieved by heating with hot air. To improve production efficiency, the prior art directly heats the chip carrier board on the material box with hot air to cure the glue, thereby avoiding the frequent disassembly and assembly of the chip carrier board on the material box. The problem in the prior art is that the chip carrier boards are stacked on the material box, and the contact area between the hot air and the chip carrier board is extremely small, resulting in an increase in heating time and energy consumption, and thus the heating process cannot be achieved quickly, and the production efficiency is limited. Summary of the Utility Model

[0003] The purpose of this application is to provide a chip carrier board material box and a transfer device, which can expand the stacked chip carrier boards during heating, increase the heat receiving area of the carrier board, and facilitate rapid heating.

[0004] The embodiments of this application are implemented as follows:

[0005] In a first aspect, an embodiment of this application provides a chip carrier board material box, including a guiding component and a plurality of carrier board supporting brackets for supporting chip carrier boards; the plurality of carrier board supporting brackets are stacked on the guiding component, and the carrier board supporting brackets are driven to move on the guiding component in a direction away from adjacent carrier board supporting brackets, so as to increase the distance between the geometric centers of adjacent two chip carrier boards.

[0006] As an optional implementation manner, a first connecting ear is arranged on the carrier board supporting bracket, and a rotating connection hole is opened on the first connecting ear; the guiding component includes guiding shaft rods sequentially passing through the rotating connection holes along the stacking direction; the carrier board supporting bracket is driven to rotate circumferentially around the guiding shaft rod, so that the chip carrier boards are sequentially arranged in the circumferential direction of the guiding shaft rod.

[0007] As an optional implementation manner, a second connecting ear spaced from the first connecting ear is arranged on the carrier board supporting bracket, and a locking connection hole is opened on the second connecting ear; the guiding component further includes locking shaft rods sequentially passing through the locking connection holes along the stacking direction.

[0008] As an alternative embodiment, the guiding assembly includes a base frame and sliding guiding members disposed on the base frame and on both sides of the carrier plate support bracket; a sliding connection portion is provided on the carrier plate support bracket, and the sliding connection portion can be driven to drive the carrier plate support bracket to slide on the sliding guiding members along the stacking direction of the carrier plate support bracket, so as to increase the distance between two adjacent chip carrier plates.

[0009] As an alternative embodiment, the base frame is provided with limiting sliding grooves on both sides where the sliding guiding members are provided, and the extending direction of the limiting sliding grooves is perpendicular to the stacking direction; a sliding frame is installed on the limiting sliding grooves, and a limiting connecting rod is provided on the sliding frame. One end of the limiting connecting rod is hinged to the sliding frame, and the other end is hinged to the carrier plate support bracket.

[0010] As an alternative embodiment, the sliding guiding member is a sliding guiding groove or a sliding guiding rod whose extending direction is perpendicular to the plane where the chip carrier plate is located.

[0011] As an alternative embodiment, a connecting plate is provided on one side of the carrier plate support bracket, and the guiding assembly includes two swing connecting rods arranged in parallel. Two ends of each swing connecting rod are respectively hinged to two adjacent connecting plates, so that four hinge points are sequentially connected to form a parallelogram link structure; the stacked carrier plate support brackets are driven to swing, and the swing connecting rods are abutted against limiting blocks fixedly arranged on the connecting plates, so that the chip carrier plates are arranged in sequence in a preset direction.

[0012] As an alternative embodiment, parallelogram link structures are respectively provided on two opposite sides of the connecting plate.

[0013] As an alternative embodiment, clamping grooves parallel to each other are provided on the carrier plate support bracket, and two opposite sides of the chip carrier plate are respectively inserted into the clamping grooves.

[0014] In a second aspect, an embodiment of the present application provides a transfer device, including the above-mentioned chip carrier plate material box and a handling mechanism for transferring the material box.

[0015] The beneficial effects of the embodiments of the present application include:

[0016] An embodiment of the present application provides a chip carrier plate material box, including a guiding assembly and a plurality of carrier plate support brackets for supporting chip carrier plates; the plurality of carrier plate support brackets in the embodiment of the present application are stacked on the guiding assembly, and the carrier plate support brackets can be driven to move on the guiding assembly in a direction away from adjacent carrier plate support brackets, so as to increase the distance between the geometric centers of two adjacent chip carrier plates. Therefore, the contact area between the chip carrier plate and the hot air flow is effectively increased, so that the hot air flow can fully heat the chip carrier plates on the carrier plate support brackets, effectively shortening the heating time and improving the heating efficiency.

[0017] An embodiment of the present application provides a transfer device, including the above-mentioned chip carrier material box and a handling mechanism for transferring the material box. The rotating device provided by the embodiment of the present application adopts the above-mentioned chip carrier material box, which can not only transfer the chip carrier, but also quickly heat the thermosetting glue on the chip carrier without removing the chip carrier. Therefore, the transfer device provided by the embodiment of the present application can greatly improve the efficient flow of semiconductor devices between different processes, improve production efficiency, and ensure product quality at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings required for the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

[0019] Figure 1 is one of the schematic structural diagrams of the chip carrier material box according to the embodiment of the present application;

[0020] Figure 2 is the second schematic structural diagram of the chip carrier material box according to the embodiment of the present application;

[0021] Figure 3 is the third schematic structural diagram of the chip carrier material box according to the embodiment of the present application;

[0022] Figure 4 is the fourth schematic structural diagram of the chip carrier material box according to the embodiment of the present application;

[0023] Figure 5 is the fifth schematic structural diagram of the chip carrier material box according to the embodiment of the present application;

[0024] Figure 6 is the sixth schematic structural diagram of the chip carrier material box according to the embodiment of the present application.

[0025] ICON:

[0026] 100 - Carrier support bracket; 101 - First connecting ear; 102 - Rotating connection hole; 103 - Guide shaft rod; 104 - Second connecting ear; 105 - Locking connection hole; 106 - Base frame; 107 - Sliding guide; 108 - Sliding connection part; 109 - Limit chute; 110 - Sliding frame; 111 - Limit link; 112 - Connecting plate; 113 - Swing link; 114 - Parallelogram link structure; 115 - Limit block; 116 - Clamping groove; 117 - Preset direction. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0027] To make the objectives, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. The components of the embodiments of the present application usually described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.

[0028] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the claimed present application, but merely represents selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the scope of protection of the present application.

[0029] It should be noted that similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. In addition, the terms "first", "second", "third", etc. are only used for descriptive distinction and cannot be construed as indicating or implying relative importance.

[0030] In the description of the present application, it should also be noted that unless otherwise clearly defined and limited, the terms "arranged", "installed", "connected", and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0031] In the semiconductor manufacturing and packaging processes, the cassette, as a component for transporting the chip carrier, is an indispensable part of the automated production line. The cassette is crucial for protecting the chip carrier from physical damage and ensuring the smooth progress of the production process. Since in some processes of chip packaging, a thermosetting glue needs to be set on the chip, and then heat fixation is achieved by heating with hot air. To improve production efficiency, the prior art directly heats the chip carrier on the cassette with hot air in production to cure the glue, thereby avoiding the frequent disassembly and assembly of the chip carrier on the cassette due to heating. The problem in the prior art is that the chip carriers are stacked on the cassette, and the contact area between the hot air and the chip carrier is extremely small, resulting in an increase in heating time and energy consumption, so that the heating process cannot be quickly achieved and the production efficiency is limited.

[0032] To solve the above technical problems, the embodiments of the present application provide a chip carrier cassette and a transfer device.

[0033] In a first aspect, referring to Figure 1 , Figure 2 and Figure 3 as shown, an embodiment of the present application provides a chip carrier material box, including a guiding component and a plurality of carrier brackets 100 for supporting chip carriers; the plurality of carrier brackets 100 are stacked on the guiding component, and the carrier brackets 100 are driven to move on the guiding component in a direction away from the adjacent carrier brackets 100, so that the distance between the geometric centers of two adjacent chip carriers is increased.

[0034] It should be noted that the chip carrier material box provided by the embodiment of the present application can carry the chip carrier through a plurality of carrier brackets 100. Among them, those skilled in the art can select the number of carrier brackets 100 according to needs, and no special limitation is made thereto.

[0035] Among them, the carrier bracket has sufficient strength and can be connected to the chip carrier through a quick-release structure such as snap connection. The carrier bracket can provide reliable support for the chip carrier to avoid damage to the chip carrier.

[0036] It should be noted that in the embodiment of the present application, the staff can manually operate the carrier bracket 100 to move the adjacent carrier brackets 100 on the guiding component, so as to increase the distance between the geometric centers of the adjacent chip carriers. In the embodiment of the present application, a driving module such as a driving motor can also be used to control the movement of the carrier bracket 100. Those skilled in the art can select according to needs.

[0037] An embodiment of the present application provides a chip carrier material box, including a guiding component and a plurality of carrier brackets 100 for supporting chip carriers; the plurality of carrier brackets 100 in the embodiment of the present application are stacked on the guiding component, and the carrier brackets 100 are driven to move on the guiding component in a direction away from the adjacent carrier brackets 100, so that the distance between the geometric centers of two adjacent chip carriers is increased. Therefore, the contact area between the chip carrier and the hot air flow is effectively increased, so that the hot air flow can fully heat the chip carrier on the carrier bracket 100, effectively shortening the heating time and improving the heating efficiency.

[0038] Referring to Figure 1 , Figure 2 as shown, as an optional implementation manner, a first connecting ear 101 is provided on the carrier bracket 100, and a rotating connection hole 102 is opened on the first connecting ear 101; the guiding component includes a guiding shaft rod 103 that sequentially passes through the rotating connection hole 102 along the stacking direction; the carrier bracket 100 is driven to rotate circumferentially around the guiding shaft rod 103, so that the chip carriers are arranged in sequence in the circumferential direction of the guiding shaft rod 103.

[0039] In the embodiment of the present application, a first connecting ear 101 is provided on the carrier board support bracket 100, and the guiding shaft rod 103 is sequentially passed through the rotating connection hole 102 of the first connecting ear 101. Therefore, each carrier board support bracket 100 can rotate on the guiding shaft rod 103 through the first connecting ear 101.

[0040] It should be noted that in the embodiment of the present application, a rotating pair formed by the guiding shaft rod 103 and the first connecting ear 101 enables multiple carrier board support brackets 100 to rotate around the axis, thereby realizing circumferential spaced arrangement.

[0041] Exemplarily, there are four carrier board support brackets 100. The rotation angle of the first carrier board support bracket 100 on the guiding shaft rod 103 can be 270°; the rotation angle of the second carrier board support bracket 100 on the guiding shaft rod 103 can be 180°; the rotation angle of the third carrier board support bracket 100 on the guiding shaft rod 103 can be 90°. That is to say, the four carrier board support brackets 100 can be evenly arranged at intervals of 90° in the circumferential direction of the guiding shaft rod 103.

[0042] Exemplarily, after six carrier board support brackets 100 rotate on the guiding shaft rod 103, they are arranged at circumferential intervals around the guiding shaft rod 103, and the spacing angle between adjacent carrier board support brackets 100 is 60°.

[0043] It should be noted that the plane where the carrier board support bracket 100 is located is perpendicular to the extending direction of the guiding shaft rod 103. When the number of carrier board support brackets 100 is too large, multiple carrier board support brackets 100 can form a spiral circumferential arrangement structure in the extending direction of the guiding shaft rod 103 after rotation.

[0044] Refer to Figure 1 、 Figure 2 As shown, as an alternative embodiment, there is a second connecting ear 104 spaced from the first connecting ear 101 on the carrier board support bracket 100, and a locking connection hole 105 is provided on the second connecting ear 104; the guiding assembly further includes a locking shaft rod sequentially passing through the locking connection holes 105 along the stacking direction.

[0045] In the embodiment of the present application, a second connecting ear 104 is provided on the carrier board support bracket 100. By providing a locking connection hole 105 on the second connecting ear 104 that cooperates with the locking shaft rod, the stability of multiple chip carrier boards during the transfer process of the chip carrier board material box can be ensured, and the problem of automatic opening can be avoided.

[0046] It should be noted that the cross-sectional shapes of the locking shaft rod and the locking connection hole 105 in the embodiment of the present application can be circular, square or other shapes. Those skilled in the art can set them according to needs and no special limitation is made here.

[0047] Refer to Figure 3 、Figure 4 As shown, as an alternative embodiment, the guiding component includes a base frame 106 and sliding guiding members 107 disposed on both sides of the carrier board supporting bracket 100 on the base frame 106; a sliding connection portion 108 is provided on the carrier board supporting bracket 100, and the sliding connection portion 108 can be driven to drive the carrier board supporting bracket 100 to slide on the sliding guiding members 107 along the stacking direction of the carrier board supporting bracket 100, so as to increase the distance between adjacent two chip carriers.

[0048] Different from the above embodiment, the embodiment of the present application provides a second guiding method. Through the setting of the sliding guiding members 107 in the embodiment of the present application, the carrier board supporting bracket 100 can slide along a direction perpendicular to the carrier board supporting bracket 100. That is to say, in the embodiment of the present application, through the mutual separation movement of two adjacent carrier board supporting brackets 100, the distance between the two carrier board supporting brackets 100 is increased, so that the hot air flow can fully contact the thermosetting glue on the chip carrier, realizing rapid curing.

[0049] Refer to Figure 3 、 Figure 4 As shown, as an alternative embodiment, the base frame 106 is provided with limiting sliding grooves 109 on both sides where the sliding guiding members 107 are provided, and the extending direction of the limiting sliding grooves 109 is perpendicular to the stacking direction; a sliding frame 110 is installed on the limiting sliding grooves 109, and a limiting connecting rod 111 is provided on the sliding frame 110. One end of the limiting connecting rod 111 is hinged to the sliding frame 110, and the other end is hinged to the carrier board supporting bracket 100.

[0050] Furthermore, on the basis of the above embodiment, in the embodiment of the present application, through the left - right movement of the sliding frame 110 on the limiting sliding grooves 109, when the carrier board supporting bracket 100 slides upward, the movement distance of the carrier board supporting bracket 100 can be limited through the movement of the limiting connecting rod 111.

[0051] In the embodiment of the present application, through the setting of the limiting connecting rod 111, the distance between two adjacent carrier board supporting brackets 100 can be made equal to the distance between the hinge center lines at both ends of the limiting connecting rod 111.

[0052] It should be noted that the sliding frame 110 can be driven to move on the limiting sliding grooves 109, and the carrier board supporting bracket 100 can be pushed to move upward through the limiting connecting rod 111. Among them, to avoid entering the mechanical dead point, the extending direction of the limiting connecting rod 111 has a certain angle with the carrier board supporting bracket 100.

[0053] Refer to Figure 3 、 Figure 4 As shown, among them, the sliding guiding member 107 is a sliding guiding groove or a sliding guiding rod whose extending direction is perpendicular to the plane where the chip carrier is located.

[0054] Refer to Figure 5 、Figure 6 As shown, as an alternative embodiment, a connecting plate 112 is provided on one side of the carrier board support 100. The guiding assembly includes two swing links 113 arranged in parallel. The two ends of each swing link 113 are respectively hinged to two adjacent connecting plates 112, so that four hinge points are sequentially connected to form a parallelogram link structure 114. The stacked carrier board supports 100 are driven to swing, and the swing link 113 abuts against a limit block 115 fixedly arranged on the connecting plate 112, so that the chip carrier boards are arranged in sequence in the preset direction 117.

[0055] Different from the above embodiment, in the embodiment of the present application, two swing links 113 are hinged to two adjacent connecting plates 112 to form a parallelogram link structure 114, so that the carrier board support 100 can swing to one side through the parallelogram link structure 114. In the embodiment of the present application, one of the swing links 113 is blocked by the limit block 115 to realize the limitation of the swing angle.

[0056] Referring to Figure 6 As shown, it should be noted that the included angle between the preset direction 117 and the plane where the carrier board support 100 is located is greater than 90°, and the preset direction 117 is parallel to the plane where the parallelogram link structure 114 is located. As for the specific size of the angle, those skilled in the art can set it according to needs. Exemplarily, the included angle between the preset direction 117 and the plane where the carrier board support 100 is located is 135 - 160°.

[0057] It should be noted that the embodiment of the present application can not only increase the distance between two adjacent carrier board supports 100, but also realize a certain distance of dislocation, so that the hot air flow can efficiently heat the chip carrier board.

[0058] Referring to Figure 5 As shown, as an alternative embodiment, parallelogram link structures 114 are respectively provided on two opposite sides of the connecting plate 112.

[0059] In the embodiment of the present application, parallelogram link structures 114 are provided on two opposite sides of the connecting plate 112, which is beneficial to improving the movement stability of the carrier board support 100.

[0060] Referring to Figure 6 As shown, as an alternative embodiment, clamping grooves 116 parallel to each other are provided on the carrier board support 100, and two opposite sides of the chip carrier board are respectively inserted into the clamping grooves 116.

[0061] In a second aspect, the embodiment of the present application provides a transfer device, including the above-mentioned chip carrier board material box and a handling mechanism for transferring the material box.

[0062] The rotating device provided by the embodiment of the present application adopts the above-mentioned chip carrier material box, which can not only transfer the chip carrier, but also quickly heat the thermosetting glue on the chip carrier without removing the chip carrier. Therefore, the transfer device provided by the embodiment of the present application can greatly improve the efficient flow of semiconductor devices between different processes, improve production efficiency, and ensure product quality at the same time.

[0063] The foregoing are only the preferred embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A chip carrier material box, characterized in that: It comprises a guide assembly and a plurality of carrier support brackets (100) for supporting chip carriers; a plurality of the carrier support brackets (100) are stacked and arranged on the guide assembly, and the carrier support brackets (100) can be driven to move on the guide assembly in a direction away from adjacent carrier support brackets (100), so that the distance between the geometric centers of two adjacent chip carriers is increased.

2. The chip carrier material box according to claim 1, characterized in that: The carrier support bracket (100) is provided with a first connecting ear (101), and a rotating connecting hole (102) is opened on the first connecting ear (101); the guide assembly comprises a guide shaft (103) through which the rotating connecting holes (102) are sequentially penetrated along the stacking direction; the carrier support bracket (100) can be driven to rotate circumferentially around the guide shaft (103), so that the chip carriers are arranged sequentially in the circumferential direction of the guide shaft (103).

3. The chip carrier material box according to claim 2, characterized in that: The carrier support bracket (100) is provided with a second connecting ear (104) spaced apart from the first connecting ear (101), and the second connecting ear (104) is provided with a locking connecting hole (105); the guide assembly also includes a locking shaft rod which passes through the locking connecting holes (105) in sequence along the stacking direction.

4. The chip carrier material box according to claim 1, characterized in that: The guide assembly comprises a base frame (106) and sliding guide members (107) arranged on the base frame (106) and located on both sides of the carrier support bracket (100); a sliding connection part (108) is arranged on the carrier support bracket (100), and the sliding connection part (108) can be driven to drive the carrier support bracket (100) to slide on the sliding guide members (107) along the stacking direction of the carrier support bracket (100), so that the distance between two adjacent chip carriers is increased.

5. The chip carrier material box according to claim 4, characterized in that: The base frame (106) is provided with limiting slide grooves (109) on both sides of the sliding guide (107), and the extension direction of the limiting slide grooves (109) is perpendicular to the stacking direction; a sliding frame (110) is installed on the limiting slide grooves (109), and a limiting connecting rod (111) is provided on the sliding frame (110), and one end of the limiting connecting rod (111) is hinged to the sliding frame (110) and the other end is hinged to the carrier support frame (100).

6. The chip carrier material box according to claim 4, characterized in that: The sliding guide member (107) is a sliding guide groove or a sliding guide rod whose extension direction is perpendicular to the plane where the chip carrier is located.

7. The chip carrier material box according to claim 1, characterized in that: A connecting plate (112) is provided on one side of the carrier support bracket (100), and the guide assembly comprises two swing connecting rods (113) arranged in parallel, and the two ends of each swing connecting rod (113) are respectively hinged to two adjacent connecting plates (112), so that four hinge points are connected in sequence to form a parallelogram connecting rod structure (114); the stacked carrier support brackets (100) are driven to swing, and the swing connecting rods (113) abut against limit blocks (115) fixedly arranged on the connecting plates (112), so that the chip carriers are arranged in sequence in a preset direction (117).

8. The chip carrier material box according to claim 7, characterized in that: The parallelogram connecting rod structures (114) are respectively arranged on two corresponding sides of the connecting plate (112).

9. The chip carrier material box according to any one of claims 1 to 8, characterized in that: The carrier support bracket (100) is provided with mutually parallel clamping grooves (116), and two opposite sides of the chip carrier are respectively inserted into the clamping grooves (116).

10. A transfer device, characterized in that: It comprises the chip carrier material box as described in any one of claims 1 to 9 and a transport mechanism for transferring the material box.

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