Silicon wafer feeding mechanism and silicon wafer feeding device

Abstract

The utility model provides a silicon wafer feeding mechanism and a silicon wafer feeding device. The silicon wafer feeding mechanism comprises an installation support, a conveying belt, an air exhaust assembly and a suction cup assembly. The conveying belt is arranged on the mounting support, and adsorption holes are formed in the conveying belt. An air exhaust assembly and a suction cup assembly are arranged on the mounting bracket, the air exhaust assembly and the suction cup assembly are arranged corresponding to the adsorption position of the conveying belt, and the air exhaust assembly exhausts air in adsorption holes, located in the adsorption position, of the conveying belt. The suction force of the suction cup assembly is larger than that of the conveying belt. The suction cup assembly upwards sucks the silicon wafers jacked to the preset height in the material box, so that the silicon wafers are attached to the suction position of the lower side conveying face of the conveying belt, and the silicon wafers are sucked by the suction holes in the suction position. And the conveyer belt conveys the adsorbed silicon wafers along the conveying direction of the conveyer belt. According to the silicon wafer taking mechanism, the silicon wafers are taken out from the material box, the silicon wafers to be sucked in the material box can be sucked to the conveying belt without being jacked to the guide inclined planes of the limiting columns, and the silicon wafers located below can be prevented from being taken out of the material box when the silicon wafers are sucked.

Description

Technical Field

[0001] The present application relates to the field of production equipment for photovoltaic cell modules, and more specifically to a wafer loading mechanism and a wafer loading device. Background Art

[0002] During the production process of photovoltaic cell modules, it is necessary to suck wafers from a cassette located on the side of a wafer conveying line by a wafer loading mechanism, and then convey and release them onto the wafer conveying line, and the wafer conveying line conveys the wafers to subsequent processing stations.

[0003] As Figure 1 shown, a conventional cassette 100 includes a bottom plate 101 and a plurality of limiting columns 102 provided on the bottom plate 101. The bottom plate 101 is provided with a jacking hole, and the plurality of limiting columns 102 enclose a storage space for stacking wafers. The top of each limiting column is provided with an outwardly expanding guiding inclined surface 103.

[0004] A jacking mechanism located below the cassette 100 first jacks up the wafers in the cassette 100 through the jacking hole, so that the topmost wafer 200 is jacked up to a predetermined height. Then, a wafer picking mechanism 300 sucks out the topmost wafer from the cassette and conveys the wafer towards the wafer conveying line.

[0005] In the existing wafer loading mechanism, the adsorption force is small. Therefore, as Figure 1 shown, the topmost wafer 200 must be jacked up to the guiding inclined surface 103 of the limiting column before the wafer picking mechanism 300 can suck the wafer 200. The problem caused thereby is that the adjacent wafers below the topmost wafer 200 may also be jacked up to the guiding inclined surface 103. Due to the lack of limitation of the limiting column 102 at the guiding inclined surface 103 around the adjacent wafers, the jacking action may cause the adjacent wafers to move to the edge and be exposed on one side of the topmost wafer 200, and then the adjacent wafers will also be sucked by the wafer picking mechanism 300. Eventually, they may leave the cassette with the topmost wafer 200 and fall out of the cassette, resulting in damage. Utility Model Content

[0006] In order to solve the above technical problems, the present application provides a sheet loading device, which adopts the following technical solutions:

[0007] A wafer loading mechanism includes a mounting bracket, at least two conveyor belts, an air extraction assembly, and a suction cup assembly, wherein:

[0008] At least two conveyor belts are arranged in parallel on the mounting bracket, and a plurality of adsorption holes are arranged on the conveyor belts. The lower conveying surfaces of the conveyor belts are on the same plane;

[0009] At least one air extraction component and at least one suction cup component are provided on the mounting bracket. Both the air extraction component and the suction cup component are arranged corresponding to the adsorption positions of the conveyor belt. The air extraction component extracts air from the adsorption holes of the conveyor belt at the adsorption positions, so as to generate an adsorption force on the adsorption holes at the adsorption positions.

[0010] The adsorption surface of the suction cup component is higher than the lower conveying surface of the conveyor belt, and the adsorption force of the suction cup component is greater than the adsorption force at the lower conveying surface of the conveyor belt.

[0011] The suction cup component is configured to suck upward the topmost silicon wafer lifted to a predetermined height in the cassette, so that the silicon wafer is sucked upward out of the cassette and then abuts against the adsorption position on the lower conveying surface of the conveyor belt, and the adsorption holes at the adsorption position adsorb the silicon wafer.

[0012] The conveyor belt is configured to convey the adsorbed silicon wafer along the conveying direction of the conveyor belt.

[0013] For the silicon wafer picking mechanism provided in this application, the suction cup component provided between two adjacent conveyor belts sucks the silicon wafer lifted to a predetermined high position in the cassette, so that the silicon wafer leaves the cassette and abuts against the lower conveying surface of the conveyor belt. Subsequently, the air extraction component extracts air from the adsorption holes on the lower conveying surface of the conveyor belt to adsorb the silicon wafer on the lower conveying surface of the conveyor belt, and then the conveyor belt conveys the silicon wafer. Since the suction cup component has a large adsorption force, when sucking the silicon wafer to be picked in the cassette, the silicon wafer to be sucked does not need to be lifted to the guiding inclined surface at the top of the limiting column, and the suction cup component can suck the silicon wafer. In this way, when the topmost silicon wafer is sucked, the silicon wafers below it can be prevented from being taken out and damaged.

[0014] In some embodiments, after the silicon wafer is adsorbed by the adsorption holes at the adsorption positions, the suction cup component is configured to stop sucking the silicon wafer.

[0015] Since the suction cup component has a large adsorption force, after the silicon wafer is adsorbed on the lower conveying surface of the conveyor belt by the adsorption holes on the conveyor belt, the suction cup component stops sucking the silicon wafer, which can reduce the conveying resistance of the suction cup component to the silicon wafer and ensure the smooth conveying of the silicon wafer by the conveyor belt.

[0016] In some embodiments, a sensor is arranged on the side of the suction cup component. After the silicon wafer abuts against the lower conveying surface of the conveyor belt under the suction of the suction cup component, the sensor is triggered by the silicon wafer to generate an induction signal.

[0017] By arranging the sensor, it is ensured that after the silicon wafer is adsorbed on the lower conveying surface of the conveyor belt by the adsorption holes, the suction cup component immediately stops sucking the silicon wafer.

[0018] In some embodiments, the air extraction assembly includes a first air block and at least two second air blocks corresponding to the conveyor belts one by one, where: a first air extraction cavity is provided in the first air block, and the first air extraction cavity is connected to an external air extraction device through an air extraction pipe; the upper surface of the second air block is attached to the lower surface of the first air block, the lower surface of the second air block is attached to the corresponding conveyor belt, a second air extraction cavity communicating with the first air extraction cavity is formed in the second air block, an air extraction groove communicating with the second air extraction cavity is provided on the lower surface of the second air block, the air extraction groove extends along the conveying direction of the conveyor belt, and the notch of the air extraction groove faces the adsorption hole.

[0019] Since the air path structure composed of the first air extraction cavity, the second air extraction cavity and the air extraction groove is arranged inside the air extraction assembly, except for the air extraction pipe connected to the external air extraction device, no other external pipelines need to be arranged, thereby reducing the interference of the air extraction assembly on the wafer picking mechanism. In addition, the air extraction assembly is a split structure composed of the first air block and the second air blocks corresponding to the conveyor belts one by one, which facilitates the processing and forming of the first air extraction cavity, the second air extraction cavity and the air extraction groove.

[0020] In some embodiments, the first air block includes a first seat body and a first sealing plate. Among them, the first air extraction cavity is formed on the first seat body, the top of the first air extraction cavity is open, and the first sealing plate is mounted on the upper end surface of the first seat body to seal the first air extraction cavity.

[0021] By setting the first air block as a split structure composed of the first seat body and the first sealing plate, it is convenient for the processing and forming of the first air extraction cavity and ensures the sealing degree of the first air extraction cavity.

[0022] In some embodiments, the second air block includes a second seat body and a second sealing plate. Among them, the second air extraction cavity is formed on the second seat body, the side of the second air extraction cavity is open, and the second sealing plate is mounted on the side of the second seat body to seal the second air extraction cavity.

[0023] By setting the second air block as a split structure composed of the second seat body and the second sealing plate, it is convenient for the processing and forming of the second air extraction cavity and ensures the sealing degree of the second air extraction cavity.

[0024] In some embodiments, the first air extraction cavity and the second air extraction cavity are communicated through a plurality of first connection air holes, and the air extraction groove and the second air extraction cavity are communicated through a plurality of second connection air holes.

[0025] By providing the first connection air holes, the communication between the first air extraction cavity and the second air extraction cavity is realized. By providing the second connection holes, the communication between the air extraction groove and the second air extraction cavity is realized.

[0026] In some embodiments, there are two air extraction assemblies and two suction cup assemblies. The two air extraction assemblies are respectively arranged at both ends of the conveyor belt, and the two suction cup assemblies are respectively arranged at both ends of the conveyor belt.

[0027] Since the adsorption positions are formed at both ends of the conveyor belt, both ends of the conveyor belt can pick up wafers from the cassettes located on both sides of the wafer conveying line, and then convey and release the wafers to the wafer conveying line directly below the middle of the conveyor belt.

[0028] In some embodiments, the wafer loading mechanism further includes at least two adsorption blocks corresponding to the conveyor belts one by one. The adsorption blocks are arranged on the mounting bracket and located at the side of the corresponding conveyor belt. The adsorption blocks extend along the conveying direction of the conveyor belt, and the adsorption blocks are configured to adsorb the wafers in the middle of the lower conveying surface of the conveyor belt.

[0029] By providing the adsorption blocks, it is ensured that the wafers are adsorbed and held in the middle of the lower conveying surface of the conveyor belt.

[0030] In some embodiments, the adsorption block includes a base and a flow guiding member. The base is installed close to the corresponding conveyor belt, and the conveyor belt abuts against the base. An air cavity is formed between the flow guiding member and the base, and an air flow guiding portion communicating with the air cavity is formed between the flow guiding member and the base. An air supply port is provided on the flow guiding member. Compressed gas enters the air cavity through the air supply port, and then flows out of the air cavity from the air flow guiding portion to generate a negative pressure based on the Bernoulli effect to non - contactingly adsorb the wafers in the middle of the lower conveying surface of the conveyor belt.

[0031] By arranging the adsorption blocks, the adsorption blocks can form a negative pressure based on the Bernoulli effect to non - contactingly hold the wafers on the conveying surface of the conveyor belt. Since the adsorption force of the adsorption blocks is distributed along the conveying direction of the conveyor belt and is generated around the conveyor belt along the conveying direction rather than concentrated between the conveyor belts, the wafers are not easily deformed during adsorption. At the same time, the base can support the conveying surface of the conveyor belt, improving the smoothness of the conveyor belt conveying.

[0032] The present application also provides a wafer loading device, which includes the wafer loading mechanism according to any one of the above, a cassette carrier table and a lifting mechanism, wherein:

[0033] The cassette carrier table is arranged on the side of the wafer conveying line. The cassette carrier table is configured to carry the cassettes. The cassette carrier table is provided with a lifting channel that penetrates the cassette carrier table up and down. The lifting mechanism is arranged below the cassette carrier table. The cassette includes a bottom plate and a plurality of limiting columns arranged on the bottom plate. The bottom plate is provided with a lifting hole communicating with the lifting channel. The plurality of limiting columns enclose a storage space for stacking wafers. The top of each limiting column is provided with an outward - expanding guiding inclined surface;

[0034] The output position of the wafer loading mechanism is located above the wafer conveying line, and the adsorption position of the wafer loading mechanism is located above the cassette carrier table;

[0035] The lifting mechanism is configured to lift the wafers located in the cassette through the lifting holes and the lifting channels in sequence, so that the wafer at the topmost layer is lifted to a predetermined high position, and the predetermined high position is below the guiding inclined plane;

[0036] The wafer loading mechanism is configured to suck the wafer at the predetermined high position from the adsorption position, and convey the wafer to the output position and release the wafer to the lower wafer conveying line.

[0037] Through the cooperation of the wafer loading mechanism and the lifting mechanism, the wafer loading device realizes taking out the wafers in the cassette one by one, and conveying and releasing the taken-out wafers to the wafer conveying line. During the wafer taking process, it is prevented that when the topmost wafer is sucked, the wafers below it are taken out and damaged. Description of the Drawings

[0038] Figure 1 It is a schematic diagram of the process of sucking wafers from the cassette by a traditional material taking mechanism;

[0039] Figure 2 It is a schematic structural diagram of the wafer loading mechanism in the first perspective of the embodiment of the present application;

[0040] Figure 3 It is a schematic structural diagram of the wafer loading mechanism in the second perspective of the embodiment of the present application;

[0041] Figure 4 It is a partial structural diagram of one end of the wafer loading mechanism in the embodiment of the present application;

[0042] Figure 5 It is a schematic structural diagram of one end of the wafer loading mechanism in the embodiment of the present application after omitting some components;

[0043] Figure 6 It is a schematic structural diagram of the wafer loading mechanism in the third perspective of the embodiment of the present application;

[0044] Figure 7 For Figure 6 The enlarged partial view of area A;

[0045] Figure 8 It is a schematic diagram of the material taking mechanism in the embodiment of the present application taking the wafers in the cassette to the wafer conveying line;

[0046] Figure 9 It is a schematic assembly diagram of the lifting mechanism and the cassette in one perspective in the embodiment of the present application;

[0047] Figure 10 It is a schematic assembly diagram of the lifting mechanism and the cassette in another perspective in the embodiment of the present application;

[0048] Figures 1 to 10It includes:

[0049] Wafer loading mechanism 10:

[0050] Mounting bracket 1;

[0051] Conveyor belt 2;

[0052] Air extraction assembly 3: first air block 31, second air block 32, first air extraction chamber 33, air extraction pipe 34, second air extraction chamber 35, air extraction groove 36, first seat body 311, first sealing plate 312, second seat body 321, second sealing plate 322, first connection air hole 37, second connection air hole 38;

[0053] Suction cup assembly 4;

[0054] Sensor 5;

[0055] Adsorption block 6;

[0056] Cartridge carrier 20;

[0057] Lifting mechanism 30;

[0058] Air knife 40;

[0059] Cartridge 100: bottom plate 101, limit post 102, guiding inclined surface 103;

[0060] Wafer 200, picking mechanism 300, wafer conveying line 400. Specific implementation manner

[0061] To make the above objects, features, and advantages of the present application more obvious and understandable, the present application will be further described in detail below with reference to the accompanying drawings and specific implementation manners.

[0062] As Figures 2 to 3 shown, the wafer loading mechanism 10 in the embodiment of the present application includes a mounting bracket 1, at least two conveyor belts 2, an air extraction assembly 3, and a suction cup assembly 4, wherein:

[0063] At least two conveyor belts 2 are arranged in parallel on the mounting bracket 1. A plurality of adsorption holes 21 are provided on the conveyor belts 2, and the lower conveying surfaces of the conveyor belts 2 are in the same plane.

[0064] At least one air extraction assembly 3 and at least one suction cup assembly 4 are provided on the mounting bracket 1. The air extraction assembly 3 and the suction cup assembly 4 are both arranged corresponding to the adsorption positions of the conveyor belts 2. The air extraction assembly 3 extracts air from the adsorption holes of the conveyor belts 2 at the adsorption positions, so as to generate an adsorption force at the adsorption holes at the adsorption positions.

[0065] The adsorption surface of the suction cup assembly 4 is higher than the lower conveying surface of the conveyor belt 2, and the adsorption force of the suction cup assembly 4 is greater than the adsorption force at the lower conveying surface of the conveyor belt 2.

[0066] The suction cup assembly 4 is configured to suck upward the topmost silicon wafer in the cassette that has been lifted to a predetermined height, so that the silicon wafer is sucked upward out of the cassette and then abuts against the adsorption position on the lower conveying surface of the conveyor belt 2, and the adsorption holes 21 at the adsorption position adsorb the silicon wafer.

[0067] The conveyor belt 2 is configured to convey the adsorbed silicon wafer along the conveying direction of the conveyor belt 2.

[0068] The working process of the silicon wafer picking mechanism 10 in the embodiment of the present application is as follows:

[0069] Arrange the silicon wafer loading mechanism 10 so that the adsorption position of the conveyor belt 2 is directly above the cassette.

[0070] Turn on the suction cup assembly 4 and control the lifting mechanism to lift the silicon wafer in the cassette upward. Since the adsorption force of the suction cup assembly 4 is large. Therefore, when the topmost silicon wafer in the cassette is lifted to a predetermined height (the predetermined height is lower than the guiding slope of the limiting post of the cassette), the suction cup assembly 4 can suck the topmost silicon wafer out of the cassette and make the silicon wafer abut against the lower conveying surface of the conveyor belt 2.

[0071] After the topmost silicon wafer sucked by the suction cup assembly 4 abuts against the lower conveying surface of the conveyor belt 2, it is adsorbed and held on the lower conveying surface of the conveyor belt 2 by the adsorption holes on the conveyor belt 2.

[0072] Subsequently, each conveyor belt 2 conveys the silicon wafer away from the cassette.

[0073] For example, as shown in 2 to Figure 3 As shown in the figure, the adsorption position of the conveyor belt 2 is the end of the conveyor belt 2. The silicon wafer conveying line is directly below the middle of the conveyor belt 2. After the end of the conveyor belt 2 sucks the silicon wafer from the cassette, it conveys the silicon wafer towards the middle of the conveyor belt 2.

[0074] It can be seen that in the silicon wafer picking mechanism in the embodiment of the present application, the suction cup assembly 4 provided between two adjacent conveyor belts 2 sucks the silicon wafer in the cassette that has been lifted to a predetermined high position, so that the silicon wafer leaves the cassette and abuts against the lower conveying surface of the conveyor belt 2. Subsequently, the air extraction assembly 3 sucks air through the adsorption holes 21 on the lower conveying surface of the conveyor belt 3 to adsorb the silicon wafer on the lower conveying surface of the conveyor belt 2, and then the conveyor belt 2 conveys the silicon wafer. Since the suction cup assembly 4 has a large adsorption force, therefore, the silicon wafer to be sucked in the cassette does not need to be lifted to the guiding slope of the limiting post, and the suction cup assembly can suck the silicon wafer. In this way, when the topmost silicon wafer is sucked, the silicon wafers located below it can be prevented from being taken out and damaged.

[0075] Optionally, after the silicon wafer is adsorbed by the adsorption holes 21 at the adsorption positions, the chuck assembly 4 is closed, and the chuck assembly 4 immediately stops sucking the silicon wafer. The silicon wafer is only held on the lower conveying surface of the conveyor belt 2 under the adsorption of the adsorption holes 21, and the adsorption force of the adsorption holes 21 is relatively small. In this way, the conveying resistance of the silicon wafer can be reduced, ensuring the smooth conveying of the silicon wafer by the conveyor belt 2.

[0076] As Figures 2 to 3 shown, optionally, a sensor 5 is provided on the side of the chuck assembly 4. After the silicon wafer is sucked by the chuck assembly 4 and abuts against the lower conveying surface of the conveyor belt 2, the sensor 5 is triggered by the silicon wafer to generate an induction signal. In this way, it can be realized that after the silicon wafer is adsorbed on the lower conveying surface of the conveyor belt 2 by the adsorption holes 21, the chuck assembly 4 immediately stops sucking the silicon wafer. The sensor 5 can be a proximity sensor that can generate a proximity induction to the silicon wafer.

[0077] As Figures 4 to 7 shown, optionally, the air extraction assembly 3 includes a first air block 31 and at least two second air blocks 32 corresponding to the conveyor belt 2 one by one, where: a first air extraction chamber 33 is provided in the first air block 31, and the first air extraction chamber 33 is connected to an external air extraction device through an air extraction pipe 34. Figures 4 to 7 In the embodiment, two conveyor belts 2 are provided. Correspondingly, the air extraction assembly 3 includes two second air blocks 32.

[0078] The upper surface of the second air block 32 is attached to the lower surface of the first air block 31, the lower surface of the second air block 32 is attached to the corresponding conveyor belt 2, a second air extraction chamber 35 communicating with the first air extraction chamber 33 is formed in the second air block 32, an air extraction groove 36 communicating with the second air extraction chamber 35 is provided on the lower surface of the second air block 32, the air extraction groove 36 extends along the conveying direction of the conveyor belt 2, and the notch of the air extraction groove 36 faces the adsorption holes 21.

[0079] When the air extraction device extracts air from the first air extraction chamber 33 through the air extraction pipe 34, negative pressures are generated in the first air extraction chamber 33, the second air extraction chamber 35, and the air extraction groove 36 that are connected in sequence. Finally, the air extraction groove 36 extracts air from the adsorption holes 21 on the conveyor belt 2, so that an adsorption force is generated on the lower conveying surface of the conveyor belt 2 at the adsorption position.

[0080] Since the air path structure composed of the first air extraction chamber 33, the second air extraction chamber 35, and the air extraction groove 36 is arranged inside the air extraction assembly 3, except for the air extraction pipe 34 connected to the external air extraction device, no other external pipelines need to be provided, thereby reducing the interference of the air extraction assembly on the wafer picking mechanism of the silicon wafer. In addition, the air extraction assembly 3 is a split structure composed of the first air block 31 and the second air blocks 32 corresponding to the conveyor belt one by one, which facilitates the processing and forming of the first air extraction chamber 33, the second air extraction chamber 35, and the air extraction groove 36.

[0081] AsFigures 4 to 5 As shown, optionally, the first air block 31 includes a first base body 311 and a first sealing plate 312. Among them, a first air extraction cavity 33 is formed on the first base body 311. The top of the first air extraction cavity 33 is open, and the first sealing plate 312 is mounted on the upper end face of the first base body 311 to seal the first air extraction cavity 33.

[0082] By setting the first air block 31 into a split structure composed of the first base body 311 and the first sealing plate 312, it is convenient for the processing and forming of the first air extraction cavity 33 and ensures the sealing degree of the first air extraction cavity 33.

[0083] Optionally, as Figures 4 to 6 shown, the second air block 32 includes a second base body 321 and a second sealing plate 322. Among them, a second air extraction cavity 35 is formed on the second base body 321. The side of the second air extraction cavity 35 is open, and the second sealing plate 322 is mounted on the side of the second base body 321 to seal the second air extraction cavity 35.

[0084] By setting the second air block 32 into a split structure composed of the second base body 321 and the second sealing plate 322, it is convenient for the processing and forming of the second air extraction cavity 35 and ensures the sealing degree of the second air extraction cavity 35.

[0085] As Figure 5 shown, in order to realize the connection between the first air extraction cavity 33 and the second air extraction cavity 35, optionally, a number of first connection air holes 37 are provided between the first air extraction cavity 33 and the second air extraction cavity 35.

[0086] As Figures 6 to 7 shown, in order to realize the connection between the air extraction groove 36 and the second air extraction cavity 35, optionally, a number of second connection air holes 38 are provided between the air extraction groove 36 and the second air extraction cavity 35.

[0087] As Figure 2 , Figure 3 and Figure 6 shown, optionally, the adsorption positions of the conveyor belt 2 are located at both ends of the conveyor belt 2. Correspondingly, two air extraction assemblies 3 are provided, and two suction cup assemblies 4 are provided. The two air extraction assemblies 3 are respectively arranged at both ends of the conveyor belt 2, and the two suction cup assemblies 4 are respectively arranged at both ends of the conveyor belt 2.

[0088] Since the adsorption positions are formed at both ends of the conveyor belt 2, therefore, both ends of the conveyor belt 2 can alternately suck silicon wafers from the cassettes located on both sides of the silicon wafer conveying line, and then convey and release the silicon wafers towards the middle of the conveyor belt 2, so that the silicon wafers fall onto the silicon wafer conveying line directly below the middle of the conveyor belt 2.

[0089] To ensure that the silicon wafer is adsorbed and held in the middle position of the conveyor belt 2 during transportation, optionally, the silicon wafer loading mechanism in the embodiments of the present application further includes at least two adsorption blocks 6 corresponding to the conveyor belt 2 one by one. The adsorption blocks 6 are arranged on the mounting bracket 1 and are located on the side of the corresponding conveyor belt 2. The adsorption blocks 6 extend along the conveying direction of the conveyor belt 2, and the adsorption blocks 6 are configured to adsorb the silicon wafer on the middle of the lower conveying surface of the conveyor belt 2.

[0090] Optionally, the adsorption block 6 includes a base and a flow guide member. The base is installed close to the corresponding conveyor belt 2, and the conveyor belt 2 abuts against the base. An air cavity is formed between the flow guide member and the base, and an air flow guiding portion communicating with the air cavity is formed between the flow guide member and the base. An air supply port is provided on the flow guide member. Compressed gas enters the air cavity through the air supply port, and then flows out of the air cavity from the air flow guiding portion to generate negative pressure based on the Bernoulli effect to non-contactingly adsorb the silicon wafer on the middle of the lower conveying surface of the conveyor belt 2.

[0091] By arranging the adsorption block 6, the adsorption block 6 can form negative pressure based on the Bernoulli effect to non-contactingly hold the silicon wafer on the conveying surface of the conveyor belt 2. Since the adsorption force of the adsorption block 6 is distributed along the conveying direction of the conveyor belt 2, the adsorption force is generated around the conveyor belt 2 along the conveying direction, rather than concentrated between the conveyor belts 2. Therefore, the silicon wafer is not easily deformed during adsorption. At the same time, the base can support the conveying surface of the conveyor belt 2, improving the smoothness of the conveyor belt 2 during transportation.

[0092] The present application also provides a silicon wafer loading device. As Figures 8 to 10 shown, the silicon wafer loading device in the embodiments of the present application includes the silicon wafer loading mechanism 10, the cassette carrier 20, and the lifting mechanism 30 in any of the above embodiments, where:

[0093] The cassette carrier 20 is arranged on the side of the silicon wafer conveying line 400. The cassette carrier 20 is configured to carry the cassette 100. The cassette carrier 20 is provided with a lifting channel that penetrates the cassette carrier 20 up and down. The lifting mechanism 30 is arranged below the cassette carrier 20. The cassette 100 includes a bottom plate 101 and a plurality of limit posts 102 arranged on the bottom plate 101. The bottom plate 101 is provided with a lifting hole that communicates with the lifting channel. The plurality of limit posts 102 enclose a storage space for stacking silicon wafers. The top of the limit posts 102 is provided with an outwardly expanding guiding inclined surface 103.

[0094] The output position of the silicon wafer loading mechanism 10 is located above the silicon wafer conveying line 400, and the adsorption position of the silicon wafer loading mechanism 10 is located above the cassette carrier 20. Figures 8 to 10 In the shown embodiment, the output position of the silicon wafer loading mechanism 10 is located in the middle of the conveyor belt 2, and the adsorption position of the silicon wafer loading mechanism 10 is located at both ends of the conveyor belt 2.

[0095] The lifting mechanism 30 is configured to lift the wafers located in the cassette 100 successively through the lifting holes and the lifting channels, so that the wafers at the topmost layer are lifted to a predetermined high position, and the predetermined high position is below the guiding inclined surface 102. The wafer loading mechanism 10 is configured to suck the wafers at the predetermined high position from the adsorption position, and convey the wafers to the output position and release the wafers to the lower wafer conveying line 400.

[0096] Through the cooperation of the wafer loading mechanism 10 and the lifting mechanism 30, the wafer loading device realizes the piece-by-piece removal of the wafers in the cassette, and conveys and releases the removed wafers to the wafer conveying line 400. During the wafer picking process, to prevent the wafers below the topmost wafer from being taken out when the topmost wafer is sucked, resulting in damage.

[0097] As Figure 9 shown, optionally, the lifting mechanism 30 includes a lifting driving part 301 and a lifting plate 302. Among them, the lifting plate 302 is connected to the driving end of the lifting driving part 301. When the lifting driving part 301 drives the lifting plate 302 to rise, the lifting plate 302 successively passes through the lifting channel and the lifting hole to lift the wafers located in the cassette 100. The lifting driving part 301 can be a cylinder.

[0098] By setting the lifting mechanism 30, the lifting mechanism 30 can successively pass through the lifting channel on the cassette bearing table 20 and the lifting holes at the bottom of the cassette 100 to lift the wafers in the cassette 100, and keep the lifted wafers horizontal, and finally ensure that the wafers lifted to the predetermined high position are stably adsorbed to the conveying surface of the conveyor belt 2 by the suction cup assembly 4.

[0099] During the wafer picking process, in order to blow away the wafers so that the wafer loading mechanism 10 can smoothly suck the wafers from the cassette 100, as Figure 9 shown, air knives 40 are further provided on the cassette bearing table 20. The air knives 40 are located on opposite sides of the cassette 100. During the wafer picking process, the air knives 40 are used to blow horizontally towards the wafers in the cassette 100 to blow away the wafers. In this application, the air extraction assembly 3 generates an adsorption force at the adsorption holes 21 by air extraction instead of blowing, which will not cause air flow interference with the air knives 40 and will not affect the effect of the air knives 40.

[0100] The above has described the present application in sufficient detail with a certain particularity. Those of ordinary skill in the art should understand that the descriptions in the embodiments are only exemplary. All changes made without departing from the true spirit and scope of the present application should fall within the protection scope of the present application. The scope to be protected by the present application is defined by the claims described, rather than by the above descriptions in the embodiments. And, the embodiments mentioned in the present application are not only implemented individually, and some embodiments can also be implemented in combination.

Claims

1. A silicon wafer feeding mechanism, characterized in that: The silicon wafer loading mechanism includes a mounting bracket, at least two conveyor belts, an air extraction assembly and a suction cup assembly, wherein: At least two conveyor belts are arranged in parallel on the mounting bracket, and a plurality of adsorption holes are arranged on the conveyor belts, and the lower conveying surfaces of the conveyor belts are on the same plane; At least one of the suction components and at least one of the suction cup components are arranged on the mounting bracket, and both of the suction components and the suction cup components are arranged corresponding to the adsorption position of the conveyor belt, and the suction component exhausts air from the adsorption holes of the conveyor belt at the adsorption position, so that the adsorption holes at the adsorption position generate adsorption force; The adsorption surface of the suction cup assembly is higher than the lower conveying surface of the conveyor belt, and the adsorption force of the suction cup assembly is greater than the adsorption force at the lower conveying surface of the conveyor belt; The suction cup assembly is configured to suck up the silicon wafer at the top layer in the material box and lifted to a predetermined height, so that the silicon wafer is sucked out of the material box and abuts against the suction position on the lower conveying surface of the conveyor belt, and the suction hole at the suction position sucks the silicon wafer; The conveyor belt is configured to convey the adsorbed silicon wafer along a conveying direction of the conveyor belt.

2. The silicon wafer loading mechanism according to claim 1, characterized in that: After the silicon wafer is adsorbed by the adsorption hole located at the adsorption position, the suction cup assembly is configured to stop adsorbing the silicon wafer.

3. The silicon wafer loading mechanism according to claim 1, characterized in that: A sensor is arranged on the side of the suction cup assembly. After the silicon wafer is attached to the lower conveying surface of the conveyor belt under the suction of the suction cup assembly, the sensor is triggered by the silicon wafer to generate an induction signal.

4. The silicon wafer loading mechanism according to claim 1, characterized in that: The air extraction assembly includes a first air block and at least two second air blocks corresponding to the conveyor belts one by one, wherein: A first air pumping cavity is provided in the first air block, and the first air pumping cavity is connected to an external air pumping device via an air pumping pipe; The upper surface of the second air block is in contact with the lower surface of the first air block, and the lower surface of the second air block is in contact with the corresponding conveyor belt. A second air pumping cavity connected with the first air pumping cavity is formed in the second air block, and an air pumping groove connected with the second air pumping cavity is provided on the lower surface of the second air block. The air pumping groove extends along the conveying direction of the conveyor belt, and the notch of the air pumping groove is arranged toward the adsorption hole.

5. The silicon wafer loading mechanism according to claim 4, characterized in that: The first gas block includes a first base and a first sealing plate, wherein the first air pumping cavity is formed on the first base, the top of the first air pumping cavity is open, and the first sealing plate is attached to the upper end surface of the first base to close the first air pumping cavity.

6. The silicon wafer loading mechanism according to claim 4, characterized in that: The second gas block includes a second base body and a second sealing plate, wherein the second air pumping cavity is formed on the second base body, the second air pumping cavity has an opening on a side, and the second sealing plate is attached to a side of the second base body to close the second air pumping cavity.

7. The silicon wafer loading mechanism according to claim 4, characterized in that: The first air pumping cavity is connected to the second air pumping cavity via a plurality of first connecting air holes, and the air pumping groove is connected to the second air pumping cavity via a plurality of second connecting air holes.

8. The silicon wafer loading mechanism according to claim 1, characterized in that: There are two vacuum assemblies and two suction cup assemblies. The two vacuum assemblies are respectively arranged at two ends of the conveyor belt, and the two suction cup assemblies are respectively arranged at two ends of the conveyor belt.

9. The silicon wafer loading mechanism according to claim 8, characterized in that: The silicon wafer loading mechanism also includes at least two adsorption blocks corresponding to the conveyor belts one by one. The adsorption blocks are arranged on the mounting bracket and located on the corresponding sides of the conveyor belts. The adsorption blocks extend along the conveying direction of the conveyor belts. The adsorption blocks are configured to adsorb the silicon wafers on the middle of the lower conveying surface of the conveyor belt.

10. The silicon wafer loading mechanism according to claim 9, characterized in that: The adsorption block includes a base and a flow guide, the base is installed close to the corresponding conveyor belt, the conveyor belt is abutted against the base, an air cavity is formed between the flow guide and the base, an air flow guide part connected to the air cavity is formed between the flow guide and the base, and an air supply port is provided on the flow guide, compressed gas enters the air cavity through the air supply port, and then flows out from the air flow guide part through the air cavity to generate negative pressure based on the Bernoulli effect to non-contact adsorb the silicon wafer on the middle of the lower conveying surface of the conveyor belt.

11. A silicon wafer loading device, characterized in that: The silicon wafer loading device comprises the silicon wafer loading mechanism, the material box carrying platform and the lifting mechanism according to any one of claims 1 to 10, wherein: The material box carrier is arranged at the side of the silicon wafer conveyor line, the material box carrier is configured to carry the material box, a lifting channel which passes through the material box carrier up and down is arranged on the material box carrier, the lifting mechanism is arranged below the material box carrier, the material box comprises a bottom plate and a plurality of limiting columns arranged on the bottom plate, a lifting hole which passes through the lifting channel is arranged on the bottom plate, a plurality of the limiting columns enclose a material storage space for stacking silicon wafers, and a top of each of the limiting columns is provided with an outwardly expanding guiding inclined surface; The output position of the silicon wafer loading mechanism is located above the silicon wafer conveyor line, and the adsorption position of the silicon wafer loading mechanism is located above the material box bearing platform; The lifting mechanism is configured to lift the silicon wafers in the material box through the lifting hole and the lifting channel in sequence, so that the silicon wafer at the top layer is lifted to a predetermined high position, and the predetermined high position is located below the guide inclined surface; The silicon wafer loading mechanism is configured to absorb the silicon wafer located at the predetermined high position from the adsorption position, transport the silicon wafer to the output position, and release the silicon wafer to the silicon wafer conveying line below.

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