Mechanism capable of taking and placing wafers of various specifications

Abstract

The utility model relates to a mechanism capable of taking and placing wafers of various specifications. The mechanism comprises a wafer manipulator, and a first wafer box, a calibrator, a placing table and a second wafer box which surround the outer side of the wafer manipulator. The quick-change finger assembly sequentially comprises five supporting partition plates from top to bottom, a quick-change finger storage space is formed between every two adjacent supporting partition plates, and the first quick-change finger, the second quick-change finger, the third quick-change finger and the fourth quick-change finger are sequentially placed in the quick-change finger storage spaces from bottom to top. According to the utility model, the traditional wafer taking and placing are optimized and upgraded, so that the original mode of taking one specification of wafer by one finger is upgraded to the mode of automatically taking and placing wafers of various specifications by quickly replacing the fingers, thereby not only saving the labor cost caused by frequently replacing the fingers, but also improving the utilization rate of equipment; and the equipment productivity is improved.

Description

Technical Field

[0001] The utility model relates to the technical field related to wafer processing, in particular to a mechanism capable of picking and placing wafers of multiple specifications. Background Art

[0002] Wafer handling is an essential process in semiconductor equipment. Wafers have different size specifications, including 4 inches, 6 inches, 8 inches, 12 inches, etc., and the loading forms of wafers also include steel rings, mother - son rings, etc. The thickness range of wafers is usually between dozens of microns and hundreds of microns. For wafers of different sizes, different loading forms, and different thicknesses, different wafer fingers are used. In the industry, ceramic fingers are commonly used to pick and place wafers. However, this method has a disadvantage that one type of finger can only pick and place 1 to 2 products. If the customer has a wide variety of product types, one type of finger cannot meet the customer's needs, and at this time, only manual replacement of the finger can be used to achieve it.

[0003] In view of the above - mentioned defects, the designer actively conducts research and innovation in order to create a mechanism capable of picking and placing wafers of multiple specifications, making it more valuable in industry. Summary of the Utility Model

[0004] To solve any one of the above - mentioned technical problems, the purpose of the utility model is to provide a mechanism capable of picking and placing wafers of multiple specifications.

[0005] To achieve the above - mentioned purpose, the utility model adopts the following technical solutions:

[0006] A mechanism capable of picking and placing wafers of multiple specifications includes a wafer manipulator, and a first wafer cassette, a calibrator, a placement table, and a second wafer cassette surrounding the outside of the wafer manipulator;

[0007] It further includes a quick - change finger assembly. The quick - change finger assembly includes five support partitions from top to bottom. Adjacent two support partitions are connected together by surrounding support rods, and a quick - change finger storage space is formed between adjacent two support partitions. A first quick - change finger, a second quick - change finger, a third quick - change finger, and a fourth quick - change finger are sequentially placed in the quick - change finger storage space from bottom to top;

[0008] The upper ends of the first quick - change finger, the second quick - change finger, the third quick - change finger, and the fourth quick - change finger are all adapted to the wafer manipulator through a quick - change joint assembly. The quick - change joint assembly includes a first quick - change joint body installed at the upper end of the first quick - change finger or the second quick - change finger or the third quick - change finger or the fourth quick - change finger, and a second quick - change joint body installed at the driving end of the wafer manipulator;

[0009] A first quick-change end face is provided on the docking portion of the first quick-change joint body. A first quick-change docking slot is opened at the middle position of the first quick-change end face. A second quick-change end face is provided on the docking portion of the second quick-change joint body. A second quick-change boss adapted to the above-mentioned first quick-change docking slot is provided at the middle position of the second quick-change end face. When the second quick-change boss is inserted into the first quick-change docking slot, the first quick-change end face and the second quick-change end face are vacuum-adsorbed together.

[0010] As a further improvement of the present utility model, a number of cushion blocks are installed in the quick-change finger storage space, and the first quick-change finger or the second quick-change finger or the third quick-change finger or the fourth quick-change finger is placed on the number of cushion blocks.

[0011] As a further improvement of the present utility model, a front support plate is provided on the outer side of the quick-change finger storage space, and the first quick-change joint body at the upper end of the first quick-change finger or the second quick-change finger or the third quick-change finger or the fourth quick-change finger is located on the front support plate.

[0012] As a further improvement of the present utility model, the first quick-change finger includes a first quick-change end plate. A first quick-change joint body is installed on the first side of the first quick-change end plate. A first quick-change carrier frame with a C-shaped structure is provided on the second side of the first quick-change end plate.

[0013] As a further improvement of the present utility model, the second quick-change finger includes a second quick-change end plate. A first quick-change joint body is installed on the first side of the second quick-change end plate. Two straight plate-shaped second quick-change carrier frames are provided on the second side of the second quick-change end plate. A second quick-change support ring is installed on the outer side of the two second quick-change carrier frames.

[0014] As a further improvement of the present utility model, the third quick-change finger includes a third quick-change end plate. A first quick-change joint body is installed on the first side of the third quick-change end plate. A disc-shaped third quick-change carrier frame is provided on the second side of the third quick-change end plate.

[0015] As a further improvement of the present utility model, the fourth quick-change finger includes a fourth quick-change end plate. A first quick-change joint body is installed on the first side of the fourth quick-change end plate. The second side of the fourth quick-change end plate is connected to the first side of the fourth quick-change extension plate. Two straight plate-shaped fourth quick-change carrier frames are provided on the second side of the fourth quick-change extension plate.

[0016] As a further improvement of the present utility model, a number of first quick-change positioning holes are opened on the first quick-change end face, and a number of second quick-change positioning posts adapted to the above-mentioned first quick-change positioning holes are provided on the second quick-change end face.

[0017] As a further improvement of the present utility model, the second quick-change boss and the first quick-change docking slot are magnetically attracted to each other.

[0018] With the above solution, the utility model has at least the following advantages:

[0019] By optimizing and upgrading the traditional wafer picking and placing, the utility model upgrades the original operation of picking one specification of wafer with one finger to automatically picking and placing multiple specifications of wafers by means of quick-change fingers. This not only saves the labor cost caused by frequent finger replacement, but also improves the equipment utilization rate and the equipment production capacity.

[0020] The utility model realizes the automatic handling of wafers with different sizes, different loading forms or different thicknesses by means of quick-change fingers. In this way, it can not only reduce the labor cost and achieve high automation, but also improve the equipment compatibility to meet the customer requirements.

[0021] The above description is only an overview of the technical solution of the utility model. In order to understand the technical means of the utility model more clearly and implement it according to the content of the specification, the following takes the preferred embodiments of the utility model and combines with the drawings to describe in detail as follows. Brief Description of the Drawings

[0022] In order to illustrate the technical solutions of the embodiments of the utility model more clearly, the following briefly introduces the drawings required to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the utility model, so they should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can also be obtained according to these drawings without creative efforts.

[0023] Figure 1 It is a schematic structural diagram of a mechanism for picking and placing multiple specifications of wafers according to the utility model;

[0024] Figure 2 is Figure 1 a schematic structural diagram of the quick-change finger assembly in

[0025] Figure 3 is Figure 2 a schematic structural diagram of the first quick-change finger in

[0026] Figure 4 is Figure 2 a schematic structural diagram of the second quick-change finger in

[0027] Figure 5 is Figure 2 a schematic structural diagram of the third quick-change finger in

[0028] Figure 6 is Figure 2 a schematic structural diagram of the fourth quick-change finger in

[0029] Figure 7 isFigures 3 to 6 Schematic structural diagram of the first half of the medium quick-change joint assembly;

[0030] Figure 8 is Figures 3 to 6 Schematic structural diagram of the second half of the medium quick-change joint assembly.

[0031] Among them, the meanings of the various reference numerals in the figures are as follows.

[0032] Wafer manipulator 1, first wafer cassette 2, calibrator 3, quick-change finger assembly 4, placement table 5, second wafer cassette 6, first quick-change finger 7, second quick-change finger 8, third quick-change finger 9, fourth quick-change finger 10, quick-change joint assembly 11;

[0033] Support partition 41, support rod 42, cushion block 43, front support plate 44;

[0034] First quick-change end plate 71, first quick-change carrier 72;

[0035] Second quick-change end plate 81, second quick-change carrier 82, second quick-change support ring 83;

[0036] Third quick-change end plate 91, third quick-change carrier 92;

[0037] Fourth quick-change end plate 101, fourth quick-change extension plate 102, fourth quick-change carrier 103;

[0038] First quick-change joint body 111, first quick-change end face 112, first quick-change mating slot 113, first quick-change positioning hole 114, second quick-change joint body 115, second quick-change end face 116, second quick-change boss 117, second quick-change positioning post 118. Specific embodiments

[0039] The following combines the drawings and embodiments to further describe in detail the specific embodiments of the present invention. The following embodiments are used to illustrate the present invention, but are not used to limit the scope of the present invention.

[0040] To enable those skilled in the art to better understand the solution of the present utility model, the following will clearly and completely describe the technical solutions in the embodiments of the present utility model in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Usually, the components of the embodiments of the present utility model described and shown in the accompanying drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present utility model provided in the accompanying drawings is not intended to limit the scope of the present utility model to be protected, but only represents the selected embodiments of the present utility model. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present utility model.

[0041] As Figures 1 to 8 shown, a mechanism for picking and placing wafers of multiple specifications includes a wafer manipulator 1 and a first wafer cassette 2, a calibrator 3, a quick-change finger assembly 4, a placement table 5, and a second wafer cassette 6 surrounding the wafer manipulator 1.

[0042] I. Basic structure of the quick-change finger assembly 4:

[0043] The quick-change finger assembly 4 includes five support partitions 41 from top to bottom. Adjacent support partitions 41 are connected together by surrounding support rods 42, and a quick-change finger storage space is formed between adjacent support partitions 41. The first quick-change finger 7, the second quick-change finger 8, the third quick-change finger 9, and the fourth quick-change finger 10 are sequentially placed in the quick-change finger storage space from bottom to top.

[0044] A number of pads 43 are installed in the quick-change finger storage space, and the first quick-change finger 7 or the second quick-change finger 8 or the third quick-change finger 9 or the fourth quick-change finger 10 is placed on the number of pads 43.

[0045] A front support plate 44 is provided on the outer side of the quick-change finger storage space, and the first quick-change joint body 111 at the upper end of the first quick-change finger 7 or the second quick-change finger 8 or the third quick-change finger 9 or the fourth quick-change finger 10 is located on the front support plate 44.

[0046] The upper ends of the first quick-change finger 7, the second quick-change finger 8, the third quick-change finger 9, and the fourth quick-change finger 10 are all adapted to the wafer manipulator 1 through a quick-change joint assembly 11. The quick-change joint assembly 11 includes a first quick-change joint body 111 installed at the upper end of the first quick-change finger 7 or the second quick-change finger 8 or the third quick-change finger 9 or the fourth quick-change finger 10 and a second quick-change joint body 115 installed on the driving end of the wafer manipulator 1.

[0047] II. Structure of the quick-change joint assembly 11:

[0048] On the docking part of the first quick-change joint body 111, there is a first quick-change end face 112. In the middle position of the first quick-change end face 112, there is a first quick-change docking slot 113. On the docking part of the second quick-change joint body 115, there is a second quick-change end face 116. In the middle position of the second quick-change end face 116, there is a second quick-change boss 117 adapted to the above-mentioned first quick-change docking slot 113. When the second quick-change boss 117 is inserted into the first quick-change docking slot 113, the first quick-change end face 112 and the second quick-change end face 116 are vacuum adsorbed together. Connection and disconnection are achieved through positive air pressure. After connection, there is negative pressure inside the finger to adsorb the product.

[0049] On the first quick-change end face 112, there are several first quick-change positioning holes 114. On the second quick-change end face 116, there are several second quick-change positioning posts 118 adapted to the above-mentioned first quick-change positioning holes 114.

[0050] The second quick-change boss 117 and the first quick-change docking slot 113 are magnetically attracted to each other. The magnetic attraction method is through an electromagnet, which can achieve quick on and off.

[0051] III. Structure of the quick-change finger:

[0052] The first quick-change finger 7 includes a first quick-change end plate 71. On the first side of the first quick-change end plate 71, there is a first quick-change joint body 111 installed. On the second side of the first quick-change end plate 71, there is a first quick-change carrier 72 with a C-shaped structure. The first quick-change finger 7 is applicable to the situation where the front and back sides of the bare die wafer are not allowed to be contacted, and it realizes handling through edge support and vacuum adsorption.

[0053] The second quick-change finger 8 includes a second quick-change end plate 81. On the first side of the second quick-change end plate 81, there is a first quick-change joint body 111 installed. On the second side of the second quick-change end plate 81, there are two linear plate-shaped second quick-change carriers 82. On the outer sides of the two second quick-change carriers 82, there is a second quick-change support ring 83 installed. The second quick-change finger 8 is applicable to the vacuum adsorption and pick-and-place of 6-inch, 8-inch, and 12-inch wafers with steel rings.

[0054] The third quick-change finger 9 includes a third quick-change end plate 91. On the first side of the third quick-change end plate 91, there is a first quick-change joint body 111 installed. On the second side of the third quick-change end plate 91, there is a disc-shaped third quick-change carrier 93. The third quick-change finger 9 is applicable to the vacuum adsorption and pick-and-place of thin wafers that are prone to deformation.

[0055] The fourth quick-change finger 10 includes a fourth quick-change end plate 101. A first quick-change joint body 111 is installed on the first side of the fourth quick-change end plate 101. The second side of the fourth quick-change end plate 101 is connected to the first side of a fourth quick-change extension plate 102. Two linear plate-shaped fourth quick-change carriers 103 are provided on the second side of the fourth quick-change extension plate 102. The fourth quick-change finger 10 is applicable to vacuum-adsorbing and picking up 6-inch, 8-inch, and 12-inch wafers with conventional thicknesses.

[0056] The working principle and process of the present utility model:

[0057] The wafer manipulator 1 is connected to the fourth quick-change finger 10 through a quick-change device from the quick-change finger assembly 4, and takes out one wafer from the first wafer cassette 2 and places it on the stage of the calibrator 3 for wafer positioning. The wafer manipulator 1 returns the fourth quick-change finger 10 to its original position and disconnects the connection, then connects through the second quick-change finger 8, takes out one wafer with a steel ring from the second wafer cassette 6 with a steel ring and places it on the stage of the steel-ring placement table 5.

[0058] By optimizing and upgrading the traditional wafer picking and placing, the original way of using one finger to pick one specification of wafer is upgraded to automatically pick and place multiple specifications of wafers through the quick-change finger method. This not only saves the labor cost caused by frequent finger replacement, but also improves the equipment utilization rate and the equipment production capacity.

[0059] The automatic handling of wafers with different sizes, different loading forms, or different thicknesses is realized through the quick-change finger method. This can not only reduce the labor cost, achieve high automation, but also improve the equipment compatibility to meet customer needs.

[0060] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation to the present utility model. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of the present utility model, unless otherwise specified, the meaning of "a plurality" is two or more.

[0061] In the description of the present utility model, it should be noted that unless otherwise clearly specified and defined, the terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium; it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood through specific circumstances.

[0062] The above are only the preferred embodiments of the present utility model and are not used to limit the present utility model. It should be pointed out that for those of ordinary skill in the art, without departing from the technical principle of the present utility model, several improvements and modifications can still be made, and these improvements and modifications should also be regarded as the protection scope of the present utility model.

Claims

1. A mechanism capable of taking and placing wafers of various specifications, comprising a wafer robot (1) and a first wafer box (2), a calibrator (3), a placement table (5) and a second wafer box (6) surrounding the outside of the wafer robot (1); characterized in that: It also includes a quick-change finger assembly (4), wherein the quick-change finger assembly (4) includes five supporting partitions (41) in sequence from top to bottom, two adjacent supporting partitions (41) are connected together by supporting rods (42) around them, and a quick-change finger storage space is formed between the two adjacent supporting partitions (41), and the first quick-change finger (7), the second quick-change finger (8), the third quick-change finger (9) and the fourth quick-change finger (10) are placed in the quick-change finger storage space in sequence from bottom to top; The ends of the first quick-change finger (7), the second quick-change finger (8), the third quick-change finger (9) and the fourth quick-change finger (10) are all adapted to the wafer robot (1) via a quick-change joint assembly (11), wherein the quick-change joint assembly (11) comprises a first quick-change joint body (111) mounted on the end of the first quick-change finger (7) or the second quick-change finger (8) or the third quick-change finger (9) or the fourth quick-change finger (10) and a second quick-change joint body (115) mounted on the driving end of the wafer robot (1); A first quick-change end face (112) is arranged on the docking portion of the first quick-change connector body (111), a first quick-change slot (113) is provided in the middle of the first quick-change end face (112), a second quick-change end face (116) is arranged on the docking portion of the second quick-change connector body (115), a second quick-change boss (117) matched with the first quick-change slot (113) is provided in the middle of the second quick-change end face (116), and when the second quick-change boss (117) is inserted into the first quick-change slot (113), the first quick-change end face (112) and the second quick-change end face (116) are vacuum-adsorbed together.

2. A mechanism for taking and placing wafers of various specifications as claimed in claim 1, characterized in that: A plurality of pads (43) are installed in the quick-change finger storage space, and the first quick-change finger (7) or the second quick-change finger (8) or the third quick-change finger (9) or the fourth quick-change finger (10) are placed on the plurality of pads (43).

3. A mechanism capable of taking and placing wafers of various specifications as claimed in claim 1, characterized in that: A front support plate (44) is arranged on the outer side of the quick-change finger storage space, and a first quick-change joint body (111) at the upper end of the first quick-change finger (7) or the second quick-change finger (8) or the third quick-change finger (9) or the fourth quick-change finger (10) is located on the front support plate (44).

4. The mechanism for taking and placing wafers of various specifications as claimed in claim 1, characterized in that: The first quick-change finger (7) comprises a first quick-change end plate (71), a first quick-change connector body (111) is installed on a first side of the first quick-change end plate (71), and a first quick-change carrier (72) with a C-shaped structure is arranged on a second side of the first quick-change end plate (71).

5. The mechanism for taking and placing wafers of various specifications as claimed in claim 1, characterized in that: The second quick-change finger (8) comprises a second quick-change end plate (81), a first quick-change connector body (111) is installed on the first side of the second quick-change end plate (81), two straight plate-shaped second quick-change carriers (82) are arranged on the second side of the second quick-change end plate (81), and second quick-change support rings (83) are installed on the outer sides of the two second quick-change carriers (82).

6. The mechanism for taking and placing wafers of various specifications as claimed in claim 1, characterized in that: The third quick-change finger (9) comprises a third quick-change end plate (91), a first quick-change connector body (111) is mounted on a first side of the third quick-change end plate (91), and a disc-shaped third quick-change carrier (93) is arranged on a second side of the third quick-change end plate (91).

7. The mechanism for taking and placing wafers of various specifications as claimed in claim 1, characterized in that: The fourth quick-change finger (10) comprises a fourth quick-change end plate (101), a first quick-change connector body (111) is installed on the first side of the fourth quick-change end plate (101), the second side of the fourth quick-change end plate (101) is connected to the first side of the fourth quick-change extension plate (102), and two fourth quick-change carriers (103) in the form of straight plates are arranged on the second side of the fourth quick-change extension plate (102).

8. The mechanism for taking and placing wafers of various specifications as claimed in claim 1, characterized in that: A plurality of first quick-change positioning holes (114) are provided on the first quick-change end surface (112), and a plurality of second quick-change positioning columns (118) matched with the first quick-change positioning holes (114) are provided on the second quick-change end surface (116).

9. The mechanism for taking and placing wafers of various specifications as claimed in claim 1, characterized in that: The second quick-change boss (117) and the first quick-change slot (113) are magnetically attracted together.

Images